INTERCONNECT STRUCTURE FOR MOLDED IC PACKAGES

61/835,933 | U.S. Patent Application

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Location ELECTRONIC
Filed June 17, 2013
Case Type Provisional
Status Provisional Application Expired
Child 13/927,470 Abandoned
Child 15/61,747 Abandoned
Last Updated: 3 years, 3 months ago
Date # Transaction
6/22/2014EXPIRED PROVISIONAL
4/15/2014Communication - Re: Power of Attorney (PTOL-308)N570 PUBLIC PROSECUTION
4/15/2014Email Notification
4/15/2014Change in Power of Attorney (May Include Associate POA)
4/9/2014Correspondence Address Change
4/7/2014Power of AttorneyPA.. PUBLIC PROSECUTION
4/7/2014EFS Acknowledgment ReceiptN417 PUBLIC PROSECUTION
4/7/2014Assignee showing of ownership per 37 CFR 3.73R3.73 PUBLIC PROSECUTION
7/5/2013Filing ReceiptAPP.FILE.REC PUBLIC PROSECUTION
7/5/2013Application Is Now Complete
7/5/2013Email Notification
7/5/2013Filing Receipt
7/3/2013Application Is Now Complete
7/3/2013Application Dispatched from OIPE
6/20/2013Cleared by OIPE CSR
6/17/2013Placeholder sheet indicating presence of supplemental content in SCORESCORE PUBLIC PROSECUTION
6/17/2013EFS Acknowledgment ReceiptN417 PUBLIC PROSECUTION
6/17/2013SpecificationSPEC PUBLIC PROSECUTION
6/17/2013Drawings-other than black and white line drawingsDRW.NONBW PUBLIC PROSECUTION
6/17/2013AbstractABST PUBLIC PROSECUTION
6/17/2013ClaimsCLM PUBLIC PROSECUTION
6/17/2013Fee Worksheet (SB06)WFEE PUBLIC PROSECUTION
6/17/2013Application Data SheetADS PUBLIC PROSECUTION
6/17/2013Applicants have given acceptable permission for participating foreign
6/17/2013IFW Scan & PACR Auto Security Review
6/17/2013ENTITY STATUS SET TO UNDISCOUNTED (INITIAL DEFAULT SETTING OR STATUS CHANGE)
6/17/2013Initial Exam Team nn