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ARCHITECTURE FOR MEMORY MODULE WITH PACKAGES OF THREE-DIMENSIONAL STACKED (3DS) MEMORY CHIPS

61/409,893 | U.S. Patent Application

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Location ELECTRONIC

Filed Nov. 3, 2010

Case Type Provisional

Status Provisional Application Expired

Child PCT/US11/59209 Published

Child 13/288,850 Patented

Child 14/337,168 Patented

Child 15/95,288 Patented

Child 15/602,099 Patented

Child 16/412,308 Patented

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Last Updated: 3 years, 1 month ago

Date	#	Transaction
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ARCHITECTURE FOR MEMORY MODULE WITH PACKAGES OF THREE-DIMENSIONAL STACKED (3DS) MEMORY CHIPS

61/409,893 | U.S. Patent Application

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