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THERMAL HEAT SINK ENCAPSULATED INTEGRATED CIRCUIT

07/611,391 | U.S. Patent Application

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Location FILE REPOSITORY (FRANCONIA)
Filed Nov. 8, 1990
Examiner VIET Q NGUYEN
Class 999
Art Group 2503
Patent No. 5,057,903
Case Type Utility - 999/072000
Status Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362
Parent 07/380,968 Abandoned
Last Updated: 5 years ago
Date # Transaction