`
`(19) —d)
`
`(12)
`
`Europaisches Patentamt
`
`European Patent Office
`
`Office européen des brevets
`
`(11)
`
`EP 1 244 146 A2
`
`EUROPEAN PATENT APPLICATION
`
`(43) Date of publication:
`25.09.2002 Bulletin 2002/39
`
`(21) Application number: 02075943.7
`
`(22) Date offiling: 11.03.2002
`
`(84) Designated Contracting States:
`AT BE CH CY DE DK ES FIFRGBGRIEITLILU
`MC NL PT SETR
`
`Designated Extension States:
`AL LT LV MK RO SI
`
`(30) Priority: 22.03.2001 US 815076
`
`(71) Applicant: EASTMAN KODAK COMPANY
`Rochester, New York 14650 (US)
`
`(61) Intci.?: HO1L 27/00, HO1L 25/04
`
`
`
`(72) Inventors:
`¢ Freidhoff, Henry R.
`Rochester, New York 14650-2201 (US)
`¢ Phelan, Giana M. R.
`Rochester, New York 14650-2201 (US)
`
`(74) Representative:
`Nunney, Ronald Frederick Adolphe etal
`Kodak Limited,
`Patent Department (W92)-3A,
`Headstone Drive
`
`Harrow, Middlesex HA1 4TY (GB)
`
`(54)
`
`A method of making a tiled emissive display
`
`=A method of making a tiled emissive display
`(57)
`having at least two aligned tiles including finishing at
`least one edge of eachtile and aligning the finished edg-
`es of such tiles and forming a monolithic structure in-
`cluding aligned tiles, each such aligned tile having a
`substrate, TFT circuits, drive circuits and bottom pixel
`
`electrodesfor providing electrical signals to pixels in the
`corresponding tile. The method also includes coating
`the aligned tiles with material that produces light when
`activated by an electric field and forming at least one top
`pixel electrode over the coated material so that the coat-
`ed material produceslight when activated by an electric
`field from the electrode.
`
`
`
`22a
`
`
`
`32
`
`“
`
`106,306
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`
`¢ 30 / 108,308 -~22b
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`Printed by Jouve, 75001 PARIS (FR)
`
`EP1244146A2
`
`

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`1
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`EP 1 244 146 A2
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`2
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`Description
`
`[0001] The present invention relates generally to tiled
`emissive displays, which include a plurality of tiles,
`which are aligned to produce an image.
`[0002]
`Flat panel technology has been dominated by
`liquid crystal displays (LCD's) in which the liquid crystal
`material acts as a valve to transmit light from a backlight
`source. Large displays are usually smaller displaystiled
`together. For large LCD panels the tile building blocks
`are generally complete displays with the liquid crystal
`material in the cavity defined by two glass plates that
`are sealed around the perimeter. The edges of the
`sealed tiles are cut and polished to minimize the dis-
`tance from the edge pixel to the edge of the tile. The
`integrity of the seal around the LCD material must be
`maintained thereby limiting the amount of cutting and
`polishing that is possible. Furthermore, variability in the
`performancefrom one tile to another can create discon-
`tinuities in the large panel image. The tiles are usually
`tested and sorted to minimizetile variability.
`[0003] US-A-5,980,348 describes a method for align-
`ing and attaching LCDtiles for large panel displays. A
`mechanical alignment system is employed. US-A-
`5,903,328 describestiled LCD displays where the adja-
`cent tile edges are ground at an angle and overlap each
`other. This allows a small increase in the spacefor the
`ground edge relative to the adjacent pixels; however, as
`the space increases the distance between the image
`planesof adjacent tiles increases proportionally. US-A-
`5,889,568 describesa tiled LCD display wherein mask-
`ing techniques are used to hide the seams between
`tiles. The mask can be positioned behind of the LCD tile
`to block stray light from the backlight as well as in front
`of the tile. US-A-5,781,258 describes an LCD tiled dis-
`play wherein the half tiles are used and the final filling
`of the LCD material is completed within the cavity of all
`the tiles simultaneously.
`[0004]
`Emissive displays, which produce their own
`light, have a very different structure from LCDs. The
`emissive material is deposited on to the substrate sur-
`face. A backplate orthin film coating provides protection
`from the environment. The organic and polymeric ma-
`terials that produce light are sensitive to environment,
`heat and dirt. The preparation of the edges of emissive
`tiles is difficult due to the potential exposure to contam-
`inants.
`
`It is an object of the present invention to pro-
`[0005]
`vide a large flat panel tiled emissive display with conti-
`nuity of the pixels, both in light-emitting characteristics
`and in spacing, acrossthe display area.
`[0006] This object is achieved by a method of making
`a tiled emissive display having at least two alignedtiles,
`comprising the stepsof:
`
`a) finishing at least one edge of eachtile and align-
`ing the finished edgesof such tiles;
`b) forming a monolithic structure including aligned
`
`tiles, each such aligned tile having a substrate, TFT
`circuits, drive circuits and bottom pixel electrodes
`for providing electrical signals to pixels in the corre-
`sponding tile;
`c) coating the aligned tiles with material that pro-
`duceslight when activated by an electric field; and
`d) forming at least one top pixel electrode over the
`coated material so that the coated material produc-
`es light when activated by an electric field from the
`electrode.
`
`Itis an advantage of the present invention that
`[0007]
`individual tiles can be prepared, aligned and joined to-
`gether prior to the deposition of light emitting materials.
`The alignedtiles are processed as a monolithic struc-
`ture. By coating the joined tiles as a single flat panel,
`the process of polishing, squaring and aligning the edg-
`es of the tiles is complete prior to deposition. The prep-
`aration of the edgesof the tiles produces many particles
`and is serious source of contamination; in the present
`invention, the debris from these operations can be re-
`moved prior to deposition of organic materials. The
`monolithic structure can be cleaned and the light-emit-
`ting materials are then deposited in a clean environment
`without further need to prepare the edges or handle the
`tiles for alignment.
`[0008]
`It is a further advantage of the present inven-
`tion that all the tiles in a single display are coated con-
`currently. Typically, for tiling of active matrix LCD dis-
`plays, the tiles are sorted and characterized and then
`tiled together. However, any variations are readily evi-
`dent at the seams. By coating all the tiles concurrently,
`the variations from different process runs and material
`lots are eliminated. Therefore, the tile-to-tile character-
`istics are indistinguishable across the seam.
`[0009]
`It is a further advantage of the present inven-
`tion that by coating the tiles as a monolithic structure the
`coating can be continuous acrosstiles thereby reducing
`coating edge effects within the tiled array. By eliminating
`the edge effects, active pixels can be placed along the
`edge ofthe tiles to allow for pixel pitch integrity from tile
`to tile.
`
`It is a further advantage of the present inven-
`[0010]
`tion that the coated monolithic structure can be imme-
`
`diately packaged and encapsulatedin its entirety. The
`monolithic structure is therefore more readily protected
`from the environment.Individual tiles do not need to be
`
`handled after deposition of the sensitive light emitting
`materials; elimination of this handling time greatly re-
`ducesrisk of environmental degradation and increases
`yield and reliability of the display.
`[0011]
`It is a further advantage of the present inven-
`tion that higher temperature joining techniques can be
`used to bond tiles to make the monolithic structure. By
`bonding the tiles prior to deposition of the light emitting
`materials high temperature processes including metal
`bonding, high temperature adhesive, microwave bond-
`ing, and fusion joining can be used. In addition, ultravi-
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`EP 1 244 146 A2
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`olet light activated adhesives can be usedprior to dep-
`osition of light emitting material.
`[0012]
`Itis a further advantage of the present inven-
`tion that electrical
`interconnections to the monolithic
`
`structure can be established prior to coating deposition.
`Connection techniques that require high temperature,
`ultrasonics or pressure can be used only when the light
`emitting materials are not present. By positioning the
`tiles prior to deposition of the light emitting material,
`electrical connections can be made to a backplate by
`means including soldering, ultrasonic bonding, micro-
`wavebonding, and conductive adhesives. Furthermore,
`electrical escapes including attachment of flex connec-
`tions at high temperatures including soldering, can be
`established. Cleaning of the monolithic structure after
`electrical connections are made and prior to deposition
`of the light emitting materials facilitates high quality dis-
`plays.
`Itis a further advantage of the present inven-
`[0013]
`tion that it is suitable for use in organic electrolumines-
`cent displays. A feature of the invention is that it can be
`readily manufactured and the display will not produce
`artifacts caused byalignedtiles.
`[0014]
`It is advantageous to prepare the tile edges
`and align the tiles prior to deposition of the light emitting
`materials.
`
`is a composite of a monolithic structure with
`1
`FIG.
`drive circuits on the edges outside the display area;
`FIG. 2 is a cross section of the monolithic structure
`
`shown in FIG. 1. with bottom emitting pixels and
`colorfilters under the pixel;
`FIG. 3 is a cross section of the monolithic structure
`
`shown in FIG. 1. with top emitting pixels and color
`filters coated on a top plate;
`FIG. 4 is a cross section of the monolithic structure
`
`shown in FIG. 1. with pattern coated top emitting
`pixels of different color;
`FIG. 5 is a cross section of the monolithic structure
`
`shown in FIG. 1. with pattern coated bottom-emit-
`ting pixels of different colors;
`FIG. 6 is a composite of a monolithic structure in-
`cluding an island tile with TFT circuits and driver cir-
`cuits under the display pixels;
`FIG. 7 is a cross section of the monolithic structure
`
`shown in FIG. 6 with top emitting pixels and color
`filters coated on a top plate;
`FIG. 8 is a cross section of the monolithic structure
`
`shown in FIG. 6 with pattern coated top emitting pix-
`els of different colors;
`FIG. 9 is a top view of a temporary coating support
`fixture;
`FIG. 10 is a front view of the coating support fixture
`shown in FIG. 9;
`FIG. 11 is a side view of the coating supportfixture
`shown in FIG. 9;
`FIG. 12 is across section of a simple emissive pixel
`structure; and
`
`FIG. 13 is a cross section of a top emitting pixel
`structure.
`
`[0015] Turning now to FIGS. 1-5, a composite view of
`a monolithic structure 20 is shown for an emissivedis-
`
`play. The monolithic structure 20 is composedoftiles
`22a-d that are preprocessed for edge quality. The tiles
`22 havethin film transistor (TFT) circuits 40 and bottom
`pixel electrode 104 or 304 arrays defining the active ar-
`ea of the display. The drive electronics 34 and TFT 40
`circuits provide electrical signals to pixels 100 in the cor-
`responding tile. It is understood that the tiles 22 can be
`tested to ensure proper performanceof the TFTcircuits
`40 and drive circuits 34. The edgesof the tiles 22 are
`polished to maintain a parallel line to the bottom pixel
`electrode 104 or 304 array. Furthermore, the polishing
`reducesthe distance from the outermostpixel to the tile
`22 edge. The tiles 22 are aligned with a position so that
`the pixel pitch 36 across the seam of the adjacent tiles
`is approximately equal to the pixel pitch 36 within the
`array of a single tile. The tiles 22 can be affixed to each
`other using adhesive. Furthermore, higher temperature
`joining techniques can be usedto bond tiles to make the
`monolithic structure 20. Light emitting materials are sen-
`sitive to temperature and ultraviolet light; this severely
`limits the options for bonding tiles together. By bonding
`the tiles prior to deposition of the light emitting materials
`108 or 308 high temperature processesincluding metal
`bonding, high temperature adhesive, microwave bond-
`ing, and fusion joining can be used. In addition, ultravi-
`olet adhesives can be used prior to deposition oflight
`emitting material 108 or 308. The proximity of the pixel
`area to the space 32 between tiles precludes the ability
`to mask only the pixel area; therefore, it would not be
`possible to use ultraviolet processes after deposition.
`Prior to deposition of the light emitting material 108 or
`308 the monolithic structure 20 can be thoroughly
`cleaned.
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`Light emitting material 108 or 308 is deposited
`[0016]
`onto the monolithic structure 20. It is understood that the
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`light emitting material 108 or 308 can be several mate-
`rials that when layered or combined provide the desired
`light emitting properties when activated by an electric
`field.
`In addition,
`it
`is understood that the monolithic
`structure 20 can be supported by a carrier throughout
`processing. The material can be deposited in numerous
`waysincluding, but not limited to, evaporation, sublima-
`tion, and spin coating. The coatings 108 or 308 can be
`continuous across the monolithic structure 20, extend-
`ing beyond the edge of the tiles 22 and covering the
`space 32 between tiles 22. When the coating is contin-
`uous the light emitting material 108 or 308 is monochro-
`matic, with the preferred embodiment being white light
`emitting. The coatings 108 or 308 include an electrolu-
`minescent material that produces light when activated
`by an electric field. The top pixel electrode 106 or 306
`is subsequently deposited over the light emitting mate-
`rials in the coatings 108 or 308. The top pixel electrodes
`
`

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`5
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`EP 1 244 146 A2
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`6
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`106 or 306 require a low work function conductive ma-
`terial.
`
`[0017] When pixels 100 are bottom emitting as shown
`in FIG. 2 colorfilters 42 and a passivation layer 44 can
`be formed on the tiles 22 prior to depositing the light
`transmissive bottom pixel electrode 104. The colorfil-
`ters 42 are aligned with bottom-emitting pixels 100 and
`can be patterned to provide a full color display; one color
`combination being red, green and blue.
`[0018]
`In another embodiment where the multilayer
`organic top emitting pixels 300 are top emitting and have
`a light transmissive top pixel electrode 306a and b the
`colorfilters 42, which are aligned to the multilayer or-
`ganic top emitting pixels 300, and the passivation layer
`44 can be formed on a top plate 46 that serves as the
`viewing plane for the display. The colorfilters 42 can be
`patterned to provide a full color display; one color com-
`bination being red, green and blue.
`[0019]
`In another embodiment where pixels 100 are
`bottom emitting as shown in FIG. 5, the light emitting
`material 108 is pattern deposited on the bottom pixel
`electrodes, 104 and viewed through the bottom. The
`deposition can be accomplished by evaporation, subli-
`mation, or other means. Additionally, different pixels 100
`can emit different colored light including patterned color
`combinations that producea full-color display. Alterna-
`tively,
`if the multilayer organic top emitting pixels 300
`are top emitting as shown in FIG. 4 the light emitting
`material 308 is pattern deposited on the bottom pixel
`electrode 304 and viewed through the top pixel elec-
`trode 306.
`
`In the preferred embodiment as shownin
`[0020]
`FIGS. 6-8, the monolithic structure 20 can include island
`tiles 22i. Island tiles 22i are thosetiles that do not have
`
`any drive circuits 34 at the perimeter of the monolithic
`structure 20. All of the tiles 22 are mounted on a back
`
`plate 30 to form a monolithic structure 20, which can
`then be coated. The island tiles 22i can have vertical
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`electrical connections to conductors on the back plate
`30.
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`Ina further embodiment the tiles 22 are prop-
`[0021]
`erly aligned and then affixed to back plate 30. The back
`plate 30 becomes a permanent part of the monolithic
`structure 20 and provides support when operated as a
`final display. The space 32 between the tiles can be, but
`need notbe, filled by adhesive or other means. Desic-
`cant or an oxygen gettering material can also be placed
`in the space 32. The tiles 22 are affixed to the back plate
`30 by adhesive, metal bonding, or other means. Further-
`more, the back plate 30 can be used to escape signal
`lines from the tiles 22. Electrical connections can be
`made from the tiles 22 of the monolithic structure 20 to
`
`the back plate 30. These connections can be made with
`conductive adhesive, flex, solder or other means. The
`connections can be made to vertical connections or run
`
`down the edgesofthetile 22.
`[0022]
`In another embodiment, a temporary support
`fixture 50, as shown in FIGS. 9-11, is used to temporarily
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`secure tiles 22 for coating as a monolithic structure 20
`wherein the temporary support fixture 50 is not a per-
`manent support plate. In addition to providing support
`during concurrent tile 22 coating, the temporary support
`fixture 50 provides protection of the polished edges of
`the tiles 22. The tiles 22 are later removed from the tem-
`
`porary supportfixture 50 and realigned and mounted in
`the final assembly. The alignment and the spacing of the
`tiles 22 in the temporary support fixture 50 are notcritical
`during coating of the light emitting layer 108 or 308 and
`top pixel electrode 106 or 306. The coatings 108 or 308
`and 106 or 306 can extend beyond the edge ofthe tiles
`to provide uniform coverage acrossall tiles.
`[0023] As shown in FIGS. 2, 3, 4, 5, 7 and 8 a polari-
`zation layer 48 can be added to the viewing surface ei-
`ther the top plate 46 or back plate 30 to increase the
`contrast ratio of the display.
`[0024] The present invention is applicable to emissive
`displays, and is particularly suitable for, but not limited
`to, use in organic electroluminescent, EL, displays.
`FIGS. 12 and 13 show examplesof pixels 100 and 300
`with organic EL materials.
`[0025] A light-emitting layer of an organic EL tile com-
`prises a luminescent or fluorescent material where elec-
`troluminescence is produced as aresult of electron-hole
`pair recombination in this region. In the simplest con-
`struction of a light-emitting pixel 100, as shownin FIG.
`12, the light-emitting layer 108 is sandwiched between
`the bottom pixel electrode or 104 and top pixel electrode
`106. The light-emitting layer is a pure material with a
`high luminescent efficiency. A well-known material is tris
`(8-quinolinato) aluminum, (Alq), which produces excel-
`lent green electroluminescence.
`[0026] The simple structure 100 can be modified to a
`three-layer structure in which an additional EL layeris
`introduced between the hole and electron-transporting
`layers to function primarily as the site for hole-electron
`recombination and thus electroluminescence. In this re-
`
`spect, the functions of the individual organic layers are
`distinct and can therefore be optimized independently.
`Thus,
`the electroluminescent or recombination layer
`can be chosen to have a desirable EL color as well as
`
`high luminance efficiency. Likewise, the electron and
`hole transport layers can be optimized primarily for the
`carrier transport property.
`[0027]
`Ina preferred embodiment when the top plate
`46 is the viewing surface, the multilayer organic top
`emitting pixel 300, as shown in FIG. 13, emits light from
`the top and has a substrate 302 on which is disposed a
`light reflective conductive bottom pixel layer 304. The
`bottom pixel electrode 304 comprises two layers 304a
`and 304b. 304ais a light reflective conductive metal lay-
`er and 304b is a thin light transmissive layer of a con-
`ductive high work function material. An organic light-
`emitting structure 308 is formed between a top pixel
`electrode 306 and a bottom pixel electrode 304. The top
`pixel electrode 306 is composed of two layers 306a and
`306b. 306ais a thin light transmissive conductive layer
`
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`EP 1 244 146 A2
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`8
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`of a low workfunction material and 306b is a light trans-
`missive conductive layer such as indium tin oxide. The
`organic light-emitting structure 308 is comprised of,
`in
`sequence, an organic hole-transporting layer 310, an or-
`ganic light-emitting layer 312, and an organic electron-
`transporting layer 314. When an electrical potential dif-
`ference (not shown) is applied between the bottom pixel
`electrode 304 and the top pixel electrode 306, the top
`pixel electrode 306 will inject electrons into the electron-
`transporting layer 314, and the electrons will migrate
`across layer 314 to the light-emitting layer 312. At the
`same time, holes will be injected from the bottom pixel
`electrode 304 into the hole-transporting layer 310. The
`holes will migrate across layer 310 and recombine with
`electrons at or near a junction formed between the hole-
`transporting layer 310 and the light-emitting layer 312.
`When a migrating electron drops from its conduction
`band to a valence band in filling a hole, energy is re-
`leased as light, and is emitted through the light-trans-
`missive top pixel electrode 306.
`[0028] Other features of the invention are included be-
`low.
`
`[0029] The method wherein the light emitting material
`is a Monochromatic continuous coating and a top plate
`pattern coated with colorfilters is aligned with the pixels
`and attachedto the tiles.
`
`[0030] The method wherein the light emitting material
`is a Monochromatic continuous coating and a top plate
`pattern coated with colorfilters is aligned with the pixels
`and attachedto the tiles.
`
`[0031] The method wherein the light emitting material
`is coated as discrete color emitting pixels arranged in a
`pattern to provide full color display.
`[0032] The method wherein the light emitting material
`is deposited as discrete color emitting pixels arranged
`in a pattern to provide full color display.
`[0033] The method wherein the light emitting material
`iS a Monochromatic continuous coating and a top plate
`pattern coated with colorfilters is aligned with the pixels
`and attachedto the tiles.
`
`[0034] The method wherein a top plate and backplate
`are attached to the display.
`[0035] The method wherein a top plate is attached to
`the display.
`
`Claims
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`c) coating the aligned tiles with material that
`produces light when activated by an electric
`field; and
`d) forming at least one top pixel electrode over
`the coated material so that the coated material
`
`produces light when activated by an electric
`field from the electrode.
`
`2. Amethod of making a tiled emissive display having
`at least two aligned tiles, comprising the stepsof:
`
`a) finishing at least one edge of each tile and
`aligning the finished edges of such tiles;
`b)
`forming a monolithic structure including
`aligned tiles, each such aligned tile having a
`substrate, TFT circuits, drive circuits and bot-
`tom pixel electrodesfor providing electrical sig-
`nals to pixels in the corresponding tile and
`mounting the tiles on a back plate;
`c) coating the aligned tiles with material that
`produces light when activated by an electric
`field; and
`d) forming at least one top pixel electrode over
`the coated material so that the coated material
`
`produces light when activated by an electric
`field from the electrode.
`
`3. Amethod of making a tiled emissive display having
`at least two alignedtiles, comprising the stepsof:
`
`a) finishing at least one edge of each tile and
`aligning the finished edgesofthetiles;
`b) forming a monolithic structure of the aligned
`tiles wherein each tile has a substrate, TFT cir-
`cuits, drive circuits and bottom pixel electrodes
`for providing electrical signals to pixels being
`mounted to a temporary supportfixture;
`c) coating the aligned tiles with material that
`produces light when activated by an electric
`field;
`d) coating at least one top pixel electrode over
`the coated material that produces light when
`activated by an electric field;
`e) removing the coated tiles from the temporary
`support fixture; and
`f) aligning and attaching the tiles to a perma-
`nent support back plate.
`
`1. Amethod of making a tiled emissive display having
`at least two aligned tiles, comprising the steps of:
`
`50
`
`a) finishing at least one edge of each tile and
`aligning the finished edges of such tiles;
`b)
`forming a monolithic structure including
`aligned tiles, each such aligned tile having a
`substrate, TFT circuits, drive circuits and bot-
`tom pixel electrodesfor providing electrical sig-
`nals to pixels in the corresponding tile;
`
`55
`
`4. The method of claim 1 wherein the pitch between
`columns of pixels on all tiles is substantially the
`sameand the pitch between rowsof pixels on all
`tiles is substantially the same and the spaces be-
`tween rows and columns of pixels on adjacent tiles
`are substantially the same as the spaces within a
`tile.
`
`5. The method of claim 2 wherein the pitch between
`columns of pixels on all tiles is substantially the
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`EP 1 244 146 A2
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`10
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`same and the pitch between rowsof pixels on all
`tiles is substantially the same and the spaces be-
`tween rows and columns of pixels on adjacent tiles
`are substantially the same as the spaces within a
`tile.
`
`The method of claim 3 wherein the pitch between
`columns of pixels on all tiles is substantially the
`same and the pitch between rowsof pixels on all
`tiles is substantially the same and the spaces be-
`tween rows and columns ofpixels on adjacent tiles
`are substantially the same as the spaces within a
`tile.
`
`The method of claim 1 wherein the light emitting ma-
`terial is a monochromatic continuous coating and
`colorfilters are disposed under the pixels.
`
`The method of claim 2 wherein the light emitting ma-
`terial is a monochromatic continuous coating and
`colorfilters are disposed under the pixels.
`
`The method of claim 3 wherein the light emitting ma-
`terial is a monochromatic continuous coating and
`colorfilters are disposed under the pixels.
`
`10.
`
`The method of claim 1 wherein the light emitting ma-
`terial is amonochromatic continuous coating and a
`top plate pattern coated with colorfilters is aligned
`with the pixels and attachedto the tiles.
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`108/308
`
`_494/304
`
`22g
`
`22e
`
`32
`
`LL
`
`L r
`
`L
`-
`
` r 106/306
`
`= |
`hoo IIIa
`|
`294
`cararctdreararcarctdharararca
`Lon tea iL oe JLILAN|99;
`
`_I
`roy
`22h
`Wy_I
`LIL
`4il
`
`rr
`
`L r
`
`rL
`
`22k
`
`Irarhrarcdrns
`Logue ot tl
`fo ry ee
`LIU LIL4
`OI Ve
`LiJbL db
`
`i
`
`22m
`
`

`

`§CARARRRARDRASSHAANAN
` AIRS
`PMVIIDLLLLLLLLALLLL.CASSSSS
` nF
`SASAMMAASAAS
`
`©oO++
`
`FIG. 7
`
`FIG. &
`
`
`
`

`

`

`

`100
`
`K{}YUERK sonyy
`
`Fila. 12
`
`———300
`
`
`%>XSWLILLIAOE
`
`VILLLLLLLLLLLLLL
`
`~M MISS
`
`FG. 18
`
`