PE2E SEARCH- Search History (Prior Art)
`
`Oope
`
`Equivalents
`
`"20160300751".pn.
`
`(US-PGPUB; USPAT)
`
`"20080053488"pn.
`
`(US-PGPUB; USPAT)
`
`"20070221253"pn.
`
`(US-PGPUB; USPAT)
`
`11:22 AM
`
`((("ZEUS") near3 ("CO")
`near3
`("LTD"))).AS,AANM.
`
`((("BAEK") near3
`("Seung") near3
`("Dae")) OR (("HEO")
`near3 ("Kuem") near3
`("Dong")) OR ("KIM")
`near3 ("Jin") near3
`("Won")) OR (("SON")
`near3 ("Jae") near3
`("Hwan")) OR (("LEE")
`near3 ("Kang") near3
`("Won"))). INV.
`
`(H01L21/68721 OR
`
`H01L21/67051 OR
`H01L21/68728 OR
`H01L21/68785 OR
`H01L21/68792 OR
`H01L21/02076 OR
`H01L21/67034 OR
`H01L21/67742 OR
`H01L21/78).cpc.
`
`(wafer OR substrate OR
`slice OR
`(semiconductor OR
`semi$1conductor))
`SAME (receptacle OR
`chuck OR table)
`
`L7 AND (h01L$ AND
`BO8B$)
`
`L7 AND (Cover$3
`NEARring)
`L9 AND (spray$3 OR
`disperse OR stream$3
`OR jet)
`
`L9 AND (spray$3 OR
`disperse OR stream$3
`OR jet)
`
`|(US-PGPUB; USPAT)
`
`(US-PGPUB; USPAT;
`USOCR; EPO; JPO;
`DERWENT)
`
`(US-PGPUB; USPAT;
`USOCR; EPO; JPO;
`DERWENT)
`
`|OR
`
`(US-PGPUB; USPAT)
`
`(US-PGPUB; USPAT)
`
`(US-PGPUB; USPAT)
`
`(US-PGPUB; USPAT)
`
`(US-PGPUB; USPAT;
`USOCR; FIT (AU, AP,
`AT, BE, BG, BR, BY,
`CA, CH, CN, CS, CU,
`
`2024/09/03
`08:41 AM
`
`2024/09/03
`10:17 AM
`
`2024/09/03
`10:57 AM
`
`2024/09/03
`11:02 AM
`
`2024/09/03
`11:02 AM
`
`2024/09/03
`11:03 AM
`
`2024/09/03
`11:15 AM
`
`2024/09/03
`11:15 AM
`
`2024/09/03
`11:17 AM
`
`2024/09/03
`11:21 AM
`
`2024/09/03
`
`09/09/2024 04:24:00 PM
`
`Workspace: Wafer Processing Method 17-865727
`
`Page 1 of 10
`
`
`
`Oope
`
`Equivalents
`
`"20160300751".pn.
`
`(US-PGPUB; USPAT)
`
`"20080053488"pn.
`
`(US-PGPUB; USPAT)
`
`"20070221253"pn.
`
`(US-PGPUB; USPAT)
`
`11:22 AM
`
`((("ZEUS") near3 ("CO")
`near3
`("LTD"))).AS,AANM.
`
`((("BAEK") near3
`("Seung") near3
`("Dae")) OR (("HEO")
`near3 ("Kuem") near3
`("Dong")) OR ("KIM")
`near3 ("Jin") near3
`("Won")) OR (("SON")
`near3 ("Jae") near3
`("Hwan")) OR (("LEE")
`near3 ("Kang") near3
`("Won"))). INV.
`
`(H01L21/68721 OR
`
`H01L21/67051 OR
`H01L21/68728 OR
`H01L21/68785 OR
`H01L21/68792 OR
`H01L21/02076 OR
`H01L21/67034 OR
`H01L21/67742 OR
`H01L21/78).cpc.
`
`(wafer OR substrate OR
`slice OR
`(semiconductor OR
`semi$1conductor))
`SAME (receptacle OR
`chuck OR table)
`
`L7 AND (h01L$ AND
`BO8B$)
`
`L7 AND (Cover$3
`NEARring)
`L9 AND (spray$3 OR
`disperse OR stream$3
`OR jet)
`
`L9 AND (spray$3 OR
`disperse OR stream$3
`OR jet)
`
`|(US-PGPUB; USPAT)
`
`(US-PGPUB; USPAT;
`USOCR; EPO; JPO;
`DERWENT)
`
`(US-PGPUB; USPAT;
`USOCR; EPO; JPO;
`DERWENT)
`
`|OR
`
`(US-PGPUB; USPAT)
`
`(US-PGPUB; USPAT)
`
`(US-PGPUB; USPAT)
`
`(US-PGPUB; USPAT)
`
`(US-PGPUB; USPAT;
`USOCR; FIT (AU, AP,
`AT, BE, BG, BR, BY,
`CA, CH, CN, CS, CU,
`
`2024/09/03
`08:41 AM
`
`2024/09/03
`10:17 AM
`
`2024/09/03
`10:57 AM
`
`2024/09/03
`11:02 AM
`
`2024/09/03
`11:02 AM
`
`2024/09/03
`11:03 AM
`
`2024/09/03
`11:15 AM
`
`2024/09/03
`11:15 AM
`
`2024/09/03
`11:17 AM
`
`2024/09/03
`11:21 AM
`
`2024/09/03
`
`09/09/2024 04:24:00 PM
`
`Workspace: Wafer Processing Method 17-865727
`
`Page 1 of 10
`
`
`
`(US-PGPUB; USPAT;
`USOCR; FIT (AU, AP,
`AT, BE, BG, BR, BY,
`CA, CH, CN, CS, CU,
`CZ, DD, DE, DK, EA,
`EE, EP, ES, Fl, FR, GB,
`HR, HU, ID, IE, IL, IS,
`IT, JP, KR, LT, LU, LV,
`MA, OA, RU, SU, WO,
`MC, MD, MY, NL, NO,
`NZ, PH, PL, PT, RO,
`RS, SE, SG, SI, SK,
`TH, TN, TR, TW, UA,
`VN); FPRS; EPO;
`JPO; DERWENT;
`IBM_TDB)
`
`11:25 AM
`
`L11 AND (suction$3 OR
`suck$3 OR vacuum$3)
`
`L12 AND (HO1L$ OR
`BO8B$)
`
`L12 AND (dry$3 OR
`dehydrat$3 OR
`dehumidify$3)
`
`CZ, DD, DE, DK, EA,
`EE, EP, ES, Fl, FR, GB,
`HR, HU, ID, IE, IL, IS,
`IT, JP, KR, LT, LU, LV,
`MA, OA, RU, SU, WO,
`MC, MD, MY, NL, NO,
`NZ, PH, PL, PT, RO,
`RS, SE, SG, SI, SK,
`TH, TN, TR, TW, UA,
`VN); FPRS; EPO;
`JPO; DERWENT;
`IBM_TDB)
`
`(US-PGPUB; USPAT;
`USOCR; FIT (AU, AP,
`AT, BE, BG, BR, BY,
`CA, CH, CN, CS, CU,
`CZ, DD, DE, DK, EA,
`EE, EP, ES, Fl, FR, GB,
`HR, HU, ID, IE, IL, IS,
`IT, JP, KR, LT, LU, LV,
`MA, OA, RU, SU, WO,
`MC, MD, MY, NL, NO,
`NZ, PH, PL, PT, RO,
`RS, SE, SG, SI, SK,
`TH, TN, TR, TW, UA,
`VN); FPRS; EPO;
`JPO; DERWENT;
`IBM_TDB)
`
`(US-PGPUB; USPAT;
`USOCR; FIT (AU, AP,
`AT, BE, BG, BR, BY,
`CA, CH, CN, CS, CU,
`CZ, DD, DE, DK, EA,
`EE, EP, ES, Fl, FR, GB,
`HR, HU, ID, IE, IL, IS,
`IT, JP, KR, LT, LU, LV,
`MA, OA, RU, SU, WO,
`MC, MD, MY, NL, NO,
`NZ, PH, PL, PT, RO,
`RS, SE, SG, SI, SK,
`TH, TN, TR, TW, UA,
`
`|OR
`
`|OR
`
`2024/09/03
`11:23 AM
`
`2024/09/03
`11:23 AM
`
`|OR
`
`2024/09/03
`
`09/09/2024 04:24:00 PM
`
`Workspace: Wafer Processing Method 17-865727
`
`Page 2 of 10
`LO
`
`
`
`05:00 PM
`
`(Artificial Intelligence)
`Morelike doc:
`US-5762751-A
`Text:
`(EP-0845155-A1 OR
`WO-9707532-A1 OR
`KR-19990037666-A OR
`US-6022484-A OR US-
`6746565-B1 OR CN-
`1197541-A OR WO-
`9506326-A1 OR US-
`5584310-A OR US-
`5489341-A OR JP-
`6121424-B2 OR US-
`6849167-B2 OR US-
`20040222086-A1 OR
`US-6322678-B1 OR
`WO-0003071-A1 OR
`US-20010052457-A1
`OR US-6527926-B2 OR
`US-20020189652-A1
`OR US-6423642-B1 OR
`
`L14 AND (BO8B$ OR
`HO1L$)
`
`L14 AND ((BO8B$ OR
`HO1L21/$).cpc.)
`
`VN); FPRS; EPO;
`JPO; DERWENT;
`IBM_TDB)
`
`(US-PGPUB; USPAT;
`USOCR; FIT (AU, AP,
`AT, BE, BG, BR, BY,
`CA, CH, CN, CS, CU,
`CZ, DD, DE, DK, EA,
`EE, EP, ES, Fl, FR, GB,
`HR, HU, ID, IE, IL, IS,
`IT, JP, KR, LT, LU, LV,
`MA, OA, RU, SU, WO,
`MC, MD, MY, NL, NO,
`NZ, PH, PL, PT, RO,
`RS, SE, SG, SI, SK,
`TH, TN, TR, TW, UA,
`VN); FPRS; EPO;
`JPO; DERWENT;
`IBM_TDB)
`
`(US-PGPUB; USPAT;
`USOCR; FIT (AP, AT,
`AU, BE, BG, BR, BY,
`CA, CH, CN, CS, CU,
`CZ, DD, DE, DK, EA,
`EE, EP, ES, Fl, FR, GB,
`HR, HU, ID, IE, IL, IS,
`IT, JP, KR, LT, LU, LV,
`MA, MC, MD, MY, NL,
`NO, NZ, OA, PH, PL,
`PT, RO, RS, RU, SE,
`SG, SI, SK, SU, TH,
`TN, TR, TW,UA, VN,
`WO); FPRS; EPO;
`JPO; DERWENT;
`IBM_TDB)
`
`(US-PGPUB; USPAT;
`USOCR; FIT (AU, AP,
`AT, BE, BG, BR, BY,
`CA, CH, CN, CS, CU,
`CZ, DD, DE, DK, EA,
`EE, EP, ES, Fl, FR, GB,
`HR, HU, ID, IE, IL, IS,
`IT, JP, KR, LT, LU, LV,
`MA, OA, RU, SU, WO,
`MC, MD, MY, NL, NO,
`NZ, PH, PL, PT, RO,
`RS, SE, SG, SI, SK,
`TH, TN, TR, TW, UA,
`VN); FPRS; EPO;
`JPO; DERWENT;
`IBM_TDB)
`
`|OR
`
`|OR
`
`2024/09/03
`11:26 AM
`
`2024/09/03
`01:30 PM
`
`|OR
`
`2024/09/03
`
`09/09/2024 04:24:00 PM
`
`Workspace: Wafer Processing Method 17-865727
`
`Page 3 of 10
`LO
`
`
`
`(Artificial Intelligence)
`Morelike doc:
`EP-0694957-A1
`Text:
`(EP-0694957-B1 OR
`EP-0297648-B1 OR
`US-4897369-A OR EP-
`0297648-A2 OR DE-
`69108838-T2 OR US-
`5211794-A OR JP-
`H04151837-A OR EP-
`0481723-B1 OR EP-
`0481723-A1 OR JP-
`H0785471-B2 OR CN-
`107968060-A OR CN-
`107968060-B OR EP-
`0297648-A3 OR WO-
`9926276-A1 OR US-
`6270585-B1 OR US-
`5839460-A OR JP-
`H01220832-A OR EP-
`0658923-A1 OR IT-
`8706615-A0 OR US-
`5816274-A).did.
`
`03:22 PM
`
`|OR
`
`2024/09/04
`09:06 AM
`
`|OR
`
`2024/09/05
`03:21 PM
`
`|OR
`
`2024/09/05
`
`EP-0694957-A1 OR
`CN-1135636-C).did.
`
`((L11 AND ((suction$3
`OR suck$3 OR
`vacuum$3) NEAR arm))
`AND (dry$3 OR
`dehydrat$3 OR
`dehumidify$3)) AND
`((BO8B$ OR
`HO1L21/$).cpc.)
`
`((L11 AND ((suction$3
`OR suck$3 OR
`vacuum$3) NEAR (arm
`OR swing$3))) AND
`(dry$3 OR dehydrat$3
`OR dehumidify$3))
`AND ((BO8B$ OR
`HO1L21/$).cpc.)
`
`(US-PGPUB; USPAT;
`USOCR; FIT (AU, AP,
`AT, BE, BG, BR, BY,
`CA, CH, CN, CS, CU,
`CZ, DD, DE, DK, EA,
`EE, EP, ES, Fl, FR, GB,
`HR, HU, ID, IE, IL, IS,
`IT, JP, KR, LT, LU, LV,
`MA, OA, RU, SU, WO,
`MC, MD, MY, NL, NO,
`NZ, PH, PL, PT, RO,
`RS, SE, SG, SI, SK,
`TH, TN, TR, TW, UA,
`VN); FPRS; EPO;
`JPO; DERWENT;
`IBM_TDB)
`
`(US-PGPUB; USPAT;
`USOCR; FIT (AP, AT,
`AU, BE, BG, BR, BY,
`CA, CH, CN, CS, CU,
`CZ, DD, DE, DK, EA,
`EE, EP, ES, Fl, FR, GB,
`HR, HU, ID, IE, IL, IS,
`IT, JP, KR, LT, LU, LV,
`MA, MC, MD, MY, NL,
`NO, NZ, OA, PH, PL,
`PT, RO, RS, RU, SE,
`SG, SI, SK, SU, TH,
`TN, TR, TW,UA, VN,
`WO); FPRS; EPO;
`JPO; DERWENT;
`IBM_TDB)
`
`(US-PGPUB; USPAT;
`USOCR; FIT (AP, AT,
`AU, BE, BG, BR, BY,
`CA, CH, CN, CS, CU,
`CZ, DD, DE, DK, EA,
`EE, EP, ES, Fl, FR, GB,
`HR, HU, ID, IE, IL, IS,
`IT, JP, KR, LT, LU, LV,
`MA, MC, MD, MY, NL,
`NO, NZ, OA, PH, PL,
`PT, RO, RS, RU, SE,
`SG, SI, SK, SU, TH,
`TN, TR, TW,UA, VN,
`WO); FPRS; EPO;
`JPO; DERWENT;
`
`09/09/2024 04:24:00 PM
`
`Workspace: Wafer Processing Method 17-865727
`
`Page 4 of 10
`LO
`
`
`
`10:03 AM 2024/09/06
`
`(L11 AND ((suction$3
`OR suck$3 OR
`vacuum$3) NEAR (arm
`OR swing$3))) AND
`((BO8B$ OR
`HO1L21/$).cpc.)
`
`(L9 AND (((spray$3 OR
`disperse OR stream$3
`OR jet) WITH
`((suction$3 OR suck$3
`OR vacuum$3))) NEAR
`(arm OR swing$3)))
`AND ((BO8B$ OR
`HO1L21/$).cpc.)
`
`L6 AND ((wafer OR
`substrate OR slice OR
`(semiconductor OR
`semi$1conductor))
`SAME (receptacle OR
`chuck OR table))
`
`L23 AND ((spray$3 OR
`disperse OR stream$3
`OR jet) WITH
`(suction$3 OR suck$3
`OR vacuum$3) WITH
`(arm nozzle))
`
`2024/09/05
`03:30 PM
`
`2024/09/05
`03:33 PM
`
`2024/09/06
`10:00 AM
`
`2024/09/06
`
`|OR
`
`|OR
`
`IBM_TDB)
`
`(US-PGPUB; USPAT;
`USOCR; FIT (AP, AT,
`AU, BE, BG, BR, BY,
`CA, CH, CN, CS, CU,
`CZ, DD, DE, DK, EA,
`EE, EP, ES, Fl, FR, GB,
`HR, HU, ID, IE, IL, IS,
`IT, JP, KR, LT, LU, LV,
`MA, MC, MD, MY, NL,
`NO, NZ, OA, PH, PL,
`PT, RO, RS, RU, SE,
`SG, SI, SK, SU, TH,
`TN, TR, TW,UA, VN,
`WO); FPRS; EPO;
`JPO; DERWENT;
`IBM_TDB)
`
`(US-PGPUB; USPAT;
`USOCR; FIT (AP, AT,
`AU, BE, BG, BR, BY,
`CA, CH, CN, CS, CU,
`CZ, DD, DE, DK, EA,
`EE, EP, ES, Fl, FR, GB,
`HR, HU, ID, IE, IL, IS,
`IT, JP, KR, LT, LU, LV,
`MA, MC, MD, MY, NL,
`NO, NZ, OA, PH, PL,
`PT, RO, RS, RU, SE,
`SG, SI, SK, SU, TH,
`TN, TR, TW,UA, VN,
`WO); FPRS; EPO;
`JPO; DERWENT;
`IBM_TDB)
`
`(US-PGPUB; USPAT)
`
`(US-PGPUB; USPAT;
`USOCR; FIT (AP, AT,
`AU, BE, BG, BR, BY,
`CA, CH, CN, CS, CU,
`CZ, DD, DE, DK, EA,
`EE, EP, ES, Fl, FR, GB,
`HR, HU, ID, IE, IL, IS,
`IT, JP, KR, LT, LU, LV,
`MA, MC, MD, MY, NL,
`NO, NZ, OA, PH, PL,
`PT, RO, RS, RU, SE,
`SG, SI, SK, SU, TH,
`TN, TR, TW,UA, VN,
`WO); FPRS; EPO;
`JPO; DERWENT;
`IBM_TDB)
`
`L25 AND (arm WITH
`
`(US-PGPUB; USPAT;
`
`|OR
`
`09/09/2024 04:24:00 PM
`
`Workspace: Wafer Processing Method 17-865727
`
`Page 5 of 10
`LO
`
`
`
`10:57 AM
`
`(L23 AND ((spray$3 OR
`disperse OR stream$3
`OR jet) WITH
`(suction$3 OR suck$3
`OR vacuum$3)) WITH
`(arm nozzle)) AND (arm
`WITH (swing$3 OR
`rotat$3 OR swivel$3))
`
`"5762751".pn.
`
`(US-PGPUB; USPAT)
`
`L26 AND (dry$3 AND
`method)
`
`(US-PGPUB; USPAT;
`USOCR; FIT (AP, AT,
`AU, BE, BG, BR, BY,
`CA, CH, CN, CS, CU,
`CZ, DD, DE, DK, EA,
`EE, EP, ES, Fl, FR, GB,
`HR, HU, ID, IE, IL, IS,
`
`(swing$3 OR rotat$3
`OR swivel$3))
`
`L26 AND dry$3
`
`USOCR; FIT (AP, AT,
`AU, BE, BG, BR, BY,
`CA, CH, CN, CS, CU,
`CZ, DD, DE, DK, EA,
`EE, EP, ES, Fl, FR, GB,
`HR, HU, ID, IE, IL, IS,
`IT, JP, KR, LT, LU, LV,
`MA, MC, MD, MY, NL,
`NO, NZ, OA, PH, PL,
`PT, RO, RS, RU, SE,
`SG, SI, SK, SU, TH,
`TN, TR, TW,UA, VN,
`
`(US-PGPUB; USPAT;
`USOCR; FIT (AP, AT,
`AU, BE, BG, BR, BY,
`CA, CH, CN, CS, CU,
`CZ, DD, DE, DK, EA,
`EE, EP, ES, Fl, FR, GB,
`HR, HU, ID, IE, IL, IS,
`IT, JP, KR, LT, LU, LV,
`MA, MC, MD, MY, NL,
`NO, NZ, OA, PH, PL,
`PT, RO, RS, RU, SE,
`SG, SI, SK, SU, TH,
`TN, TR, TW,UA, VN,
`WO); FPRS; EPO;
`JPO; DERWENT;
`IBM_TDB)
`
`(US-PGPUB; USPAT;
`USOCR; FIT (AP, AT,
`AU, BE, BG, BR, BY,
`CA, CH, CN, CS, CU,
`CZ, DD, DE, DK, EA,
`EE, EP, ES, Fl, FR, GB,
`HR, HU, ID, IE, IL, IS,
`IT, JP, KR, LT, LU, LV,
`MA, MC, MD, MY, NL,
`NO, NZ, OA, PH, PL,
`PT, RO, RS, RU, SE,
`SG, SI, SK, SU, TH,
`TN, TR, TW,UA, VN,
`WO); FPRS; EPO;
`JPO; DERWENT;
`IBM_TDB)
`
`|OR
`
`|OR
`
`2024/09/06
`02:52 PM
`
`2024/09/06
`03:15 PM
`
`2024/09/09
`08:41 AM
`
`2024/09/09
`
`09/09/2024 04:24:00 PM
`
`Workspace: Wafer Processing Method 17-865727
`
`Page 6 of 10
`LO
`
`
`
`(US-PGPUB; USPAT;
`USOCR; FIT (AP, AT,
`AU, BE, BG, BR, BY,
`CA, CH, CN, CS, CU,
`CZ, DD, DE, DK, EA,
`EE, EP, ES, Fl, FR, GB,
`HR, HU, ID, IE, IL, IS,
`IT, JP, KR, LT, LU, LV,
`MA, MC, MD, MY, NL,
`NO, NZ, OA, PH, PL,
`PT, RO, RS, RU, SE,
`SG, SI, SK, SU, TH,
`TN, TR, TW,UA, VN,
`WO); FPRS; EPO;
`JPO; DERWENT;
`IBM_TDB)
`
`12:37 PM
`
`L26 AND (dry$3
`samemethod)
`
`L26 AND (dry$3 SAME
`method)
`
`"5964954" pn.
`
`IT, JP, KR, LT, LU, LV,
`MA, MC, MD, MY, NL,
`NO, NZ, OA, PH, PL,
`PT, RO, RS, RU, SE,
`SG, SI, SK, SU, TH,
`TN, TR, TW,UA, VN,
`
`(US-PGPUB; USPAT;
`USOCR; FIT (AP, AT,
`AU, BE, BG, BR, BY,
`CA, CH, CN, CS, CU,
`CZ, DD, DE, DK, EA,
`EE, EP, ES, Fl, FR, GB,
`HR, HU, ID, IE, IL, IS,
`IT, JP, KR, LT, LU, LV,
`MA, MC, MD, MY, NL,
`NO, NZ, OA, PH, PL,
`PT, RO, RS, RU, SE,
`SG, SI, SK, SU, TH,
`TN, TR, TW,UA, VN,
`WO); FPRS; EPO;
`JPO; DERWENT;
`IBM_TDB)
`
`(US-PGPUB; USPAT;
`USOCR; FIT (AP, AT,
`AU, BE, BG, BR, BY,
`CA, CH, CN, CS, CU,
`CZ, DD, DE, DK, EA,
`EE, EP, ES, Fl, FR, GB,
`HR, HU, ID, IE, IL, IS,
`IT, JP, KR, LT, LU, LV,
`MA, MC, MD, MY, NL,
`NO, NZ, OA, PH, PL,
`PT, RO, RS, RU, SE,
`SG, SI, SK, SU, TH,
`TN, TR, TW,UA, VN,
`WO); FPRS; EPO;
`JPO; DERWENT;
`IBM_TDB)
`
`|OR
`
`|OR
`
`2024/09/09
`10:57 AM
`
`2024/09/09
`10:57 AM
`
`|OR
`
`2024/09/09
`
`09/09/2024 04:24:00 PM
`
`Workspace: Wafer Processing Method 17-865727
`
`Page 7 of 10
`LO
`
`
`
`
`
`(Artificial Intelligence)
`Morelike doc:
`US-20070221253-A1
`Text:
`(US-7431038-B2 OR
`JP-4043455-B2 OR
`WO-2005117081-A1
`OR JP-2005340661-A
`OR KR-20070019746-A
`OR KR-101062530-B1
`OR JP-4288207-B2 OR
`JP-2005340381-A OR
`CN-1993810-A OR KR-
`101216872-B1 OR JP-
`2011086826-A OR JP-
`4983885-B2 OR CN-
`100521099-C OR US-
`20140338706-A1 OR
`US-8956465-B2 OR
`CN-102078850-A OR
`CN-102078850-B OR
`US-7344600-B2 OR
`TW-1544535-B OR US-
`20100216078-A1).did.
`2024/09/09
`(L23 AND ((spray$3 OR|(US-PGPUB; USPAT;
`09/09/2024 04:24:00 PM
`
`2024/09/09
`12:40 PM
`
`|OR
`
`2024/09/09
`12:40 PM
`
`"2015/0144164".pn.
`
`"20150144164"pn.
`
`(US-PGPUB; USPAT;
`USOCR; FIT (AP, AT,
`AU, BE, BG, BR, BY,
`CA, CH, CN, CS, CU,
`CZ, DD, DE, DK, EA,
`EE, EP, ES, Fl, FR, GB,
`HR, HU, ID, IE, IL, IS,
`IT, JP, KR, LT, LU, LV,
`MA, MC, MD, MY, NL,
`NO, NZ, OA, PH, PL,
`PT, RO, RS, RU, SE,
`SG, SI, SK, SU, TH,
`TN, TR, TW,UA, VN,
`WO); FPRS; EPO;
`JPO; DERWENT;
`IBM_TDB)
`
`(US-PGPUB; USPAT;
`USOCR; FIT (AP, AT,
`AU, BE, BG, BR, BY,
`CA, CH, CN, CS, CU,
`CZ, DD, DE, DK, EA,
`EE, EP, ES, Fl, FR, GB,
`HR, HU, ID, IE, IL, IS,
`IT, JP, KR, LT, LU, LV,
`MA, MC, MD, MY, NL,
`NO, NZ, OA, PH, PL,
`PT, RO, RS, RU, SE,
`SG, SI, SK, SU, TH,
`TN, TR, TW,UA, VN,
`WO); FPRS; EPO;
`JPO; DERWENT;
`IBM_TDB)
`
`(US-PGPUB; USPAT;
`USOCR; FIT (AU, AP,
`AT, BE, BG, BR, BY,
`CA, CH, CN, CS, CU,
`CZ, DD, DE, DK, EA,
`EE, EP, ES, Fl, FR, GB,
`HR, HU, ID, IE, IL, IS,
`IT, JP, KR, LT, LU, LV,
`MA, OA, RU, SU, WO,
`MC, MD, MY, NL, NO,
`NZ, PH, PL, PT, RO,
`RS, SE, SG, SI, SK,
`TH, TN, TR, TW, UA,
`VN); FPRS; EPO;
`JPO; DERWENT;
`IBM_TDB)
`
`|OR
`
`2024/09/09
`02:39 PM
`
`Workspace: Wafer Processing Method 17-865727
`
`Page 8 of 10
`LO
`
`
`
`
`
`(Artificial Intelligence)
`Morelike doc:
`CN-117912999-A
`Text:
`(CN-114551303-B OR
`CN-117133685-A OR
`CN-116759345-B OR
`KR-101430691-B1 OR
`KR-20140001278-A OR
`CN-116759345-A OR
`CN-115116907-A OR
`CN-118106256-A OR
`TW-1770753-B OR CN-
`114724972-A OR JP-
`2023134520-A OR TW-
`202227198-A OR KR-
`100228141-B1 OR KR-
`19980073404-A OR
`CN-113560298-A OR
`CN-113560298-B OR
`JP-5596071-B2 OR JP-
`2013187492-A OR CN-
`110473773-B OR CN-
`110473773-A).did.
`
`|OR
`
`2024/09/09
`03:05 PM
`
`|OR
`
`2024/09/09
`03:18 PM
`
`2024/09/09
`03:22 PM
`
`Page 9 of 10
`LO
`
`disperse OR stream$3
`OR jet) WITH
`(suction$3 OR suck$3
`OR vacuum$3))) AND
`(arm WITH (swing$3
`OR rotat$3 OR
`swivel$3))
`
`"20180243882"pn.
`
`L6 AND (wafer
`substrate) AND
`
`09/09/2024 04:24:00 PM
`
`Workspace: Wafer Processing Method 17-865727
`
`USOCR; FIT (AP, AT,
`AU, BE, BG, BR, BY,
`CA, CH, CN, CS, CU,
`CZ, DD, DE, DK, EA,
`EE, EP, ES, Fl, FR, GB,
`HR, HU, ID, IE, IL, IS,
`IT, JP, KR, LT, LU, LV,
`MA, MC, MD, MY, NL,
`NO, NZ, OA, PH, PL,
`PT, RO, RS, RU, SE,
`SG, SI, SK, SU, TH,
`TN, TR, TW,UA, VN,
`
`(US-PGPUB; USPAT;
`USOCR; FIT (AU, AP,
`AT, BE, BG, BR, BY,
`CA, CH, CN, CS, CU,
`CZ, DD, DE, DK, EA,
`EE, EP, ES, Fl, FR, GB,
`HR, HU, ID, IE, IL, IS,
`IT, JP, KR, LT, LU, LV,
`MA, OA, RU, SU, WO,
`MC, MD, MY, NL, NO,
`NZ, PH, PL, PT, RO,
`RS, SE, SG, SI, SK,
`TH, TN, TR, TW, UA,
`VN); FPRS; EPO;
`JPO; DERWENT;
`IBM_TDB)
`
`(US-PGPUB; USPAT;
`USOCR; FIT (AU, AP,
`AT, BE, BG, BR, BY,
`CA, CH, CN, CS, CU,
`CZ, DD, DE, DK, EA,
`EE, EP, ES, Fl, FR, GB,
`HR, HU, ID, IE, IL, IS,
`IT, JP, KR, LT, LU, LV,
`MA, OA, RU, SU, WO,
`MC, MD, MY, NL, NO,
`NZ, PH, PL, PT, RO,
`RS, SE, SG, SI, SK,
`TH, TN, TR, TW, UA,
`VN); FPRS; EPO;
`JPO; DERWENT;
`IBM_TDB)
`
`(US-PGPUB; USPAT)
`
`
`
`
`
`(spray$3 WITH (arm
`nozzle)) AND
`(suction$3 WITH (arm
`nozzle))
`
`PE2E SEARCH- Search History (Interference)
`
`There are no Interference searches to show.
`
`09/09/2024 04:24:00 PM
`Workspace: Wafer Processing Method 17-865727
`
`Page 10 of 10
`LO
`
`
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