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`UNITED STATES DEPARTMENT OF COMMERCE
`United States Patent and Trademark Office
`Address: COMMISSIONER FOR PATENTS
`P.O. Box 1450
`Alexandria, Virginia 22313-1450
`
`17/865,727
`
`07/15/2022
`
`Seung Dae BAEK
`
`AJU-0021-ZS
`
`4060
`
`KILE PARK REED & HOUTTEMAN PLLC
`JAE Y PARK
`1101 30th Street, N.W.
`suite 30
`Washington, DC 20007
`
`ORTA, LAUREN GRACE
`
`Pana NO
`
`1711
`
`NOTIFICATION DATE
`
`DELIVERY MODE
`
`09/12/2024
`
`ELECTRONIC
`
`Please find below and/or attached an Office communication concerning this application or proceeding.
`
`The time period for reply, if any, is set in the attached communication.
`
`Notice of the Office communication was sent electronically on above-indicated "Notification Date" to the
`following e-mail address(es):
`
`email @kilepark.com
`info@kilepark.com
`jpark @kilepark.com
`
`PTOL-90A (Rev. 04/07)
`
`

`

`
`
`Application No.
`Applicant(s)
`17/865,727
`BAEK et al.
`
`Office Action Summary Art Unit|AIA (FITF)StatusExaminer
`LAUREN G ORTA
`4153
`Yes
`
`
`
`-- The MAILING DATEof this communication appears on the cover sheet with the correspondence address --
`Period for Reply
`
`A SHORTENED STATUTORYPERIOD FOR REPLYIS SET TO EXPIRE 3 MONTHS FROM THE MAILING
`DATE OF THIS COMMUNICATION.
`Extensionsof time may be available underthe provisions of 37 CFR 1.136(a). In no event, however, may a reply betimely filed after SIX (6) MONTHSfrom the mailing
`date of this communication.
`If NO period for reply is specified above, the maximum statutory period will apply and will expire SIX (6) MONTHSfrom the mailing date of this communication.
`-
`- Failure to reply within the set or extended period for reply will, by statute, cause the application to become ABANDONED (35 U.S.C. § 133).
`Any reply received by the Office later than three months after the mailing date of this communication, evenif timely filed, may reduce any earned patent term
`adjustment. See 37 CFR 1.704(b).
`
`Status
`
`1) Responsive to communication(s)filed on 15 July 2022.
`C) A declaration(s)/affidavit(s) under 37 CFR 1.130(b) was/werefiled on
`
`2a)() This action is FINAL. 2b)¥)This action is non-final.
`3) An election was madeby the applicant in responseto a restriction requirement set forth during the interview
`on
`; the restriction requirement and election have been incorporated into this action.
`4)(2) Since this application is in condition for allowance except for formal matters, prosecution as to the merits is
`closed in accordance with the practice under Exparte Quayle, 1935 C.D. 11, 453 O.G. 213.
`
`Disposition of Claims*
`1-10 is/are pending in the application.
`)
`Claim(s)
`5a) Of the above claim(s) _ is/are withdrawn from consideration.
`C} Claim(s)__ is/are allowed.
`Claim(s) 1-10 is/are rejected.
`(] Claim(s)__ is/are objectedto.
`C] Claim(s
`are subjectto restriction and/or election requirement
`)
`* If any claims have been determined allowable, you maybeeligible to benefit from the Patent Prosecution Highway program at a
`participating intellectual property office for the corresponding application. For more information, please see
`http://www.uspto.gov/patents/init_events/pph/index.jsp or send an inquiry to PPHfeedback@uspto.gov.
`
`) ) ) )
`
`Application Papers
`10)( The specification is objected to by the Examiner.
`11){¥} The drawing(s) filed on 15 July 2022 is/are: a)(¥) accepted or b)() objected to by the Examiner.
`Applicant may not request that any objection to the drawing(s) be held in abeyance. See 37 CFR 1.85(a).
`Replacement drawing sheet(s) including the correction is required if the drawing(s) is objected to. See 37 CFR 1.121(d).
`
`Priority under 35 U.S.C. § 119
`12)(¥) Acknowledgment is made of a claim for foreign priority under 35 U.S.C. § 119(a)-(d)or (f).
`Certified copies:
`_—_c)L) None ofthe:
`b)L) Some**
`a)Y) All
`1.) Certified copies of the priority documents have been received.
`2.1.) Certified copies of the priority documents have been received in Application No. |
`3.2.) Copies of the certified copies of the priority documents have been receivedin this National Stage
`application from the International Bureau (PCT Rule 17.2(a)).
`*“ See the attached detailed Office action for a list of the certified copies not received.
`
`Attachment(s)
`
`1)
`
`Notice of References Cited (PTO-892)
`
`(LJ Interview Summary (PTO-413)
`Paper No(s)/Mail Date
`(Qj Other:
`4)
`Information Disclosure Statement(s) (PTO/SB/08a and/or PTO/SB/08b)
`2)
`Paper No(s)/Mail Date15JULY2022,12MAY2023.
`U.S. Patent and Trademark Office
`
`3)
`
`PTOL-326 (Rev. 11-13)
`
`Office Action Summary
`
`Part of Paper No./Mail Date 20240903
`
`

`

`Application/Control Number: 17/865,727
`Art Unit: 4153
`
`Page 2
`
`Notice of Pre-AlA or AIA Status
`
`1.
`
`The present application, filed on or after March 16, 2013, is being examined under the first
`
`inventor to file provisions of the AIA.
`
`Claim Rejections - 35 USC § 103
`
`2.
`
`The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections
`
`set forth in this Office action:
`
`A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is
`not identically disclosed as set forth in section 102,if the differences between the claimed invention
`and the prior art are such that the claimed invention as a whole would have been obvious before the
`effective filing date of the claimed invention to a person having ordinaryskill in the art to which the
`claimed invention pertains. Patentability shall not be negated by the manner in which the invention
`was made.
`
`3.
`
`The factual inquiries for establishing a background for determining obviousness under 35 U.S.C.
`
`103 are summarized as follows:
`
`1. Determining the scope and contentsofthe prior art.
`
`2. Ascertaining the differences between the prior art and the claims at issue.
`
`3. Resolving the level of ordinary skill in the pertinent art.
`
`4. Considering objective evidence present in the application indicating obviousness or
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`nonobviousness.
`
`4.
`
`Claims 1, 2, and 4-10 are rejected under 35 U.S.C. 103 as being unpatentable over Bleck et al.
`
`U.S. Patent 5,762,751 (henceforth referred to as Bleck) in view of Lee U.S. Publication 2018/0243882
`
`(henceforth referred to as Lee) and Sotozaki et al. Japanese Patent JP2001007069 (henceforth referred
`
`to as Sotozaki).
`
`5.
`
`As to claim 1, Bleck teaches a wafer processing method comprising: mounting a wafer (column 6
`
`line 48 piece holder 130) part on a chuck table (column 4 lines 10-12 FIG. 1 processing base 30is
`
`supported upon a main processor deck 11); loading a ring cover unit (column 4 line 20 FIG. 1 processing
`
`

`

`Application/Control Number: 17/865,727
`Art Unit: 4153
`
`Page 3
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`head 20) on the chuck table to restrain the wafer part to the chuck table; unloading the ring cover unit
`
`from the chuck table (column 10 line 62 disengaging the processing head 20 from the processing base
`
`30).
`
`6.
`
`Bleck differs from the instant claim in failing to teach spraying, by a spray suction arm module,a
`
`processing solution onto the wafer part and suctioning, by the spray suction arm module, foreign
`
`materials floating on the processing solution.
`
`Lee teaches a similar wafer processing method that sprays, by a spray suction arm module, a
`
`processing solution onto the wafer part and suctioning, by the spray suction arm module,foreign
`
`materials floating on the processing solution. Lee teaches a spraying (FIG. 2 paragraph [0073] liquid
`
`spray unit 170), by a spray suction arm module, a processing solution onto the wafer part and suctioning
`
`(FIG. 2 paragraph [0073] suction unit 180), by the spray suction arm module, foreign materials floating
`
`on the processing solution (paragraph [0084] suction unit 180 sucks particles that are generated by the
`
`cleaning liquid).
`
`Therefore, it would have been obvious to one ofordinaryskill in the art before the effective
`
`filing date of the claimed invention to modify the wafer processing method taught by Bleck with the
`
`spray suction arm module taught by Lee to achieve the predictable result of a wafer processing method
`
`that can better control the spraying portion’s flow rates of the processing liquid (paragraph [0079]) and
`
`movementof the spray suction arm module (paragraphs [0081, 0086]), as well as instantaneously
`
`remove contamination from the wafer processing solution (paragraph [0084)]).
`
`The invention of Bleck and Lee differ from the instant claim in failing to teach a wafer processing
`
`method that includes a process of spraying, by a spray arm module, a cleaning solution onto the wafer
`
`part to clean the wafer part.
`
`Sotozaki teaches a similar wafer processing method that teaches spraying, by the spray arm
`
`module, the cleaning solution onto the wafer part to perform intermediate cleaning on the waferpart.
`
`

`

`Application/Control Number: 17/865,727
`Art Unit: 4153
`
`Page 4
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`Sotozaki teaches a spray arm module (paragraph [0016] liquid jet cleaning means 30 and nozzle 31) that
`
`sprays the cleaning solution onto the wafer part to perform intermediate cleaning on the wafer part.
`
`Therefore, it would have been obvious to one ofordinaryskill in the art before the effective
`
`filing date of the claimed invention to modify the wafer processing method taught by Bleck and Lee with
`
`the spray arm module taught by Sotozaki to achieve the predictable result of a wafer processing method
`
`with a spray arm module in order to clean the wafer more thoroughly.
`
`7.
`
`As to claim 2, Bleck further teaches a wafer processing method, wherein the mounting of the
`
`wafer part on the chuck table includes: holding, by a transfer device, the wafer part transferred from a
`
`second transfer module (column 11 lines 6-8 a wafer transfer and lifting mechanism); and lowering the
`
`transfer device to mountthe wafer part on the chuck table (column 11 lines 6-8 a wafer transfer and
`
`lifting mechanism).
`
`8.
`
`As to claim 4, Lee further teaches a wafer processing method, wherein the spraying of (FIG. 2
`
`paragraph [0073] liquid spray unit 170), by the spray suction arm module, the processing solution onto
`
`the wafer part and the suctioning of (FIG. 2 paragraph [0073] suction unit 180), by the spray suction arm
`
`module, the foreign materials from the processing solution include: moving the spray suction arm
`
`module to be positioned above the wafer part (paragraph [0086] liquid spray unit 170 and the suction
`
`unit 180 may swing at the same angular speed or at the same swing speed); swinging the spray suction
`
`arm module within a set angle range to spray the processing solution onto the wafer part (paragraph
`
`[0086] liquid spray unit 170 and the suction unit 180 may swing at the same angular speed or at the
`
`same swing speed); and suctioning (FIG. 2 paragraph [0073] suction unit 180), by the spray suction arm
`
`module, the foreign materials within a certain range.
`
`9.
`
`As to claim 5, Bleck further teaches a wafer processing method, wherein the unloading of the
`
`ring cover unit from the chuck table includes: rotating a tilting device to be positioned abovethe ring
`
`cover unit (column 4 lines 20-22 lateral output shaft 17 is controllably pivoted to place the processing
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`

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`Application/Control Number: 17/865,727
`Art Unit: 4153
`
`Page 5
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`head 20); restraining, by a holding unit of the tilting device, the ring cover unit (column 4 lines 30-31
`
`processing head is lowered into an engaged position); releasing, by a chucking module of the chuck
`
`table, restraint of the ring cover unit (column 4 lines 30-31 processing head can be disengaged and
`
`raised); and rotating, by the tilting device, the ring cover unit to movethe ring cover unit outward from
`
`the chuck table (column 4 lines 20-22 lateral output shaft 17 is controllably pivoted to place the
`
`processing head 20).
`
`10.
`
`As to claim 6, Sotozaki further teaches the spraying of, by the spray arm module (paragraph
`
`[0016] liquid jet cleaning means 30 and nozzle 31), the cleaning solution onto the wafer part to clean the
`
`wafer part includes: moving the spray arm module to be positioned above the wafer part (paragraph
`
`[0016] swing plate 55 of the swing means 50); and swinging the spray arm module within a set angle
`
`range to spray the cleaning solution onto the wafer part to perform final-cleaning on the wafer part
`
`(FIG. 1 paragraph [0016] swing plate 55 of the swing means 50).
`
`11.
`
`As to claim 7, Sotozaki further teaches a wafer processing method, further comprising, before
`
`the unloading of the ring cover unit from the chuck table, spraying, by the spray arm module (paragraph
`
`[0016] liquid jet cleaning means 30 and nozzle 31), the cleaning solution onto the wafer part to perform
`
`intermediate cleaning on the wafer part.
`
`12.
`
`As to claim 8, Sotozaki and Lee further teaches a wafer processing method, wherein the spraying
`
`of, by the spray arm module, the cleaning solution onto the wafer part to perform the intermediate
`
`cleaning on the wafer part includes: moving the spray suction arm module outward from the wafer part
`
`(Lee paragraph [0086] liquid spray unit 170 and the suction unit 180 may swing); moving the spray arm
`
`module to be positioned above the wafer part (paragraph [0016] swing means 50. The spray arm
`
`module can be moved and positioned into place to clean the workpiece); and swinging the spray arm
`
`module within a set angle range to spray the cleaning solution onto the wafer part (FIG. 1 paragraph
`
`[0016] swing plate 55 of the swing means 50).
`
`

`

`Application/Control Number: 17/865,727
`Art Unit: 4153
`
`Page 6
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`13.
`
`As to claim 9, Bleck further teaches a wafer processing method further comprising, after the
`
`spraying of, by the spray arm module, the cleaning solution onto the wafer part to perform the
`
`intermediate cleaning on the wafer part, primarily drying the wafer part on the chuck table (column 5
`
`lines 22-23 a drying nozzle 45 which directs a jet of drying gas toward a wafer).
`
`14.
`
`As to claim 10, Sotozaki further teachesafter the spraying of, by the spray arm module
`
`(paragraph [0016] liquid jet cleaning means 30 and nozzle 31), the cleaning solution onto the wafer part
`
`to clean the waferpart.
`
`Bleck, Lee, and Sotozaki differ from the instant claim in failing to teach that the wafer processing
`
`method will secondarily dry the wafer part on the chuck table. However, as shown above, Bleck teaches
`
`a wafer processing method in which the chuck table can dry the wafer part (column5lines 22-23 a
`
`drying nozzle 45 which directs a jet of drying gas toward a wafer).
`
`Therefore, it would have been obvious to one ofordinaryskill in the art before the effective
`
`filing date of the claimed invention to dry a wafer part as taught by Bleck after spraying a cleaning
`
`solution on the wafer part to achieve the predictable result of a wafer being cleaned and dried more
`
`than once resulting in cleaner and dry workpiece.
`
`15.
`
`Claim 3 is rejected under 35 U.S.C. 103 as being unpatentable over Bleck et al. U.S. Patent
`
`5,762,751 (henceforth referred to as Bleck), Lee U.S. Publication 2018/0243882 (henceforth referred to
`
`as Lee), and Sotozakiet al. Japanese Patent JP2001007069 (henceforth referred to as Sotozaki) as
`
`applied to claim 1 above,in further view of Bergman etal. U.S. Patent 5,357,991 (henceforth referred to
`
`as Bergman) .
`
`16.
`
`As to claim 3, Bleck further teaches a wafer processing method, wherein the loading of the ring
`
`cover unit on the chuck table to restrain the wafer part to the chuck table includes: restraining the ring
`
`coverunit to a holding unit of a device (column 4 lines 15-18 elevator shaft column 16 is used to
`
`

`

`Application/Control Number: 17/865,727
`Art Unit: 4153
`
`Page 7
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`controllably raise and lower the processing head 20); coupling, by the device, the ring cover unit to an
`
`upper side of the chuck table (FIG. 1 column 4 lines 12-14 processing head 20 is advantageously
`
`supported relative to the processor deck 11 using a processing head actuator 15); restraining, by a
`
`chucking module of the chuck table, the ring cover unit (column 4 lines 30-31 processing head is lowered
`
`into an engagedposition); releasing, by the holding unit, restraint of the ring cover unit (column 4 lines
`
`30-31 since the processing head can be lowered into an engaged position,it can also be disengaged to
`
`be removed); and moving the device outward from the chuck table (column 4 lines 20-22 lateral output
`
`shaft 17 is controllably pivoted to place the processing head 20).
`
`17.
`
`Bleck, Lee, and Sotozaki differs from the instant claims in failing to teach that the ring cover is
`
`restrained tois a tilting device.
`
`Bergman teachesa similar wafer processing method in which the processing headis tilted to
`
`removethe ring cover unit. Bergman teachesthat the ring cover unit is restrained by a tilting device
`
`(FIG. 18 processing head 312 can betilted upwards).
`
`Therefore, it would have been obvious to one ofordinaryskill in the art before the effective
`
`filing date of the claimed invention to modify the wafer processing method taught by Bleck with the
`
`tilting device taught by Bergman. The purposeofthe tilting device is to move or remove the processing
`
`head to and from the chuck table. The elevator shaft column 16 taught by Bleck functions in the same
`
`wayin whichit can pivot, raise, and lower the processing head from the chuck table, but Bergman
`
`teaches that the processing head is tilted away from the chuck table. The resulting method of the
`
`processing head taught by Bleck in combination with the tilting device taught by Bergman comprises a
`
`ring cover thatis restrained by a tilting device. While there are several variations that are taught
`
`regarding the removal of the processing head,the tilting device taught by Bergman allowseasier access
`
`for replacementsor repairs of parts (column 19 lines 2-4).
`
`

`

`Application/Control Number: 17/865,727
`Art Unit: 4153
`
`Page 8
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`Conclusion
`
`Any inquiry concerning this communication or earlier communications from the examiner
`
`should be directed to LAUREN G ORTA whosetelephone number is (703)756-5455. The examiner can
`
`normally be reached Monday- Friday 7:30-5:00.
`
`Examiner interviewsare available via telephone, in-person, and video conferencing using a
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`
`the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice.
`
`If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor,
`
`Michael Barr can be reached on 571-272-1414. The fax phone number for the organization wherethis
`
`application or proceeding is assigned is 571-273-8300.
`
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`
`/L.G.0./
`Examiner, Art Unit 1711
`
`/MICHAEL E BARR/
`Supervisory Patent Examiner, Art Unit 1711
`
`