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`FIG. 24
`
`START
`
`MOUNT WAFER PART ON GHUCK TABLE
`
`LOAD RING COVER UNIT ON CHUCK TABLE TO
`RESTRAIN WAFER PART TO CHUCK TABLE
`
`SPRAY, BY SPRAY SUCTION ARM MODULE, PROCESSING
`SOLUTION ONTO WAFER PART TO SUCTION SLUDGE
`
`SPRAY, BY SPRAY ARM MODULE, CLEANING SOLUTION ONTO
`WAFER PART TO PRIMARILY CLEAN WAFER PART
`
`PRIMARILY DRY WAFER PART ON CHUCK TABLE
`
`UNLOAD RING COVE UNIT FROM CHUCK TABLE
`
`SPRAY, BY SPRAY ARM MODULE, CLEANING SOLUTION
`ONTO WAFER PART TO SECONDARILY CLEAN WAFER PART
`
`SECONDARILY DRY WAFER PART ON CHUCK TABLE
`
`END
`
`S11
`
`$12
`
`$138
`
`S14
`
`S15
`
`S16
`
`S17
`
`S518
`
`