WHATIS CLAIMEDIS:
`
`1. A wafer processing method comprising:
`
`mounting a wafer part on a chucktable;
`
`loading a ring cover unit on the chuck table to restrain the wafer part to the chuck
`
`table;
`
`spraying, by a spray suction arm module, a processing solution onto the wafer part
`
`and suctioning, by the spray suction arm module, foreign materials floating on the processing
`
`solution;
`
`10
`
`unloading the ring cover unit from the chuck table; and
`
`spraying, by a spray arm module, a cleaning solution onto the wafer part to clean the
`
`waferpart.
`
`2. The wafer processing method of claim 1, wherein the mounting of the wafer part
`
`15
`
`on the chucktable includes:
`
`holding, by a transfer device,
`
`the wafer part transferred from a second transfer
`
`module; and
`
`lowering the transfer device to mount the wafer part on the chucktable.
`
`20
`
`3. The wafer processing method of claim 1, wherein the loading of the ring cover
`
`unit on the chuck table to restrain the wafer part to the chuck table includes:
`
`restraining the ring coverunit to a holding unit ofa tilting device;
`
`coupling, by the tilting device, the ring cover unit to an upperside of the chucktable;
`
`restraining, by a chucking module of the chucktable, the ring cover unit;
`
`25
`
`releasing, by the holding unit, restraint of the ring cover unit; and
`
`moving the tilting device outward from the chucktable.
`
`4. The wafer processing method of claim 1, wherein the spraying of, by the spray
`
`suction arm module, the processing solution onto the wafer part and the suctioning of, by the
`
`30
`
`spray suction arm module, the foreign materials from the processing solution include:
`
`moving the spray suction arm module to be positioned above the waferpart;
`
`AJU-0021-ZS
`
`34
`
`
`
`swinging the spray suction arm module within a set angle range to spray the
`
`processing solution onto the wafer part; and
`
`suctioning, by the spray suction arm module, the foreign materials within a certain
`
`range.
`
`5. The wafer processing method of claim 1, wherein the unloading of the ring cover
`
`unit from the chuck table includes:
`
`rotating a tilting device to be positioned abovethe ring cover unit;
`
`restraining, by a holding unitofthe tilting device, the ring cover unit;
`
`10
`
`releasing, by a chucking module of the chuck table, restraint of the ring cover unit;
`
`and
`
`rotating, by the tilting device, the ring cover unit to move the ring cover unit outward
`
`from the chucktable.
`
`15
`
`6. The wafer processing method of claim 1, wherein the spraying of, by the spray
`
`arm module, the cleaning solution onto the wafer part to clean the wafer part includes:
`
`moving the spray arm module to be positioned above the wafer part; and
`
`swinging the spray arm module within a set angle range to spray the cleaning solution
`
`onto the wafer part to perform final—cleaning on the waferpart.
`
`20
`
`7.
`
`The wafer processing method of claim 1,
`
`further comprising, before the
`
`unloading of the ring cover unit from the chuck table, spraying, by the spray arm module, the
`
`cleaning solution onto the wafer part to perform intermediate cleaning on the waferpart.
`
`25
`
`8. The wafer processing method of claim 7, wherein the spraying of, by the spray
`
`arm module, the cleaning solution onto the wafer part to perform the intermediate cleaning on
`
`the wafer part includes:
`
`moving the spray suction arm module outward from the waferpart;
`
`moving the spray arm module to be positioned above the wafer part; and
`
`30
`
`swinging the spray arm module within a set angle range to spray the cleaning solution
`
`onto the waferpart.
`
`AJU-0021-ZS
`
`35
`
`
`
`9. The wafer processing method of claim 8, further comprising, after the spraying of,
`
`by the spray arm module,
`
`the cleaning solution onto the wafer part
`
`to perform the
`
`intermediate cleaning on the wafer part, primarily drying the wafer part on the chucktable.
`
`10. The wafer processing method of claim 9, further comprising, after the spraying
`
`of, by the spray arm module, the cleaning solution onto the wafer part to clean the wafer part,
`
`secondarily drying the wafer part on the chucktable.
`
`AJU-0021-ZS
`
`36
`
`
