WAFER PROCESSING METHOD
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`CROSS-REFERENCE TO RELATED APPLICATION
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`This application claims priority to and the benefit of Korean Patent Application No.
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`10-2021-0107501, filed on August 13, 2021, the disclosure of which is incorporated herein by
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`reference inits entirety.
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`1.
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`Field of the Invention
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`BACKGROUND
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`The present invention relates to a wafer processing method, and moreparticularly, to
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`a wafer processing method capable of shortening a wafer part processing time and improving
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`wafer part processing and cleaning performance.
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`2.
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`Discussion of Related Art
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`In general, in a semiconductor process, an etching process of etching wafer parts, a
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`singulation process of sawing the waferparts into a plurality of dies, and a cleaning process of
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`cleaning the wafer parts are performed. A wafer processing apparatus is used in the wafer
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`etching process or the cleaning process.
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`The wafer processing apparatus includes a rotary table which is rotatably installed
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`and on which a wafer part is mounted, and a sealing ring coupled to an edgearea of the rotary
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`table in a ring shape. A processing solution is supplied onto the wafer part mounted on the
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`rotary table while the rotary table rotates.
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`A background technique of the present
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`invention is disclosed in Korean Patent
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`Publication No. 10-2016-0122067 (published on October 21, 2016, and titled “Wafer
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`processing apparatus andsealing ring for wafer processing apparatus’).
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`SUMMARYOF THE INVENTION
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`The present invention is directed to providing a wafer processing method capable of
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`shortening a wafer part processing time and improving wafer part processing and cleaning
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`performance.
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`According to an aspect of the present invention, there is provided a wafer processing
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`method includes mounting a wafer part on a chuck table, loading a ring cover unit on the
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`chuck table to restrain the wafer part to the chuck table, spraying, by a spray suction arm
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`module, a processing solution onto the wafer part and suctioning, by the spray suction arm
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`module, foreign materials floating on the processing solution, unloading the ring cover unit
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`from the chuck table, and spraying, by a spray arm module, a cleaning solution onto the wafer
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`part to clean the waferpart..
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`The mounting of the wafer part on the chuck table may include holding, by a transfer
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`device, the wafer part transferred from a second transfer module, and lowering the transfer
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`device to mount the wafer part on the chucktable.
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`The loading of the ring cover unit on the chuck table to restrain the wafer part to the
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`chuck table may include restraining the ring cover unit to a holding unit ofa tilting device,
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`coupling, by the tilting device,
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`the ring cover unit to an upper side of the chuck table,
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`restraining, by a chucking module of the chuck table, the ring cover unit, releasing, by the
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`holding unit, restraint of the ring cover unit, and moving thetilting device outward from the
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`chucktable.
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`The spraying of, by the spray suction arm module, the processing solution onto the
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`wafer part and the suctioning of, by the spray suction arm module, the foreign materials from
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`the processing solution may include moving the spray suction arm module to be positioned
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`above the wafer part, swinging the spray suction arm module within a set angle range to spray
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`the processing solution onto the wafer part, and suctioning, by the spray suction arm module,
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`the foreign materials within a certain range.
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`The unloading of the ring cover unit from the chuck table may include rotating a
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`tilting device to be positioned above the ring cover unit, restraining, by a holding unit of the
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`tilting device, the ring cover unit, releasing, by a chucking module of the chucktable, restraint
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`of the ring cover unit, and rotating, by the tilting device, the ring cover unit to movethe ring
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`cover unit outward from the chucktable.
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`The spraying of, by the spray arm module, the cleaning solution onto the wafer part to
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`clean the wafer part may include moving the spray arm module to be positioned above the
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`wafer part, and swinging the spray arm module within a set angle range to spray the cleaning
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`solution onto the wafer part to perform final—cleaning on the waferpart.
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`The wafer processing method may further include, before the unloading of the ring
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`cover unit from the chucktable, spraying, by the spray arm module, the cleaning solution onto
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`the wafer part to perform intermediate cleaning on the waferpart.
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`The spraying of, by the spray arm module, the cleaning solution onto the wafer part to
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`perform the intermediate cleaning on the wafer part may include moving the spray suction
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`arm module outward from the wafer part, moving the spray arm module to be positioned
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`above the wafer part, and swinging the spray arm module within a set angle range to spray the
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`cleaning solution onto the waferpart.
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`The wafer processing method mayfurther include, after the spraying of, by the spray
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`arm module, the cleaning solution onto the wafer part to perform the intermediate cleaning on
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`the wafer part, primarily drying the wafer part on the chucktable.
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`The primarily drying of the wafer part on the chuck table may include moving the
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`spray arm module outward from the chuck table and rotating the chuck table to primarily dry
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`the waferpart.
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`The wafer processing method may include, after the spraying of, by the spray arm
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`module, the cleaning solution onto the wafer part to clean the wafer part, secondarily drying
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`the wafer part on the chucktable.
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`The secondarily drying of the wafer part on the chuck table may include moving the
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`spray arm module outward from the chuck table and rotating the chuck table to secondarily
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`dry the waferpart.
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`BRIEF DESCRIPTION OF THE DRAWINGS
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`FIG. 1 is a schematic plan view illustrating a wafer part according to one embodiment
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`of the present invention.
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`FIG. 2 is a schematic block diagram illustrating a wafer processing apparatus
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`according to one embodimentof the present invention.
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`FIGS. 3A AND 3B show schematic plan views illustrating a vision aligner in the
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`wafer processing apparatus according to one embodiment of the present invention.
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`FIG.4 is a schematic plan view illustrating a first processing chamber and a second
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`processing chamberin the wafer processing apparatus according to one embodimentof the
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`present invention.
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`FIG. 5 is a schematic side view illustrating a transfer device in the wafer processing
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`apparatus according to one embodimentof the present invention.
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`FIG.6 is a schematic plan view illustrating the transfer device in the wafer processing
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`apparatus according to one embodimentof the present invention.
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`FIG.7 is a schematic side view illustrating a gripper unit in the transfer device of the
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`wafer processing apparatus according to one embodiment of the present invention.
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`FIG. 8 is a schematic side view illustrating a state in which the gripper unit is drawn
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`out of the transfer device of the wafer processing apparatus according to one embodiment of
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`the present invention.
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`FIG. 9 is a schematic side view illustrating a tilting device in the wafer processing
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`apparatus according to one embodimentof the present invention.
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`FIG. 10 is a schematic side view illustrating a state in which a holding unit is lowered
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`in the tilting device of the wafer processing apparatus according to one embodiment of the
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`present invention.
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`FIG. 11 is a schematic plan view illustrating the holding unit of the tilting device in
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`the wafer processing apparatus according to one embodimentof the present invention.
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`FIG. 12 is a schematic rear view of the holding unit of the tilting device in the wafer
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`processing apparatus according to one embodimentof the present invention.
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`FIG. 13 is a schematic enlarged view illustrating the holding unit of the tilting device
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`in the wafer processing apparatus according to one embodimentof the present invention.
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`FIG. 14 is a schematic cross-sectional view illustrating a chuck table device in the
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`wafer processing apparatus according to one embodiment of the present invention.
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`FIG. 15 is a schematic plan view illustrating a chucking module of the chuck table
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`device in the wafer processing apparatus according to one embodiment of the present
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`invention.
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`FIG. 16 is a schematic enlarged view illustrating the chucking module in the chuck
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`table device of the wafer processing apparatus according to one embodiment of the present
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`invention.
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`FIG. 17 is a schematic cross-sectional view illustrating a state in which the chucking
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`module restrains a ring cover unit in the chuck table device of the wafer processing apparatus
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`according to one embodiment of the present invention.
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`FIG. 18 is a schematic plan view illustrating a processing solution spray device of the
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`wafer processing apparatus according to one embodiment of the present invention.
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`FIG. 19 is a schematic perspective view illustrating a spray arm module in the
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`processing solution spray device of the wafer processing apparatus according to one
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`embodimentof the present invention.
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`FIG. 20 is a schematic enlarged view illustrating a first spray nozzle unit of the spray
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`arm module in the processing solution spray device of the wafer processing apparatus
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`according to one embodiment of the present invention.
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`FIG. 21 is a schematic enlarged view illustrating a second spray nozzle unit and a
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`second suction nozzle unit of a spray suction arm module in the processing solution spray
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`device of the wafer processing apparatus according to one embodiment of the present
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`invention.
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`FIG. 22 is a schematic view illustrating a suction tank connected to the second
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`suction nozzle unit of the spray suction arm module in the processing solution spray device of
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`the wafer processing apparatus according to one embodimentof the present invention.
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`FIGS. 23A TO 23H show schematic viewsillustrating a wafer processing method
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`according to one embodiment of the present invention.
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`FIG. 24 is a schematic flowchart illustrating the wafer processing method according
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`to one embodimentof the present invention.
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`DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS
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`Hereinafter, embodiments of a wafer processing method according to the present
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`invention will be described with reference to the accompanying drawings.
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`In describing the
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`wafer processing method, thicknesses of lines or sizes of components shown in the drawings
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`may be exaggerated for the sake of convenience and clarity in description.
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`Furthermore,
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`terminologies used herein are defined by taking functions of the present invention into
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`account and may be changed according to a custom or the intent of a user or an operator.
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`Accordingly, the terminologies should be defined based on the following overall description
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`of the present specification.
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`FIG. 1 is a schematic plan view illustrating a wafer part according to one embodiment
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`of the present invention.
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`FIG. 2 is a schematic block diagram illustrating a wafer processing
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`apparatus according to one embodiment of the present invention.
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`FIGS. 3A AND 3B show
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`schematic plan viewsillustrating a vision aligner in the wafer processing apparatus according
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`to one embodimentof the present invention.
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`Referring to FIGS.
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`1
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`to 3, a wafer processing apparatus 1 according to one
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`embodiment of the present invention processes a ring frame wafer part 10. The ring frame
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`wafer part 10 etched in an etching process is sawn in the form of a matrix in a singulation
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`process. The ring frame wafer part 10 includes a wafer 11 including a plurality of dies sawn
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`and arranged in the form of a matrix, an adhesive sheet 12 to which the wafer 11 is attached,
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`and a retainer ring portion 13 connected to a circumferential portion of the adhesive sheet 12
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`to tightly support the adhesive sheet 12. The adhesive sheet 12 is made of a material that is
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`stretchable or contractible in a horizontal direction. The adhesive sheet 12 is pulled tight by
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`the retainer ring portion 13 so that the plurality of dies are positioned and fixed, and the die,
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`which is a thin plate, maintains a flat plate shape. Hereinafter, the ring frame wafer part 10
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`will be referred to as a wafer part 10.
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`A wafer cassette 20 is a front opening unified pod (FOUP) which has an internal
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`space sealed from the outside, in which a plurality of wafer parts 10 are loaded, and which,
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`along with the wafer part 10, moves between unit process apparatuses. The wafer cassette
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`20 transferred to the unit process apparatus is mounted on an upper surface of a load port
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`module (not shown) disposed at one side of the unit process apparatus, and while an internal
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`space of the wafer cassette 20 is sealed from the outside, a wafer part cassette door (not
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`shown)
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`is opened.
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`Accordingly,
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`the wafer part
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`10 can be prevented from being
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`contaminated from an external environment and can be moved between the unit process
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`apparatuses.
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`The wafer part 10 loaded in the wafer cassette 20 is adsorbed by a first transfer
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`module 50 and loaded on a buffer unit 30. The buffer unit 30 includes two pre-slots (not
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`shown) and two post-slots (not shown). As the first
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`transfer module 50, a vacuum
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`adsorption robot for adsorbing the wafer part 10 using a vacuum may be applied.
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`The wafer part 10 loaded on the buffer unit 30 is mounted on a vision aligner 40 by
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`the first transfer module 50. The vision aligner 40 includes an aligner table 41 on which the
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`wafer part 10 is mounted, and a vision unit (not shown) which reads the wafer part 10 by
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`irradiating light onto the aligner table 41. The vision aligner 40 may rotate at an angle of
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`about 4° with respect to a center of the aligner table 41 and may laterally move to a distance
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`10
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`of about 7 mm with respect to the center of the aligner table 41. The vision unit may read a
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`position of the wafer part 10 and a center of the wafer 11 to align the position of the wafer
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`part 10.
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`In this case, the vision unit reads whether the center of the wafer 11 and a center of
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`the retainer ring portion 13 match each other and aligns the wafer part 10 such that the center
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`of the wafer 11 is aligned at a correct position.
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`The wafer part 10 aligned in the vision aligner 40 is loaded into a first processing
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`chamber70 and a second processing chamber 80 by a second transfer module 60.
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`In thefirst
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`processing chamber70, a processing solution is sprayed onto the wafer part 10 to process the
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`wafer part 10. A plurality of second processing chambers 80 are installed.
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`In the second
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`processing chamber 80, a processing solution is sprayed onto the wafer part 10, and
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`simultaneously, foreign materials floating on an upper side of the processing solution are
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`suctioned to process the wafer part 10.
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`FIG. 4 is a schematic plan view illustrating the first processing chamber and the
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`second processing chamberin the wafer processing apparatus according to one embodiment
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`of the present invention.
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`Referring to FIG. 4, an ionizer 102, a transfer device 100, a tilting device 200, a
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`chuck table device 300, a spray device 400, and a suction device 500 are installed in the first
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`processing chamber 70.
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`Anionizer 102, a transfer device 100, a tilting device 200, a chuck
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`table device 300, and a spray device 400are installed in the second processing chamber80.
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`The ionizer 102 is installed above each of the first processing chamber 70 and the
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`second processing chamber 80. The ionizer 102 removesstatic electricity generated during a
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`processing process and a non-processing process of the wafer part 10.
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`Since the ionizer 102
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`prevents static electricity from being generated on the wafer part 10 and inside the first
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`processing chamber 70 and the second processing chamber 80, foreign materials can be
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`prevented from being reattached to the wafer part 10 by static electricity.
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`When air as a supply gas is supplied to the ionizer 102 and deionized water (DI
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`water) as a cleaning solution is supplied, positive ions and negative ions ionized through the
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`ionizer 102, along with the cleaning solution, may be sprayed onto the wafer part 10.
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`Before DI water including positive ions and negative ions is sprayed onto the wafer
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`part 10, an electrostatic potential of the wafer part 10 was measured to be approximately 3.6
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`kV. On the other hand, after DI water including positive ions and negative ions is sprayed
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`10
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`onto the wafer part 10, the electrostatic potential was measured to be in a range of about -0.10
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`kV to -0.17 kV.
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`Theelectrostatic potential of such a negative voltage causes an amount of
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`positive ions to be increased by the ionizer 102, thereby controlling the static electricity of the
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`wafer part 10 to be close to “zero” whichis an ideal value.
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`FIG. 5 is a schematic side view illustrating the transfer device in the wafer processing
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`apparatus according to one embodimentof the present invention.
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`FIG. 6 is a schematic plan
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`view illustrating the transfer device in the wafer processing apparatus according to one
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`embodiment of the present invention.
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`FIG. 7 is a schematic side view illustrating a gripper
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`unit in the transfer device of the wafer processing apparatus according to one embodimentof
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`the present invention.
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`FIG. 8 is a schematic side view illustrating a state in which the
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`gripper unit is drawn out of the transfer device of the wafer processing apparatus according to
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`one embodiment of the present invention.
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`Referring to FIGS. 5 to 8, the transfer device 100 is installed at both sides of the
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`chuck table device 300. The transfer device 100 mounts the wafer part 10 transferred from
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`the second transfer module 60 on the chuck table device 300.
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`The transfer device 100 includesa lifting unit 120, a transfer unit 130, and a gripper
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`unit 140.
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`The lifting unit 120 is installed outside a chuck table 320 and 330. One pair of
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`lifting units 120 are installed at both sides of the chuck table 320 and 330 in a radial direction.
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`Thelifting unit 120 is installed under a base unit 110.
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`Asthelifting unit 120, any type such
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`as a ball screw type, a linear motor types, or a belt driving type may be applied.
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`The transfer unit 130 is connected to the lifting unit 120 to be lifted or lowered by the
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`lifting unit 120 and is disposed outside the chuck table 320 and 330. The transfer unit 130 is
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`installed at each of the lifting units 120. The transfer unit 130 is installed above the base unit
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`110.
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`The gripper unit 140 is reciprocally installed in the transfer unit 130 to hold or place
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`the wafer part 10. The gripper unit 140 is installed in each of one pair of transfer units 130.
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`Onepair of gripper units 140 support both sides of a ring frame portion 15 of the wafer part
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`10. The gripper unit 140 receives the wafer part 10 transferred by the second transfer
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`module 60 andis lowered by the lifting unit 120 to mount the gripper unit 140 on the chuck
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`10
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`table 320 and 330.
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`Since the lifting unit 120 and the transfer unit 130 are disposed outside the chuck
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`table 320 and 330, and the gripper unit 140 is disposed vertically parallel to the lifting unit
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`120 and the transfer unit 130, it is possible to considerably reduce an installation space of the
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`gripper unit 140 and a movement path of the gripper unit 140. Accordingly, even in a
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`narrow space, the wafer part 10 can be received from the second transfer module 60 and
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`mounted on the chuck table 320 and 330, and the processed wafer part 10 can be unloaded
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`from the chuck table 320 and 330.
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`Thelifting unit 120 includesa lifting arm driving part 122 disposed underthe transfer
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`unit 130, a power transmission part 123 connected to the lifting arm driving part 122, and a
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`linear guide part 124 connected to the power transmission part 123 to lift or lower the transfer
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`unit 130.
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`Thelifting arm driving part 122 may be disposed outside a case unit 121, and the
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`power transmission part 123 and the linear guide part 124 may be disposed inside the case
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`unit 121. When the lifting arm driving part 122 transmits power to the power transmission
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`part 123, the linear guide part 124 maybe lifted or lowered in the case unit 121 to vertically
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`movethe transfer unit 130.
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`A motor part may be applied as the lifting arm driving part 122.
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`The power
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`transmission part 123 may beaball screw rotated by the lifting arm driving part 122.
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`The linear guide part 124 includes fixed guide portions 125 vertically disposed in
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`parallel on the lifting arm driving part 122, a moving guide portion 126 coupled to the fixed
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`guide portion 125 to be lifted or lowered and connected to the power transmission part 123 to
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`be movable by the powertransmission part 123, and a lifting rod 127 connected to the moving
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`guide portion and the transfer unit 130. The fixed guide portions 125 may be fixed rail
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`portions vertically disposed in parallel inside the case unit 121. The moving guide portion
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`126 maybe slidably coupled to the fixed guide portion 125.
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`Thelifting rod 127 is installed
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`in the case unit 121 to be vertically movable. When the lifting arm driving part 122 1s driven,
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`the moving guide portion 126 is moved along the fixed guide portion 125, and thelifting rod
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`127 is moved by the moving guide portion 126. Accordingly, a vertical stroke of the transfer
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`unit 130 can be accurately controlled.
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`The gripper unit 140 includes a gripper driving part 141, at least one pinion portion
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`142, a plurality of rack gear portions 145 and 146, and a finger part 147.
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`The gripper driving part 141 is installed in the transfer unit 130. As the gripper
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`driving part 141, any form such as a hydraulic cylinder, a ball screw, or a belt driving type
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`motor part may be applied.
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`At least one pinion portion 142is installed to be connected to the gripper driving part
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`141 and be movable by the gripper driving part 141.
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`The plurality of rack gear portions 145 and 146 are installed to be engaged with the
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`pinion portion 142 and are movedbythe rotation of the pinion portion 142. The rack gear
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`portions 145 and 146 are movably installed at both sides of the pinion portion 142. When
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`one pinion portion 142 is installed, two rack gear portions 145 and 146 maybe installed to be
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`engaged with both sides of the pinion portion 142. When two pinion portions 142 are
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`installed, three rack gear portions 145 and 146 maybe installed to be engaged with both sides
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`of the pinion portions 142.
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`The finger part 147 extends from one rack gear portion 146 to hold the wafer part 10.
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`In this case, the finger part 147 is installed at one rack gear portion 146 that is moved farthest
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`from the transfer unit 130 whenthe gripper driving part 141 is driven.
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`Hereinafter, the gripper unit 140 in which one pinion portion 142 and two rack gear
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`portions 145 and 146 areinstalled will be described.
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`A pinion tooth portion (not shown) is formed on an outer surface of the pinion portion
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`142.
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`In this case, the plurality of rack gear portions 145 and 146 include a first rack gear
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`portion 145 whichis installed to be engaged with the pinion portion 142 and reciprocates by
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`the rotation of pinion portion 142 and a second rack gear portion 146 whichis installed to be
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`engaged with the pinion portion 142 and reciprocates by the rotation of the pinion portion 142
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`and from which the finger part 147 extends.
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`In this case, the pinion portion 142 is disposed
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`between the first rack gear portion 145 and the second rack gear portion 146.
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`In addition,
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`the pinion tooth portion of the pinion portion 142is installed to be engaged with an upperside
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`of the first rack gear portion 145 and a lowerside of the second rack gear portion 146.
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`The first rack gear portion 145 is fixed to a housing unit 131 of the transfer unit 130,
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`and the second rack gear portion 146 is moved bythe translation and rotation of the pinion
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`portion 142. When the gripper driving part 141 is driven,
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`the pinion portion 142
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`simultaneously performs translational motion and rotational motion along the first rack gear
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`portion 145 so that the second rack gear portion 146 moves to a certain distance by the
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`translational motion and rotational motion of the pinion portion 142. Accordingly,
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`the
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`second rack gear portion 146 may moveto a distance about twice a distance by which the
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`gripper driving part 141 movesthe pinion portion 142 so that a stroke of the finger part 147
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`may considerably increase as compared with a stroke of the gripper driving part 141.
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`The pinion portion 142 includes a slider portion 143 which is connected to the gripper
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`driving part 141 andis installed between the first rack gear portion 145 and the second rack
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`gear portion 146 to reciprocate and a pinion gear portion 144 whichis rotatably coupled to the
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`slider portion 143 and movesthe second rack gear portion 146 while moving together with the
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`slider portion 143. The slider portion 143 is disposed parallel with the first rack gear portion
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`146 and the second rack gear portion 146. When the gripper driving part 141 is driven, the
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`pinion gear portion 144 performs translational motion in a linear direction together with the
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`slider portion 143 and is engaged with the first rack gear portion 145 to perform rotational
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`motion.
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`The gripper driving part 141 includes a cylinder 141a installed in the transfer unit 130,
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`a moving rod 141b movably installed in the cylinder 141a, and a connection link portion 141¢
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`connected to the moving rod 141b and the slider portion 143. The connection link portion
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`141c extends upward from the moving rod 141b of the cylinder 141a to be connected to the
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`slider portion 143. The connection link portion 141c is moved in a linear direction by the
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`moving rod 141b of the cylinder 141a. As the moving rod 141b is moved,the slider portion
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`143 is moved.
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`The finger part 147 includes a vacuum adsorption part 148 which holds the wafer part
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`10 through vacuum adsorption. Two or more vacuum adsorption parts 148 may be installed
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`in the finger part 147. The vacuum adsorption part 148 vacuum-adsorbs the ring frame
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`portion 15 of the wafer part 10. A vacuum flow path (not shown) may be formed inside the
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`finger part 147 to form a vacuum in the vacuum adsorption part 148.
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`FIG. 9 is a schematic side view illustrating a tilting device in the wafer processing
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`apparatus according to one embodimentof the present invention.
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`FIG. 10 is a schematic side
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`view illustrating a state in which a holding unit is lowered in the tilting device of the wafer
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`processing apparatus according to one embodiment of the present invention.
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`FIG. 11 is a
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`schematic plan view illustrating the holding unit of the tilting device in the wafer processing
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`apparatus according to one embodimentof the present invention.
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`FIG. 12 is a schematic rear
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`10
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`view of the holding unit of the tilting device in the wafer processing apparatus according to
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`one embodiment of the present invention.
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`FIG. 13 is a schematic enlarged view illustrating
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`the holding unit of the tilting device in the wafer processing apparatus according to one
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`embodimentof the present invention.
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`Referring to FIGS. 9 to 13, a tilting device 200 includes a tilting motor unit 210, a
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`15
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`tilting unit 220,a lifting unit 230, and a holding unit 240.
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`The chuck table device 300is installed underthe tilting device 200. The chucktable
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`device 300is installed to be rotatable by a chuck driving unit 310. As the chuck driving unit
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`310, a motor unit such as a belt driving type or a gear driving type may be applied.
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`The chuck table device 300 is installed on a rotating shaft 311 to be rotated by the
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`20
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`rotating shaft 311. A wafer part 10 is mounted on a vacuum chuckunit 330. A plurality of
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`chuck pins 303 are installed to protrude from a circumferential portion of the vacuum chuck
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`unit 330 and fix a ring coverunit 201.
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`Thetilting device 200 holds the ring cover unit 201 and couples the ring cover unit
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`201 to the chuck table device 300. A plurality of fixing holes 202 are formed in a lower
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`25
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`portion of a circumferential portion of the ring cover unit 201 such that the plurality of chuck
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`pins 303 are inserted thererin when the ring cover unit 201 is seated on the chuck table device
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`300.
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`In addition, a plurality of restraining grooves 203 (see FIG. 17) are formed in an outer
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`surface of the circumferential portion of the ring cover unit 201 to be held by the holding unit
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`240. The plurality of restraining grooves 203 are formed to face locking pins 259 of the
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`30
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`holding unit 240. The ring cover unit 201 seals a circumferential portion of the wafer part
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`10 mounted on the vacuum chuck unit 330 to prevent a processing solution from permeating
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`AJU-0021-ZS
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`into the circumferential portion of the wafer part 10 and the ring cover unit 201 when the
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`wafer part 10 is processed.
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`The tilting unit 220 is rotatably connected to a tilting shaft 212 of the tilting motor
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`unit 210. A tilting arm 222 is formed in thetilting unit 220 to be connected to the tilting
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`shaft 212 of the tilting motor unit 210.
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`Thetilting unit 220 maintainsa state of being erected
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`upward in a standby state. The tilting motor unit 210 horizontally rotates the tilting unit 220
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`to be positioned above the vacuum chuck unit 330 when the ring cover unit 201 is coupled to
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`the circumferential portion of the vacuum chuck unit 330. A setting module (not shown)
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`capable of setting the initial position of the holding unit 240 in a horizontal direction is
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`10
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`installed in the tilting unit 220 to horizontally position the holding unit 240 at a coupling
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`position of the ring cover unit 201.
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`installed in a central portion of the tilting unit 220.Alifting rod 233 ofthe lifting unit 230 is
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`The lifting unit 230 is installed in the tilting unit 220. The lifting unit 230 is
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`installed to pass through the central portion of the tilting unit 220. A plurality of lifting
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`15
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`guide portions are installed in the tilting unit 220 to guide the lifting and lowering of the
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`lifting unit 230.
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`The holding unit 240 is connected to the lifting unit 230 to be lifted or lowered by the
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`lifting unit 230 and holds the ring cover unit 201. Before the wafer part 10 is mounted on
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`the vacuum chuck unit 330, the holding unit 240 is positioned in a standby state in which the
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`20
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`holding unit 240 is vertically erected while holding the ring cover unit 201.
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`When the wafer part 10 is mounted on the vacuum chuck unit 330, as the tilting
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`motor unit 210 is driven, the tilting unit 220 and the holding unit 240 are horizontally rotated.
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`Whenthe rotation of the tilting unit 220 and the holding unit 240 is completed, as thelifting
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`unit 230 is driven, the holding unit 240 is moved underthe tilting unit 220.
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`In this case, the
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`25
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`tilting unit 220 is not lowered together with the lifting unit 230 and maintains a horizontal
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`state without any change.
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`The holding unit 240 is lowered to mount the ring cover unit 201 on the vacuum
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`chuck unit 330.
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`In order to continuously maintain a state in which the ring cover unit 201 is
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`coupled to the vacuum chuck unit 330 until the ring cover unit 201 is completely chucked to a
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`30
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`chucking module 350 (see FIG. 15) of the vacuum chuck unit 330, the holding unit 240
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`maintainsa state of being loweredbythelifting unit 230.
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`When the coupling of the ring cover unit 201 to the vacuum chuck unit 330 is
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`completed, as the lifting unit 230 is driven, the holding unit 240 is moved upward to come
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`into contact with a lower side of the tilting unit 220 or to be slightly spaced apart therefrom.
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`When the holding unit 240 is completely moved upward, as the tilting motor unit 210 is
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`driven, the tilting unit 220 and the holding unit 240 are rotated to enter a standby state in
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`whichthetilting unit 220 and the holding unit 240 are erected vertically or almostvertically.
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`In order to correct a coupling deviation of the holding unit 240 when the holding unit
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`240 couples the ring cover unit 201 to the vacuum chuck unit 330, position correction units
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`260 are installed at the lifting unit 230 and the holding unit 240 to be floatable. The
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`10
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`coupling deviation refers to a deviation in which the locking pin 259 of the holding unit 240 is
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`misaligned with the restraining groove 203 of the ring cover unit 201 when the holding unit
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`240 and the ring cover unit 201 are coupled.
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`The position correction unit 260 includes a thrust portion 261 and an elastic member
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`268.
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`15
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`A plurality of thrust p