`
`A semiconductorstructure includes: a first base having a first face, a second base having
`
`a second face and a welded structure. The first base is provided with an electrical connection
`
`column protruding from thefirst face. A conductive column is provided in the second base, and
`
`a first groove and a second groove are further provided at the second face. The first grooveis
`
`located above the conductive column, and the second groove exposesat least part of a side
`
`surface of the conductive column. The protruding portion of the electrical connection column
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`is located in the second groove, and part of a side surface of the electrical connection column
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`and part of the side surface of the conductive column overlap in staggered way in a direction
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`perpendicularto the first face or the second surface. At least part of the welded structureis filled
`
`in the first groove.
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`28
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`

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