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`Notice
`This translation is machine- generated. It cannotbe guaranteed that it is intelligible accurate, complete, reliable or
`fit for specific purposes. Critical decisions, such as commercially relevantorfinancial decisions, should not be
`based on machine- translation output.
`
`DESCRIPTION CN110648589A
`70 display screen
`
`[0001]
`14T echnical field
`
`[0002]
`78 T he present invention relates to a display device, andin particular to a flexible display device having a bending
`sensor unit.
`
`[0003]
`23 Backgroundtechnique
`
`[0004]
`27In recentyears, flexible electronic devices have becomeoneof the focuses of the developmentof new
`generation electronic device technology.
`29T herefore, the demandfordisplay devices that can be integrated into flexible electronic devices is also gradually
`increasing.
`31 Flexible display device meansa display device that can be curved,folded, stretched, flexed, bent, or otherwise
`deformed similarly.
`33In order to improve the functions and performanceofflexible display devices, it is necessary to detect the
`bending state offlexible display devices to display corresponding images and provide corresponding control
`signals. T he above requirements arestill an importantissue for manufacturers.
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`[0005]
`39 Contents of theinvention
`
`[0006]
`43 T he present invention provides a display device, which includes a flexible substrate, a display layer and a
`plurality of bending sensorunits.
`45 The display layer is disposed on theflexible substrate and includes a plurality of light emitting units.
`46Aplurality of bend sensorunits are provided on the display layer. In a top view direction of the display device,
`at least one ofthe plurality of bend sensor units is disposed between at least two adjacentlight- emitting units
`among the plurality of light-emitting units and does not overlap with the two adjacentlight- emitting units.
`
`[0007]
`52 Description of the drawings
`
`[0008]
`56 FIG. 1 isa schematic top view of a display device accordingto a first embodimentof the present invention.
`
`[0009]
`60 FIG. 2isa partially enlarged top view ofthe display area of the display device shownin FIG. 1.
`
`[0010]
`64FIG. 3 isa schematic cross-sectional view of the display device shownin FIG. 2 along the tangent line A-B.
`
`[0011]
`68 FIG. 4 isan enlarged partial cross-sectional view ofthe display device shown in FIG. 3 ina bentstate.
`
`[0012]
`72F1G. 5isa partially enlarged top view of the display area of thefirst variation of thefirst embodimentof the
`display device of the present invention.
`
`[0013]
`776a and 6b are partial enlarged schematic diagrams of wires in other modified embodiments ofthefirst
`embodimentofthe present invention.
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`[0014]
`s2FIG. 7isa partially enlarged top view ofthe display area of the second modified enbodiment ofthefirst
`embodimentof the display device of the present invention.
`
`[0015]
`s7 FIG. 8isa partially enlarged top view ofthe display area of the display device accordingto the second
`embodimentofthe present invention.
`
`[0016]
`92 FIG. 9is.a schematic cross-sectional view ofthe display device shownin FIG. 8 along the tangent line A-B.
`
`[0017]
`96 FIG. 10 isa partially enlarged top view ofthe display area of the third embodimentofthe display device of the
`present invention.
`
`[0018]
`101 FIG. 11 is aschematic cross-sectional view ofthe display device shown in FIG. 10 along the tangentline A-B.
`
`[0019]
`105 FIG. 12 is a partially enlarged top view ofthe display area of the fourth embodimentof the display device of
`the present invention.
`
`[0020]
`110 Figure 13 isa schematic cross-sectional view of another embodimentof the display device of the present
`invention.
`
`[0021]
`115 FIG. 14 is a partially enlarged top view ofthefifth embodimentofthe display device of the presentinvention.
`
`[0022]
`719FIG. 15 is a partially enlarged top view ofthe sixth embodimentof the display device of the present invention.
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`[0023]
`123 FIG. 16 is a partially enlarged top view ofthe display area of the display device according to the seventh
`embodiment of the present invention.
`
`[0024]
`128 Figure 17 isa schematic cross-sectional view of another embodimentof the display device of the present
`invention.
`
`[0025]
`733 Explanation of reference signs: 100- display device: 102- substrate structure 1021-flexible substrate, 1022-
`support film; 1023-support film glue; 102A- front surface; 102B- rear surface; 104- controlunit; 106- Display
`layer; 1061- driving element; 1061c- semiconductorlayer; 1061D- drain; 1061G- gate 1061S-source; 1062-
`display unit; 1062a- first electrode; 1062b-light- emitting layer; 1062c-second electrode; 1064, 1065, 1066,
`1067- dielectric layer; 108- bend sensorlayer; 1081- first conductive layer; 1082-second conductive layer; 1083,
`126- insulating layer; 110-buffer layer; 112- encapsulation layer; 116 - Polarizing layer; 118- protective layer;
`1181- optical adhesive layer; 1182- covering layer; 122-touch unit; 124- anti-reflective layer; 13D, D 17-
`direction; 20R, 25R-given area; 31, 41- Thefirst part; 32, 42-the second part; 33, 43-the third part; 51-thefirst
`recessed part; 52-the second recessed part; AX - bending axis; BS- bending sensorunit; BS1-first Bend sensor
`unit; BS2-second bendsensorunit; C 1-first capacitor; C 2-second capacitor; C L-conductor; CL1-first
`conductor; CL2-second conductor; D 1-first direction; D2-second Direction; DB- distribution density of
`bend sensor unit BS; DL- distribution density of light-emitting unit LE; DT - distribution density of touch unit
`122; G1, G2- group; LE-light- emitting unit; LE 1-first light-emitting unit; LE2-secondlight-emitting unit;
`LE3-third light- emitting unit; O P- opening: O P1-first opening OP1 (O P2)- overlapping opening; OP2-
`second opening; R1-first part; R2-second part; Ra - Surrounding area; Rb- display area; S1, S2, 60, 62-
`distance W 1-first width; W2- second width; W3-third width; W4, W 5-width; W6, W7- minimum width.
`
`[0026]
`152 D etailed ways
`
`[0027]
`156 T he present invention can be understoodbyreferring to the following detailed description in combination
`with the accompanying drawings. It should be noted that, in order to make the readers easy to understand
`and the drawings to be concise, many of the drawings in the present invention only depict a part of the
`display device, and Certain elements in the drawings are not drawn toactualscale.
`1601n addition, the number andsize of components in thefigures are only forillustration and are not intended to
`limit the scope of the present invention.
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`[0028]
`765 Throughoutthis description and the appended claims, certain wordsare used to refer to specific elements.
`166 T hose skilled in the art will understand that electronic device manufacturers may refer to the same component
`by different names.
`168 T his article is not intended to differentiate between components that have the samefunction but have different
`names.
`
`1701n the following description and claims, the words "including" and "include" are open-ended words, and
`therefore they should be interpreted to mean "including but notlimited to...".
`
`[0029]
`175 It should be understood that when an elementorlayer is referred to as being "on"or "connected to" another
`elementorlayer, it can be directly on or directly connected to the other element orlayer. to another element
`orlayer, or thereis an intervening elementor layer between the two.
`178In contrast, when an elementis referred to as being "directly on"or "directly connected to" another element or
`layer, there are nointervening elements orlayers present.
`
`[0030]
`783 It will be understoodthat although the terms"first", "second", "third", etc. may be used herein to describe
`various elements, components, regions, layers, and/orsections, the order, composition, and composition of
`these elements C omponents, regions, layers, and/orsections should not be limited by these terms, and these
`terms are only used to distinguish between different components, components, regions, layers, and/or
`sections.
`
`[0031]
`791 It should be noted that in the following enbodiments, features in several different enbodiments can be
`replaced, reorganized, and mixed without departing from thespirit of the present invention to complete
`other embodiments.
`
`[0032]
`197 Please refer to FIGS. 1 to 3. FIG. 1 isaschematic top view of the display device accordingto thefirst
`embodiment of the present invention. FIG. 2 isa partially enlarged schematic top view of the display area of
`the display device shownin FIG. 1. And FIG. 3 isa schematic top view of the display device shown in FIG. 2
`Showsaschematic cross-section of the equipment along the tangent lineA-B.
`201 T his embodiment provides a display device 100.
`202 T he display device 100 may bea flexible display device, for example, it can be repeatedly bent along at least
`one bendingaxis ( bending zxis) AX.
`204T he term "bended/bending/bend"”in the present invention means curved/curving/curve, bent/bending/bend,
`folded/folding/fold, rolled/rolling /roll), stretching (stretched/stretching/stretch), flexing
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`(flexed/flexing/flex), or other similar deformations, the above situations are generally referred to as "bending",
`"flexing" and/or " Bend" means.
`208 In this embodiment, the display device 100 includes a substrate structure 102. For example, the substrate
`structure 102 may includea flexible substrate 1021.
`210 T he substrate structure 102 has a first portion R1, which is a bendable area, and as mentioned above,thefirst
`portion R1 of the substrate structure 102 can be repeatedly bent.
`212 T he substrate structure 102 may further include a second portion R2 disposed adjacent thefirst portion R1.
`213 T hesecond part R2 may be the main area of the displayed image and may be an unbendable area, butis not
`limited to this.
`
`215 In this embodiment, the display device 100 includes two second portions R2,and thefirst portion R11 is
`adjacent to the two second portions R2 in thefirst direction D1 and is disposed between the two second
`portions R2.
`218 T he bending axis AX extends along a seconddirection D2.
`219T hesecond direction D2 is different from thefirst direction D1. In other words, the seconddirection D2
`
`intersects thefirst direction D1.
`
`221 In this embodiment, for example, the second direction D2 is perpendicularto thefirst direction D1, but isnot
`limited to this.
`
`[0033]
`226 In addition, a surrounding area Ra anda display area Rb are defined on the substrate structure 102.
`227T he surrounding area Ra may be provided on onesideofthe display area Rb.
`228 In this embodiment, the surrounding area Ra may surroundthe display area Rb, and one or more
`surrounding wires and/or components may be disposed in the surrounding area Ra.
`230 For example, one or more control units 104 orintegrated circuits (IC s) may be electrically connected to wires
`(not shown) on the substrate structure 102.
`232 Please refer to FIG. 1. In some embodiments, the control unit 104 may be disposed in the surrounding area
`Raand bentto the rear surface 102Bof the substrate structure 102 (the state shownin FIG. 1 is not bent to the
`rear surface 102B).
`235 In this case, the control unit 104 may not occupythe front surface 102A of the substrate structure 102, and
`thus the area of the surrounding area Ra may be reduced.
`237A lternatively, in some enbodiments, the control unit 104 may be disposed onaflexible printed circuit (FPC,
`not shown) andelectrically connected via chip onfilm (COF) technology. Wires (not shown) are connected
`to the substrate structure 102 .
`
`240 T he flexible printed circuit board can also be bent onto the rear surface 102Bof the substrate structure 102, so
`the control unit 104 does not occupy thefront surface 102A of the substrate structure 102, and the area of the
`surrounding area Ra can be reduced.
`
`[0034]
`24 Referring to FIGS. 2 and 3, the display device 100 further includes a display layer 106 and a bend sensorlayer
`108.
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`248 Display layer 106 is disposed on front surface 102A ofsubstrate structure 102.
`249T he bend sensorlayer 108 is provided on the display layer 106 and includes a plurality of bend sensorunits BS.
`250 T he bend sensorunit BS is provided in the display area Rb.
`251 In this embodiment, because thefirst part R1 is the bendable area ofthe display device 100, the bend sensor
`unit BS is disposed inside thefirst part R1, but it is notlimited to this.
`253 In some embodiments, the bending sensor unit BS may be disposed in both thefirst part R1 and the second
`part R2, or may be arranged in the entire display area Rb, for example. In some embodiments, the
`distribution density of the bending sensor units BS in thefirst part R1 is greater than the distribution density in
`the second part R2, butis notlimited to this.
`
`[0035]
`260 As shown in FIGS. 2 and 3, the display layer 106 may includeaplurality oflight emitting units LE located in
`the display area Rb of the display device 100.
`262In this embodiment, the display layer 106 includes three types of light- emitting units LE, such as a plurality of
`first light-emitting units LE 1, a plurality of second light-emitting units LE2, and a plurality of third light-
`emitting units LE3. For example, thefirst light-emitting unit LE1 may emit bluelight, the secondlight-
`emitting unit LE2 may emit green light, and the third light- emitting unit LE3 may emit red light, but is not
`limited thereto. T hefirst light-emitting unit LE 1, the secondlight-emitting unit LE2 and thethird light-
`emitting unit LE3 may be alternately and repeatedly arranged into an array. In the display area Rb,the
`numbersofthefirst light- emitting unit LE1, the second light-emitting unit LE2, and thethird light- emitting
`unit LE3 may bethe sameordifferent. For example, in this embodiment, the number offirst light- emitting
`units and thirdlight-emitting units per unit area may be smaller than the numberof secondlight-emitting
`units per unit area, butis notlimited to this. In addition, the areas or shapes ofthefirst light-emitting unit
`LE1, the secondlight-emitting unit LE2, and the third light- emitting unit LE3 may be the sameordifferent.
`For example, in this enbodiment, the secondlight- emitting unit may be circular, and thefirst light-emitting
`unit LE1 and the third light- emitting unit LE3 may be rectangular, but are notlimited thereto.
`
`[0036]
`278 According to the presentinvention, in the top view direction (Z direction) of the display device 100, at least
`oneofthe plurality of bend sensorunits BS is disposed between at least two adjacentlight-emitting units LE
`amongthe plurality oflight-emitting units LE and is connected to the at least onelight- emitting unit BS.
`Thereis a gap between two adjacentlight-emitting units LE.
`282In other words, in the top view direction of the display device 100, at least one of the plurality of bend sensor
`units BS does not overlap with at least two adjacent light emitting units LE. In this enbodiment,all the
`bending sensorunits BS are spaced apart from the light- emitting units LE without overlapping each other, but
`this is not a limitation.
`
`[0037]
`289 Specifically, referring to FIGS. 2 and 3, the bend sensorlayer 108 may includea first conductive layer 1081
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`and a second conductive layer 1082 disposed on thefirst conductive layer 1081 .
`291 T he first conductive layer 1081 includes a plurality offirst conductive lines CL1 extending along thefirst
`direction D1. The second conductive layer 1082 includes a plurality of second conductive lines CL2
`extending along the second direction D2. In some embodiments, thefirst conductor CL1 and the second
`conductor C L2 may belinear (as shown in FIG. 2). In some enbodiments, the first conductor CL1 and the
`second conductor C L2 may be non-linear but substantially extend in one direction, for example, in a wavy or
`zigzag shape, or may include a curved shape. For example, thefirst conductive line C L1 is wavy, butstill
`substantially extends towardthefirst direction D1. The bend sensorlayer 108 also includes an insulating layer
`1083. T he insulating layer 1083 is located onthefirst conductor C L1 (first conductive layer 1081) and the
`second conductor C L2 (second conductive layer 1082) in the vertical direction Z of the front surface 102A of
`the substrate structure 102. ) between. Therefore, the plurality offirst conductive wires CL1 and the plurality
`of second conductive wires C L2 intersect with each otherto form a plurality of bend sensorunits BS. In other
`words, a bend sensorunit is defined by an overlapping portion ofa first conductor CL1 and asecond
`conductor C L2 and the insulating layer 1083 corresponding to the overlapping portion.In this embodiment,
`the bending sensor unit BS may be a capacitive sensor. Furthermore, the protective layer 118 can be
`selectively disposed and cover the bend sensorlayer 108 . Protective layer 118 may include aninsulating
`material and provide protection to bend sensor layer 108.
`
`[0038]
`310 Comparing the arrangementof the bend sensorunits BS and the light emitting units LE, the distribution
`density of the multiple bend sensor units BS will be smaller than the density of the multiple light emitting units
`LE.
`
`313 T he "distribution density" mentioned aboverefers to the total number of componentsper unit area (such as
`square inches), and the "distribution density” mentioned above can be calculated based on the entire display
`area Rb, or based on Calculated from any area in the display area Rb. For example, the distribution density of
`the bend sensorunits BS (defined as DB) may be calculated by dividing the total number of bend sensorunits
`BS by the total area of the display region Rb. Likewise, the distribution density of the light-emitting units LE
`(defined as DL) can be calculated by dividing the total number ofthe light-emitting units LE by the total area
`ofthe display region Rb. Alternatively, the distribution density of the bend sensorunit BS andthelight
`emitting unit LE can also be calculated based on any area in the display area Rb. Specifically, a given area can
`be selected within the display area Rb and thegiven area includes at least one bend sensorunit BS and at least
`twolight emitting units LE. T he distribution density of the bending sensorunits BS in the given area can be
`calculated by dividing the numberof bending sensorunits BS in the given area by the area of the given area.
`Likewise, the distribution density of the light emitting units LE can be calculated by dividing the number of
`light emitting units in a given area by the area of the given area. For example, a given area may be rectangular
`and may have anarea of 1 inch by 1 inch or an area of 1 cm by 1. cm.
`
`[0039]
`330 In some embodiments, the given area may be the entire area of thefirst portion R1 (bendable area).
`331 IN some embodiments, the given area may beselected to be part (but notall) of the first portion R1 (bendable
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`area). For example,if the length of thefirst part R1 in the seconddirection D2 is L, then the given area can be
`selected to be a square or a rectangle, and the length in the seconddirection is one-tenth of L (L/10). Figure 1
`illustrates two possible given regions 20R and 25R, where 20R is arectangle and 25Risa square, but isnot
`limited thereto.
`
`[0040]
`339 According to this embodiment, in the top view directionof the display area Rb of the display device 100, the
`ratio of the distribution density of the bending sensor unit BS to the distribution density of the light emitting
`unit LE is greater than or equal to 0.0001 and less than 0.5 (ie, 0.0001 < DB/DL<0.5).
`
`[0041]
`345 Please refer to FIG. 2, asecond conductor CL2 includes a plurality offirst portions 31 overlapping thefirst
`conductor CL1 and a plurality of second portions 32 not overlapping thefirst conductor CL1.
`347In some embodiments, thefirst portion 31 isa portion corresponding to the bending sensorunit BS, and the
`second portion 32 is a portion not corresponding to the bending sensorunit BS.
`349In some embodiments, thefirst portion 31 and the second portion 32 in asecond conductive line C L2 may
`have the same widthin the first direction D 1.
`
`[0042]
`354 In some embodiments, thefirst portion 31 and the second portion 32 of the second conductive line CL2 may
`have different widthsin thefirst direction D1.
`
`356 For example, in thefirst direction D1, thefirst width W 1 of thefirst portion 31 of the second wire CL2
`(corresponding to the bend sensing unit BS) may be greater than thefirst width W 1 of the second portion 32
`(not corresponding to the bend sensor unit BS). Two widths W 2. In addition, the width of the portionof the
`first wire CL1 corresponding to the bend sensor unit BS may be larger than the width ofthe portion not
`corresponding to the bendsensorunit BS. Therefore, the sensitivity of the bend sensor can be improved by
`making thefirst conductive line CL1 and the second conductiveline C L2 have widerportions.
`
`[0043]
`365 T he first conductive layer 1081 formingthefirst conductive line C L1 and the second conductive layer 1082
`forming the second conductive line C L2 may include metal materials and/or metal oxide materials, but are
`notlimited thereto.
`
`368 T he metallic material may include, for example, magnesium (Mg), calcium (Ca), aluminum (Al), silver (Ag),
`tungsten (W), copper (Cu), nickel (Ni), chromium (Cn), or one of the above materials or various alloys.
`Metal oxide materials may include, for example, indium tin oxide(IT O), indium zinc oxide(IZO), zinc
`oxide or indium oxide. In some enbodiments, thefirst conductive layer 1081 and the second conductive
`layer 1082 may includesilver nanowires. Thefirst conductive layer 1081 and the second conductive layer
`1082 can independently be a single-layer structure or a multi-layer structure. For example, thefirst
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`conductive layer 1081 and the second conductive layer 1082 can be independently molybdenum
`(Mo)/aluminum (Al)/molybdenum. (Mo) multilayer or titanium (Ti)/copper (Cu)/titanium (Ti) multilayer
`structure.
`
`[0044]
`380 As shown in FIG. 3, the substrate structure 102 may includeaflexible substrate 1021 and a support film 1022 .
`The flexible substrate 1021 may be adhered to the support film 1022 via an adhesivelayer.
`382 Flexible substrate 1021 may include polymer material, thin glass, or any suitable material. The materials of the
`flexible substrate 1021 and the supportingfilm 1022 may include, for example, polyethylene terephthalate
`(PET), polyimide(PI) or polyethylene naphthalate ( polyethylene naphthalate). ,PEN), but notlimited to
`this.
`
`[0045]
`389 T he display layer 106 may includea plurality of driving e¢ements 1061 and a plurality of display units 1062
`arranged in an array, wherein each display unit 1062 may serve as one of the above- mentioned light- emitting
`units LE.
`
`392 Each driving element10671is electrically connected to a corresponding display unit 1062 to drive the
`corresponding display unit 1062 . The driving element 1061 in this enbodimentis a driving thin film
`transistor as an example, butit is not limited thereto. There can also be multiple driving thin film transistors,
`depending on the design requirements. FIG. 3 depicts that in the vertical direction Z of the front surface 102A
`of the substrate structure 102, the driving element 1061 can overlap the corresponding display unit 1062, but
`isnotlimited to this.
`
`[0046]
`4o1 T he display unit 1062 can be any type ofdisplay unit (cell) or display element (element), for example, it can
`includeliquid crystal (liquid crystal), fluorescence (fluorescence), phosphorescence (phosphor)orlight-
`emitting diode(light-emitting diode, LED) T he light-emitting diode may be, for example, an organic light-
`emitting diode(OLED), amicrolight- emitting diode(micro-LED), asub- millimeter light- emitting diode
`(mini-LED) or a quantum dotlight-emitting diode (quantum dot). LED, QLED), but notlimited to this.
`406 AS shown in FIG. 3, the display unit 1062 includes a first electrode 1062a, a second electrode 1062c, anda
`light-emitting layer 1062b disposed between thefirst electrode 1062a and the second electrode 1062c. For
`example,thefirst electrode 1062a in this embodiment can be the anodeofthe display unit 1062 and the
`second electrode 1062c can be the cathodeofthe display unit 1062, but is notlimited thereto. The light
`emitting area of each display unit 1062 may be defined via the dielectric layer 1064 as a pixel defining layer
`(PDL). The light- emitting layer 1062b may include one or morelayers of emissive materials, and the emissive
`materials may be organic, inorganic materials or a combination thereof. Different display units 1062 can emit
`different colorsoflight, such as red, green, and blue. For example, the light- emitting layers 1062bofdifferent
`display units 1062 can be made ofdifferent materials to emit red light, green light, and blue light. As shown in
`FIG. 3, bluelight- emitting units LE 1 and red light-emitting units LE3 are alternately and repeatedly provided.
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`In some embodiments, the light- emitting layers 1062bofdifferent display units 1062 may be madeof the
`same material to emit the samelight. T he first electrode 1062a and the secondelectrode 1062c may include
`metal or transparent conductive materials, but are not limited thereto. The metal material of the dectrode
`may include, for example, magnesium, calcium, aluminum,silver, tungsten, copper, nickel, chromium oran
`alloy of one or more of the above materials, but is not limited thereto. The transparent conductive material
`may include, for example, indium tin oxide, indium zinc oxide, zinc oxide or indium oxide, but is not limited
`thereto.
`
`[0047]
`42 AsSmentioned above, in this embodiment, the driving aement 1061 may be a top- gate typethin film transistor
`(TFT), but is not limited thereto.
`428 Bottom-gatethin film transistors may be used in other embodiments, andin the display device 100, the thin
`film transistor structure may not be limited to only one type. The driving aement 1061 may includea
`semiconductor layer 1061c, a dielectric layer 1065, a gate 1061G, a dielectric layer 1066, a drain 1061D anda
`source 1061S. T he semiconductorlayer 1061C may be formed of semiconductor material, such assilicon or
`metal oxide, butis not limited thereto. For example, the semiconductorlayer 1061C can be an amorphous
`silicon layer, a polysilicon layer, or an indium gallium zinc oxide(IGZO) layer, butis notlimited thereto.
`Furthermore, in a driving eement 1061, the semiconductorlayer 1061C includes a source contact, a drain
`contact, and a channel disposed between the source contact and the drain contact. The source 1061S is
`electrically connected to the corresponding source contact through the via hole in the dielectric layer 1065
`andthe dielectric layer 1066. The drain 1061D is electrically connected to the corresponding drain contact
`through another dielectric layer 1065 and a via hole in the dielectric layer 1066 . The gate 1061G isisolated
`from the semiconductorlayer 1061c via the dielectric layer 1065 as a gate insulating layer in the driving
`element 1061. The gate 1061G, the source 1061S and the drain 1061D can be formed of conductive materials
`(such as metal), but are not limited thereto. Materials suitable for forming the gate electrode 1061G, the
`source electrode and the drain electrode 1061D may refer to the above mentioned materials for forming the
`first dectrode 1062a and the secondelectrode 1062c.In the present invention, a driving element 1061 can be
`directly electrically connected to the corresponding display unit 1062 through the drain 1061D to drive the
`display unit 1062. In detail, the drain electrode 1061D may be directly connected to thefirst electrode 1062a
`of the display unit 1062. In addition, the dielectric layer 1067 may be disposed between thefirst electrode
`1062a of the display unit 1062 and the conductive layer forming the source electrode 1061S and the drain
`electrode 1061D.
`
`[0048]
`452 Furthermore, in addition to the above mentioned driving component 1061, the display layer 106 may also
`include one or more electronic components, such as but notlimited to reset components, compensation
`components, operation control components, and capacitors.
`455 A|though the driving element 1061 has a top- gatethin film transistor structure, this is only an example of the
`present invention and should not be used to limit the structure ortype of the thin film transistor of the display
`layer 106 in the presentinvention. In addition, the buffer layer 110 may be disposed betweentheflexible
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`substrate 1021 and the display layer 106 . In this embodiment, the buffer layer 110 may include an oxidelayer,
`anitride layer, an oxynitridelayer or other suitable insulating layers, but is not limited thereto. Furthermore
`the encapsulation layer 112 can be disposed on the display layer 106 . The encapsulation layer 112 may
`provide protection, encapsulation, and/or planarization functions for the display layer 106 and may include
`organic materials, inorganic materials, or mixtures thereof, butis not limited thereto. For example the
`encapsulation layer 112 may bea multi-layer structure, including an inorganic layer, an organic layer, and an
`inorganic layer.
`
`[0049]
`468 ASmentioned above, in some embodiments, the bend sensor unit BS and thelight emitting unit LE are spaced
`apart and do not overlap each other.
`470In some embodiments, the bending sensor unit BS may be disposed between two adjacentlight emitting units
`LE and located directly above thedielectric layer 1064 . In this embodiment, for a bend sensorunit BS, the
`distance S1 between oneside of the bend sensorunit BS andits adjacent light- emitting unit LE and the other
`side of the bend sensor unit BS and anotheradjacentlight-emitting unit LE are T he distance S2 between them
`isthesame, as shownin Figure 3, butis notlimited to this. In some embodiments, distance S1 may be
`different from distance S2.
`
`[0050]
`479 Please refer to FIG. 4, which isan enlarged partial cross-sectional view of the bending state of the display
`device shownin FIG. 3.
`
`431 AS shown in FIG. 4, whenthe display device 100 isin a bentstate, the first part R1 may be bent, bent, folded,
`stretched, deflected or otherwise deformed, while the second part R2 may not be deformed or may remain
`flat. state. Therefore, thefilm layer of thefirst part R1 will be stretched and stretched so that the thickness of
`the film layer is reduced. Therefore, the distance between thefirst conductive line CL1 and the second
`conductive line C L2 may change, for example, being smaller than theinitial distance when thedisplay device
`100 is not bentor deflected. As shownin Figure4, the distance betweenthefirst conductor CL1 and the
`second conductor C L2 of thefirst capacitor C 1 is d1, close to the centerof the first part R1 or corresponding
`to the bending axisAX. A bend sensorunit BS further away from the bending axisAX or closer to the second
`part R2 forms a distance d2 between thefirst conductor CL1 and the second conductor C L2 of the second
`capacitor C 2. Whenthe display device 100 is in a bentstate, because thefirst part R1 has a larger curvature,
`although the distances d1 and d2 may both decrease compared with theinitial distances, the distance d1 may
`become smaller than the distance d2. Therefore, the capacitance change in thefirst capacitor C1 formed by
`the bending sensorunit BS close to thefirst part R 1 will be larger than that of the second capacitor C 2 formed
`by the bending sensorunit BS far away from thefirst part R1. Specifically, in the bending state, since the
`distance d1 is smaller than the distance d2, the capacitance valueofthefirst capacitor C 1 is larger than the
`Capacitance valueof the second capacitor C 2. Therefore, by collecting the capacitance values and capacitance
`changevalues ofdifferent bend sensor units BS in thefirst part R1, the bending degree and bending state of
`the display device 100 can be known.
`
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`[0051]
`502 Additionally, in certain aspects, the insulating layer 1083 may include organic materials, such as hydrophobic
`organic materials, piezoelectric materials (such as polyvinylidene (PV DF)), and/or dielectric elastomers
`(such as Rubber, acrylic elastomer, polyurethane elastomer, acrylonitrile butadiene rubber, vinylidene
`fluoride trifluoroethyleneortheir compounds, butis notlimited thereto.
`506 W hen the insulating layer 1083 is an organic material, a suitable insulating layer 1083 may have a Y oung's
`coefficient ranging from 0.01 GPa to 10 GPa, and may havea thickness ranging from 0.8 microns to 10
`microns, but is not limited thereto. On the other hand, the insu