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Taiwan Semiconductor Manufacturing Company, Ltd.

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Jie Chen Tzuan-Horng Liu Hsien-Wei Chen Ying-Ju Chen

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METHOD FOR FABRICATING A CHIP PACKAGE

17/458,557 | U.S. Patent Application

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Location ELECTRONIC

Filed Aug. 27, 2021

Examiner LATANYA N CRAWFORD EASON

Class 438

Art Group 2813

Patent No. 11,908,692

Case Type Utility - 438/127000

Status Patented Case

Parent 15/884,328 Patented

Parent 62/552,401 Expired

Child 18/415,549 Pending

Last Updated: 5 months, 1 week ago

Date	#	Transaction
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METHOD FOR FABRICATING A CHIP PACKAGE

17/458,557 | U.S. Patent Application

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