`
`Application N0.: 16/354,005
`Office Action Dated: December 31, 2019
`
`PATENT
`
`This listing of claims will replace all prior versions, and listings, of claims in the application.
`
`Listing of Claims:
`
`1.
`
`(Original) A method for plating a substrate while preventing a generation of an
`
`electrolyte component which inhibits bottom-up plating of the substrate, comprising:
`
`preparing a substrate having a recess formed in a surface thereof, a conductive layer
`
`being formed in at least a part of the recess;
`
`placing an insoluble anode and the substrate in contact with a copper sulfate plating
`
`solution containing an additive;
`
`applying a predetermined plating voltage between the substrate and the insoluble anode
`
`by a plating power source to plate the substrate; and
`
`applying a forward voltage, which is lower than the predetermined plating voltage,
`
`between the substrate and the insoluble anode when the predetermined plating voltage is not
`
`applied, thereby decreasing a reverse electric current which flows from the insoluble anode to the
`
`substrate via the plating power source.
`
`2.
`
`(Original) The method according to claim 1, wherein the forward voltage is
`
`applied by the plating power source.
`
`3.
`
`(Original) The method according to claim 1, wherein the forward voltage is
`
`applied by an auxiliary power source which is coupled in parallel with the plating power source.
`
`4.
`
`(Original) The method according to claim 1, wherein an inert gas is supplied into
`
`the copper sulfate plating solution while applying the forward voltage between the substrate and
`
`the insoluble anode, thereby lowering a concentration of dissolved oxygen in the copper sulfate
`
`plating solution.
`
`5.
`
`(Original) The method according to claim 1, wherein the copper sulfate plating
`
`solution is passed through a deaerator while applying the forward voltage between the substrate
`
`and the insoluble anode, thereby lowering a concentration of dissolved oxygen in the copper
`
`sulfate plating solution.
`
`Page 2 of 3
`
`

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