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MEMORY MODULE WITH PACKAGES OF STACKED MEMORY CHIPS

15/95,288 | U.S. Patent Application

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Location ELECTRONIC
Filed April 11, 2016
Examiner HUAN HOANG
Class 365
Art Group 2827
Patent No. 9,659,601
Case Type Utility - 365/063000
Status Patented Case
Parent 14/337,168 Patented
Parent 13/288,850 Patented
Parent 61/409,893 Expired
Child 15/602,099 Patented
Child 16/412,308 Pending
Last Updated: 5 years, 5 months ago
Date # Transaction