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MEMORY MODULE WITH PACKAGES OF STACKED MEMORY CHIPS

15/602,099 | U.S. Patent Application

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Location ELECTRONIC
Filed May 22, 2017
Examiner HUAN HOANG
Class 365
Art Group 2827
Patent No. 10,290,328
Case Type Utility - 365/063000
Status Patented Case
Parent 15/95,288 Patented
Parent 14/337,168 Patented
Parent 13/288,850 Patented
Parent 61/409,893 Expired
Child 16/412,308 Pending
Last Updated: 4 years, 7 months ago
Date # Transaction