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MICROELECTRONIC PACKAGES WITH ENHANCED HEAT DISSIPATION AND METHODS OF MANUFACTURING

12/970,729 | U.S. Patent Application

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Location ELECTRONIC
Filed Dec. 16, 2010
Examiner TIMOR KARIMY
Class 257
Art Group 2894
Patent No. 8,283,758
Case Type Utility - 257/673000
Status Application Involved in Court Proceedings
Last Updated: 4 years, 10 months ago
Date # Transaction