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Flip-Chip Semiconductor Package with Encapsulant Retaining Structure and Strip

11/847,813 | U.S. Patent Application

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Location ELECTRONIC
Filed Aug. 30, 2007
Examiner KRISTA Z SODERHOLM
Class 257
Art Group 2826
Case Type Utility - 257/778000
Status Abandoned -- Failure to Respond to an Office Action
Parent 11/469,194 Abandoned
Child PCT/US07/77387
Last Updated: 1 year, 5 months ago
Date # Transaction