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Kioxia Corporation

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KIOXIA CORPORATION

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Daisaku HIYAMIZU

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SEMICONDUCTOR INTEGRATED CIRCUITS, MULTI-CHIP PACKAGE, AND OPERATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUITS

17/394,577 | U.S. Patent Application

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Location ELECTRONIC

Filed Aug. 5, 2021

Examiner SON T DINH

Class 365

Art Group 2824

Patent No. 11,749,355

Case Type Utility - 365/185180

Status Patented Case

Child 2021-044422

Last Updated: 9 months, 1 week ago

Date	#	Transaction
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SEMICONDUCTOR INTEGRATED CIRCUITS, MULTI-CHIP PACKAGE, AND OPERATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUITS

17/394,577 | U.S. Patent Application

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