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Solder ball placement system

11/582,826 | U.S. Patent Application

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Location ELECTRONIC
Filed Oct. 17, 2006
Examiner JACKY YUEN
Class 228
Art Group 1793
Case Type Utility - 228/102000
Status Abandoned -- Failure to Respond to an Office Action
Parent 11/107,308 Patented
Parent 10/942,311 Patented
Parent 10/943,151 Patented
Parent 10/650,169 Patented
Parent 10/36,579 Patented
Parent 60/288,203 Expired
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Last Updated: 4 years, 9 months ago
Date # Transaction