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WET ETCHING METHOD OF REMOVING SILICON FROM A SUBSTRATE AND METHOD OF FORMING TRENCH ISOLATION

11/207,115 | U.S. Patent Application

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Location ELECTRONIC
Filed Aug. 18, 2005
Examiner STEPHEN W SMOOT
Class 438
Art Group 2813
Patent No. 7,135,381
Case Type Utility - 438/430000
Status Patented Case
Parent 10/625,166 Patented
Last Updated: 4 years, 10 months ago
Date # Transaction