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Stanford W. Crane, JR.Jennifer Colegrove Zsolt Horvath Myoung-Soo Jeon Joshua Nickel Lei-Ming Yang

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Modular semiconductor die package and method of manufacturing thereof

10/636,754 | U.S. Patent Application

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Location ELECTRONIC

Filed Aug. 8, 2003

Examiner DAVID A ZARNEKE

Class 257

Art Group 2891

Case Type Utility - 257/099000

Status Abandoned -- Failure to Respond to an Office Action

Parent 10/81,146 Patented

Last Updated: 5 years, 1 month ago

Date	#	Transaction
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Modular semiconductor die package and method of manufacturing thereof

10/636,754 | U.S. Patent Application

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