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METHOD FOR FABRICATING A PACKAGING DEVICE FOR SEMICONDUCTOR DIE AND SEMICONDUCTOR DEVICE INCORPORATING SAME

10/608,606 | U.S. Patent Application

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Location ELECTRONIC

Filed June 27, 2003

Examiner SARA W CRANE

Class 438

Art Group 2811

Patent No. 7,279,355

Case Type Utility - 438/106000

Status Patented Case

Last Updated: 4 years, 1 month ago

Date	#	Transaction
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METHOD FOR FABRICATING A PACKAGING DEVICE FOR SEMICONDUCTOR DIE AND SEMICONDUCTOR DEVICE INCORPORATING SAME

10/608,606 | U.S. Patent Application

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