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METHOD OF EPITAXIAL-LIKE WAFER BONDING AT LOW TEMPERATURE AND BONDED STRUCTURE

09/635,272 | U.S. Patent Application

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Location FILE REPOSITORY (FRANCONIA)
Filed Aug. 9, 2000
Examiner JOSE R DIAZ
Class 257
Art Group 2815
Patent No. 6,563,133
Case Type Utility - 257/052000
Status Patented Case
Child PCT/US01/22591 Published
Child 10/358,141 Patented
Last Updated: 4 years, 9 months ago
Date # Transaction