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Multi-chip module having interconnect dies

09/484,047 | U.S. Patent Application

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Location FILE REPOSITORY (FRANCONIA)
Filed Jan. 18, 2000
Examiner MICHAIL DATSKOVSKIY, V
Class 361
Art Group 2835
Patent No. 6,266,246
Case Type Utility - 361/704000
Status Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362
Parent 08/970,379 Patented
Child 09/903,699 Patented
Child 10/194,074 Abandoned
Last Updated: 5 years, 4 months ago
Date # Transaction