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MULTI-CHIP MODULE HAVING INTERCONNECT DIES

08/970,379 | U.S. Patent Application

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Location FILE REPOSITORY (FRANCONIA)
Filed Nov. 14, 1997
Examiner DONALD ALAN SPARKS
Class 361
Art Group 2835
Patent No. 6,016,256
Case Type Utility - 361/820000
Status Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362
Child 09/484,047 Patented
Child PCT/US98/24252 Published
Child 09/903,699 Patented
Child 10/194,074 Abandoned
Last Updated: 1 year, 11 months ago
Date # Transaction