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PARTIALLY-MOLDED, PCB CHIP CARRIER PACKAGE FOR CERTAIN NON-SQUARE DIE SHAPES

08/79,499 | U.S. Patent Application

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Filed June 18, 1993
Case Type Utility - 361/784000
Status Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362
Last Updated: 5 years ago
Date # Transaction