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Uhf/VHF Plasma for Use in Forming Integrated Circuit Structures on Semiconductor Wafers

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UHF/VHF PLASMA FOR USE IN FORMING INTEGRATED CIRCUIT STRUCTURES ON SEMICONDUCTOR WAFERS

08/32,744 | U.S. Patent Application

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Filed March 16, 1993

Case Type Utility - 999/225000

Status Application Undergoing Preexam Processing

Last Updated: 5 years ago

Date	#	Transaction
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UHF/VHF PLASMA FOR USE IN FORMING INTEGRATED CIRCUIT STRUCTURES ON SEMICONDUCTOR WAFERS

08/32,744 | U.S. Patent Application

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