`Case 3:14-cv-00757-REP-DJN Document 81-8 Filed 04/10/15 Page 1 of 11 Page|D# 10607
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`EXHIBIT H
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`EXHIBIT H
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`Case 3:14-cv-00757-REP-DJN Document 81-8 Filed 04/10/15 Page 2 of 11 PageID# 10608
`Case 3:14-cv-00757-REP-DJN Document 8“““mlrmmmmMmmmmmflflm 10608
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`USOO5777854A
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`5,777,854
`[11] Patent Number:
`[19]
`Umted States Patent
`
`Welch et al.
`[45] Date of Patent:
`Jul. 7, 1998
`
`[54]
`
`INTEGRATE FLEXIBLE CONTACTS
`GROUNDING SYSTEM FOR A COMPUTER
`SYSTEM CHASSIS
`
`[75]
`
`Inventors:
`
`Randall S. Weld). Lake Forest; 330
`Gla Le. Orange. both of Calif.
`
`[73]
`
`[le
`
`[22]
`
`[63]
`
`[51]
`[52]
`
`[53]
`
`Assignee: AST Research, Inc. Irvine. Calif.
`
`App]. No.: 866.397
`
`Filed:
`
`May 30, 1997
`
`Related US. Application Data
`
`Continuation of Ser. No. 445.430. May 19. 1995, aban-
`doned.
`
`-............................ nosx 7/14
`1m. C1.6 .....
`
`us. c1. ....................... 361/800; 364/818; 364/224:
`364/816; 364/752; 174/35 R; 174/35 GC;
`435/88; 435/109; 435/609: 435/608
`Field of Search ..................................... 361/128. 736.
`361/738. 752. 753. 757. 800. 816. 818.
`820. 821. 212. 220. 744. 784. 790: 174/35 R.
`35 GC. 50. 52.1. 51: 439/88. 108. 109.
`607-610; 257/678. 659. 660: 307/89. 90.
`220/402: 206/275
`
`[56]
`
`References Cited
`
`U.S. PATENT DOCUMENTS
`
`4.322572
`5.014.160
`5.278.351
`5.354.951
`
`3/1982 Snyder .................................. 174/35 R
`...... 361/818
`5/1991 McCoy, Jr.
`
`1/1994 Herrick ........
`174/3511
`
`10/1994 Lange. Sr. et a1.
`................... 174/3511
`
`Primary Examiner—Leo P. Picard
`Assistant Examiner—Anthony Dinkins
`Attorney Agent, or Firm—Knobbe. Martens. Olson & Bear.
`LLP.
`
`[57]
`
`ABSTRACT
`
`A computer system chassis. including a base and a cover.
`implements an improved grounding system by integrally
`forming a plurality of flexible protruding contacts into
`predetermined contact regions throughout the base during
`the metal punching manufacturing phase of the chassis base
`blank. In this way. when the base and cover are attached to
`each other. the size of any gaps which may form in these
`contact regions. as a result of warpage or design tolerances.
`are reduced. This is due to the number of mechanical
`
`contacts being made by the plurality of flexible contacts
`which protrude and extend across these gaps and connect the
`base to the cover. In addition to reducing the size of these
`gaps. the flexible contacts provide an improved electrical
`grounding to the cover by increasing metal-to-metal contact
`betWeen the cover and the base. both of which reduce EMI
`
`emissions from the computer system chassis.
`
`4,llS.655
`
`9/1978 Prentice ................................ 174/3511
`
`19 Claims, 3 Drawing Sheets
`
`
`
`
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`Case 3:14-cv-00757-REP-DJN Document 81-8 Filed 04/10/15 Page 3 of 11 PageID# 10609
`Case 3:14-cv-00757-REP-DJN Document 81-8 Filed 04/10/15 Page 3 of 11 Page|D# 10609
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`US. Patent
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`Jul. 7, 1998
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`Sheet 1 of 3
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`5,777,854
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`Case 3:14-cv-00757-REP-DJN Document 81-8 Filed 04/10/15 Page 4 of 11 PageID# 10610
`Case 3:14-cv-00757-REP-DJN Document 81-8 Filed 04/10/15 Page 4 of 11 Page|D# 10610
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`US. Patent
`
`Jul. 7, 1998
`
`Sheet 2 of 3
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`5,777,854
`
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`Case 3:14-cv-00757-REP-DJN Document 81-8 Filed 04/10/15 Page 5 of 11 PageID# 10611
`Case 3:14-cv-00757-REP-DJN Document 81-8 Filed 04/10/15 Page 5 of 11 Page|D# 10611
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`US. Patent
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`Jul. 7, 1998
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`Sheet 3 of 3
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`5,777,854
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`2.9
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`30
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` \\\\E“‘}\\&\\\\\\\\\\\\\\‘
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`[Rim
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`FIG~ 7b 30
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`Case 3:14-cv-00757-REP-DJN Document 81-8 Filed 04/10/15 Page 6 of 11 PageID# 10612
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`5.777.854
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`l
`INTEGRATE FLEXIBLE CONTACTS
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`GROUNDING SYSTEM FOR A COMPUTER
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`SYSTEM CHASSIS
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`This application is a continuation of US. patent appli-
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`cation Ser. No. 08/445430. filed May 19. 1995 now aban-
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`doned.
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`FIELD OF THE INVENTION
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`This invention relates to a grounding system for a chassis
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`used for housing electronic devices. and more specifically to
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`a grounding system for a computer system chassis compris—
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`ing integrated flexible contacts for reducing Electromagnetic
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`Interference (EMI) emissions from the computer system
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`chassis.
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`BACKGROUND OF THE INVENTION
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`Manufacturers of electronic devices must conform to
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`certain Federal Communications Commission's (FCC) rules
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`and regulations regarding the acceptable amount of EMI
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`emissions from electronic devices. The FCC imposes limits
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`on the amounts of EMI emissions allowed to be released
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`from devices being sold and transported in and around the
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`United States.
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`With the implementation of each new generation of
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`computer processor and specialized internal circuitry. the
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`amount of EMI emissions generated by these new electronic
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`devices have continued to increase. Therefore. computer
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`manufacturers are constantly trying to improve the ground-
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`ing on the computer system chassis used to house these
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`devices in order to minimize the EMI emissions from the
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`computer system chassis. Improving the grounding of the
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`chassis also provides additional protection against electro-
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`static discharge. which can damage computer system cir-
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`cuitry if contact with a poorly grounded chassis results in
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`electrostatic discharge.
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`In a typical computer system. the computer system chas-
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`sis comprises a base and a mating cover. The cover is
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`removable from the base. thereby allowing an end user to
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`maintain and upgrade the computer system and its associ-
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`ated internal circuitry. However. if the cover is not properly
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`mated to the base once the cover is attached to the base. then
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`gaps will form between the cover and the base around a
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`perimeter of contact region between the cover and the base.
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`As is known in the art. the existence of these gaps allows for
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`increased EMI emissions from the computer system chassis.
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`Basically. with a loose-fitting cover. the cover is driven by
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`the EMI emissions and acts like an antenna. By providing
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`greater contact from the cover to the base which is properly
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`grounded. the antenna etfect of the cover is reduced.
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`Previously. such gaps. or improper fittings. did not cause
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`problems since the amount of EMI emissions being gener—
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`ated was not significant. However. with today’s advanced
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`circuitry. this is no longer true. Therefore. in order to reduce
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`EMI emissions. computer manufacturers have attempted to
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`increase the metal-to—metal contact between the base and the
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`cover and to reduce the size of the gaps that occur between
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`the base and the cover along the perimeter of contact region.
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`thereby providing a better electrical grounding between the
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`cover and the base.
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`A prior art solution to EMI emissions has been to attach
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`one or more add—on contacts to the perimeter of contact
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`region around the base in one or more localized areas in
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`order to increase metal-to-metal contact between the base
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`and the cover and to reduce the size of the gaps that form
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`between the base and the cover. However.
`individually
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`10
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`15
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`20
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`25
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`35
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`4s
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`50
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`55
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`65
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`2
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`installing such contacts by hand onto the chassis base
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`increases costs by requiring additional add-on parts. and is
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`both time consuming and labor intensive to install.
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`Therefore. a better solution is needed to increase metal—
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`to-metal contact between the base and cover. and to reduce
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`the size of gaps occurring between the base and cover.
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`thereby providing a better electrical grounding between the
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`base and cover. which reduces EMI emissions from the
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`computer system chassis without increasing the cost of parts
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`and labor.
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`SUMMARY OF THE INVENTION
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`The computer system chassis grounding system of the
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`present invention comprises integrated flexible contacts for
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`reducing EMI emissions from a computer system chassis by
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`providing an improved electrical grounding system that
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`increases contact between. and reduces the size of gaps
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`between. the base and cover without increasing the cost of
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`parts and labor.
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`The grounding system of the present invention comprises
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`a plurality of integrated flexible contacts which. in a pre-
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`ferred embodiment. are integrally formed throughout por-
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`tions of the base that are referred to as contact regions. The
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`flexible contacts are formed by punching out portions of a
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`chassis base blank during the manufacturing process to form
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`flexible contacts comprising a protrusion arm having a
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`dimple. In this way. the size of any potential gaps which may
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`form between the base and cover due to design tolerances
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`are minimized by the placement of these flexible contacts.
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`which provide additional points of contact between the base
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`and the cover. The dimple provides the actual contact point
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`on the protrusion arm between the computer system chassis
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`base and cover. If design tolerances are very small.
`the
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`protrusion arm can be kept flush with the base plane. since
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`the dimple will provide enough of a protrusion to extend
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`across a slim gap formed in a chassis having a small design
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`tolerance.
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`It is to be understood that the flexible contacts may be
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`formed in various ways. other than by punching out portions
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`of the base blank. For example. if the shape of the base blank
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`is formed by a mold. then the mold can be designed to
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`produce the flexible contacts without the need for punching
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`out portions of the base blank after the molding process.
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`One of the benefits of the present invention is that the
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`computer system chassis grounding system of the present
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`invention does not require any add-on contacts. Thus. cost
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`savings are realized by reducing the parts count and by
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`reducing labor costs required for manual installation.
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`Accordingly. it is an object of the present invention to
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`provide an improved grounding system for a chassis used for
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`housing electronic devices.
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`It is a further object of the present invention to provide an
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`improved grounding system for a computer system chassis.
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`An additional object of the present invention is to provide
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`an improved computer system chassis grounding system
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`comprising integrated flexible contacts.
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`Another object of the present invention is to provide a
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`chassis grounding system that increases metal-to—metal con-
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`tact between the base and the cover. thereby reducing EMI
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`emissions from the computer system chassis.
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`Further objects and advantages of the present invention
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`will become apparent from a consideration of the drawings
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`and ensuing description.
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`BRIEF DESCRIPTION OF THE DRAWINGS
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`FIG. 1 is an exploded perspective View of a computer
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`system chassis comprising a base and a mating cover.
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`Case 3:14-cv-00757-REP-DJN Document 81-8 Filed 04/10/15 Page 7 of 11 PageID# 10613
`Case 3:14-cv-00757-REP-DJN Document 81-8 Filed 04/10/15 Page 7 of 11 Page|D# 10613
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`5.777.854
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`3
`FIG. 2 is an enlarged perspective view of a portion of FIG.
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`1 showing the details of a plurality of flexible contacts.
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`FIG. 3 is a partial front View of a front face of the base.
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`FIG. 4 is a partial rear view of a rear face of the base.
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`FIG. 5 is a partial top View of the rear face of the base.
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`FIG. 6 is a partial top phantom view of a front cover
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`perimeter of contact region and a front base perimeter of
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`contact region.
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`FIG. 7a is a side cutaway view of FIG. 6 shown prior to
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`attaching the cover to the base.
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`FIG. 7b is a side cutaway view of FIG. 6 shown after the
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`cover is attached to the base. This figure illustrates the
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`benefits of having flexible contacts. which increase the
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`likelihood of contact between the cover and the base in
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`contact regions where gaps may form.
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`DETAILED DESCRIPTION OF A PREFERRED
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`EMBODIMENT
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`FIG. 1 is an exploded perspective view of a computer
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`system chassis 113 comprising a base 12 and a mating cover
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`14. Most computer systems usually include a front bezel 16
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`as well. In a preferred embodiment. the base 12 comprises
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`a front face 18 and a rear face 20. The front face 18
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`comprises a front base perimeter of contact region 22. This
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`region 22 comprises a plurality of flexible contacts 29. and.
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`as seen in FIGS. 2 and 3. each contact 29 comprises a
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`protrusion arm 30 having a dimple 32. The rear face 20
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`comprises a rear base perimeter of contact region 24. This
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`region 24 comprises a plurality of flexible contacts 29. and.
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`as seen in FIG. 4 and 5. each contact 29 comprises a
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`protrusion arm 30 having a dimple 32. The base 12 also has
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`a left side edge 34a and a right side edge 3417. which
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`typically comprises a rail (not shown) for mating with and
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`guiding a corresponding rail (not shown) on the cover 14.
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`Although a stand-up tower type chassis may differ slightly
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`in configuration. it is to be understood that a person of
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`ordinary skill in the art will be able to apply the concepts
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`disclosed herein to such variations in configuration. For
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`example. in a tower type chassis. a base may comprise a
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`major portion of the chassis. with a cover merely being a
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`removable side.
`top. or rear panel. If contact regions
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`between the base and removable panel are susceptible to
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`forming gaps. then the teachings of the present invention are
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`desirable in. and easily adaptable to. such a configuration.
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`The cover 14 comprises a front cover perimeter of contact
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`region 26 and a rear cover perimeter of contact region 28
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`(which extends inward from the top and sides of the cover
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`toward the center of the rear. in order to provide a region for
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`contacting with the rear base perimeter of contact region 24.
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`but is not shown in FIG. 1). as well as a left side 35a having
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`a left side edge 36a and a right side 35b having a right side
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`edge 36b. The cover 14 also typically comprises side rails
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`(not shown) along the left and right side edges 36a and 36b
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`for mating with and being guided onto the base 12.
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`The various “perimeter of contact regions” (e.g. regions
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`22. 24. 26. and 28 as are shown in FIG. 1) are defined as
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`regions between the base 12 and cover 14 which are
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`designed to contact each other to form a flush contact
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`between the base 12 and cover 14. but do not always do so.
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`These regions sometimes form gaps due to warped bases 12
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`or covers 14 or other various factors relating to design
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`tolerances. On the base 12. these regions are the localized
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`regions to which prior art add—on contacts were typically
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`attached These regions typically run along the left. right.
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`and upper perimeter of the front and rear faces 18 and 20 of
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`4
`the computer system chassis 10 base 12. On the cover 14.
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`these regions typically run along the left. right. and upper
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`perimeter of the front and rear edges of the cover 14. as
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`indicated by the labels 26 and 28. which define the front
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`cover perimeter of contact region 26 and the rear cover
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`perimeter of contact region 28.
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`It is known in the prior art that attaching the cover 14 of
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`the computer system chassis 10 to the base 12 may result in
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`some gaps forming between the front base perimeter of
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`contact region 22 and the front cover perimeter of contact
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`region 26. as well as between the rear base perimeter of
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`contact region 24 and the rear cover perimeter of contact
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`region 28. These gaps. contribute to leakage from the
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`computer system chassis 10 of EMI emissions generated by
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`a computer’s processor and internal circuitry (not shown).
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`EMI emissions also occur as a result of improper grounding
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`of the cover 14 resulting from poor contact between the
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`cover 14 and the base 12. A prior art solution has been to
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`attach one or more contacts in these localized areas where
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`gaps are formed.
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`For example. if a certain region of one of the perimeter of
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`contact region areas is slightly warped. then the contact in
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`that region between the base 12 and the cover 14 will not sit
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`flush. and gaps will form (as shown in FIG. 7b). By
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`manually placing an add-on contact
`into this localized
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`region. the size of the gap can be reduced. thereby reducing
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`the leakage of EMI emissions resulting from that gap.
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`The computer system chassis 10 of the present invention
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`comprises a plurality of flexible contacts 29 which are
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`comprised of protrusion arms 30 having dimples 32. The
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`flexible contacts 29 are manufactured integrally into the
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`chassis 10 so that add-on contact parts (not shown) do not
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`have to be used. and so that manual labor to install these
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`add-on protrusion parts is not required. By manufacturing
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`the chassis 10 with a plurality of flexible contacts 29 integral
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`to the chassis 10. potential gaps formed by contact regions
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`that do not sit flush are reduced in size. thereby reducing
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`leakage of EMI emissions generated by the computer’s
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`processor and internal circuitry (not shown). In a preferred
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`embodiment. the flexible contacts 29 are formed integral to
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`the base 12. although the contacts 29 could just as easily
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`have been formed on the cover 14 or both the base 12 and
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`the cover 14.
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`FIG. 2 is an enlarged view showing more detail of a few
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`of the flexible contacts 29. In FIG. 2. a portion of the front
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`base perimeter of contact region 22 is shown. This region 22
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`comprises integrally formed flexible contacts 29 which
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`comprise protrusion arms 30 having dimples 32. The
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`dimples 32 act as the contact point between the base 12 and
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`the cover 14. The flexible contacts 29 are formed during the
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`manufacturing process by taking a base blank (not shown)
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`and punching out portions of the base blank so as to form the
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`protrusion arms 30. The dimples 32 are added to the
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`protrusion arms 30 during this process as well. It is to be
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`understood that the flexible contacts 29 can be formed using
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`a molding process as well.
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`Each flexible contact 29 is then slightly oflset and raised
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`from the plane of the surface from which it was punched out.
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`The flexible contact 30 protrudes from the surface level of
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`the from base perimeter of contact region 22. and in a
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`preferred embodiment. the contacts 29 remain flexible after
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`this process. By remaining flexible. the contacts 29 ensure
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`that most. if not all. of the contacts 29 will make contact with
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`the cover 14. If stilf contacts 29 are used. an individual
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`contact 29 that protrudes the furthest would stop the cover
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`14 from coming closer to the base 12. thereby preventing
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`5
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`Case 3:14-cv-00757-REP-DJN Document 81-8 Filed 04/10/15 Page 8 of 11 PageID# 10614
`Case 3:14-cv-00757-REP-DJN Document 81-8 Filed 04/10/15 Page 8 of 11 Page|D# 10614
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`5.777.854
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`5
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`contacts 29 which protrude less from making contact. In
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`other words. flexibility is important in case certain contacts
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`29 protrude more than others. By flexing. all contacts 29 are
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`capable of making contact with a corresponding contact
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`point on the cover 14.
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`FIG. 3 is a front view of a portion of the front base
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`perimeter of contact region 22. This View better illustrates
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`the raised offset of the flexible contacts 29 above the plane
`of the sheet metal from which it was punched out.
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`FIG. 4 is a rear view of a portion of the rear base perimeter
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`of contact region 24. which illustrates the plurality of
`flexible contacts 29 formed onto the rear face 20.
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`FIG. 5 is a top view looking down on a portion of the rear
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`face 20. which illustrates the raised oflset of the flexible
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`contacts 29 above the plane of the sheet metal from which
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`it was punched out.
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`When referring to an offset “above” the plane. the direc-
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`tion of “above” is meant to describe a direction toward the
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`corresponding mating component.
`In a preferred
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`embodiment. the flexible contacts 29 may be raised out of
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`the base 12 toward the cover 14. If the contacts 29 were
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`punched out of the cover 14 instead. then the raised offset
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`would be in the direction of the base 12.
`In such an
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`alternative configuration. the term “above” would be in the
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`opposite direction from that described for the preferred
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`embodiment.
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`However.
`if the manufacturing tolerances are small
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`enough. then the contacts 29 may be formed in a plane
`parallel to the plane of the sheet metal from which is was
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`punched out. since the raised dimples 32 will protrude a
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`suflicient amount to extend across any slim gaps that may
`form in a chassis with small design tolerances.
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`FIG. 6 is a partial phantom view of the front base
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`perimeter of contact region 22 shown in contact with the
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`front cover perimeter of contact region 26. The phantom
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`view shows the flexible contacts 29 of the base 12 making
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`contact with the front cover perimeter of contact region 26.
`FIGS. 70 and FIG. 7b show a side cutaway view of the
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`front cover perimeter of contact region 26 coming into
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`contact with the front base perimeter of contact region’s 22
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`flexible contacts 29. Gaps typically are created when the
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`cover 14 and base 12 do not sit flush. such as when one or
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`the other is warped. Without
`the placement of flexible
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`contacts 29 throughout the contact regions. large gaps may
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`form where the contact regions do not sit flush. By integrally
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`forming flexible contacts 29 into the base 12 contact region
`22. even if the base 12 and cover 14 do not sit flush in these
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`contact regions. the flexible contacts 29 extend across the
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`gaps to form a contact with the cover 14. thereby reducing
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`the size of the gap. which in turn reduces the leakage of EMI
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`emissions through the gap. It is also understood by people of
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`ordinary skill in the art that EMI emissions are reduced by
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`improving the grounding of the cover 14 to the base 12.
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`which is properly grounded via a power cord. Proper
`grounding is achieved by increasing metal-to—metal contact
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`between the cover 14 and the base 12. and the contacts 29
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`of the present invention provide this function. By utilizing
`contacts 29 that are flexible. the probability of each flexible
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`contact 29 making contact with the cover 14 across a formed
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`’gap is increased. since higher protruding contacts 29 will
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`flex downward and will not prevent lower protruding con-
`tacts 29 from making contact.
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`While the above description contains many specificities.
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`these should not be construed as limitations on the scope of
`the invention. but rather as an exempliflcation of preferred
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`embodiments thereof. Many other variations are possible.
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`10
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`6
`For example. the flexible contacts 29 can be formed on the
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`sides of the cover 14 and base 12. or on the front and rear
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`of the cover 14. or on both the base 12 and the cover 14. In
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`addition. flexible contacts 29 can be integrally formed into
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`a computer system chassis for stand-up tower type configu—
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`rations as well. by integrally forming flexible contacts 29
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`along the perimeter of contact regions between the base and
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`cover of the tower chassis.
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`What is claimed is:
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`l. A chassis for housing electronic devises. said housing
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`comprising:
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`a base formed from a base material.
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`a cover formed from a cover material.
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`said cover configured to attach to said base. with certain
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`cover regions contacting certain base regions. and
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`wherein said contact between said base and said cover
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`is less than continuous. and
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`a plurality of flexible contacts integrally formed from the
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`material of at least one of said base regions and said
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`cover regions and shaped to contact the other of said
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`base regions and said cover regions. said flexible con-
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`tacts improving electrical contact between said base
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`regions and said cover regions and reducing the size of
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`any gaps that form between the cover regions and base
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`regions. and said flexible contacts having suflicient
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`flexibility to enable more than one contact to contact
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`said other region.
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`2. The chassis of claim 1. wherein said improved contact
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`between said base regions and said cover regions is an
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`electrical contact for improving electrical grounding of said
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`cover.
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`3. The chassis of claim 1. wherein said improved contact
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`between said base regions and said cover regions is a
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`mechanical contact for reducing the size of potential gaps.
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`4. The chassis of claim 1. wherein said flexible contacts
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`are integrally formed into said base during manufacturing of
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`a base blank.
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`5. The chassis of claim 1. wherein said electronic devices
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`comprise a computer system.
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`6. The chassis of claim 1. wherein said chassis is a
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`computer system chassis used for housing a computer sys—
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`tem comprising a microprocessor.
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`7. The chassis of claim 1. wherein said flexible contacts
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`comprise a section of a base blank around which a portion
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`of the base blank is punched out.
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`8. The chassis of claim 7. wherein said flexible contacts
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`are parallel to said portions of said base blank from which
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`said flexible contacts are formed.
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`9. The chassis of claim 7. wherein said flexible contacts
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`protrude from the plane of said base blank from which said
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`flexible contacts are formed.
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`10. The chassis of claim 1. wherein said flexible contacts
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`comprise molded portions of a base blank.
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`11. The chassis of claim 10. wherein said flexible contacts
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`comprise portions of said base blank formed in a plane
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`parallel to the plane of the base blank.
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`12. The chassis of claim 10. wherein said flexible contacts
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`protrude from the plane of said base blank from which said
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`flexible contacts are formed
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`13. The chassis of claim 1. wherein each of said plurality
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`of flexible contacts comprises
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`a protrusion arm formed by punching out portions of a
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`base blank
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`14. The chassis of claim 1. wherein said flexible contact
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`has an outwardly arcing dimple extending outward in the
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`same direction as the flexible contact.
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`Case 3:14-cv-00757-REP-DJN Document 81-8 Filed 04/10/15 Page 9 of 11 PageID# 10615
`Case 3:14-cv-00757-REP-DJN Document 81-8 Filed 04/10/15 Page 9 of 11 PagelD# 10615
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`5.777.854
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`15. A chassis for housing electronic device. said chassis
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`comprising:
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`a base formed from an electrically conductive material.
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