Case 3:14-cv-00757-REP-DJN Document 30-8 Filed 12/19/14 Page 1 of 11 PageID# 918
`Case 3:14-cv-00757-REP-DJN Document 30-8 Filed 12/19/14 Page 1 of 11 PageID# 918
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`EXHIBIT H
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`EXHIBIT H
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`Case 3:14-cv-00757-REP-DJN Document 30-8 Filed 12/19/14 Page 2 of 11 PageID# 919
`case 3:14'CV'00757'REP'DJN Docurner“Willi]iiillllli111111111111lllll’illlfilililflllillilillillllillll’i’i 919
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`USOOS777854A
`
`C
`Umted States Patent
`
`[19]
`
`[11] Patent Number:
`
`5,777,854
`
`Welch et al.
`[45] Date of Patent:
`Jul. 7, 1998
`
`
`[54]
`
`INTEGRATE FLEXIBLE CONTACTS
`GROUNDING SYSTEM FOR A COMPUTER
`SYSTEM CHASSIS
`
`[75]
`
`Inventors: Randall S. Welch. Lake Forest; Bao
`Gia Le. Orange. both of Calif.
`
`[73] Assignee: AST Research, Inc. Irvine. Calif.
`
`[21] Appl. No.: 866,397
`
`4,322,572
`5,014,160
`5,278,351
`5,354,951
`
`3/1982 Snyder .................................. 174/35 R
`
`5/1991 McCoy, It
`361/818
`
`1/1994 Herrick ...............
`.. 174/35 R
`................... 174/35 R
`10/1994 Lange, Sr. et a1.
`
`Primary Examiner—Leo P. Picard
`Assistant Examiner—Anthony Dinkins
`Attorney, Agent, or Firm—Knobbe. Martens. Olson & Bear.
`L.L.P.
`
`[22]
`
`Filed:
`
`May 30, 1997
`
`[57]
`
`ABSTRACT
`
`Related US Application Data
`.
`.
`Eggetanuanon 0f Ser. No. 445’430’ May 19’ 1995’ aban—
`6
`
`[63]
`
`Int. Cl.
`[51]
`[52] US. Cl.
`
`....................................................... H05K 7/14
`.......................... 361/800; 364/818; 364/224:
`364,816; 364(7523 174.35 R; 17.435 GC;
`435/88’ 435/109’ 435/6099 435/608
`[58] Field of Search ..................................... 361/723. 736.
`20 8;?1/271328'272557737757789? 816' 813‘
`‘
`35‘ GC ‘50 5'2 1 518:?9/88’ 1176??0%
`607—610; 257/678. 659. 660; 307/89. 90;
`220/402 206/275
`’
`
`8
`
`[56]
`
`References Cited
`U.S. PATENT DOCUMENTS
`
`A computer system chassis. including a base and a cover.
`implements an improved grounding system by integrally
`forming a plurality of flexible protruding contacts into
`predetermined contact regions throughout the base during
`the metal punching manufacturing phase of the chassis base
`blank. In this way‘ when the base and cover are attached to
`each other. the size of any gaps which may form in these
`contact regions. as a result of warpage or design tolerances.
`are reduced. This is due to the number of mechanical
`contacts being made by the plurality of flexible contacts
`which protrude and extend across these gaps and connect the
`base to the coyer. In addition toreducrng the sac of these
`gaps, the flexrble contacts prov1de an improved electrical
`grounding to the cover by increasing metal-to-metal contact
`between the cover and the base. both of which reduce EMI
`emissions from the computer system chassis.
`
`4,115,655
`
`9/1978 Prentice ................................ 174135 R
`
`19 Claims, 3 Drawing Sheets
`
`
`
`

`

`Case 3:14-cv-00757-REP-DJN Document 30-8 Filed 12/19/14 Page 3 of 11 PageID# 920
`Case 3:14-cv-OO757-REP-DJN Document 30-8 Filed 12/19/14 Page 3 of 11 Page|D# 920
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`US. Patent
`
`Jul. 7, 1998
`
`Sheet 1 of 3
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`5,777,854
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`
`
`

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`Case 3:14-cv-00757-REP-DJN Document 30-8 Filed 12/19/14 Page 4 of 11 PageID# 921
`Case 3:14-cv-OO757-REP-DJN Document 30-8 Filed 12/19/14 Page 4 of 11 Page|D# 921
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`US. Patent
`
`Jul. 7, 1998
`
`Sheet 2 of 3
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`5,777,854
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`FIG. 3
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`'
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`"9
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`52
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`22
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`1
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`FIG. 5
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`30
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`32
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`2.9
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`Case 3:14-cv-00757-REP-DJN Document 30-8 Filed 12/19/14 Page 5 of 11 PageID# 922
`Case 3:14-cv-OO757-REP-DJN Document 30-8 Filed 12/19/14 Page 5 of 11 Page|D# 922
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`US. Patent
`
`Jul. 7, 1998
`
`Sheet 3 of 3
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`5,777,854
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`FlG.7a
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`26'
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`7/7/:/://4.'f’l////////////_/////__//_//[//_//,/////////////.
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`\\\\r\\\\\\\\\\\\\\\\\\\\r\\\\\\\\\\\\\\
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`Case 3:14-cv-00757-REP-DJN Document 30-8 Filed 12/19/14 Page 6 of 11 PageID# 923
`Case 3:14-cv-OO757-REP-DJN Document 30-8 Filed 12/19/14 Page 6 of 11 PagelD# 923
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`5.777.854
`
`2
`
`l
`INTEGRATE FLEXIBLE CONTACTS
`GROUNDING SYSTEM FOR A COMPUTER
`SYSTEM CHASSIS
`
`This application is a continuation of US. patent appli-
`cation Ser. No. 08/445430. filed May 19. 1995 now aban-
`doned.
`
`FIELD OF THE INVENTION
`
`This invention relates to a grounding system for a chassis
`used for housing electronic devices. and more specifically to
`a grounding system for a computer system chassis compris—
`ing integrated flexible contacts for reducing Electromagnetic
`Interference (EMI) emissions from the computer system
`chassis.
`
`BACKGROUND OF THE INVENTION
`
`Manufacturers of electronic devices must conform to
`certain Federal Communications Commission's (FCC) rules
`and regulations regarding the acceptable amount of EMI
`emissions from electronic devices. The FCC imposes limits
`on the amounts of EMI emissions allowed to be released
`from devices being sold and transported in and around the
`United States.
`
`With the implementation of each new generation of
`computer processor and specialized internal circuitry. the
`amount of EMI emissions generated by these new electronic
`devices have continued to increase. Therefore. computer
`manufacturers are constantly trying to improve the ground-
`ing on the computer system chassis used to house these
`devices in order to minimize the EMI emissions from the
`
`computer system chassis. Improving the grounding of the
`chassis also provides additional protection against electro-
`static discharge. which can damage computer system cir-
`cuitry if contact with a poorly grounded chassis results in
`electrostatic discharge.
`In a typical computer system. the computer system chas-
`sis comprises a base and a mating cover. The cover is
`removable from the base. thereby allowing an end user to
`maintain and upgrade the computer system and its associ-
`ated internal circuitry. However. if the cover is not properly
`mated to the base once the cover is attached to the base. then
`gaps will form between the cover and the base around a
`perimeter of contact region between the cover and the base.
`As is known in the art. the existence of these gaps allows for
`increased EMI emissions from the computer system chassis.
`Basically. with a loose-fitting cover. the cover is driven by
`the EMI emissions and acts like an antenna. By providing
`greater contact from the cover to the base which is properly
`grounded. the antenna effect of the cover is reduced.
`Previously. such gaps. or improper fittings. did not cause
`problems since the amount of EMI emissions being gener—
`ated was not significant. However. with today’s advanced
`circuitry. this is no longer true. Therefore. in order to reduce
`EMI emissions. computer manufacturers have attempted to
`increase the metal-to—metal contact between the base and the
`cover and to reduce the size of the gaps that occur between
`the base and the cover along the perimeter of contact region.
`thereby providing a better electrical grounding between the
`cover and the base.
`
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`A prior art solution to EMI emissions has been to attach
`one or more add—on contacts to the perimeter of contact
`region around the base in one or more localized areas in
`order to increase metal-to-metal contact between the base
`and the cover and to reduce the size of the gaps that form
`between the base and the cover. However.
`individually
`
`65
`
`installing such contacts by hand onto the chassis base
`increases costs by requiring additional add-on parts. and is
`both time consuming and labor intensive to install.
`Therefore. a better solution is needed to increase metal—
`to-metal contact between the base and cover. and to reduce
`the size of gaps occurring between the base and cover.
`thereby providing a better electrical grounding between the
`base and cover. which reduces EMI emissions from the
`computer system chassis without increasing the cost of parts
`and labor.
`
`SUMMARY OF THE INVENTION
`
`The computer system chassis grounding system of the
`present invention comprises integrated flexible contacts for
`reducing EMI emissions from a computer system chassis by
`providing an improved electrical grounding system that
`increases contact between. and reduces the size of gaps
`between. the base and cover without increasing the cost of
`parts and labor.
`The grounding system of the present invention comprises
`a plurality of integrated flexible contacts which. in a pre-
`ferred embodiment. are integrally formed throughout por-
`tions of the base that are referred to as contact regions. The
`flexible contacts are formed by punching out portions of a
`chassis base blank during the manufactlning process to form
`flexible contacts comprising a protrusion arm having a
`dimple. In this way. the size of any potential gaps which may
`form between the base and cover due to design tolerances
`are minimized by the placement of these flexible contacts.
`which provide additional points of contact between the base
`and the cover. The dimple provides the actual contact point
`on the protrusion arm between the computer system chassis
`base and cover. If design tolerances are very small.
`the
`protrusion arm can be kept flush with the base plane. since
`the dimple will provide enough of a protrusion to extend
`across a slim gap formed in a chassis having a small design
`tolerance.
`
`It is to be understood that the flexible contacts may be
`formed in various ways. other than by punching out portions
`of the base blank. For example. if the shape of the base blank
`is formed by a mold. then the mold can be designed to
`produce the flexible contacts without the need for punching
`out portions of the base blank after the molding process.
`One of the benefits of the present invention is that the
`computer system chassis grounding system of the present
`invention does not require any add-on contacts. Thus. cost
`savings are realized by reducing the parts count and by
`reducing labor costs required for manual installation.
`Accordingly. it is an object of the present invention to
`provide an improved grounding system for a chassis used for
`housing electronic devices.
`It is a further object of the present invention to provide an
`improved grounding system for a computer system chassis.
`An additional object of the present invention is to provide
`an improved computer system chassis grounding system
`comprising integrated flexible contacts.
`Another object of the present invention is to provide a
`chassis grounding system that increases metal-to—metal con-
`tact between the base and the cover. thereby reducing EMI
`emissions from the computer system chassis.
`Ftn‘ther objects and advantages of the present invention
`will become apparent from a consideration of the drawings
`and ensuing description.
`BRIEF DESCRIPTION OF THE DRAWINGS
`
`FIG. 1 is an exploded perspective View of a computer
`system chassis comprising a base and a mating cover.
`
`

`

`Case 3:14-cv-00757-REP-DJN Document 30-8 Filed 12/19/14 Page 7 of 11 PageID# 924
`Case 3:14-cv-OO757-REP-DJN Document 30-8 Filed 12/19/14 Page 7 of 11 Page|D# 924
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`5,777,854
`
`3
`FIG. 2 is an enlarged perspective view of a portion of FIG.
`1 showing the details of a plurality of flexible contacts.
`FIG. 3 is a partial front view of a front face of the base.
`FIG. 4 is a partial rear view of a rear face of the base.
`FIG. 5 is a partial top View of the rear face of the base.
`FIG. 6 is a partial top phantom view of a front cover
`perimeter of contact region and a front base perimeter of
`contact region.
`FIG. 7a is a side cutaway view of FIG. 6 shown prior to
`attaching the cover to the base.
`FIG. 7b is a side cutaway view of FIG. 6 shown after the
`cover is attached to the base. This figure illustrates the
`benefits of having flexible contacts. which increase the
`likelihood of contact between the cover and the base in
`contact regions where gaps may form.
`
`DETAILED DESCRIPTION OF A PREFERRED
`EMBODIMENT
`
`FIG. 1 is an exploded perspective View of a computer
`system chassis 19 comprising a base 12 and a mating cover
`14. Most computer systems usually include a front bezel 16
`as well. In a preferred embodiment. the base 12 comprises
`a front face 18 and a rear face 20. The front face 18
`comprises a front base perimeter of contact region 22. This
`region 22 comprises a plurality of flexible contacts 29. and.
`as seen in FIGS. 2 and 3. each contact 29 comprises a
`protrusion arm 30 having a dimple 32. The rear face 20
`comprises a rear base perimeter of contact region 24. This
`region 24 comprises a plurality of flexible contacts 29. and.
`as seen in FIG. 4 and 5. each contact 29 comprises a
`protrusion arm 30 having a dimple 32. The base 12 also has
`a left side edge 34a and a right side edge 3417. which
`typically comprises a rail (not shown) for mating with and
`guiding a corresponding rail (not shown) on the cover 14.
`Although a stand-up tower type chassis may differ slightly
`in configuration. it is to be understood that a person of
`ordinary skill in the art will be able to apply the concepts
`disclosed herein to such variations in configuration. For
`example. in a tower type chassis. a base may comprise a
`major portion of the chassis. with a cover merely being a
`removable side.
`top. or rear panel. If contact regions
`between the base and removable panel are susceptible to
`forming gaps. then the teachings of the present invention are
`desirable in. and easily adaptable to. such a configuration.
`The cover 14 comprises a front cover perimeter of contact
`region 26 and a rear cover perimeter of contact region 28
`(which extends inward from the top and sides of the cover
`toward the center of the rear. in order to provide a region for
`contacting with the rear base perimeter of contact region 24.
`but is not shown in FIG. 1). as well as a left side 35a having
`a left side edge 36a and a right side 35b having a right side
`edge 36b. The cover 14 also typically comprises side rails
`(not shown) along the left and right side edges 36a and 36b
`for mating with and being guided onto the base 12.
`The various “perimeter of contact regions” (e.g. regions
`22. 24. 26. and 28 as are shown in FIG. 1) are defined as
`regions between the base 12 and cover 14 which are
`designed to contact each other to form a flush contact
`between the base 12 and cover 14. but do not always do so.
`These regions sometimes form gaps due to warped bases 12
`or covers 14 or other various factors relating to design
`tolerances. On the base 12. these regions are the localized
`regions to which prior art add—on contacts were typically
`attached These regions typically run along the left. right.
`and upper perimeter of the front and rear faces 18 and 20 of
`
`4
`the computer system chassis 10 base 12. On the cover 14.
`these regions typically run along the left. right. and upper
`perimeter of the front and rear edges of the cover 14. as
`indicated by the labels 26 and 28. which define the front
`cover perimeter of contact region 26 and the rear cover
`perimeter of contact region 28.
`It is known in the prior art that attaching the cover 14 of
`the computer system chassis 10 to the base 12 may result in
`some gaps forming between the from base perimeter of
`contact region 22 and the front cover perimeter of contact
`region 26. as well as between the rear base perimeter of
`contact region 24 and the rear cover perimeter of contact
`region 28. These gaps. contribute to leakage from the
`computer system chassis 10 of EMI emissions generated by
`a computer’s processor and internal circuitry (not shown).
`EMI emissions also occur as a result of improper grounding
`of the cover 14 resulting from poor contact between the
`cover 14 and the base 12. A prior art solution has been to
`attach one or more contacts in these localized areas where
`gaps are formed.
`For example. if a certain region of one of the perimeter of
`contact region areas is slightly warped. then the contact in
`that region between the base 12 and the cover 14 will not sit
`flush. and gaps will form (as shown in FIG. 7b). By
`manually placing an add-on contact
`into this localized
`region. the size of the gap can be reduced. thereby reducing
`the leakage of EMI emissions resulting from that gap.
`The computer system chassis 10 of the present invention
`comprises a plurality of flexible contacts 29 which are
`comprised of protrusion arms 30 having dimples 32. The
`flexible contacts 29 are manufactured integrally into the
`chassis 10 so that add-on contact parts (not shown) do not
`have to be used. and so that manual labor to install these
`add-on protrusion parts is not required. By manufacturing
`the chassis 10 with a plurality of flexible contacts 29 integral
`to the chassis 10. potential gaps formed by contact regions
`that do not sit flush are reduced in size. thereby reducing
`leakage of EMI emissions generated by the computer’s
`processor and internal circuitry (not shown). In a preferred
`embodiment. the flexible contacts 29 are formed integral to
`the base 12. although the contacts 29 could just as easily
`have been formed on the cover 14 or both the base 12 and
`the cover 14.
`
`FIG. 2 is an enlarged view showing more detail of a few
`of the flexible contacts 29. In FIG. 2. a portion of the front
`base perimeter of contact region 22 is shown. This region 22
`comprises integrally formed flexible contacts 29 which
`comprise protrusion arms 30 having dimples 32. The
`dimples 32 act as the contact point between the base 12 and
`the cover 14. The flexible contacts 29 are formed during the
`manufacturing process by taking a base blank (not shown)
`and punching out portions of the base blank so as to form the
`protrusion arms 30. The dimples 32 are added to the
`protrusion arms 30 during this process as well. It is to be
`understood that the flexible contacts 29 can be formed using
`a molding process as well.
`Each flexible contact 29 is then slightly oflset and raised
`from the plane of the surface from which it was punched out.
`The flexible contact 30 protrudes from the surface level of
`the front base perimeter of contact region 22. and in a
`preferred embodiment. the contacts 29 remain flexible after
`this process. By remaining flexible. the contacts 29 ensure
`that most. if not all. of the contacts 29 will make contact with
`the cover 14. If stilf contacts 29 are used. an individual
`contact 29 that protrudes the furthest would stop the cover
`14 from coming closer to the base 12. thereby preventing
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`

`

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`5
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`5.777.854
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`contacts 29 which protrude less from making contact. In
`other words. flexibility is important in case certain contacts
`29 protrude more than others. By flexing. all contacts 29 are
`capable of making contact with a corresponding contact
`point on the cover 14.
`FIG. 3 is a front view of a portion of the front base
`perimeter of contact region 22. This View better illustrates
`the raised offset of the flexible contacts 29 above the plane
`of the sheet metal from which it was punched out.
`FIG. 4 is a rear view of a portion of the rear base perimeter
`of contact region 24. which illustrates the plurality of
`flexible contacts 29 formed onto the rear face 20.
`
`FIG. 5 is a top view looking down on a portion of the rear
`face 20. which illustrates the raised oflset of the flexible
`contacts 29 above the plane of the sheet metal from which
`it was punched out.
`When referring to an offset “above” the plane. the direc-
`tion of “above” is meant to describe a direction toward the
`corresponding mating component.
`In a preferred
`embodiment. the flexible contacts 29 may be raised out of
`the base 12 toward the cover 14. If the contacts 29 were
`
`punched out of the cover 14 instead. then the raised offset
`would be in the direction of the base 12.
`In such an
`alternative configuration. the term “above” would be in the
`opposite direction from that described for the preferred
`embodiment.
`
`if the manufacturing tolerances are small
`However.
`enough. then the contacts 29 may be formed in a plane
`parallel to the plane of the sheet metal from which is was
`punched out. since the raised dimples 32 will protrude a
`suflicient amount to extend across any slim gaps that may
`form in a chassis with small design tolerances.
`FIG. 6 is a partial phantom view of the front base
`perimeter of contact region 22 shown in contact with the
`front cover perimeter of contact region 26. The phantom
`view shows the flexible contacts 29 of the base 12 making
`contact with the front cover perimeter of contact region 26.
`FIGS. 70 and FIG. 7b show a side cutaway view of the
`front cover perimeter of contact region 26 coming into
`contact with the front base perimeter of contact region’s 22
`flexible contacts 29. Gaps typically are created when the
`cover 14 and base 12 do not sit flush. such as when one or
`the other is warped. Without
`the placement of flexible
`contacts 29 throughout the contact regions. large gaps may
`form where the contact regions do not sit flush. By integrally
`forming flexible contacts 29 into the base 12 contact region
`22. even if the base 12 and cover 14 do not sit flush in these
`contact regions. the flexible contacts 29 extend across the
`gaps to form a contact with the cover 14. thereby reducing
`the size of the gap. which in turn reduces the leakage of EMI
`emissions through the gap. It is also understood by people of
`ordinary skill in the art that EMI emissions are reduced by
`improving the grounding of the cover 14 to the base 12.
`which is properly grounded via a power cord. Proper
`grounding is achieved by increasing metal-to—metal contact
`between the cover 14 and the base 12. and the contacts 29
`of the present invention provide this function. By utilizing
`contacts 29 that are flexible. the probability of each flexible
`contact 29 making contact with the cover 14 across a formed
`’gap is increased. since higher protruding contacts 29 will
`flex downward and will not prevent lower protruding con-
`tacts 29 from making contact.
`While the above description contains many specificities.
`these should not be construed as limitations on the scope of
`the invention. but rather as an exempliflcation of preferred
`embodiments thereof. Many other variations are possible.
`
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`For example. the flexible contacts 29 can be formed on the
`sides of the cover 14 and base 12. or on the front and rear
`of the cover 14. or on both the base 12 and the cover 14. In
`addition. flexible contacts 29 can be integrally formed into
`a computer system chassis for stand-up tower type configu—
`rations as well. by integrally forming flexible contacts 29
`along the perimeter of contact regions between the base and
`cover of the tower chassis.
`What is claimed is:
`l. A chassis for housing electronic devises. said housing
`comprising:
`a base formed from a base material.
`a cover formed from a cover material.
`
`said cover configured to attach to said base. with certain
`cover regions contacting certain base regions. and
`wherein said contact between said base and said cover
`is less than continuous. and
`
`a plurality of flexible contacts integrally formed from the
`material of at least one of said base regions and said
`cover regions and shaped to contact the other of said
`base regions and said cover regions. said flexible con-
`tacts improving electrical contact between said base
`regions and said cover regions and reducing the size of
`any gaps that form between the cover regions and base
`regions. and said flexible contacts having suflicient
`flexibility to enable more than one contact to contact
`said other region.
`2. The chassis of claim 1. wherein said improved contact
`between said base regions and said cover regions is an
`electrical contact for improving electrical grounding of said
`cover.
`
`3. The chassis of claim 1. wherein said improved contact
`between said base regions and said cover regions is a
`mechanical contact for reducing the size of potential gaps.
`4. The chassis of claim 1. wherein said flexible contacts
`are integrally formed into said base during manufacturing of
`a base blank.
`5. The chassis of claim 1. wherein said electronic devices
`comprise a computer system.
`6. The chassis of claim 1. wherein said chassis is a
`computer system chassis used for housing a computer sys—
`tem comprising a microprocessor.
`7. The chassis of claim 1. wherein said flexible contacts
`
`comprise a section of a base blank around which a portion
`of the base blank is punched out.
`8. The chassis of claim 7. wherein said flexible contacts
`
`are parallel to said portions of said base blank from which
`said flexible contacts are formed.
`9. The chassis of claim 7. wherein said flexible contacts
`protrude from the plane of said base blank from which said
`flexible contacts are formed.
`10. The chassis of claim 1. wherein said flexible contacts
`comprise molded portions of a base blank.
`11. The chassis of claim 10. wherein said flexible contacts
`comprise portions of said base blank formed in a plane
`parallel to the plane of the base blank.
`12. The chassis of claim 10. wherein said flexible contacts
`
`protrude from the plane of said base blank from which said
`flexible contacts are formed
`13. The chassis of claim 1. wherein each of said plurality
`of flexible contacts comprises
`a protrusion arm formed by punching out portions of a
`base blank
`14. The chassis of claim 1. wherein said flexible contact
`has an outwardly arcing dimple extending outward in the
`same direction as the flexible contact.
`
`

`

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`5.777.854
`
`7
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`15. A chassis for housing electronic device. said chassis
`comprising:
`a base formed from an electrically conductive material.
`a cover formed from an electrically conductive material.
`said base having predetermined base regions of intended
`contact with said cover when said base and said cover
`are mutually attached.
`said cover having predetermined cover regions of
`intended contact with said base when said base and said
`cover are mutually attached. and
`a plurality of flexible contacts integrally formed from said
`electrically conductive material of at least one of said
`base regions and said cover regions and shaped to
`contact the other of said base regions and said cover
`regions. said flexible contacts reducing the size of gaps
`which form between said base regions and said cover
`regions wherein said flexible contacts extend across
`said gaps. said contact
`thereby increasing contact
`between said base and said cover and reducing the size
`of said gaps. said flexible contacts having sufficient
`flexibility to enable more than one contact to contact
`said other region.
`16. A chassis for housing electronic devices comprising:
`a base section;
`
`a cover section. said cover section attaching to said base
`section such that at least a plurality of cover section
`regions contact a plurality of base section regions; and
`a plurality of flexible contacts homogeneously formed
`from at least one of said base section and said cover
`section. wherein each of said flexible contacts is sepa-
`rated from said at least one of said base section and said
`cover section by a slot so that said flexible contact may
`
`10
`
`15
`
`25
`
`30
`
`8
`move outwardly from said at least one of said base
`section and said cover section to contact the other of
`said base section and said cover section to provide an
`electrical connection therebetween to provide continu-
`ity between EMF shielding provided by said base
`section and EMF shielding provided by said cover
`section.
`17. A chassis as defined in claim 16. wherein said flexible
`contact has a protrusion partially traversing the width of the
`flexible contact. said protrusion further enhancing contact
`between said flexible contact and the other of said base
`section and said cover section.
`18. The chassis as defined in claim 16. wherein said
`flexible contact is generally flat and biased outward from
`said one of said base section and said cover section toward
`the other of said base section and said cover section by a
`single bend. said single bend located where said flexible
`contact breaks the general plane of said one of said base
`section and said cover section from which said flexible
`contact is integrally formed.
`19. A chassis for housing electronic devices comprising:
`a base;
`a cover;
`
`a plurality of flexible contacts formed as part of an
`original material from which at least one of said base
`and said cover portion is formed; and
`a first end of each contact being a continuum of said
`original material. and a second end of each contact
`moving with respect to said cover portion. each said
`contact flexing between said respective first end and
`said respective second end.
`*****
`
`

`

`Case 3:14-cv-00757-REP-DJN Document 30-8 Filed 12/19/14 Page 10 of 11 PageID# 927
`
`UNITED STATES PATENT AND TRADEMARK OFFICE
`
`CERTIFICATE OF CORRECTION
`
`PATENT NO.
`DATED
`INVENTOR(S)
`
`: 5,777,854
`: July 7, 1998
`: Randall S. Welch et 211.
`
`Page 1 of l
`
`It is certified that error appears in the above-identified patent and that said Letters Patent is
`hereby corrected as shown below:
`
`Title page, Item I54], and Column 1, line 1,
`In the Title, Change "INTEGRATE" to -- INTEGRATED --.
`
`
`
`Signed and Sealed this
`
`Twenty-sixth Day of February, 2002
`
`Am'm'ng Officer
`
`Director nfthc United Statex Parent and Trndenmrk Oflice
`
`JAMES E. ROGAN
`
`

`

`Case 3:14-cv-00757-REP-DJN Document 30-8 Filed 12/19/14 Page 11 of 11 PageID# 928
`Case 3:14-cv-OO757-REP-DJN Document 30-8 Filed 12/19/14 Pae 11 of 11 Page|D# 928
`
`UNITED STATES PATENT AND TRADEMARK OFFICE
`
`CERTIFICATE OF CORRECTION
`
`PATENT NO.
`DATED
`INVENTOR(S)
`
`: 5,777,854
`: July 7, 1998
`: Welch et a1.
`
`Page 1 of 1
`
`It is certified that error appears in the above-identified patent and that said Letters Patent is
`hereby corrected as shown below:
`
`
`Column 8
`
`Line 29, insert -- the other of at least one of said base portion and -- between "with
`respect to" and "said cover portion. "
`
`Signed and Sealed this
`
`Third Day of May, 2005
`
`m W311.”
`
`JON W. DUDAS
`Director oft/1e United States Patent and Trademark Ofi‘ice
`
`