Case 6:20-cv-01215-ADA Document 59 Filed 02/23/22 Page 1 of 41
`Case 6:20-cv-01215-ADA Document 59 Filed 02/23/22 Page 1 of 41
`
`IN THE UNITED STATES DISTRICT COURT
`FOR THE WESTERNDISTRICT OF TEXAS
`WACODIVISION
`
`
`
`Plaintiff
`
`Vv.
`
`MediaTek Inc. and MediaTek USA Inc.
`(‘“MediaTek”),
`
` Ocean Semiconductor LLC,
`
`
`
`
`Defendants. Ocean Semiconductor LLC,
`
`Defendant. Ocean Semiconductor LLC,
`
`
`
` Defendants.
`
`Plaintiff
`
`Vv.
`
`NVIDIA Corporation,
`
`
`
`Plaintiff
`
`¥.
`
`NXP USA,Inc.
`
`Civil Action No.: 6:20-cv-1210-ADA
`
`JURY TRIAL DEMANDED
`
`PATENT CASE
`
`Civil Action No.: 6:20-cv-01211-ADA
`
`JURY TRIAL DEMANDED
`
`PATENT CASE
`
`Civil Action No.: 6:20-cv-1212-ADA
`
`JURY TRIAL DEMANDED
`
`PATENT CASE
`
`

`

`Case 6:20-cv-01215-ADA Document 59 Filed 02/23/22 Page 2 of 41
`Case 6:20-cv-01215-ADA Document 59 Filed 02/23/22 Page 2 of 41
`
`Ocean Semiconductor LLC,
`
`Plaintiff
`
`Vv.
`
`Renesas Electronics Corporation and Renesas
`Electronics America,Inc.,
`
` Defendants.
`
`Ocean Semiconductor LLC,
`
`Plaintiff
`
`v.
`
`Silicon Laboratories Inc.,
`
`
`
`
`
`
`
`
`
`
` Defendant.
`
`
`Defendant.
`
`Ocean Semiconductor LLC,
`
`Plaintiff
`
`Vv.
`
`STMicroelectronics, Inc.,
`
`
`
`Civil Action No.: 6:20-cv-1213-ADA
`
`JURY TRIAL DEMANDED
`
`PATENT CASE
`
`Civil Action No.: 6:20-cv-1214-ADA
`
`JURY TRIAL DEMANDED
`
`PATENT CASE
`
`Civil Action No.: 6:20-cv-1215-ADA
`
`JURY TRIAL DEMANDED
`
`PATENT CASE
`
`

`

`Case 6:20-cv-01215-ADA Document 59 Filed 02/23/22 Page 3 of 41
`Case 6:20-cv-01215-ADA Document 59 Filed 02/23/22 Page 3 of 41
`
`
`Ocean Semiconductor LLC,
`
`Plaintiff
`
`v.
`
`
`
`
`
`
`Civil Action No.: 6:20-cv-1216-ADA
`
`JURY TRIAL DEMANDED
`
`PATENT CASE
`
`Western Digital Technologies, Inc.
`
`Defendant.
`
`
`TO THE APPROPRIATE JUDICIAL AUTHORITY OF TAIWAN:
`
`The United States District Court for the Western District of Texas presents its
`
`compliments to the Appropriate Judicial Authority of Taiwan, and requests judicial assistance to
`
`obtain evidence to be usedin a civil proceeding before this Court in the above-captioned matters.
`
`The Court requests the assistance described herein as necessary in the interests ofjustice.
`
`I. REQUEST
`
`The Court requests that the Appropriate Judicial Authority of Taiwan compel production
`ofdocuments andtestimony ofa representative or representatives from the following corporate
`
`entity:
`
`United Microelectronics Corporation (UMC)
`United Tower, 3 Li-Hsin 2nd Rd.,
`Hsinchu Science Park,
`Hsinchu, Taiwan 30078
`
`United Microelectronics Corporation is represented by:
`
`Robert G. Litts
`CANDESCENT LAW GROUP
`1350 Old Bayshore Hwy, Ste. 520
`Burlingame, CA 94010
`Telephone: (925) 644-1102
`robert.litts@candescentlaw.com
`
`

`

`Case 6:20-cv-01215-ADA Document 59 Filed 02/23/22 Page 4 of 41
`Case 6:20-cv-01215-ADA Document 59 Filed 02/23/22 Page 4 of 41
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`Specifically, the Court requests that United Microelectronics Corporation (“UMC”)
`
`produce the documents andthingsset forth in AttachmentA to this Request and thereafter
`produce a witness or witnessesto testify regarding the deposition topics set forth in Attachment
`
`A. The Court requests that the witness be placed under oath, subject to questioning by counsel
`
`for the parties to the above-captioned matters, and that a verbatim transcript of the testimony be
`
`taken.
`
`The Court understands that the documents and information requested may be of a
`
`confidential nature. As such, there is a Protective Orderin this case to protect the confidentiality
`
`of any documents produced. A copy of the Protective Order is appended to Attachment A.
`
`If service cannot be effected at the address indicated above, this Court respectfully
`
`requests judicial assistance to effect service by any means permitted under Taiwaneselaw.
`
`This Court further requests that the executed Letters Rogatory and any evidence produced
`
`in response be sent directly to counsel for the Requesting Party, Ocean Semiconductor LLC
`
`(“Ocean Semiconductor”), at the following address:
`
`Alex Chan
`Devlin Law Firm LLC
`1526 Gilpin Avenue
`Wilmington, DE 19806
`
`II. FACTS
`
`Plaintiff Ocean Semiconductorfiled lawsuits against Defendants Mediatek Inc. and
`
`Mediatek USAInc. (““Mediatek”), NVIDIA Corporation (“NVIDIA”), NXP USA,Inc. (“NXP”),
`
`Renesas Electronics Corporation and Renesas Electronics America, Inc. (“Renesas”), Silicon
`
`Laboratories Inc. (“Silicon Labs”), STMicroelectronics, Inc. (‘STMicro”), and Western Digital
`
`Technologies, Inc. (“WD”) (collectively “Defendants”) in the United States District Court for the
`
`Western District of Texas. Ocean seeks a judgment that Defendants infringe U.S. Patent Nos.
`
`

`

`Case 6:20-cv-01215-ADA Document 59 Filed 02/23/22 Page 5 of 41
`Case 6:20-cv-01215-ADA Document 59 Filed 02/23/22 Page 5 of 41
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`6,660,651, 6,907,305, 6,725,402, 6,968,248, 7,080,330, 6,836,691, and 8,676,538 (collectively,
`
`the “Asserted Patents”).! Ocean Semiconductor seeks an award of damages from Defendantsto
`
`compensate for the alleged patent infringement. The technology described and claimed in the
`
`Asserted Patents relates to, among other things, the use of a movable wafer stage, fault detection,
`
`process scheduling, and measurementofcritical dimension and overlay in semiconductor
`
`manufacturing.
`
`In response to Ocean Semiconductor’s infringement claims, Defendants have asserted
`
`defenses that include noninfringement, exhaustion, license and implied license. The documents
`
`requested in AttachmentA are critical to Ocean Semiconductor’s ability to demonstrate
`
`Defendants’ infringement of the Asserted Patents and to properly and fully respond to
`
`Defendants’ defenses.
`
`.
`
`III]. OFFER OF RECIPROCAL ASSISTANCE
`
`The United States District Court for the Western District of Texasis willing to provide
`
`similar assistance to the Appropriate Judicial Authority of Taiwan. See 28 U.S.C. § 1782.
`
`°
`
`IV. REIMBURSEMENTFOR COSTS
`
`This Court, through Plaintiff Ocean Semiconductor, is willing to reimburse the
`
`Appropriate Judicial Authority of Taiwan for costs and expenses incurred in executing these
`
`Letters Rogatory.
`
`' Ocean also seeks a judgment against NXP and STMicrofor infringement of U.S. Patent No.
`6,420,097. However, Oceanis not presently seeking information from UMC related to those
`claims.
`
`iii
`
`

`

`Case 6:20-cv-01215-ADA Document 59 Filed 02/23/22 Page 6 of 41
`Case 6:20-cv-01215-ADA Document 59 Filed 02/23/22 Page 6 of 41
`
`Respectfully Requested,
`DATEDthis Le day of
`
`, 2022.
`
`(SEAL OF THE COURT)
`
`
`
`The Honorable Alan D
`United States District Judge
`for the Western District of Texas
`800 Franklin Avenue
`Waco, Texas 76701
`United States of America
`Tel.: +1 (254) 750-1519
`
`
`
`

`

`Case 6:20-cv-01215-ADA Document 59 Filed 02/23/22 Page 7 of 41
`Case 6:20-cv-01215-ADA Document 59 Filed 02/23/22 Page 7 of 41
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`ATTACHMENTA:
`
`You are hereby subpoenaed and commandedto appearto testify and produce the
`
`documents as requested below:
`
`DEFINITIONS
`
`Whenusedin the below topics, the following definitions apply:
`
`l.
`
`“UMC,” “You,” or “Your” shall each mean andrefer, individually and
`
`collectively, to United Microelectronics Corporation; all of its corporate locations, andall
`
`predecessors, successors, assigns, parents, subsidiaries and divisions, affiliates, partners; and all
`
`past and present directors, officers, employees, agents, and representatives (including
`
`accountants, consultants, and attorneys) of any of the foregoing, and all persons acting or
`
`purporting to act on its behalf.
`
`2.
`
`“Plaintiff,” “Ocean Semiconductor,” or “Ocean” shall mean Ocean Semiconductor
`
`LLC andits predecessors, successors, assigns, parents, subsidiaries and divisions, affiliates,
`
`partners, and all past and present directors, officers, employees, agents, and representatives
`
`(including consultants and attorneys) of any of the foregoing. andall persons acting or purporting
`
`to act on their behalf.
`
`3.
`
`“ASML”shall mean ASML Holding N.V. and ASML Netherlands B.V., andall
`
`of their corporate locations, and all predecessors, successors. assigns, parents, subsidiaries and
`
`divisions, affiliates, partners; and all past and present directors, officers, employees, agents, and
`
`representatives (including accountants, consultants, and attorneys) of any of the foregoing, and
`
`all persons acting or purporting to act on their behalf.
`
`4.
`
`“Applied Materials” shall mean Applied Materials, Inc. all of its corporate
`
`locations, and all predecessors, successors, assigns, parents, subsidiaries and divisions, affiliates,
`
`

`

`Case 6:20-cv-01215-ADA Document 59 Filed 02/23/22 Page 8 of 41
`Case 6:20-cv-01215-ADA Document 59 Filed 02/23/22 Page 8 of 41
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`partners; andall past and presentdirectors, officers, employees, agents, and representatives
`
`(including accountants, consultants, and attorneys) of any of the foregoing, and all persons acting
`
`or purporting to act on its behalf.
`
`5.
`
`“PDFSolutions” shall mean PDFSolutions, Inc.all of its corporate locations, and
`
`all predecessors, successors, assigns, parents, subsidiaries and divisions, affiliates, partners; and
`
`all past and presentdirectors, officers, employees, agents, and representatives (including
`
`accountants, consultants, and attorneys) of any of the foregoing, and all persons acting or
`
`purportingto acton its behalf.
`
`6.
`
`“Actions” shall mean any andall of the following: Ocean Semiconductor LLCv.
`
`MediaTekInc., et al., No. 6:20-cv-012 0-ADA (W.D. Tex.), Ocean Semiconductor LLC v.
`
`NVIDIA Corp., No. 6:20-cv-01211-ADA (W.D. Tex.), Ocean Semiconductor LLC v. NXP
`
`Semiconductors NV, et al., No. 6:20-cv-01212-ADA (W.D. Tex.), Ocean Semiconductor LLC v.
`
`Renesas Elecs. Corp., et al., No. 6:20-cv-01213-ADA (W.D. Tex.), and Ocean Semiconductor
`
`LLC v. STMicroeletronics, Inc., No. 6:20-cv-1215-ADA (W.D. Tex).
`
`7.
`
`“Defendant” and “Defendants” shall mean any andall of the following entities:
`
`MediaTek Inc., MediaTek USAInc., NVIDIA Corporation, NXP USA,Inc., Renesas Electronics
`
`Corporation, Renesas Electronics America,Inc., STMicroelectronics,Inc., Analog Devices,Inc.,
`
`Infineon Technologies AG and Infineon Technologies Americas Corp., as well asall
`
`predecessors, successors, assigns, parents, subsidiaries and divisions, affiliates, partners of any of
`
`the foregoing, andall persons acting, or purporting to act, on behalf of any of the foregoing.
`
`8.
`
`“Mediatek Infringing Instrumentalities” shall mean products include, without
`
`limitation, mobile devices (e.g., Helio G, Helio A, Helio P, Helio X, mid-range 4G devices, and
`
`Google Mobile Services express devices), tablet products (e.g., MiraVision), internet of things
`
`

`

`Case 6:20-cv-01215-ADA Document 59 Filed 02/23/22 Page 9 of 41
`Case 6:20-cv-01215-ADA Document 59 Filed 02/23/22 Page 9 of 41
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`devices (e.g., 1500,
`
`i350,
`
`i300A,
`
`i300B, MT3620, MT2625, MT2621, MT2601, MT2523G,
`
`MT2523D, MT2511, MT6280, MT2502, MT5931, MT3332, MT 2503, MT3333, MT3303,
`
`MT3337, and MT3339), automotive devices (e.g., Autus 120 (MT2712) devices, Autus RIO
`
`(MT2706) devices, and Autus T10 (M1T2635) devices), networkingand broadband devices(e.g.,
`
`MediaTek T750 MT7688A, MT7628K/N/A, MT7623N/A, MT7622, MT7621A/N, MT7620N/A,
`
`RT3662, RT3883, MT7688K, MT5932, MT8167S, MT7686, MT7682, MT7697H/HD, MT7681,
`
`MT7687F, MT7697, MT7697D, MT7601E, MT7601U, MT7603E, MT7603U, MT7610E,
`
`MT7610U, MT7612E, MT7612U, MT7615, MT7615B, MT76I5S, MT7662E, MT7662U,
`
`MT7668, RT3062, RT3070, RT3562, RT3573, RT3593, RT5370, RT5572, RT5592, MT3729,
`
`MT7601, MT7610, MT7630, RT5372, RT539x, RT8070, RT2870, RT2890, RT309x, RT3290,
`
`RT3370, RT3572, RT2070, RT2760, RT2770, RT2790, and RT2860), and home devices (e.g.,
`
`MT8516 SoM, MT8516, MT8507, MT8502, MediaTek C4X Development Kit for Amazon AVS,
`
`MT8516 2-Mic Development Kit for Amazon AVS, MT8516, MT8693, MT8685, MT8581,
`
`MT8580, MT8563, MT8553, MT1389/G, MT1389/J, MT1389/Q, S900 (MT9950), MT9613,
`
`MT9685, MT9602, MT5592, MT5582, MT5596, MT5597, MT5580, MT5561, MT5505,
`
`MT5398, MT5396, MT1959, MT1887, MT1865, MT1862, and MT1398), flash memory and
`
`memory controllers (e.g., MT81XX SPI), and WiFi extenders (MTK7621A), television products
`
`(e.g., S900 (MT9950)); camera products (e.g., MediaTek Dimensity 900), loT products (e.g.,
`
`MT8385; MediaTek i350,
`
`i300A (MT8362A),
`
`i300B (MT8362B), MT3620 MCU) gaming
`
`products (e.g. MediaTek Helio G90 Series, MediaTek Helio G85, MediaTek Helio G80, MediaTek
`
`Helio G70, MediaTek Helio G25, MediaTek Helio G35, MediaTek Helio G95) and similar
`
`systems, products, devices, and integrated circuits including, for example, products manufactured
`
`at 16nm technology node.
`
`

`

`Case 6:20-cv-01215-ADA Document 59 Filed 02/23/22 Page 10 of 41
`Case 6:20-cv-01215-ADA Document 59 Filed 02/23/22 Page 10 of 41
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`9.
`
`“NVIDIA Infringing Instrumentalities” shall mean without
`
`limitation graphics
`
`cards (e.g.GEFORCE RTX models(including, but not limited to, GEFORCE RTX 2060, 2060
`
`SUPER, 2070, 2070 SUPER, 2080, 2080 SUPER, 3070, 3080, and 3090), GEFORCE GTX
`
`models (including, but not limited to, GEFORCE GTX 1650, 1650 SUPER, 1660, and 1660
`
`Super), GEFORCE GTX TI models (including, but not limited to, GEFORCE GTX 1650 TI and
`
`1660 TI), TITAN RTX models (including, but not limited to, TITAN RTX , TITAN XP models,
`
`ZOTACmodels, GIGABYTE models, ASUS models, MSI models, and EVGA models), SHIELD
`
`devices, SHIELD TV media streamers, Jetson developer kits (e.g., NANO, NANO 2GB,and
`
`NANO MODULE), QUADRO professional graphics cards (e.g.. QUADRO RTX 8000,
`
`QUADRO RTX 8000 NVLink HB Bridge, QUADRO RTX 6000, QUADRO RTX 6000 NVLink
`
`HB Bridge, QUADRO GV100, QUADRO GV100 Bridge, and QUADRO Sync II), DGX Al
`
`Workstations, laptop products (GEFORCE RTX 3080 LAPTOP GPU, GEFORCE RTX 3080
`
`LAPTOP GPU, GEFORCE RTX 3070 LAPTOP GPU, GEFORCE RTX 3060 LAPTOP GPU,
`
`GEFORCERTX 3050 Ti LAPTOP GPU, GEFORCE RTX 3050 LAPTOP GPU),display products
`
`(e.g., GSYNC processors); streaming products (NVIDIA Tegra X1+); cloud products(e.g., A100
`
`40GB PCle, A100 80GB PCIe, A100 40GB SXM, Al00 80GB SXM, NVIDIA A10 TENSOR
`
`CORE GPU, NVIDIA A100, NVIDIA A10, NVIDIA Al6 GPU, NVIDIA A30 TENSOR CORE
`
`GPU, NVIDIA Al6, NVIDIA A30, NVIDIA A40, NVIDIA BlueField DPU, NVIDIA Converged
`Accelerators, NVIDIA ConnectX SmartNIC, NVIDIA V100, NVIDIA T4, NVIDIA T4Enterprise
`
`Server, NVIDIA HGX A100, NVIDIA DGX A100, NVIDIA DGXStation A100, NVIDIA DGX
`
`Systems, NVIDIA EGX Platform, NVIDIA EGX A100, NVIDIA HGX AI SUPERCOMPUTER),
`
`automotive products (e.g.. NVIDIA DRIVE Orin, NVIDIA DRIVE AGX Pegasus, NVIDIA
`
`DRIVE AGXXavier, NVIDIA DRIVE Hyperion, NVIDIA DRIVEAtlan), ethernet products (e.g.,
`
`

`

`Case 6:20-cv-01215-ADA Document 59 Filed 02/23/22 Page 11 of 41
`Case 6:20-cv-01215-ADA Document 59 Filed 02/23/22 Page 11 of 41
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`ConnectX-7 25/50/100/200/400G SmartNIC, ConnectX-6 Dx 10/25/50/100/200G SmartNIC,
`
`ConnectX-6 Lx 25-50G SmartNIC, ConnectX-6 10/25/50/100/200G SmartNIC, ConnectX-5
`
`10/25/50/100G SmartNIC, ConnectX-4 Lx 10-50GbE SmartNIC, Innova-2 Flex), data processing
`
`unit products (e.g, NVIDIA BlueField-3 DPU, NVIDIA BlueField-2 DPU, NVIDIA BlueField-
`2X Al-Powered DPU), embedded systems products (e.g., Jetson Nano, Jetson TX2 Series, Jetson
`
`Xavier NX, Jetson AGX Xavier Series) products manufactured at, for example, 5nm, 7nm, 28nm,
`
`and/or 90nm technology node, and similar products, devices, systems, components of systems,
`
`and/or integrated circuits.
`
`10...
`
`“NXPInfringing Instrumentalities” shall mean without limitation, ARM MCUs,
`
`power
`
`architecture
`
`processors,
`
`audio
`
`products,
`
`interfaces
`
`(e.g.,
`
`translators,
`
`1/Os,
`
`repeaters/hubs/extenders, transceivers, and PMICs and system basis chips), peripherals and logic
`(switches, drivers, comparators, multiplexers, bridges, and clocks), power management products,
`
`sensors, RF products, security and authentication products, wireless connectivity products, and
`
`application-specific products, such as processors and microcontrollers (e.g., HC $12, HC $12X,
`
`S08, digital signal controllers, $12 MAGNIV mixed-signal controllers, digital signal processors,
`
`PowerQuicc communications processors, Coldfire MCUs/MPUs,
`
`legacy MPUs, MPCSSXX
`
`MCUs, 5XX controllers, legacy MCUs, VFXXX controller solutions, MAC7100, MOBILEGT,
`
`crypto processors, media processors, S32K automotive MCUs,
`
`I/MX crossover MCUs,
`
`MAC57DXXX automotive MCUs, KEA MCUs, I.MX 6 processors, ILMX mature processors,
`
`I.MX 8 processors,
`
`IL.MX28 processors,
`
`ILMX 7 processors, Layerscape communication
`
`processors, S32V2 Vision MPUs,host andintegrated host processors (including 8XXX, 7XXX,
`
`7XX, and 6XX), QORIQ communication processors, MPC5XXX ultra-reliable MCUs, and S32R
`
`radar microcontrollers), audio products (e.g., TEF66XXHN, TDF85XXXX, SAF35XXXX,
`
`

`

`Case 6:20-cv-01215-ADA Document 59 Filed 02/23/22 _Page 12 of 41
`Case 6:20-cv-01215-ADA Document 59 Filed 02/23/22 Page 12 of 41
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`SAF36XXXX, and TDAI8XXXXHN),
`
`interfaces, (e.g., CBTLOXXXXXX, CBTU02044HE,
`
`GTL200XPW, MC33XXXBXXX, MC34XXX, MCZ339XXDXXXX, NTV200XXX,
`
`P82BXXTD, PCA3409AXX, PCA3416AXX, PCA85XXXX, PCA93XXXX, PCA9SXXXX,
`
`PCA96XXXX,
`
`PCAY7TXXXX,
`
`PCA9BXXXX,
`
`PCAL64XXXXX,
`
`PCAL65XXXXxX,
`
`PCALOSXXXXX, PCF85XXXX, MCZ33XXXCXXEK, UJALI6XATK, TJAII28XTK,
`
`),
`
`peripherals
`
`and logic products
`
`(e.g... CBTXXXXXXXX, GTL200XPW, NCX2202GX,
`
`NCX2220GX, NCX2222GX, NTBO10IGXX, NTBOIO02GXX, NTBO104GXX, NTSOI01XX,
`
`NTSO102XX, NTSO104XX, NTV4XXXXUK, NX3DV221XX, NX371G3157GM,
`
`), power
`
`management products (e.g., ASLSOXSHN, ASL250XSHN, ASL34XXSHN, ASL45XXSHN,
`
`MC32PFXXXX, MC33XXXXXX, MC3377KXXXXXX, MC3388XXXXXXX, ), RF devices
`
`(e.g., control circuits, low power TX/RX ICs, microwave LO generators, mixers, RF amplifiers,
`
`RF discrete components, RF power, Radar transceivers, and WLAN front-end modules), RFID
`
`devices(e.g., HITAG, MIFARE, NFC, and UCODEdevices). security and authentications devices
`
`(e.g., AlO06XX, A7IOXXXXX, SEOSOXXXXX, TDA80XXXX, OM67100), sensors (e.g.,
`
`FXLNXXXXX, FXLSXXXXX, MP3VXXXXXXXX, MPXXXXXX, MPAXXXXXXXX,X3T-
`
`OHXXX, and KMXXxX), and wireless connectivity devices (e.g., audio streaming devices,
`
`Bluetooth devices, DSRC modems, MCUSs, NFMI radio devices, thread, Wi-Fi and Bluetooth
`
`devices, wireless microcontrollers, and ZIGBEE), 8-Bit S08 MCU products (e.g., SO8PT Series,
`
`SO8PA Series, SOSPB Series, SO8PL Series, SO8PLS Series, SO8SU Series, SO8LL Series, SO8QL
`
`Series, SO8AW Series, SO8D Series, SO8EL-SL Series, SO8LG Series, SO8MP Series, SO8QD
`
`Series, SO8RN Series, SO8SC4 Series, SO8SG Series, SO8SL Series, SO8AC Series, SO8FL Series,
`
`SO8MM Series, SO8GT Series, SO8GW Series, SO8QA Scries, SO8SH Series, SO8JE Series,
`
`S08JM Series, SO8SV Series, SO8LC Series, SO8QE Series), edge computing products (e.g. i.MX
`
`

`

`Case 6:20-cv-01215-ADA Document 59 Filed 02/23/22 Page 13 of Al
`Case 6:20-cv-01215-ADA Document 59 Filed 02/23/22 Page 13 of 41
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`RT1170, iMX RTI170,
`
`i.MX RT1064,
`
`i. MX RT1060, i MX RT1050, i.MX RT1024,
`
`i.MX
`
`RT1020,
`
`i.MX RT1010,
`
`i.MX RT600,
`
`i.MX RT500, Layerscape® FRWY-LS1I046A Board,
`
`LS1046A Reference Design Board, Smart Home Gateway Reference Design, FRDM-LS1012A
`
`Board, LS1021A Tower® System Module, LS1043A Reference Design Board), motor and
`
`solenoid driver products (e.g. MC33887APVW, MC33887PEK, MC33887PFK, MC33926AES,
`
`MC33926PNB, MC33931EK, MC33931VW); powertrain and engine control products (e.g.,
`
`GD3100, MC33814, PT2001), high current motor control products (MM908E622ACPEK,
`
`MM908E624ACPEW, MM908E624AYPEW)automotive processors and microcontrollers(e.g.,
`
`S32 Processing Platform, S32G Vehicle Network Processor, $32K Microcontrollers), and similar
`systems, products, devices, and integrated circuits.
`11.
`“Renesas
`Infringing
`Instrumentalities”
`
`shall mean, without
`
`limitation,
`
`microcontrollers and microprocessors (e.g., RL78 Family of 8/16-bit Ultra-Low Energy MCUs,
`
`RX Family of 32-bit High Power Efficiency MCUs, RH850 Family, RZ Family of 64-Bit & 32-
`
`Bit Arm-Based High-End MPUs, V850 Family, 78K Family, R8C Family, M16C Family (R32C
`
`/ M32C / M16C), M32R Family, H8/S/SX Family, 720 Family, 740 Family, SuperH RISC engine
`Family, H8 Super Low Power, PLC MCU,Renesas RA Family of32-bit MCUs with Arm Cortex-
`
`M Core, RE Family, QZROM (740/720 Family), M16C (M32C/M16C) Family, R8C Family, 7700
`
`Family, and SuperH RISC engine Family and MCUs with Arm Cortex-M Core Implemented on
`
`Silicon on Thin Buried Oxide (SOTB)), amplifiers and buffers (e.g., CAIXXX, CA5XXX,
`
`EL2XXX, EL4XXX, EL5XXX, EL8XXX, HA-2XXX, HA-5XXX, HFAIIXX, ICL7XXX,
`ISL28XXX, ISLS55XXX, ISL59XXX, READ23XXXSP, and UPCKXXXXxX), analog products
`
`(e.g., switches and multiplexers), clocks and timing products(e.g., application-specific clocks,
`
`clock distribution, clock generation, crystal oscillators, and jitter attenuators with frequency
`
`

`

`Case 6:20-cv-01215-ADA Document 59 Filed 02/23/22 Page 14 of 41
`Case 6:20-cv-01215-ADA Document 59 Filed 02/23/22 Page 14 of 41
`
`translation), interface & connectivity products (e.g., wireless modules, switches and hubs, and
`
`wireless modules), audio and video products (e.g., ISL54XXX), automotive products (e.g.,
`
`Automotive System-on-Chip (SOC), Ambient Light Sensors, Analog ICs, Car Audio ICs, Battery
`
`Management Systems, CAN Transceivers, Discrete/Power MOFETsfor Automotive, Display ICs,
`
`Intelligent Power Devices, Interface ICs, LSI for Automotive, Microcontrollers (e.g. RH850 and
`
`RH850/F1 Kx), Microcontrollers (e.g. RL78/F 1x), Power Management(e.g., Power Management
`
`ICs for RH850, Power Supply ICs for R-Car, Switches & Multiplexers, Video ICs, Discrete Power
`
`Devices, regulators, MOSFETs and Motor Drivers, PMICs, and wireless power devices), ICs for
`
`Communications and Mobile Devices (e.g., SH-MobileR, SH-MobileR2, EMMA Mobile, SH-
`
`Mobile MT1, and R-Mobile Al), sensor products (e.g., flow sensors, gas sensors, humidity
`
`sensors,light & proximity sensors, position sensors, sensor signal conditioners, and optical sensors
`
`such as 1SL76671), data converters (e.g., HI-565A, HI-565A/883, and HI5XXX), ICs for Industrial
`
`Automation (R-IN) (e.g. R-IN32M3, R-IN32M4-CL2, TPS-1, EC-1, R-IN32M4-CL3, and R-
`
`IN32M3), ICs for Motor Driver/Actuator Driver, Interface devices (e.g., Bus Buffers, RS-485, RS-
`
`422, RS-232, Signal Integrity ICs, Dual Protocol RS-485, RS-232 Transceivers, and Industrial
`
`Network Transceivers), Legacy MCUs(e.g., 80C/82C Microprocessors & Peripherals), memory
`
`(e.g., ultra-fast Quad Data Rate SRAMs, SRAMs, EEPROM & PROM, MRAMS,FIFOproducts,
`
`interface products, and standard logic), Optoelectronics, power management devices (e.g.,
`
`RAJ240XXXDNP), RF products (e.g., modulators, demodulators, transistor arrays, beamformers,
`
`mixers, switches, attenuators, VGAs, synthesizers and PLLs), Renesas USB Power Delivery
`
`Family (e.g., Renesas USB Power Delivery Family Features and U30 Group), Secure MCUs (e.g.,
`
`AE-5 Series and RS-4 Series), Smart Analog devices (e.g., Smart Analog IC101, IC300, IC301,
`
`IC500,
`
`IC501, and I1C502), and space and harsh environment devices (e.g., 4PD720115,
`
`

`

`Case 6:20-cv-01215-ADA Document 59 Filed 02/23/22 Page 15 of 41
`Case 6:20-cv-01215-ADA Document 59 Filed 02/23/22 Page 15 of 41
`
`uPD720201, »PD720202, pPD720210, 1PD720211, M66291, R8A66593, and R8A66597),
`
`products manufactured at 28nm and 40nm technology node such as eFlash and MCUs,
`microprocessors, sensors,
`radars, power efficiency systems, electronic control units, and
`
`automotive products, and similar systems, products, devices, and integrated circuits.
`
`-
`
`12.
`
`“STMicro Infringing Instrumentalities” shall mean, without limitation advanced
`
`driver assistance systems(e.g., STV0991, STV0991, VG5761, STRADA431, STRADA770M),
`
`MEMS and sensor products
`
`(e.g., AISII20SX, AISI200PS, AIS2120SX, AIS2DW12,
`
`AIS328DQ, AIS3624DQ, H3LISI00DL, H3LIS200DL, H3LIS33IDL,
`
`IIS2DH, 1IS2DLPC,
`
`HS2ICLX, HS328DQ, IS3DHHC,
`
`IIS3DWB, LIS25BA, LIS2DE12, LIS2DH, LIS2DH12,
`
`LIS2DS12, LIS2DTW12, LIS2DW, LIS2DW12, LIS2HH12, LIS33IDLH, LIS331HH,
`
`LIS344ALH, LIS3DH, LIS3DHH, LIS3DSH, LIS3LV02DL, MIS2DH, AIS326DQ, A3G4250D,
`
`AIS1120SX, AIS1200PS, AIS2120SX, AIS2DW12, AIS328DQ, AIS3624DQ, ASM330LHH,
`
`VL53L0X, VL53LICB, VL53L1X, VL53L3CX, VL6180VI, VL6180X), microcontrollers (e.g.,
`
`STM32F410C8,
`
`STM32F41IRC,
`
`STM32F412CE,
`
`STM32F412RE,
`
`STM32413RH,
`
`STM32F423VH,
`
`STM32F439ZG,
`
`STM32F446ME,
`
`STM32723VC,
`
`STM32F732VE,
`
`STM32F767NI,
`
`STM32H723VE,
`
`STM32H723VG,
`
`STM32H23ZE,
`
`STM32H723ZG,
`
`STM32H725AE,
`
`STM32725AG,
`
`STM32725IE,
`
`STM32H7251IG,
`
`STM32H725RE,
`
`STM32H725RG,
`STM32H725ZG,
`
`STM32H725VE,
`STM32H725ZG,
`
`STM32H725VG,
`STM32H730AB,
`
`STM32H725ZE,
`STM327301B,
`
`STM32H725ZG,
`STM32H730VB,
`
`STM32H730ZB,
`
`STM32H733VG,
`
`STM32H733ZG,
`
`STM32H735AG,
`
`STM32H735IG,
`
`STM32H735RG,
`
`STM32H735VG,
`
`STM32H735ZG,
`
`STM32F205RB,
`
`STM32F205RB,
`
`STM32205RC,
`
`STM32F205RE,
`
`STM32F205RF,
`
`STM32F205RG,
`
`STM32F205VB,
`
`STMF205VC, STMF205VE, STM32F205VF, STMF205VG, STM32F205ZC, STM32F205ZE,
`
`

`

`Case 6:20-cv-01215-ADA Document 59 Filed 02/23/22 Page 16 of 41
`Case 6:20-cv-01215-ADA Document 59 Filed 02/23/22 Page 16 of 41
`
`STM32F205ZF, STMF205ZG), microprocessors, amplifiers, diodes,
`
`rectifiers, comparators,
`
`automotive devices, clocks and timers, converters, set-top boxes ICs,
`
`logic ICs, transceivers,
`
`memories, drivers, transistors, switches, voltage regulators, systems-on-chip (SoC), or similar
`
`products for mobile devices, wearables, banking,
`
`identification,
`
`industrial, communications,.
`
`energy, automotive, personal electronics, sensing, cloud, and Internet of Things applications, and
`
`similar systems, products, devices, and integrated circuits.
`
`13.
`
`“Infringing Instrumentalities” shall mean any and all of the Mediatek Infringing
`
`Instrumentalities, the NVIDIA Infringing Instrumentalities, the NXP Infringing Instrumentalities,
`
`the Renesas Infringing Instrumentalities and the STMicro Infringing Instrumentalities.
`
`14.
`
`“Asserted Patents”shall mean U.S. Patent Nos. 6,660,651 (referred to individually
`
`as the “’651 Patent”), 6,907,305 (referred to individually as the “’305 Patent”), 6,725,402 (referred
`
`to individually as the “’402 Patent”), 6,968,248 (referred to individually as the “248 Patent”),
`
`7,080,330 (referred to individually as the “’330 Patent”), 6,836,691 (referred to individually as the
`
`“°691 Patent”), 8,676,538 (referred to individually as the “’538 Patent”), and 6,420,097 (referred
`
`to individually as the “the ’097 Patent”).
`
`15.
`
`“Person” shall mean any natural person or any business, proprietorship, firm,
`
`partnership, corporation, association, organization, or other legal entity. The acts of a Person shall
`
`include the acts of directors, officers, owners, members, employees, agents, attorneys, or other
`
`representatives acting on the Person’sbehalf.
`
`16.
`
`The term “Documents” is defined, without
`
`limitation,
`
`to be synonymous in
`
`meaning and equal
`
`in scope to the usage of the phrase “documents or electronically stored
`
`information” in Federal Rule of Civil Procedure 34(a)(1)(A), and includes, without limitation,
`
`“writings,” “recordings,” and “photographs,” both “originals” and “duplicates,” as those terms are
`
`

`

`Case 6:20-cv-01215-ADA Document 59 Filed 02/23/22 Page 17 of 41
`Case 6:20-cv-01215-ADA Document 59 Filed 02/23/22 Page 17 of 41
`
`defined in Federal Rule of Evidence 1001. The term “Documents” specifically includes all
`
`electronic versions of any particular document and any associated metadata.
`
`17.
`
`“Thing” shall be construed using the broadest possible construction under the
`
`Federal Rules of Civil Procedure.
`
`18.
`
`“Advanced Process Control” or “APC” means any computer integrated system or
`
`factory automation hardware or software for monitoring and/or controlling processes and tools
`
`used in the manufacture, fabrication, assembly and/or production of semiconductor systems,
`
`devices, components, and/or integrated circuits.
`
`19.
`
`“Fault Detection and Classification” or “FDC” means any computer integrated
`
`hardware or software for the detection and/orclassification of manufacturing-related fault events
`
`in the manufacture, fabrication, assembly and/or production of semiconductor systems, devices,
`
`components, and/or integrated circuits.
`
`20.
`
` “YieldStar” refers to any and all metrology and inspection systems designed,
`
`developed, assembled, and/or manufactured by ASML,including without limitation ASML’s
`
`optical metrology systems (e.g., YieldStar 1385, YieldStar 1375F, YieldStar 375F, YieldStar
`
`380G, YieldStar 375) and E-beam metrology and inspection systems (e.g., HMI eScan 600, HMI
`
`eScan 430, HMI eP5, and HMI eScan 1000), as well as all models, versions, and their predecessors
`(e.g., YieldStar S-250, YieldStar S-200, and YieldStar S-100).
`|
`
`21.
`
`“TWINSCAN?”refers to any and all lithography systems designed, developed,
`
`assembled, and/or manufactured by ASML,
`
`including ASML’s deep ultraviolet
`
`(DUV)
`
`lithography systems (e.g., NXT:2050i, NXO:2000i, NXT:!1980Di, NXT:1970:Ci, NXT:1470,
`
`XT:1460K, XT:1060K, XT:860M, and XT:400L) and extreme ultraviolet (EUV) lithography
`
`

`

`Case 6:20-cv-01215-ADA Document 59 Filed 02/23/22 Page 18 of 41
`Case 6:20-cv-01215-ADA Document 59 Filed 02/23/22 Page 18 of 41
`
`systems(e.g., NXE:3600D and NXE:3400C), as well as lithography systems that utilize more than
`
`one wafertable (e.g., AT:1100, AT:750, AT:400, and XT:400L), and their predecessors.
`
`22.
`
` “E3” refers to Applied Materials’ E3 framework, platform, hardware, and/or
`
`software and all equipment modulesof E3 (e.g., E3 FDC, E3 R2R (Run-to-Run Control), E3 SPC
`
`(Statistical Process Control)) as well as all models, versions, and their predecessors.
`
`23.
`
`“Smart Factory” refers to Applied Materials’ SmartFactory Productivity Solution
`
`framework, platform, hardware and/or software and all equipment modules of SmartFactory (e.g.,
`SmartFactory APF (Advanced Productivity Family) RTD (Real Time Dispatcher), SmartFactory
`
`Scheduling (SmartSched), and SmartFactory Activity Manager) as well as all models, versions,
`
`and their predecessors.
`
`24.
`
`“Exensio” refers to PDF Solutions’ Exensio framework, platform, hardware and/or
`
`software and all equipment modules of Exensio (e.g., Exensio Control) as well as all models,
`
`versions, and their predecessors.
`
`25.
`
`“Manufacturing Equipment” shall mean any and all of ASML’s TWINSCANand
`
`YieldStar, Applied Materials’ E3 and SmartFactory, and PDF Solutions’ Exensio, and their
`
`respective frameworks, platforms, hardware and/or software and all equipment modules.
`
`26.
`
`“Equipment Manufacturers”
`
`shall mean
`
`any
`
`and
`
`all manufacturers of
`
`Manufacturing Equipment including but not limited to ASML, Applied Materials, and PDF
`
`Solutions.
`
`27.
`
`“MES” shall mean any and all manufacturing execution system used for
`
`monitoring,
`
`tracking, and/or documenting the process of manufacturing, fabricating, and/or
`
`assembling the Infringing Instrumentalities, such as that described in Your 2020 Annual Report at
`
`

`

`Case 6:20-cv-01215-ADA Document 59 Filed 02/23/22 Page 19 of 41
`Case 6:20-cv-01215-ADA Document 59 Filed 02/23/22 Page 19 of 41
`
`https://www.umc.com/upload/media/08_Investors/Annual_Reports/Form-20 pdf eng/Form_20-
`
`F_December_31_2020.pdf
`
`28.
`
`The terms “sale” and “sold” meansthe transferof title to property from one party
`
`to another and includes the granting of a license with respect to products containing software or
`
`firmware.
`
`29.
`
`“Communication” shall mean any transmission of information in any context or
`
`situation by or between two or more persons by any means or medium whatsoever, whetherin the
`
`form ofan original, a draft, or a copy; whether stored in hard copy, electronically or digitally, or
`
`on tape; either orally or in writing, including but not limited to, conversations, correspondence,
`electronic mails, telexes, facsimile transmissions, telecopies, recordings in any medium oforal,
`
`written, or typed communications, telephone or message logs, notes or memorandarelating to
`written ororal communications, and anytranslation thereof.
`
`30.
`
`“Identify” and “identity” shall each mean:
`
`a.
`
`as applied to an individual: to state the individual's full name, presentor last known
`
`address and telephone number, present or last known employer, present or last known business
`
`address and telephone number, present and prior employment positions and corresponding dates
`
`of such positions, and a description of his or her present employment responsibilities;
`
`b.
`
`as applied to a Person other than a natural person (including but not limited to any
`
`business or other entity): to state the Person’s full name, place and date of incorporation or
`
`formation, principal place ofbusiness oractivity, and the identity ofthe natural persons within that
`
`entity having knowledge of the matter with respect to which that entity is named;
`
`c.
`
`as applied to a Document(whetherornot any claim ofprivilege is made in respect
`
`thereof):
`
`to state the type of Document, the date of creation of the Document, the date of
`
`13
`
`