`Case 6:20-cv-01215-ADA Document 56-3 Filed 02/16/22 Page 1 of 54
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`EXHIBIT B
`EXHIBIT B
`
`
`
`Case 6:20-cv-01215-ADA Document 56-3 Filed 02/16/22 Page 2 of 54
`
`AO 88A (Rev. 02/14) Subpoena to Testify at a Deposition in a Civil Action
`
`UNITED STATES DISTRICT COURT
`for the
` Western District of Texas
`__________ District of __________
`
`Civil Action No.
`
` 6:20-cv-1210
`
`))))))
`
`Ocean Semiconductor LLC
`Plaintiff
`v.
`MediaTek Inc. and MediaTek USA Inc.,
`
`Defendant
`
`SUBPOENA TO TESTIFY AT A DEPOSITION IN A CIVIL ACTION
`
`To:
`
`United Microelectronics Corporation
`No. 3, Li-Hsin Road 2nd Road, Hsinchu Science Park, Hsinchu City,Taiwan, Republic of China
`(Name of person to whom this subpoena is directed)
`✔
`(cid:117) Testimony: YOU ARE COMMANDED to appear at the time, date, and place set forth below to testify at a
`deposition to be taken in this civil action. If you are an organization, you must designate one or more officers, directors,
`or managing agents, or designate other persons who consent to testify on your behalf about the following matters, or
`those set forth in an attachment:
`
`Place:
`
`Devlin Law Firm, 1526 Gilpin Avenue, Wilmington DE
`19806
`Or via Zoom
`
`Date and Time:
`
`01/04/2021 10:00 am
`
`The deposition will be recorded by this method:
`
`video and stenography
`
`✔
`(cid:117) Production: You, or your representatives, must also bring with you to the deposition the following documents,
`electronically stored information, or objects, and must permit inspection, copying, testing, or sampling of the
`See attachment A
`material:
`
`The following provisions of Fed. R. Civ. P. 45 are attached – Rule 45(c), relating to the place of compliance;
`Rule 45(d), relating to your protection as a person subject to a subpoena; and Rule 45(e) and (g), relating to your duty to
`respond to this subpoena and the potential consequences of not doing so.
`
`Date:
`
`12/20/2021
`
`CLERK OF COURT
`
`Signature of Clerk or Deputy Clerk
`
`OR
`
`Alex Chan
`Attorney’s signature
`
`The name, address, e-mail address, and telephone number of the attorney representing (name of party)
`Plaintiff OCEAN SEMICONDUCTOR LLC
`, who issues or requests this subpoena, are:
`Alex Chan, Devlin Law Firm, 1526 Gilpin Avenue, Wilmington DE 19806
`
`Notice to the person who issues or requests this subpoena
`If this subpoena commands the production of documents, electronically stored information, or tangible things before
`trial, a notice and a copy of the subpoena must be served on each party in this case before it is served on the person to
`whom it is directed. Fed. R. Civ. P. 45(a)(4).
`
`
`
`Case 6:20-cv-01215-ADA Document 56-3 Filed 02/16/22 Page 3 of 54
`
`AO 88A (Rev. 02/14) Subpoena to Testify at a Deposition in a Civil Action (Page 2)
`
`Civil Action No.
`
` 6:20-cv-1210
`
`PROOF OF SERVICE
`(This section should not be filed with the court unless required by Fed. R. Civ. P. 45.)
`
`I received this subpoena for (name of individual and title, if any)
`.
`
`on (date)
`
`(cid:117) I served the subpoena by delivering a copy to the named individual as follows:
`
`(cid:117) I returned the subpoena unexecuted because:
`
`on (date)
`
`; or
`
`Unless the subpoena was issued on behalf of the United States, or one of its officers or agents, I have also
`tendered to the witness the fees for one day’s attendance, and the mileage allowed by law, in the amount of
`$
`.
`
`My fees are $
`
`for travel and $
`
`for services, for a total of $
`
`0.00
`
`.
`
`.
`
`I declare under penalty of perjury that this information is true.
`
`Date:
`
`Additional information regarding attempted service, etc.:
`
`Server’s signature
`
`Printed name and title
`
`Server’s address
`
`
`
`Case 6:20-cv-01215-ADA Document 56-3 Filed 02/16/22 Page 4 of 54
`
`AO 88A (Rev. 02/14) Subpoena to Testify at a Deposition in a Civil Action (Page 3)
`Federal Rule of Civil Procedure 45 (c), (d), (e), and (g) (Effective 12/1/13)
`(i) disclosing a trade secret or other confidential research, development,
`or commercial information; or
`(ii) disclosing an unretained expert’s opinion or information that does
`not describe specific occurrences in dispute and results from the expert’s
`study that was not requested by a party.
`(C) Specifying Conditions as an Alternative. In the circumstances
`described in Rule 45(d)(3)(B), the court may, instead of quashing or
`modifying a subpoena, order appearance or production under specified
`conditions if the serving party:
`(i) shows a substantial need for the testimony or material that cannot be
`otherwise met without undue hardship; and
`(ii) ensures that the subpoenaed person will be reasonably compensated.
`
`(c) Place of Compliance.
`
` (1) For a Trial, Hearing, or Deposition. A subpoena may command a
`person to attend a trial, hearing, or deposition only as follows:
` (A) within 100 miles of where the person resides, is employed, or
`regularly transacts business in person; or
` (B) within the state where the person resides, is employed, or regularly
`transacts business in person, if the person
` (i) is a party or a party’s officer; or
` (ii) is commanded to attend a trial and would not incur substantial
`expense.
`
` (2) For Other Discovery. A subpoena may command:
` (A) production of documents, electronically stored information, or
`tangible things at a place within 100 miles of where the person resides, is
`employed, or regularly transacts business in person; and
` (B) inspection of premises at the premises to be inspected.
`
`(d) Protecting a Person Subject to a Subpoena; Enforcement.
`
` (1) Avoiding Undue Burden or Expense; Sanctions. A party or attorney
`responsible for issuing and serving a subpoena must take reasonable steps
`to avoid imposing undue burden or expense on a person subject to the
`subpoena. The court for the district where compliance is required must
`enforce this duty and impose an appropriate sanction—which may include
`lost earnings and reasonable attorney’s fees—on a party or attorney who
`fails to comply.
`
` (2) Command to Produce Materials or Permit Inspection.
`(A) Appearance Not Required. A person commanded to produce
`documents, electronically stored information, or tangible things, or to
`permit the inspection of premises, need not appear in person at the place of
`production or inspection unless also commanded to appear for a deposition,
`hearing, or trial.
`(B) Objections. A person commanded to produce documents or tangible
`things or to permit inspection may serve on the party or attorney designated
`in the subpoena a written objection to inspecting, copying, testing, or
`sampling any or all of the materials or to inspecting the premises—or to
`producing electronically stored information in the form or forms requested.
`The objection must be served before the earlier of the time specified for
`compliance or 14 days after the subpoena is served. If an objection is made,
`the following rules apply:
`(i) At any time, on notice to the commanded person, the serving party
`may move the court for the district where compliance is required for an
`order compelling production or inspection.
` (ii) These acts may be required only as directed in the order, and the
`order must protect a person who is neither a party nor a party’s officer from
`significant expense resulting from compliance.
`
` (3) Quashing or Modifying a Subpoena.
`
`(A) When Required. On timely motion, the court for the district where
`compliance is required must quash or modify a subpoena that:
`
` (i) fails to allow a reasonable time to comply;
`(ii) requires a person to comply beyond the geographical limits
`specified in Rule 45(c);
`(iii) requires disclosure of privileged or other protected matter, if no
`exception or waiver applies; or
`(iv) subjects a person to undue burden.
`(B) When Permitted. To protect a person subject to or affected by a
`subpoena, the court for the district where compliance is required may, on
`motion, quash or modify the subpoena if it requires:
`
`(e) Duties in Responding to a Subpoena.
`
` (1) Producing Documents or Electronically Stored Information. These
`procedures apply to producing documents or electronically stored
`information:
`(A) Documents. A person responding to a subpoena to produce documents
`must produce them as they are kept in the ordinary course of business or
`must organize and label them to correspond to the categories in the demand.
`(B) Form for Producing Electronically Stored Information Not Specified.
`If a subpoena does not specify a form for producing electronically stored
`information, the person responding must produce it in a form or forms in
`which it is ordinarily maintained or in a reasonably usable form or forms.
`(C) Electronically Stored Information Produced in Only One Form. The
`person responding need not produce the same electronically stored
`information in more than one form.
`(D) Inaccessible Electronically Stored Information. The person
`responding need not provide discovery of electronically stored information
`from sources that the person identifies as not reasonably accessible because
`of undue burden or cost. On motion to compel discovery or for a protective
`order, the person responding must show that the information is not
`reasonably accessible because of undue burden or cost. If that showing is
`made, the court may nonetheless order discovery from such sources if the
`requesting party shows good cause, considering the limitations of Rule
`26(b)(2)(C). The court may specify conditions for the discovery.
`
`(2) Claiming Privilege or Protection.
`(A) Information Withheld. A person withholding subpoenaed information
`under a claim that it is privileged or subject to protection as trial-preparation
`material must:
`(i) expressly make the claim; and
`(ii) describe the nature of the withheld documents, communications, or
`tangible things in a manner that, without revealing information itself
`privileged or protected, will enable the parties to assess the claim.
`(B) Information Produced. If information produced in response to a
`subpoena is subject to a claim of privilege or of protection as
`trial-preparation material, the person making the claim may notify any party
`that received the information of the claim and the basis for it. After being
`notified, a party must promptly return, sequester, or destroy the specified
`information and any copies it has; must not use or disclose the information
`until the claim is resolved; must take reasonable steps to retrieve the
`information if the party disclosed it before being notified; and may promptly
`present the information under seal to the court for the district where
`compliance is required for a determination of the claim. The person who
`produced the information must preserve the information until the claim is
`resolved.
`
`(g) Contempt.
`The court for the district where compliance is required—and also, after a
`motion is transferred, the issuing court—may hold in contempt a person
`who, having been served, fails without adequate excuse to obey the
`subpoena or an order related to it.
`
`For access to subpoena materials, see Fed. R. Civ. P. 45(a) Committee Note (2013).
`
`
`
`Case 6:20-cv-01215-ADA Document 56-3 Filed 02/16/22 Page 5 of 54
`
`ATTACHMENT A:
`
`You are hereby subpoenaed and commanded to appear to testify and produce the
`
`documents as requested below:
`
`DEFINITIONS
`
`When used in the below topics, the following definitions apply:
`
`1.
`
`“UMC,” “You,” or “Your” shall each mean and refer, individually and
`
`collectively, to United Microelectronics Corporation; all of its corporate locations, and all
`
`predecessors, successors, assigns, parents, subsidiaries and divisions, affiliates, partners; and all
`
`past and present directors, officers, employees, agents, and representatives (including
`
`accountants, consultants, and attorneys) of any of the foregoing, and all persons acting or
`
`purporting to act on its behalf.
`
`2.
`
`“Plaintiff,” “Ocean Semiconductor,” or “Ocean” shall mean Ocean Semiconductor
`
`LLC and its predecessors, successors, assigns, parents, subsidiaries and divisions, affiliates,
`
`partners, and all past and present directors, officers, employees, agents, and representatives
`
`(including consultants and attorneys) of any of the foregoing, and all persons acting or purporting
`
`to act on their behalf.
`
`3.
`
`“ASML” shall mean ASML Holding N.V. and ASML Netherlands B.V., and all
`
`of their corporate locations, and all predecessors, successors, assigns, parents, subsidiaries and
`
`divisions, affiliates, partners; and all past and present directors, officers, employees, agents, and
`
`representatives (including accountants, consultants, and attorneys) of any of the foregoing, and
`
`all persons acting or purporting to act on their behalf.
`
`4.
`
`“Applied Materials” shall mean Applied Materials, Inc. all of its corporate
`
`locations, and all predecessors, successors, assigns, parents, subsidiaries and divisions, affiliates,
`
`A - 1
`
`
`
`Case 6:20-cv-01215-ADA Document 56-3 Filed 02/16/22 Page 6 of 54
`
`partners; and all past and present directors, officers, employees, agents, and representatives
`
`(including accountants, consultants, and attorneys) of any of the foregoing, and all persons acting
`
`or purporting to act on its behalf.
`
`5.
`
`“PDF Solutions” shall mean PDF Solutions, Inc. all of its corporate locations, and
`
`all predecessors, successors, assigns, parents, subsidiaries and divisions, affiliates, partners; and
`
`all past and present directors, officers, employees, agents, and representatives (including
`
`accountants, consultants, and attorneys) of any of the foregoing, and all persons acting or
`
`purporting to act on its behalf.
`
`6.
`
`“Actions” shall mean any and all of the following: Ocean Semiconductor LLC v.
`
`MediaTek Inc., et al., No. 6:20-cv-01210-ADA (W.D. Tex.), Ocean Semiconductor LLC v.
`
`NVIDIA Corp., No. 6:20-cv-01211-ADA (W.D. Tex.), Ocean Semiconductor LLC v. NXP
`
`Semiconductors NV, et al., No. 6:20-cv-01212-ADA (W.D. Tex.), Ocean Semiconductor LLC v.
`
`Renesas Elecs. Corp., et al., No. 6:20-cv-01213-ADA (W.D. Tex.), Ocean Semiconductor LLC
`
`v. Silicon Labs. Inc., No. 6:20-cv-01214-ADA (W.D. Tex.), Ocean Semiconductor LLC v.
`
`STMicroeletronics, Inc., No. 6:20-cv-1215-ADA (W.D. Tex) Ocean Semiconductor LLC v.
`
`Western Digital Technologies, Inc. No. 6:20-cv-1216-ADA (W.D. Tex.), Ocean Semiconductor
`
`LLC v. Huawei Device USA, Inc., Huawei Device Co., Ltd., and HiSilicon Technologies Co.,
`
`Ltd., C.A. No. 4:20-cv-991-ALM (E.D. Tex.); Ocean Semiconductor LLC v. Analog Devices,
`
`Inc., 1:20-cv-12310-PBS (D. Mass.); and Ocean Semiconductor LLC v. Infineon Technologies
`
`AG et al., 1:20-cv-12311-PBS (D. Mass.).
`
`7.
`
`“Defendant” and “Defendants” shall mean any and all of the following entities:
`
`MediaTek Inc., MediaTek USA Inc., NVIDIA Corporation, NXP USA, Inc., Renesas Electronics
`
`Corporation, Renesas Electronics America, Inc., Silicon Laboratories Inc., STMicroelectronics,
`
`A - 2
`
`
`
`Case 6:20-cv-01215-ADA Document 56-3 Filed 02/16/22 Page 7 of 54
`
`Inc., Western Digital Technologies, Inc., Huawei Device USA, Inc., Huawei Device Co., Ltd.,
`
`HiSilicon Technologies Co., Ltd., Analog Devices, Inc., Infineon Technologies AG and Infineon
`
`Technologies Americas Corp., as well as all predecessors, successors, assigns, parents,
`
`subsidiaries and divisions, affiliates, partners of any of the foregoing, and all persons acting, or
`
`purporting to act, on behalf of any of the foregoing.
`
`8.
`
`“Mediatek Infringing Instrumentalities” shall mean products include, without
`
`limitation, mobile devices (e.g., Helio G, Helio A, Helio P, Helio X, mid-range 4G devices, and
`
`Google Mobile Services express devices), tablet products (e.g., MiraVision), internet of things
`
`devices (e.g., i500, i350, i300A, i300B, MT3620, MT2625, MT2621, MT2601, MT2523G,
`
`MT2523D, MT2511, MT6280, MT2502, MT5931, MT3332, MT 2503, MT3333, MT3303,
`
`MT3337, and MT3339), automotive devices (e.g., Autus I20 (MT2712) devices, Autus R10
`
`(MT2706) devices, and Autus T10 (MT2635) devices), networking and broadband devices (e.g.,
`
`MediaTek T750 MT7688A, MT7628K/N/A, MT7623N/A, MT7622, MT7621A/N, MT7620N/A,
`
`RT3662, RT3883, MT7688K, MT5932, MT8167S, MT7686, MT7682, MT7697H/HD, MT7681,
`
`MT7687F, MT7697, MT7697D, MT7601E, MT7601U, MT7603E, MT7603U, MT7610E,
`
`MT7610U, MT7612E, MT7612U, MT7615, MT7615B, MT7615S, MT7662E, MT7662U,
`
`MT7668, RT3062, RT3070, RT3562, RT3573, RT3593, RT5370, RT5572, RT5592, MT3729,
`
`MT7601, MT7610, MT7630, RT5372, RT539x, RT8070, RT2870, RT2890, RT309x, RT3290,
`
`RT3370, RT3572, RT2070, RT2760, RT2770, RT2790, and RT2860), and home devices (e.g.,
`
`MT8516 SoM, MT8516, MT8507, MT8502, MediaTek C4X Development Kit for Amazon AVS,
`
`MT8516 2-Mic Development Kit for Amazon AVS, MT8516, MT8693, MT8685, MT8581,
`
`MT8580, MT8563, MT8553, MT1389/G, MT1389/J, MT1389/Q, S900 (MT9950), MT9613,
`
`MT9685, MT9602, MT5592, MT5582, MT5596, MT5597, MT5580, MT5561, MT5505,
`
`A - 3
`
`
`
`Case 6:20-cv-01215-ADA Document 56-3 Filed 02/16/22 Page 8 of 54
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`MT5398, MT5396, MT1959, MT1887, MT1865, MT1862, and MT1398), flash memory and
`
`memory controllers (e.g., MT81XX SPI), and WiFi extenders (MTK7621A), television products
`
`(e.g., S900 (MT9950)); camera products (e.g., MediaTek Dimensity 900), IoT products (e.g.,
`
`MT8385; MediaTek i350, i300A (MT8362A), i300B (MT8362B), MT3620 MCU) gaming
`
`products (e.g. MediaTek Helio G90 Series, MediaTek Helio G85, MediaTek Helio G80, MediaTek
`
`Helio G70, MediaTek Helio G25, MediaTek Helio G35, MediaTek Helio G95) and similar
`
`systems, products, devices, and integrated circuits including, for example, products manufactured
`
`at 16nm technology node.
`
`9.
`
`“NVIDIA Infringing Instrumentalities” shall mean without limitation graphics
`
`cards (e.g. GEFORCE RTX models (including, but not limited to, GEFORCE RTX 2060, 2060
`
`SUPER, 2070, 2070 SUPER, 2080, 2080 SUPER, 3070, 3080, and 3090), GEFORCE GTX
`
`models (including, but not limited to, GEFORCE GTX 1650, 1650 SUPER, 1660, and 1660
`
`Super), GEFORCE GTX TI models (including, but not limited to, GEFORCE GTX 1650 TI and
`
`1660 TI), TITAN RTX models (including, but not limited to, TITAN RTX , TITAN XP models,
`
`ZOTAC models, GIGABYTE models, ASUS models, MSI models, and EVGA models), SHIELD
`
`devices, SHIELD TV media streamers, Jetson developer kits (e.g., NANO, NANO 2GB, and
`
`NANO MODULE), QUADRO professional graphics cards (e.g., QUADRO RTX 8000,
`
`QUADRO RTX 8000 NVLink HB Bridge, QUADRO RTX 6000, QUADRO RTX 6000 NVLink
`
`HB Bridge, QUADRO GV100, QUADRO GV100 Bridge, and QUADRO Sync II), DGX AI
`
`Workstations, laptop products (GEFORCE RTX 3080 LAPTOP GPU, GEFORCE RTX 3080
`
`LAPTOP GPU, GEFORCE RTX 3070 LAPTOP GPU, GEFORCE RTX 3060 LAPTOP GPU,
`
`GEFORCE RTX 3050 Ti LAPTOP GPU, GEFORCE RTX 3050 LAPTOP GPU), display products
`
`(e.g., GSYNC processors); streaming products (NVIDIA Tegra X1+); cloud products (e.g., A100
`
`A - 4
`
`
`
`Case 6:20-cv-01215-ADA Document 56-3 Filed 02/16/22 Page 9 of 54
`
`40GB PCIe, A100 80GB PCIe, A100 40GB SXM, A100 80GB SXM, NVIDIA A10 TENSOR
`
`CORE GPU, NVIDIA A100, NVIDIA A10, NVIDIA A16 GPU, NVIDIA A30 TENSOR CORE
`
`GPU, NVIDIA A16, NVIDIA A30, NVIDIA A40, NVIDIA BlueField DPU, NVIDIA Converged
`
`Accelerators, NVIDIA ConnectX SmartNIC, NVIDIA V100, NVIDIA T4, NVIDIA T4 Enterprise
`
`Server, NVIDIA HGX A100, NVIDIA DGX A100, NVIDIA DGX Station A100, NVIDIA DGX
`
`Systems, NVIDIA EGX Platform, NVIDIA EGX A100, NVIDIA HGX AI SUPERCOMPUTER),
`
`automotive products (e.g., NVIDIA DRIVE Orin, NVIDIA DRIVE AGX Pegasus, NVIDIA
`
`DRIVE AGX Xavier, NVIDIA DRIVE Hyperion, NVIDIA DRIVE Atlan), ethernet products (e.g.,
`
`ConnectX-7 25/50/100/200/400G SmartNIC, ConnectX-6 Dx 10/25/50/100/200G SmartNIC,
`
`ConnectX-6 Lx 25-50G SmartNIC, ConnectX-6 10/25/50/100/200G SmartNIC, ConnectX-5
`
`10/25/50/100G SmartNIC, ConnectX-4 Lx 10-50GbE SmartNIC, Innova-2 Flex), data processing
`
`unit products (e.g, NVIDIA BlueField-3 DPU, NVIDIA BlueField-2 DPU, NVIDIA BlueField-
`
`2X AI-Powered DPU), embedded systems products (e.g., Jetson Nano, Jetson TX2 Series, Jetson
`
`Xavier NX, Jetson AGX Xavier Series) products manufactured at, for example, 5nm, 7nm, 28nm,
`
`and/or 90nm technology node, and similar products, devices, systems, components of systems,
`
`and/or integrated circuits.
`
`10.
`
`“NXP Infringing Instrumentalities” shall mean without limitation, ARM MCUs,
`
`power architecture processors, audio products,
`
`interfaces
`
`(e.g.,
`
`translators,
`
`I/Os,
`
`repeaters/hubs/extenders, transceivers, and PMICs and system basis chips), peripherals and logic
`
`(switches, drivers, comparators, multiplexers, bridges, and clocks), power management products,
`
`sensors, RF products, security and authentication products, wireless connectivity products, and
`
`application-specific products, such as processors and microcontrollers (e.g., HC S12, HC S12X,
`
`S08, digital signal controllers, S12 MAGNIV mixed-signal controllers, digital signal processors,
`
`A - 5
`
`
`
`Case 6:20-cv-01215-ADA Document 56-3 Filed 02/16/22 Page 10 of 54
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`PowerQuicc communications processors, Coldfire MCUs/MPUs, legacy MPUs, MPC55XX
`
`MCUs, 5XX controllers, legacy MCUs, VFXXX controller solutions, MAC7100, MOBILEGT,
`
`crypto processors, media processors, S32K automotive MCUs, I/MX crossover MCUs,
`
`MAC57DXXX automotive MCUs, KEA MCUs, I.MX 6 processors, I.MX mature processors,
`
`I.MX 8 processors, I.MX28 processors, I.MX 7 processors, Layerscape communication
`
`processors, S32V2 Vision MPUs, host and integrated host processors (including 8XXX, 7XXX,
`
`7XX, and 6XX), QORIQ communication processors, MPC5XXX ultra-reliable MCUs, and S32R
`
`radar microcontrollers), audio products (e.g., TEF66XXHN, TDF85XXXX, SAF35XXXX,
`
`SAF36XXXX, and TDA18XXXXHN), interfaces, (e.g., CBTL0XXXXXX, CBTU02044HE,
`
`GTL200XPW, MC33XXXBXXX, MC34XXX, MCZ339XXDXXXX, NTV200XXX,
`
`P82BXXTD, PCA3409AXX, PCA3416AXX, PCA85XXXX, PCA93XXXX, PCA95XXXX,
`
`PCA96XXXX,
`
`PCA97XXXX,
`
`PCA98XXXX,
`
`PCAL64XXXXX,
`
`PCAL65XXXXX,
`
`PCAL95XXXXX, PCF85XXXX, MCZ33XXXCXXEK, UJA116XATK, TJA1128XTK, ),
`
`peripherals and
`
`logic products (e.g., CBTXXXXXXXX, GTL200XPW, NCX2202GX,
`
`NCX2220GX, NCX2222GX, NTB0101GXX, NTB0102GXX, NTB0104GXX, NTS0101XX,
`
`NTS0102XX, NTS0104XX, NTV4XXXXUK, NX3DV221XX, NX371G3157GM, ), power
`
`management products (e.g., ASL50XSHN, ASL250XSHN, ASL34XXSHN, ASL45XXSHN,
`
`MC32PFXXXX, MC33XXXXXX, MC3377XXXXXXX, MC3388XXXXXXX, ), RF devices
`
`(e.g., control circuits, low power TX/RX ICs, microwave LO generators, mixers, RF amplifiers,
`
`RF discrete components, RF power, Radar transceivers, and WLAN front-end modules), RFID
`
`devices (e.g., HITAG, MIFARE, NFC, and UCODE devices), security and authentications devices
`
`(e.g., A1006XX, A710XXXXX, SE050XXXXX, TDA80XXXX, OM67100), sensors (e.g.,
`
`FXLNXXXXX, FXLSXXXXX, MP3VXXXXXXXX, MPXXXXXX, MPAXXXXXXXX, X3T-
`
`A - 6
`
`
`
`Case 6:20-cv-01215-ADA Document 56-3 Filed 02/16/22 Page 11 of 54
`
`OHXXX, and KMXXX), and wireless connectivity devices (e.g., audio streaming devices,
`
`Bluetooth devices, DSRC modems, MCUSs, NFMI radio devices, thread, Wi-Fi and Bluetooth
`
`devices, wireless microcontrollers, and ZIGBEE), 8-Bit S08 MCU products (e.g., S08PT Series,
`
`S08PA Series, S08PB Series, S08PL Series, S08PLS Series, S08SU Series, S08LL Series, S08QL
`
`Series, S08AW Series, S08D Series, S08EL-SL Series, S08LG Series, S08MP Series, S08QD
`
`Series, S08RN Series, S08SC4 Series, S08SG Series, S08SL Series, S08AC Series, S08FL Series,
`
`S08MM Series, S08GT Series, S08GW Series, S08QA Series, S08SH Series, S08JE Series,
`
`S08JM Series, S08SV Series, S08LC Series, S08QE Series), edge computing products (e.g. i.MX
`
`RT1170, i.MX RT1170, i.MX RT1064, i.MX RT1060, i.MX RT1050, i.MX RT1024, i.MX
`
`RT1020, i.MX RT1010, i.MX RT600, i.MX RT500, Layerscape® FRWY-LS1046A Board,
`
`LS1046A Reference Design Board, Smart Home Gateway Reference Design, FRDM-LS1012A
`
`Board, LS1021A Tower® System Module, LS1043A Reference Design Board), motor and
`
`solenoid driver products (e.g. MC33887APVW, MC33887PEK, MC33887PFK, MC33926AES,
`
`MC33926PNB, MC33931EK, MC33931VW); powertrain and engine control products (e.g.,
`
`GD3100, MC33814, PT2001), high current motor control products (MM908E622ACPEK,
`
`MM908E624ACPEW, MM908E624AYPEW) automotive processors and microcontrollers (e.g.,
`
`S32 Processing Platform, S32G Vehicle Network Processor, S32K Microcontrollers), and similar
`
`systems, products, devices, and integrated circuits.
`
`11.
`
`“Renesas
`
`Infringing
`
`Instrumentalities”
`
`shall mean, without
`
`limitation,
`
`microcontrollers and microprocessors (e.g., RL78 Family of 8/16-bit Ultra-Low Energy MCUs,
`
`RX Family of 32-bit High Power Efficiency MCUs, RH850 Family, RZ Family of 64-Bit & 32-
`
`Bit Arm-Based High-End MPUs, V850 Family, 78K Family, R8C Family, M16C Family (R32C
`
`/ M32C / M16C), M32R Family, H8/S/SX Family, 720 Family, 740 Family, SuperH RISC engine
`
`A - 7
`
`
`
`Case 6:20-cv-01215-ADA Document 56-3 Filed 02/16/22 Page 12 of 54
`
`Family, H8 Super Low Power, PLC MCU, Renesas RA Family of 32-bit MCUs with Arm Cortex-
`
`M Core, RE Family, QzROM (740/720 Family), M16C (M32C/M16C) Family, R8C Family, 7700
`
`Family, and SuperH RISC engine Family and MCUs with Arm Cortex-M Core Implemented on
`
`Silicon on Thin Buried Oxide (SOTB)), amplifiers and buffers (e.g., CA3XXX, CA5XXX,
`
`EL2XXX, EL4XXX, EL5XXX, EL8XXX, HA-2XXX, HA-5XXX, HFA11XX, ICL7XXX,
`
`ISL28XXX, ISL55XXX, ISL59XXX, READ23XXXSP, and UPCXXXXXX), analog products
`
`(e.g., switches and multiplexers), clocks and timing products (e.g., application-specific clocks,
`
`clock distribution, clock generation, crystal oscillators, and jitter attenuators with frequency
`
`translation), interface & connectivity products (e.g., wireless modules, switches and hubs, and
`
`wireless modules), audio and video products (e.g., ISL54XXX), automotive products (e.g.,
`
`Automotive System-on-Chip (SOC), Ambient Light Sensors, Analog ICs, Car Audio ICs, Battery
`
`Management Systems, CAN Transceivers, Discrete/Power MOFETs for Automotive, Display ICs,
`
`Intelligent Power Devices, Interface ICs, LSI for Automotive, Microcontrollers (e.g. RH850 and
`
`RH850/F1 Kx), Microcontrollers (e.g. RL78/F1x), Power Management (e.g., Power Management
`
`ICs for RH850, Power Supply ICs for R-Car, Switches & Multiplexers, Video ICs, Discrete Power
`
`Devices, regulators, MOSFETs and Motor Drivers, PMICs, and wireless power devices), ICs for
`
`Communications and Mobile Devices (e.g., SH-MobileR, SH-MobileR2, EMMA Mobile, SH-
`
`Mobile MT1, and R-Mobile A1), sensor products (e.g., flow sensors, gas sensors, humidity
`
`sensors, light & proximity sensors, position sensors, sensor signal conditioners, and optical sensors
`
`such as ISL76671), data converters (e.g., HI-565A, HI-565A/883, and HI5XXX), ICs for Industrial
`
`Automation (R-IN) (e.g. R-IN32M3, R-IN32M4-CL2, TPS-1, EC-1, R-IN32M4-CL3, and R-
`
`IN32M3), ICs for Motor Driver/Actuator Driver, Interface devices (e.g., Bus Buffers, RS-485, RS-
`
`422, RS-232, Signal Integrity ICs, Dual Protocol RS-485, RS-232 Transceivers, and Industrial
`
`A - 8
`
`
`
`Case 6:20-cv-01215-ADA Document 56-3 Filed 02/16/22 Page 13 of 54
`
`Network Transceivers), Legacy MCUs (e.g., 80C/82C Microprocessors & Peripherals), memory
`
`(e.g., ultra-fast Quad Data Rate SRAMs, SRAMs, EEPROM & PROM, MRAMS, FIFO products,
`
`interface products, and standard logic), Optoelectronics, power management devices (e.g.,
`
`RAJ240XXXDNP), RF products (e.g., modulators, demodulators, transistor arrays, beamformers,
`
`mixers, switches, attenuators, VGAs, synthesizers and PLLs), Renesas USB Power Delivery
`
`Family (e.g., Renesas USB Power Delivery Family Features and U30 Group), Secure MCUs (e.g.,
`
`AE-5 Series and RS-4 Series), Smart Analog devices (e.g., Smart Analog IC101, IC300, IC301,
`
`IC500, IC501, and IC502), and space and harsh environment devices (e.g., μPD720115,
`
`μPD720201, μPD720202, μPD720210, μPD720211, M66291, R8A66593, and R8A66597),
`
`products manufactured at 28nm and 40nm technology node such as eFlash and MCUs,
`
`microprocessors, sensors, radars, power efficiency systems, electronic control units, and
`
`automotive products, and similar systems, products, devices, and integrated circuits.
`
`12.
`
`“STMicro Infringing Instrumentalities” shall mean without limitation advanced
`
`driver assistance systems (e.g., STV0991, STV0991, VG5761, STRADA431, STRADA770M),
`
`MEMS and sensor products (e.g., AIS1120SX, AIS1200PS, AIS2120SX, AIS2DW12,
`
`AIS328DQ, AIS3624DQ, H3LIS100DL, H3LIS200DL, H3LIS331DL, IIS2DH, IIS2DLPC,
`
`IIS2ICLX, IIS328DQ, IIS3DHHC, IIS3DWB, LIS25BA, LIS2DE12, LIS2DH, LIS2DH12,
`
`LIS2DS12, LIS2DTW12, LIS2DW, LIS2DW12, LIS2HH12, LIS331DLH, LIS331HH,
`
`LIS344ALH, LIS3DH, LIS3DHH, LIS3DSH, LIS3LV02DL, MIS2DH, AIS326DQ, A3G4250D,
`
`AIS1120SX, AIS1200PS, AIS2120SX, AIS2DW12, AIS328DQ, AIS3624DQ, ASM330LHH,
`
`VL53L0X, VL53L1CB, VL53L1X, VL53L3CX, VL6180V1, VL6180X), microcontrollers (e.g.,
`
`STM32F410C8,
`
`STM32F411RC,
`
`STM32F412CE,
`
`STM32F412RE,
`
`STM32413RH,
`
`STM32F423VH,
`
`STM32F439ZG,
`
`STM32F446ME,
`
`STM32723VC,
`
`STM32F732VE,
`
`A - 9
`
`
`
`Case 6:20-cv-01215-ADA Document 56-3 Filed 02/16/22 Page 14 of 54
`
`STM32F767NI,
`
`STM32H723VE,
`
`STM32H723VG,
`
`STM32H23ZE,
`
`STM32H723ZG,
`
`STM32H725AE,
`
`STM32725AG,
`
`STM32725IE,
`
`STM32H725IG,
`
`STM32H725RE,
`
`STM32H725RG, STM32H725VE, STM32H725VG, STM32H725ZE, STM32H725ZG,
`
`STM32H725ZG,
`
`STM32H725ZG,
`
`STM32H730AB,
`
`STM32730IB,
`
`STM32H730VB,
`
`STM32H730ZB, STM32H733VG, STM32H733ZG, STM32H735AG, STM32H735IG,
`
`STM32H735RG, STM32H735VG, STM32H735ZG, STM32F205RB, STM32F205RB,
`
`STM32205RC,
`
`STM32F205RE,
`
`STM32F205RF,
`
`STM32F205RG,
`
`STM32F205VB,
`
`STMF205VC, STMF205VE, STM32F205VF, STMF205VG, STM32F205ZC, STM32F205ZE,
`
`STM32F205ZF, STMF205ZG), microprocessors, amplifiers, diodes, rectifiers, comparators,
`
`automotive devices, clocks and timers, converters, set-top boxes ICs, logic ICs, transceivers,
`
`memories, drivers, transistors, switches, voltage regulators, systems-on-chip (SoC), or similar
`
`products for mobile devices, wearables, banking, identification, industrial, communications,
`
`energy, automotive, personal electronics, sensing, cloud, and Internet of Things applications, and
`
`similar systems, products, devices, and integrated circuits.
`
`13.
`
`“Silicon Labs Infringing Instrumentalities” shall mean, without limitation, wireless
`
`products (e.g., EFR32XG2X family, EFR32XG1X family, ZGM130S, and WFM200), internet of
`
`things products (e.g., EFM8BB10F8G-QFN20, EFM8BB10F2A-QFN20, EFM8BB10F2G-
`
`QFN20,
`
`EFM8BB10F2I-QFN20,
`
`EFM8BB10F4A-QFN20,
`
`EFM8BB10F4G-QFN20,
`
`EFM8BB10F4I-QFN20, EFM8BB10F8A-QFN20, EFM8BB10F8G-QSOP24, EFM8BB10F8G-
`
`SOIC16,
`
`EFM8BB10F8I-QFN20,
`
`EFM8BB10F8I-QSOP24,
`
`EFM8BB10F8I-SOIC16,
`
`EFM8BB21F16A-QFN20,
`
`EFM8BB21F16G-QFN20,
`
`EFM8BB21F16G-QSOP24,
`
`EFM8BB21F16I-QFN20,
`
`EFM8BB21F16I-QSOP24,
`
`EFM8BB22F16A-QFN28,
`
`EFM8BB22F16G-QFN28,
`
`EFM8BB22F16I-QFN28,
`
`EFM8BB31F16A-4QFN24,
`
`A - 10
`
`
`
`Case 6:20-cv-01215-ADA Document 56-3 Filed 02/16/22 Page 15 of 54
`
`EFM8BB31F16A-5QFN32,
`
`EFM8BB31F16G-QFN24,
`
`EFM8BB31F16G-QFN32,
`
`EFM8BB31F16G-QFP32,
`
`EFM8BB31F16G-QSOP24,
`
`EFM8BB31F16I-4QFN24,
`
`EFM8BB31F16I-5QFN32,
`
`EFM8BB31F16I-QFN24,
`
`EFM8BB31F16I-QFN32,
`
`EFM8BB31F16I-QFP32,
`
`EFM8BB31F16I-QSOP24,
`
`EFM8BB31F32A-4QFN24,
`
`EFM8BB31F32A-5QFN32,
`
`EFM8BB31F32G-QFN24,
`
`EFM8BB31F32G-QFN32,
`
`EFM8BB31F32G-QFP32,
`
`EFM8BB31F32G-QSOP24,
`
`EFM8BB31F32I-4QFN24,
`
`EFM8BB31F32I-5QFN32,
`
`EFM8BB31F32I-QFN24,
`
`EFM8BB31F32I-QFN32,
`
`EFM8BB31F32I-QFP32,
`
`EFM8BB31F32I-QSOP24,
`
`EFM8BB31F64A-4QFN24,
`
`EFM8BB31F64A-5QFN32,
`
`EFM8BB31F64G-QFN24,
`
`EFM8BB31F64G-QFN32,
`
`EFM8BB31F64G-QFP32,
`
`EFM8BB31F64G-QSOP24,
`
`EFM8BB31F64I-4QFN24,
`
`EFM8BB31F64I-5QFN32,
`
`EFM8BB31F64I-QFN24,
`
`EFM8BB31F64I-QFN32,
`
`EFM8BB31F64I-QFP32, EFM8BB31F64I-QSOP24), infrastructure products (e.g., Si5332A-
`
`GM1, Si5332A-GM2, Si5332A-GM3, Si5332B-GM1, Si5332B-GM2, Si5332B-GM3, Si5332C-
`
`GM1, Si5332C-GM2, Si5332C-GM3, Si5332D-GM1, Si5332D-GM2, Si5332D-GM3, Si5332E-
`
`GM1, Si5332E-GM2, Si5332E-GM3, Si5332F-GM1, Si5332F-GM2, Si5332F-GM3, Si5332G-
`
`GM1, Si5332G-GM2, Si5332G-GM3, Si5332H-GM1, Si5332H-GM2, Si5332H-GM3, Si5332A-
`
`GM1, Si5332A-GM2, Si5332A-GM3, Si5332B-GM1, Si5332B-GM2, Si5332B-GM3, Si5332C-
`
`GM1, Si5332C-GM2, Si5332C-GM3, Si5332D-GM1, Si5332D-GM2, Si5332D-GM3, Si5332E-
`
`GM1, Si5332E-GM2, Si5332E-GM3, Si5332F-GM1, Si5332F-GM2, Si5332F-GM3, Si5332G-
`
`GM1, Si5332G-GM2, Si5332G-GM3, Si5332H-GM1, Si5332H-GM2, Si5332H-GM3), broadcast
`
`products (e.g., Si2160, Si2162, Si2164, Si2180, Si2181, Si2182, Si2183), access products (e.g.,
`
`Si3000, Si3402-GM, Si3404-GM, Si3406-GM, Si34062-GM, Si3462-GM, Si3471A-IM,
`
`microcontrollers