Case 6:20-cv-00636-ADA Document 92-4 Filed 03/31/21 Page 1 of 22
`
`Exhibit 25
`
`
`
`
`
`
`
`
`
`
`
`

`

`( 12 ) United States Patent
`Madiwal et al .
`
`( 10 ) Patent No . : US 10 , 381 , 247 B2
`( 45 ) Date of Patent :
`Aug . 13 , 2019
`
`US010381247B2
`
`( 54 ) GAS SYSTEMS AND METHODS FOR
`CHAMBER PORTS
`( 71 ) Applicant : Applied Materials , Inc . , Santa Clara ,
`CA ( US )
`( 72 ) Inventors : Nagendra V . Madiwal , Bangalore ( IN ) ;
`Robert Irwin Decottignies , Redwood
`City , CA ( US ) ; Andrew Nguyen , San
`Jose , CA ( US ) ; Paul B . Reuter , Austin ,
`TX ( US ) ; Angela R . Sico , Round Rock ,
`TX ( US ) ; Michael Kuchar ,
`Georgetown , TX ( US ) ; Travis Morey ,
`Austin , TX ( US ) ; Mitchell DiSanto ,
`Georgetown , TX ( US )
`( 73 ) Assignee : APPLIED MATERIALS , INC . , Santa
`Clara , CA ( US )
`Subject to any disclaimer , the term of this
`patent is extended or adjusted under 35
`U . S . C . 154 ( b ) by 200 days .
`( 21 ) Appl . No . : 15 / 238 , 604
`Aug . 16 , 2016
`( 22 ) Filed :
`Prior Publication Data
`( 65 )
`US 2016 / 0358792 A1
`Dec . 8 , 2016
`
`( * ) Notice :
`
`( 51 )
`
`( 62 )
`
`Related U . S . Application Data
`Division of application No . 14 / 036 , 754 , filed on Sep .
`25 , 2013 , now Pat . No . 9 , 435 , 025 .
`Int . Cl .
`HOIL 21 / 67
`( 2006 . 01 )
`( 2006 . 01 )
`C23C 14 / 56
`( Continued )
`( 52 ) U . S . CI .
`CPC . . . . . . . HOIL 21 / 6719 ( 2013 . 01 ) ; C23C 14 / 564
`( 2013 . 01 ) ; C23C 14 / 566 ( 2013 . 01 ) ;
`( Continued )
`
`( 58 )
`
`( 56 )
`
`CN
`ON
`
`Field of Classification Search
`CPC . . . . . . . . . . HO1L 21 / 6719 ; HO1L 21 / 67126 ; C23C
`16 / 45563 ; C23C 14 / 566 ; C23C 14 / 564 ;
`C23C 16 / 4401 ; Y10T 29 / 49432
`See application file for complete search history .
`References Cited
`U . S . PATENT DOCUMENTS
`5 , 951 , 770 A
`9 / 1999 Perlov et al .
`6 , 287 , 386 B1
`9 / 2001 Perlov et al .
`( Continued )
`FOREIGN PATENT DOCUMENTS
`101158852 A
`4 / 2008
`101508111 A
`8 / 2009
`( Continued )
`OTHER PUBLICATIONS
`Taiwan Search Report of Taiwanese Application No . 103133253
`dated Oct . 30 , 2018 .
`
`( Continued )
`Primary Examiner — Yuechuan Yu
`( 74 ) Attorney , Agent , or Firm — Lowenstein Sandler LLP
`ABSTRACT
`( 57 )
`An electronic device manufacturing system may include a
`chamber port assembly that provides an interface between a
`transfer chamber and a process chamber . In some embodi
`ments , the chamber port assembly may be configured to
`direct a flow of purge gas into a substrate transfer area of the
`chamber port assembly . In other embodiments , a process
`chamber and / or the transfer chamber may be configured to
`direct a flow of purge gas into the substrate transfer area . The
`flow of purge gas into a substrate transfer area may prevent
`and / or reduce migration of particulate matter from chamber
`hardware onto a substrate being transferred between the
`transfer chamber and a process chamber . Methods of assem
`bling a chamber port assembly are also provided , as are
`other aspects .
`11 Claims , 12 Drawing Sheets
`
`Case 6:20-cv-00636-ADA Document 92-4 Filed 03/31/21 Page 2 of 22
`
`112
`CONTROLLER
`
`- 100
`
`114 - 4
`104 W
`
`1161
`
`104
`114
`
`104
`114
`
`102
`
`414
`
`114
`
`1114
`
`116
`114
`116
`
`106
`
`106
`
`114 <
`116
`
`108
`
`11
`
`110
`
`

`

`US 10 , 381 , 247 B2
`Page 2
`
`( 51 )
`
`( 52 )
`
`( 2006 . 01 )
`( 2006 . 01 )
`
`Int . Cl .
`C23C 16 / 44
`C23C 16 / 455
`U . S . CI .
`CPC . . . C23C 16 / 4401 ( 2013 . 01 ) ; C23C 16 / 45563
`( 2013 . 01 ) ; HOIL 21 / 67126 ( 2013 . 01 ) ; Y10T
`29 / 49432 ( 2015 . 01 )
`
`( 56 )
`
`References Cited
`U . S . PATENT DOCUMENTS
`6 , 468 , 353 B110 / 2002 Perlov et al .
`6 , 575 , 737 B1
`6 / 2003 Perlov et al .
`6 , 916 , 397 B2
`7 / 2005 Pfeiffer et al .
`6 , 955 , 197 B2 10 / 2005 Elliott et al .
`7 , 147 , 424 B2 12 / 2006 Weaver
`7 , 299 , 831 B2 11 / 2007 Elliott et al .
`7 , 720 , 655 B2
`5 / 2010 Rice
`7 , 857 , 570 B2 12 / 2010 Elliott et al .
`2004 / 0081546 A14 / 2004 Elliott et al .
`2005 / 0072716 Al
`4 / 2005 Quiles et al .
`2006 / 0011140 A1 1 / 2006 Blahnik et al .
`2006 / 0028596 A1
`2 / 2006 Leung et al .
`2007 / 0059127 Al
`3 / 2007 Guo et al .
`2009 / 0062960 A1
`3 / 2009 Krishnasamy et al .
`2009 / 0108544 Al 4 / 2009 Sico et al .
`2010 / 0022093 A
`1 / 2010 Yamaguchi et al .
`2012 / 0325140 Al 12 / 2012 Schaller
`2014 / 0262036 A1
`9 / 2014 Reuter et al .
`2014 / 0263165 A1 9 / 2014 Hongkham et al .
`2015 / 0083330 A1 3 / 2015 Madiwal et al .
`
`FOREIGN PATENT DOCUMENTS
`
`e se
`
`JP
`JP
`KR
`WO
`
`2003 - 109993
`2004 - 186378
`2006 - 147859
`2008 - 251631
`2009 - 038073
`2011146717
`100555258
`WO 2009 - 031419
`
`4 / 2003
`7 / 2004
`6 / 2006
`10 / 2008
`2 / 2009
`7 / 2011
`3 / 2006
`3 / 2009
`
`OTHER PUBLICATIONS
`Perlov et al . , U . S . Appl . No . 10 / 193 , 605 , titled : “ Method and
`Apparatus for Improved Substrate Handling ” , filed Jul . 11 , 2002 .
`International Search Report and Written Opinion of International
`Application No . PCT / US2014 / 057242 dated Jan . 19 , 2015 .
`Restriction Requirement of U . S . Appl . No . 14 / 036 , 754 dated Feb .
`11 , 2016 .
`Apr . 7 , 2016 Reply to Feb . 11 , 2016 Restriction Requirement of U . S .
`Appl . No . 14 / 036 , 754 .
`International Preliminary Report on Patentability of International
`Application No . PCT / US2014 / 057242 dated Apr . 7 , 2016 .
`Notice of Allowance of U . S . Appl . No . 14 / 036 , 754 dated Jun . 24 ,
`2016 .
`Taiwan Search Report of Taiwan Application No . 103133253 dated
`Mar . 22 , 2018 .
`Chinese Search Report of Chinese Application No . 201480049216 . 5
`dated Apr . 21 , 2017 .
`
`Case 6:20-cv-00636-ADA Document 92-4 Filed 03/31/21 Page 3 of 22
`
`

`

`U . S . Patent
`
`Aug . 13 , 2019
`
`Sheet 1 of 12
`
`US 10 , 381 , 247 B2
`
`712
`CONTROLLER
`
`100
`
`104
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`116
`
`Case 6:20-cv-00636-ADA Document 92-4 Filed 03/31/21 Page 4 of 22
`
`110
`
`110
`
`110
`
`FIG . 1
`
`

`

`U . S . Patent
`
`Aug . 13 , 2019
`
`Sheet 2 of 12
`
`US 10 , 381 , 247 B2
`
`204
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`Case 6:20-cv-00636-ADA Document 92-4 Filed 03/31/21 Page 5 of 22
`
`216
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`FIG . 2
`
`

`

`U . S . Patent
`
`Aug . 13 , 2019
`
`Sheet 3 of 12
`
`US 10 , 381 , 247 B2
`
`356
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`Case 6:20-cv-00636-ADA Document 92-4 Filed 03/31/21 Page 6 of 22
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`

`U . S . Patent
`
`Aug . 13 , 2019
`
`Sheet 4 of 12
`
`US 10 , 381 , 247 B2
`
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`Case 6:20-cv-00636-ADA Document 92-4 Filed 03/31/21 Page 7 of 22
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`

`U . S . Patent
`
`Aug . 13 , 2019
`
`Sheet 5 of 12
`
`US 10 , 381 , 247 B2
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`Case 6:20-cv-00636-ADA Document 92-4 Filed 03/31/21 Page 8 of 22
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`

`U . S . Patent
`
`Aug . 13 , 2019
`
`Sheet 6 of 12
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`US 10 , 381 , 247 B2
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`Case 6:20-cv-00636-ADA Document 92-4 Filed 03/31/21 Page 9 of 22
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`

`U . S . Patent
`
`Aug . 13 , 2019
`
`Sheet 7 of 12
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`US 10 , 381 , 247 B2
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`Case 6:20-cv-00636-ADA Document 92-4 Filed 03/31/21 Page 10 of 22
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`FIG . 5B
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`

`

`atent
`
`Aug . 13 , 2019
`
`Sheet 8 of 12
`
`US 10 , 381 , 247 B2
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`Case 6:20-cv-00636-ADA Document 92-4 Filed 03/31/21 Page 11 of 22
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`

`

`atent
`
`Aug . 13 , 2019
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`Sheet 9 of 12
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`US 10 , 381 , 247 B2
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`Case 6:20-cv-00636-ADA Document 92-4 Filed 03/31/21 Page 12 of 22
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`

`U . S . Patent
`
`Aug . 13 , 2019
`
`Sheet 10 of 12
`
`US 10 , 381 , 247 B2
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`Case 6:20-cv-00636-ADA Document 92-4 Filed 03/31/21 Page 13 of 22
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`

`atent
`
`Aug . 13 , 2019
`
`Sheet 11 of 12
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`US 10 , 381 , 247 B2
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`Case 6:20-cv-00636-ADA Document 92-4 Filed 03/31/21 Page 14 of 22
`
`

`

`atent
`
`Aug . 13 , 2019
`
`Sheet 12 of 12
`
`US 10 , 381 , 247 B2
`
`1000
`
`PROVIDING LID HAVING GAS INLET
`AND FIRST GAS PASSAGEWAY
`
`PROVIDING GAS CONDUIT MEMBER
`HAVING SECOND GAS PASSAGEWAY
`
`PROVIDING FRAME INSERT HAVING
`THIRD GAS PASSAGEWAY
`
`COUPLING LID , GAS CONDUIT MEMBER , AND
`FRAME INSERT SUCH THAT FIRST , SECOND , AND
`THIRD PASSAGEWAYS IN FLUID COMMUNICATION
`
`D11
`
`Case 6:20-cv-00636-ADA Document 92-4 Filed 03/31/21 Page 15 of 22
`
`ATTACHING ONE OR MORE GAS NOZZLES TO
`FRAME INSERT TO DIRECT FLOW OF GAS RECEIVED
`AT GAS INLET INTO SUBSTRATE TRANSFER AREA
`
`FIG . 10
`
`1002
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`

`

`US 10 , 381 , 247 B2
`
`5
`
`FIELD
`
`GAS SYSTEMS AND METHODS FOR
`CHAMBER PORTS
`
`receive a substrate therein , a chamber port assembly inter
`facing the first chamber with the second chamber , the
`chamber port assembly having a substrate transfer area
`RELATED APPLICATIONS
`between the first chamber and the second chamber , the
`substrate transfer area configured to receive a substrate as
`the substrate is transferred through the chamber port assem
`This application is a divisional of and claims priority to
`bly between the first chamber and the second chamber , a gas
`U . S . patent application Ser . No . 14 / 036 . 754 filed Sep . 25 .
`inlet , a gas conduit member having a gas passageway there
`2013 , and titled " GAS APPARATUS , SYSTEMS , AND
`through in fluid communication with the gas inlet , and one
`METHODS FOR CHAMBER PORTS ” , which is hereby
`incorporated herein by reference in its entirety for all pur - 10 or more gas nozzles configured to direct a flow of gas
`received at the gas inlet into the substrate transfer area .
`poses .
`According to a third aspect , a method of assembling a
`chamber port assembly for an electronic device manufac
`turing system is provided . The method comprises providing
`The invention relates generally to electronic device manu - 15 a lid having a gas inlet formed therein and a first gas
`passageway extending there through , the first gas passage
`facturing , and more particularly to chamber ports through
`way in fluid communication with the gas inlet ; providing a
`which substrates are transferred .
`gas conduit member having a second gas passageway
`BACKGROUND
`extending there through ; providing a frame insert having a
`20 third gas passageway extending there through , the frame
`Conventional electronic device manufacturing systems
`insert configured to receive one or more gas nozzles such
`may include one or more process chambers configured to
`that the third gas passageway is in fluid communication with
`perform any number of substrate processes including , e . g . ,
`the one or more gas nozzles ; coupling the lid , gas conduit
`degassing , pre - cleaning or cleaning , deposition ( e . g . , chemi
`member , and frame insert such that the first , second , and
`cal vapor deposition ( CVD ) , physical vapor deposition 25 third gas passageways are in fluid communication with each
`( PVD ) , and / or atomic layer deposition ) , coating , oxidation ,
`other ; and attaching the one or more gas nozzles to the frame
`nitration , etching ( e . g . , plasma etching ) , and the like . Sub
`insert such that the one or more gas nozzles are configured
`strates may be semiconductor wafers , glass plates or panels ,
`to direct a flow of gas received at the gas inlet into a
`and / or other workpieces used to make electronic devices or
`substrate transfer area of the chamber port assembly .
`circuit components . Substrates may be transferred between 30
`In another aspect , an electronic device manufacturing
`a process chamber and a transfer chamber through a cham -
`system is provided . The electronic device manufacturing
`ber port assembly that may include , e . g . , a slit valve . A
`includes a process chamber configured to receive a substrate
`chamber port assembly provides an interface between cham -
`therein , a transfer chamber configured to receive a substrate
`ber ports of a process chamber and a transfer chamber .
`therein , a chamber port assembly interfacing the process
`Undesirable particulate matter from chamber hardware may 35 chamber with the transfer chamber , the chamber port assem
`migrate to a substrate during a transfer of the substrate
`bly including a frame with a frame insert , and a substrate
`through a chamber port assembly . The undesirable particu -
`transfer area between the process chamber and the transfer
`late matter may adversely affect the processing of the
`chamber , the substrate transfer area including an opening in
`substrate , which may render any electronic device and / or
`the frame insert configured to receive a substrate as the
`circuit component ( s ) fabricated thereon unusable .
`40 substrate is transferred through the chamber port assembly
`Accordingly , improved apparatus , systems , and methods
`between the process chamber and the transfer chamber , a slit
`for transferring a substrate through a chamber port assembly
`valve mechanism including a slit valve door configured to be
`sealed against the opening in the frame insert , a gas inlet , a
`are desired .
`gas conduit member having a gas passageway there through
`SUMMARY
`45 in fluid communication with the gas inlet , and one or more
`gas nozzles in the frame insert configured to direct a flow of
`gas received at the gas inlet into the substrate transfer area .
`According to a first aspect , a chamber port assembly of an
`Still other aspects , features , and advantages of embodi
`electronic device manufacturing system is provided . The
`chamber port assembly comprises a lid having a gas inletm ents of the invention may be readily apparent from the
`formed therein and a first gas passageway extending there 50 following detailed description wherein a number of example
`through , the first gas passageway in fluid communication
`embodiments and implementations are described and illus
`with the gas inlet ; a gas conduit member having a second gas
`trated , including the best mode contemplated for carrying
`passageway extending there through , the second gas pas
`out the invention . The invention may also include other and
`sageway in fluid communication with the first gas passage -
`different embodiments , and its several details may be modi
`way ; a frame insert having a third gas passageway in fluid 55
`fied in various respects , all without departing from the scope
`communication with the second gas passageway ; and one or
`of the invention . Accordingly , the drawings and descriptions
`more gas nozzles coupled to the frame insert and in fluid
`are to be regarded as illustrative in nature , and not as
`communication with the third gas passageway , the one or
`restrictive . The invention covers all modifications , equiva
`more gas nozzles configured to direct a flow of gas received
`lents , and alternatives falling within the scope of the inven
`at the gas inlet into a substrate transfer area , the substrate 60 tion .
`transfer area configured to receive a substrate as the sub
`BRIEF DESCRIPTION OF DRAWINGS
`strate is transferred through the chamber port assembly from
`a first chamber to a second chamber .
`The drawings , described below , are for illustrative pur
`According to a second aspect , an electronic device manu
`facturing system is provided . The electronic device manu - 65 poses only and are not necessarily drawn to scale . The
`facturing system comprises a first chamber configured to
`drawings are not intended to limit the scope of this disclo
`receive a substrate therein , a second chamber configured to
`sure in any way .
`
`Case 6:20-cv-00636-ADA Document 92-4 Filed 03/31/21 Page 16 of 22
`
`

`

`US 10 , 381 , 247 B2
`
`interfaces , and / or may reduce particulate matter build - up in
`FIG . 1 illustrates a schematic top view of an electronic
`the substrate transfer area , and / or may purge the substrate
`device manufacturing system according to embodiments .
`transfer area to reduce and / or prevent migration of particu
`FIG . 2 illustrates a perspective view of a chamber port
`late matter from the chamber hardware onto a substrate
`assembly coupled to a process chamber ( with lid removed )
`5 being transferred through the chamber port assembly . In
`according to embodiments .
`some embodiments , one or more parts of a conventional
`FIGS . 3A and 3B illustrate perspective and orthographic
`chamber port assembly may be modified to include , e . g . , a
`views , respectively , of a first chamber side of the chamber
`gas inlet , one or more gas passageways , and one or more gas
`port assembly of FIG . 2 according to embodiments .
`nozzles positioned proximate a substrate transfer area . In
`FIGS . 3C and 3D illustrate perspective and orthographic
`views , respectively , of a second chamber side of the chamber 10 some embodiments , one or more additional part may be
`added to a conventional chamber port assembly to provide ,
`port assembly of FIG . 2 according to embodiments .
`FIGS . 4A and 4B illustrate perspective and orthographic
`e . g . , one or more gas passageways in fluid communication
`with a gas inlet and / or one or more gas nozzles .
`views , respectively , of a first chamber side of a subassembly
`of the chamber port assembly of FIG . 2 according to
`In another aspect , either or both chambers coupled to
`15 opposite sides of a chamber port assembly may include gas
`embodiments .
`FIGS . 4C and 4D illustrate perspective and orthographic
`apparatus configured to direct a flow of gas into a substrate
`views , respectively , of a second chamber side of the subas
`transfer area of the chamber port assembly . Either or both of
`sembly of FIGS . 4A and 4B according to embodiments .
`the chambers may include a gas inlet and a gas conduit
`FIG . 4E illustrates a side orthographic view of the sub
`member coupled to the gas inlet . The gas conduit member
`assembly of FIGS . 4A - D according to embodiments .
`20 may be configured to receive one or more gas nozzles
`FIG . 5A illustrates a top perspective view of a lid of the
`positioned sufficiently proximate to the substrate transfer
`chamber port assembly of FIG . 2 according to embodiments .
`area to direct a flow of gas into the substrate transfer area .
`FIG . 5B illustrates a top perspective view of the lid ( with
`For example , in some embodiments , the gas inlet may be
`top surface removed ) of FIG . 5A attached to a frame of the
`formed in a lid ( i . e . , top wall ) or a side wall of the chamber ,
`chamber port assembly of FIG . 2 according to embodiments . 25 and / or the gas conduit member may be positioned and / or
`FIG . 5C illustrates a bottom perspective view of the lid of
`mounted on a lid or a side wall to which the chamber port
`assembly may be coupled .
`FIG . 5A according to embodiments .
`FIGS . 6A and 6B illustrate perspective and side ortho -
`In other aspects , methods of assembling a chamber port
`graphic views , respectively , of a gas conduit member of the
`assembly for an electronic device manufacturing system are
`chamber port assembly of FIG . 2 according to embodiments . 30 provided , as will be explained in greater detail below in
`FIGS . 7A and 7B illustrate orthographic and perspective
`connection with FIGS . 1 - 10 .
`views , respectively , of a first chamber side of a frame insert
`FIG . 1 illustrates an electronic device manufacturing
`of the chamber port assembly of FIG . 2 according to
`system 100 in accordance with one or more embodiments .
`Electronic device manufacturing system 100 may be con
`embodiments .
`FIGS . 70 and 7D illustrate schematic cross - sectional 35 figured to process multiple substrates concurrently . Sub
`views of alternative embodiments of a portion of the frame
`strates may be a semiconductor wafer , glass plate or panel ,
`insert of FIGS . 7A and 7B taken along section line 7C - 7C of
`and / or other workpiece used to make electronic devices or
`circuit components . Electronic device manufacturing system
`FIG . 7B .
`FIGS . 7E and 7F illustrate orthographic and perspective
`100 may include a transfer chamber 102 , a plurality of
`views , respectively , of a second chamber side of the frame 40 process chambers 104 , and one or more load lock chambers
`106 , each of which may operate at a vacuum pressure .
`insert of FIGS . 7A and 7B according to embodiments .
`FIG . 76 illustrates a side orthographic view of the frame
`Transfer chamber 102 may have a robot ( not shown ) con
`figured to transfer substrates to and from each process
`insert of FIGS . 7A - F according to embodiments .
`FIG . 8 illustrates a perspective view of a gas nozzle of the
`chamber 104 and each load lock chamber 106 .
`chamber port assembly of FIG . 2 according to embodiments . 45
`Process chambers 104 may each perform a same or a
`FIG . 9 illustrates a schematic cut - away view of a chamber
`different substrate process including , e . g . , deposition ( e . g . ,
`port assembly disposed between two chambers according to
`chemical vapor deposition ( CVD ) , physical vapor deposi
`tion ( PVD ) , and / or atomic layer deposition ) , oxidation ,
`embodiments .
`FIG . 10 illustrates a flowchart of a method of assembling
`nitration , coating , etching ( e . g . , plasma etching ) , polishing ,
`a chamber port assembly for an electronic device manufac - 50 cleaning , lithography , degassing , or the like . Other substrate
`processes may additionally or alternatively be performed by
`turing system according to embodiments .
`process chambers 104 . Within each process chamber 104 ,
`DETAILED DESCRIPTION
`one or more substrates may be processed .
`Load lock chambers 106 may each be a batch - type or
`Reference will now be made in detail to the example 55 single substrate - type load lock chamber . Load lock cham
`embodiments of this disclosure , which are illustrated in the
`bers 106 may be coupled to a factory interface 108 and may
`accompanying drawings . Wherever possible , the same ref -
`provide a first vacuum interface between factory interface
`erence numbers will be used throughout the drawings to
`108 and transfer chamber 102 .
`Factory interface 108 may be coupled to one or more
`refer to the same or like parts .
`In one aspect , a chamber port assembly that provides an 60 FOUPs ( front opening unified pods ) 110 . Each FOUP 110
`interface between two chambers , such as , e . g . , a process
`may be a container having a stationary cassette for holding
`chamber and a transfer chamber of an electronic device
`multiple substrates . FOUPs 110 may each have a front
`manufacturing system , may include gas apparatus config -
`opening interface configured to be used with factory inter
`ured to direct a flow of gas into a substrate transfer area of
`face 108 . In other embodiments , any suitable type of pod
`the chamber port assembly . Such a flow of gas , which may 65 and / or load port may be used instead of FOUPs 110 . Factory
`be a purge gas , such as , e . g . , nitrogen , may reduce oxidation
`interface 108 may have one or more robots ( not shown )
`and / or corrosion of chamber port assembly parts and sealing
`configured to transfer substrates in any sequence or direction
`
`Case 6:20-cv-00636-ADA Document 92-4 Filed 03/31/21 Page 17 of 22
`
`

`

`US 10 , 381 , 247 B2
`
`Chamber port assembly 216 may have a first chamber side
`via linear , rotational , and / or vertical movement between
`322 , which may be a process chamber side , as shown in
`FOUPs 110 and load lock chambers 106 . Electronic device
`FIGS . 3A and 3B . First chamber side 322 may be configured
`manufacturing system 100 may have other suitable numbers
`to be coupled to , e . g . , process chamber 204 as described
`of FOUPs 110 .
`A controller 112 may control some or all of the processing 5 above and / or to any one of process chambers 104 . First
`chamber side 322 may have a first opening 324 sized to
`and transferring of substrates in and through electronic
`device manufacturing system 100 . Controller 112 may be ,
`allow a horizontally - oriented substrate to pass there through
`e . g . , a general purpose computer and / or may include a
`via robot or other suitable mechanism . As described above ,
`microprocessor or other suitable CPU ( central processing
`first chamber side 322 may have a plurality of coupling
`unit ) , a memory for storing software routines that control 10 locations 220 ( seven are labeled in FIG . 3A ) formed on
`electronic device manufacturing system 100 , input / output
`frame 218 for coupling to a process chamber . First chamber
`peripherals , and support circuits ( such as , e . g . , power sup -
`side 322 may also have one or more O - rings 326 disposed
`plies , clock circuits , circuits for driving robots , a cache ,
`thereon to provide an airtight seal with a process chamber .
`Chamber port assembly 216 may have a second chamber
`and / or the like ) .
`In other embodiments , electronic device manufacturing 15 side 328 , which may be a transfer chamber side , as shown
`system 100 may have other suitable numbers and configu -
`in FIGS . 3C and 3D . Second chamber side 328 may be
`rations of transfer chamber 102 ( including other suitable
`configured to be coupled to , e . g . , transfer chamber 102 .
`shapes thereof ) , process chambers 104 , and / or load lock
`Second chamber side 328 may have one or more O - rings 327
`chambers 106 , each of which may be of conventional design
`( only one is shown ) disposed thereon to provide an airtight
`and / or construction .
`20 seal between chamber port assembly 216 and a transfer
`Transfer chamber 102 and each of process chambers 104
`chamber . Second chamber side 328 may have a second
`and load lock chambers 106 may have one or more chamber
`opening 330 sized to allow a horizontally - oriented substrate
`ports 114 . A chamber port 114 may be an opening in a side
`to pass there through via robot or other suitable mechanism .
`wall of a chamber configured to allow a horizontally -
`Second opening 330 may be larger than first opening 324 . A
`oriented substrate to pass there through via a robot or other 25 substrate transfer area 332 may be located between first
`suitable mechanism . Each chamber port 114 may be , e . g . , an
`chamber side 322 and second chamber side 328 , and more
`elongated slot or slit . Chamber ports 114 may have other
`particularly , between first opening 324 and second opening
`suitable configurations . Each chamber port 114 may be
`330 . Substrate transfer area 332 may be configured to
`configured to be coupled to one side of a chamber port
`receive a substrate there through as the substrate is trans
`assembly 116 .
`30 ferred via robot or other suitable mechanism through cham
`A plurality of chamber port assemblies 116 may be
`ber port assembly 216 from a first chamber to
`a second
`included in electronic device manufacturing system 100 . A
`chamber , which may be a process chamber and a transfer
`chamber port assembly 116 may be configured to interface
`chamber or vice versa .
`one chamber with another chamber at their corresponding
`Chamber port assembly 216 may include a slit valve
`chamber ports 114 . For example , as shown in FIG . 1 , a 35 mechanism 234 . Slit valve mechanism 234 may include a
`respective chamber port assembly 116 may interface transfer
`slit valve door 336 ( see FIGS . 3B and 3D ) and an actuating
`chamber 102 with process chambers 104 and / or load lock
`cylinder 238 for manipulating slit valve door 336 . In some
`chambers 106 . One chamber may be coupled to one side of
`embodiments , slit valve door 336 and actuating cylinder 238
`a chamber port assembly 116 , and the other chamber may be
`may be located in the substrate transfer area 332 . Slit valve
`coupled to the opposite side of the chamber port assembly 40 door 336 may be configured to have open and closed
`116 . Chamber port assembly 116 may have a substrate
`positions . In the open position , a substrate may be trans
`transfer area therein through which horizontally - oriented
`ferred via robot or other suitable mechanism through sub
`substrates may be transferred between adjoining chambers
`strate transfer area 332 and first and second openings 324
`via robot or other suitable mechanism . A chamber port
`and 330 . In the closed position , slit valve door 336 may seal
`assembly 116 may include a slit valve mechanism or other 45 first opening 324 to provide an airtight boundary between
`suitable device for opening and closing an opening to the
`the adjoining chambers coupled to chamber port assembly
`216 . In some embodiments , slit valve mechanism 234 may
`substrate transfer area .
`FIG . 2 shows a chamber port assembly 216 coupled to a
`be an L - motion slit valve mechanism . Slit valve mechanism
`process chamber 204 ( with lid removed ) in accordance with
`234 may otherwise be of any suitable and / or conventional
`o