Case 6:20-cv-00636-ADA Document 92-3 Filed 03/31/21 Page 1 of 16
`
`Exhibit 24
`
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`
`
`
`
`
`
`

`

`( 12 ) United States Patent
`Reuter
`
`( 10 ) Patent No . : US 10 , 446 , 428 B2
`( 45 ) Date of Patent :
`Oct . 15 , 2019
`
`US010446428B2
`
`( * ) Notice :
`
`( 51 )
`
`( 52 )
`
`WO
`
`5 , 697 , 750 A * 12 / 1997 Fishkin . . . . . . . . . . . . . HO1L 21 / 67772
`414 / 217 . 1
`5 , 746 , 008 A *
`5 / 1998 Yamashita . . . . . . . . HO1L 21 / 67772
`34 / 211
`6 , 561 , 894 B1 *
`5 / 2003 Miyajima . . . . . . . . . HO1L 21 / 67772
`454 / 187
`6 , 955 , 197 B2 10 / 2005 Elliot et al .
`7 , 726 , 353 B2
`6 / 2010 Okabe
`8 , 601 , 975 B2
`12 / 2013 Shah et al .
`8 , 689 , 812 B2
`4 / 2014 Shah et al .
`( Continued )
`FOREIGN PATENT DOCUMENTS
`W O - 2010007657 A1 *
`1 / 2010 . . . . . . . HOIL 21 / 67772
`OTHER PUBLICATIONS
`Reuter et al . , U . S . Appl . No . 15 / 348 , 964 , titled : Systems , Apparatus ,
`and Methods for an Improved Load Port Backplane , filed Nov . 10 ,
`2016 .
`( Continued )
`Primary Examiner — James Keenan
`( 74 ) Attorney , Agent , or Firm — Lowenstein Sandler LLP
`ABSTRACT
`( 57 )
`An electronic device manufacturing system may include a
`factory interface having a controlled environment . The elec
`tronic device manufacturing system may also include a load
`port coupled to the factory interface . The load port may be
`configured to receive a substrate carrier thereon and may
`include purge apparatus and a controller . The controller may
`be configured to operate the load port such that any air
`located around and between a substrate carrier door and the
`load port is at least partially or entirely purged , thus reducing
`or preventing contamination of the controlled environment
`upon the opening of the substrate carrier door by the load
`port . Methods of operating a factory interface load port are
`also provided , as are other aspects .
`18 Claims , 7 Drawing Sheets
`
`( 54 ) LOAD PORT OPERATION IN ELECTRONIC
`DEVICE MANUFACTURING APPARATUS ,
`SYSTEMS , AND METHODS
`( 71 ) Applicant : Applied Materials , Inc . , Santa Clara ,
`CA ( US )
`( 72 ) Inventor : Paul B . Reuter , Austin , TX ( US )
`Assignee : Applied Materials , Inc . , Santa Clara ,
`( 73 )
`CA ( US )
`Subject to any disclaimer , the term of this
`patent is extended or adjusted under 35
`U . S . C . 154 ( b ) by 99 days .
`( 21 ) Appl . No . : 15 / 458 , 908
`( 22 )
`Filed :
`Mar . 14 , 2017
`( 65 )
`Prior Publication Data
`US 2018 / 0269095 A1 Sep . 20 , 2018
`Int . Cl .
`( 2006 . 01 )
`HOIL 21 / 677
`HOIL 21 / 673
`( 2006 . 01 )
`U . S . Ci .
`CPC . . HOIL 21 / 67772 ( 2013 . 01 ) ; HOIL 21 / 67393
`( 2013 . 01 ) ; HOIL 21 / 67775 ( 2013 . 01 )
`( 58 ) Field of Classification Search
`CPC . . . . . . . . . . . . . . . . . . HO1L 21 / 67772 ; H01L 21 / 67775
`See application file for complete search history .
`References Cited
`U . S . PATENT DOCUMENTS
`5 , 169 , 272 A * 12 / 1992 Bonora . . . . . . . . . . . HO1L 21 / 67772
`414 / 217 . 1
`5 , 364 , 219 A * 11 / 1994 Takahashi . . . . . . . . HOIL 21 / 67772
`414 / 217
`
`( 56 )
`
`Case 6:20-cv-00636-ADA Document 92-3 Filed 03/31/21 Page 2 of 16
`
`1 96
`
`120T
`
`108
`
`FACTORY
`INTERFACE
`
`112
`
`SUBSTRATE
`PROCESS TOOL
`
`109a
`
`120
`12OF 2
`122
`102
`10217 113
`
`110 -
`SUBS RATE
`CARRIER
`
`111 1076
`1973
`105
`
`PUJRGE
`APPARATUS
`
`CONTROLLER
`118
`w
`LOAD PORT
`
`104
`
`120R - - -
`
`120B
`
`

`

`US 10 , 446 , 428 B2
`Page 2
`
`( 56 )
`
`References Cited
`U . S . PATENT DOCUMENTS
`8 , 870 , 512 B2 10 / 2014 Rice et al .
`9 , 153 , 468 B2 *
`10 / 2015 Emoto . . . . . . . . . . . . . . HO1L 21 / 67772
`9 , 406 , 537 B2 *
`8 / 2016 Oyama . . . . . . . . . . . . . HO1L 21 / 67772
`10 , 134 , 619 B2 * 11 / 2018 Kondoh . . . . . . . . . . . . HOLL 21 / 67389
`10 , 159 , 169 B2
`12 / 2018 Vincent et al .
`10 , 262 , 884 B2
`4 / 2019 Bonecutter et al .
`2006 / 0225299 Al 10 / 2006 Kim et al .
`2008 / 0069670 Al
`3 / 2008 Hashimoto et al .
`2008 / 0260498 A1 *
`10 / 2008 Nagata . . . . . . . . . . . . . . HO1L 21 / 67775
`414 / 217
`2009 / 0110518 A14 / 2009 Rice et al .
`2009 / 0169342 A1 7 / 2009 Yoshimura et al .
`2012 / 0237323 Al
`9 / 2012 Sugawara
`2012 / 0241032 A1 9 / 2012 Sugawara
`2015 / 0013771 A1
`1 / 2015 Quiles et al .
`2015 / 0045961 AL
`2 / 2015 Koshti et al .
`2015 / 0221538 Al
`8 / 2015 Ochiai et al .
`2016 / 0118279 A1 4 / 2016 Iyer et al .
`2016 / 0147235 Al 5 / 2016 Rice et al .
`2018 / 0124960 A1
`5 / 2018 Vincent et al .
`2018 / 0130684 A1 5 / 2018 Reuter et al .
`2018 / 0130685 Al 5 / 2018 Bonecutter et al .
`
`2018 / 0130686 AL 5 / 2018 Blahnik et al .
`2018 / 0130687 A15 / 2018 Bonecutter
`2018 / 0226284 A1
`8 / 2018 Blahnik
`
`OTHER PUBLICATIONS
`Vincent et al . , U . S . Appl . No . 15 / 336 , 279 , titled : Flexible Equip
`ment Front End Module Interfaces , Environmentally - Controlled
`Equipment Front End Modules , and Assembly Methods , filed Oct .
`27 , 2016 .
`Blahnik et al . , U . S . Appl . No . 15 / 348 , 947 , titled : Electronic Device
`Manufacturing Load Port Apparatus , Systems , and Methods , filed
`Nov . 10 , 2016 .
`Luke W . Bonecutter , U . S . Appl . No . 15 / 348 , 961 , titled : Electronic
`Device Manufacturing Load Port Apparatus , Systems , and Methods ,
`filed Nov . 10 , 2016 .
`Luke W . Bonecutter , U . S . Appl . No . 15 / 348 , 967 , titled : Systems ,
`Apparatus , and Methods for an Improved Load Port , filed Nov . 10 ,
`2016 .
`David T . Blahnik , U . S . Appl . No . 15 / 426 , 037 , titled : Systems ,
`Apparatus , and Methods for a Load Port Door Opener , filed Feb . 6 ,
`2017 .
`International Search Report & Written Opinion of International
`Application PCT / US2018 / 016158 dated Jun . 26 , 2018 .
`* cited by examiner
`
`Case 6:20-cv-00636-ADA Document 92-3 Filed 03/31/21 Page 3 of 16
`
`

`

`U . S . Patent
`
`Oct . 15 , 2019
`
`Sheet 1 of 7
`
`US 10 , 446 , 428 B2
`
`1207
`
`108
`
`GES
`
`FACTORY
`INTERFACE
`pohnung m . 112
`
`mm
`
`7
`
`SUBSTRATE
`PROCESS TOOL
`
`120
`
`120F -
`
`102
`102H 113
`
`110 -
`SUBSTRATE
`CARRIER
`
`w
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`DOLOKOOOOOOOOOOOOOOOOO
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`107a
`
`PURGE
`APPARATUS
`
`OOOOOOOOOOOOOOOOOOOOOOOOOOOOOOOOOOOOOOOOOO
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`LOAD PORT
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`120R -
`
`120B
`
`Case 6:20-cv-00636-ADA Document 92-3 Filed 03/31/21 Page 4 of 16
`
`FIG . 1
`
`

`

`atent
`
`Oct . 15 , 2019
`
`Sheet 2 of 7
`
`US 10 , 446 , 428 B2
`
`106
`
`
`
`0 0 . 0 0 0 . 0 0 . 0 0 0 ooo oo ooo 0000000000000
`
`FACTORY
`INTERFACE
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`108
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`SUBSTRATE
`PROCESS TOOL
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`Case 6:20-cv-00636-ADA Document 92-3 Filed 03/31/21 Page 5 of 16
`
`FIG . 1A
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`da da da da da da da da da da da da da da da da da da da da da da da da da
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`

`atent
`
`Oct . 15 , 2019
`
`Sheet 3 of 7
`
`US 10 , 446 , 428 B2
`
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`Case 6:20-cv-00636-ADA Document 92-3 Filed 03/31/21 Page 6 of 16
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`FIG . 2
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`atent
`
`Oct . 15 , 2019
`
`Sheet 4 of 7
`
`US 10 , 446 , 428 B2
`
`312
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`Case 6:20-cv-00636-ADA Document 92-3 Filed 03/31/21 Page 7 of 16
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`FIG . 3
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`VVViW
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`

`

`U . S . Patent
`
`Oct . 15 , 2019
`
`Sheet 5 of 7
`
`US 10 , 446 , 428 B2
`
`DDDDDDDDDDDDDDDDDDDDDDDDDDDDDDDDDDDDDDDDDDDDDDDDDDDDDDDDD
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`404
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`402H
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`410
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`CARRIER
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`432 - VUN
`Y 434 434
`
`LOAD PORT
`
`Case 6:20-cv-00636-ADA Document 92-3 Filed 03/31/21 Page 8 of 16
`
`FIG . 4A
`
`

`

`U . S . Patent
`
`Oct . 15 , 2019
`
`Sheet 6 of 7
`
`US 10 , 446 , 428 B2
`
`400B
`
`( 402
`
`402
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`HCOV
`
`jam 412
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`414
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`436
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`+ 436
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`DODOTIEDODDDDDDDDDDDDDDDDDDDDDDDDDDDDDDD nonnnnnnnnnnnnnnnnnnnnnnnnnnnn
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`432 - - - -
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`410
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`CARRIER
`
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`LOAD PORT
`
`FIG . 4B
`
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`Case 6:20-cv-00636-ADA Document 92-3 Filed 03/31/21 Page 9 of 16
`
`713
`
`

`

`atent
`
`Oct . 15 , 2019
`
`Sheet 7 of 7
`
`US 10 , 446 , 428 B2
`
`500
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`
`PURGING A SUBSTRATE CARRIER PLACED ON A
`LOAD PORT DOCKING TRAY
`
`r
`
`ytykytykytykytykytykytyykkyytytykytykytyykkyytytykytyykytykytykytykytyytytytytytytytytyytykytykytykytyytytytytytykytyyty
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`E
`PORT DOCKING TRAY
`
`ACTIVATING A PURGE OF AN AREA AROUND AND
`BETWEEN A SUBSTRATE CARRIER DOOR OF THE
`SUBSTRATE CARRIER AND A CARRIER DOOR OPENER
`OF THE LOAD PORT FOR A PERIOD OF TIME
`
`DEACTIVATING THE PURGE OF THE AREA
`BETWEEN THE SUBSTRATE CARRIER DOOR
`AND THE CARRIER DOOR OPENER IN RESPONSE
`TO EXPIRY OF THE PERIOD OF TIME
`
`Case 6:20-cv-00636-ADA Document 92-3 Filed 03/31/21 Page 10 of 16
`
`wwwwwwwwwwwwwww
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`CLAMPING THE SUBSTRATE CARRIER AGAINST
`A BACKPLANE OF THE LOAD PORT IN RESPONSE
`TO THE DEACTIVATING
`
`FIG . 5
`
`

`

`US 10 , 446 , 428 B2
`
`LOAD PORT OPERATION IN ELECTRONIC
`DEVICE MANUFACTURING APPARATUS ,
`SYSTEMS , AND METHODS
`
`FIELD
`This disclosure relates to electronic device manufacturing
`and , more particularly , to factory interface load port opera
`tion .
`
`coupled to the front side at the front side opening . The
`backplane has a backplane opening . The load port also
`comprises a docking tray and a carrier door opener . The
`carrier door opener seals the backplane opening when the
`carrier door opener is closed and opens a substrate carrier
`door of the substrate carrier . The electronic device manu
`facturing system further comprises a controller configured to
`purge the substrate carrier placed on the docking tray , dock
`the substrate carrier to the docking tray , activate a purge of
`10 an area around and between the substrate carrier door and
`BACKGROUND
`the carrier door opener for a period of time , deactivate the
`purge of the area in response to expiry of the period of time ,
`Processing of substrates in semiconductor electronic
`and clamp the substrate carrier to the backplane in response
`device manufacturing is generally carried out in multiple
`15 to deactivating the purge of the area .
`process tools , where substrates travel between process tools 15 "
`According to a third aspect , a method of operating a
`in substrate carriers . Substrate carriers may be sealable
`factory interface load port in an electronic device manufac
`containers carrying from one to , e . g . , 25 substrates , and may
`be . e . g . Front Opening Unified Pods or FOUPs . A substrate
`turing system is provided . The method comprises purging a
`carrier may be docked to a load port , which may be mounted
`substrate carrier placed on a load port docking tray , docking
`to a factory interface , such as , e . g . , an Equipment Front End 20 the substrate carrier to the load port docking tray , activating
`Module or EFEM . The factory interface may be coupled to
`a purge of an area around and between a substrate carrier
`a process tool and may include a robot substrate handler
`door of the substrate carrier and a carrier door opener of the
`operable to transfer substrates between a substrate carrier
`load port for a period of time , deactivating the purge of the
`and the process tool .
`area between the substrate carrier door and the carrier door
`An environmentally - controlled atmosphere may be pro - 25 opener in response to expiry of the period of time , and
`vided within and between the substrate carrier , the factory
`clamping the substrate carrier against a backplane of the
`interface , and the process tool . That is , because exposure to
`load port in response to the deactivating .
`e . g . , air ( particularly oxygen , a reactive gas ) and moisture
`Still other aspects , features , and advantages in accordance
`may adversely affect substrate properties and substrate pro
`with these and other embodiments of the disclosure may be
`cessing due to oxidation , substrates may be kept in
`a 30 readily apparent from the following detailed description , the
`non - reactive gas environment . A non - reactive gas may be ,
`appended claims , and the accompanying drawings . Accord
`e . g . , nitrogen . Any leakage in that environment occurring
`ingly , the drawings and descriptions herein are to be
`during , e . g . , a transfer of substrates from a substrate carrier
`regarded as illustrative in nature , and not as restrictive .
`to a factory interface via a load port may accordingly
`contaminate substrates being processed and / or adversely 35
`BRIEF DESCRIPTION OF DRAWINGS
`affect processes being performed on the substrates . This may
`result in the manufacture of defective electronic devices on
`The drawings , described below , are for illustrative pur
`those substrates . Existing electronic device manufacturing
`poses only and are not necessarily drawn to scale . The
`systems may therefore benefit from improved load port
`drawings are not intended to limit the scope of the disclosure
`operation that reduces or eliminates such leakage .
`in any way .
`FIG . 1 illustrates a side schematic view of an electronic
`SUMMARY
`device manufacturing system according to embodiments of
`According to a first aspect , a load port of a factory
`the disclosure .
`interface of an electronic device manufacturing system is 45
`FIG . 1A is a simplified version of FIG . 1 illustrating a
`provided . The load port comprises purge apparatus , a dock
`substrate carrier door and a carrier door opener in an open
`ing tray , a backplane located adjacent to the docking tray , a
`position according to embodiments of the disclosure .
`carrier door opener configured to seal an opening in the
`FIG . 2 illustrates a front perspective view of a load port
`backplane when the carrier door opener is closed , and a
`according to embodiments of the disclosure .
`controller coupled to operate the purge apparatus , the dock - 50
`FIG . 3 illustrates a simplified rear perspective view of a
`ing tray , and the carrier door opener . The controller is
`load port according to embodiments of the disclosure .
`configured to purge a substrate carrier placed on the docking
`FIG . 4A illustrates a simplified side schematic view of a
`tray , dock the substrate carrier to the docking tray , activate
`substrate carrier docked but not clamped to a load port
`a purge of an area around and between a substrate carrier
`relative to a carrier door opener of the load port according
`door and the carrier door opener for a period of time , 55 to embodiments of the disclosure .
`deactivate the purge of the area in response to expiry of the
`FIG . 4B illustrates a simplified side schematic view of a
`period of time , and clamp the substrate carrier to the
`substrate carrier docked and clamped to a load port relative
`backplane in response to deactivating the purge of the area .
`to a carrier door opener of the load port according to
`According to a second aspect , an electronic device manu -
`embodiments of the disclosure .
`facturing system is provided . The electronic device manu - 60
`FIG . 5 illustrates a method of operating a factory interface
`facturing system comprises a substrate process tool and a
`load port in an electronic device manufacturing system
`factory interface . The factory interface comprises a housing
`according to embodiments of the disclosure .
`having a front side and a rear side , the front side having a
`DETAILED DESCRIPTION
`front side opening and the rear side coupled to the substrate
`process tool . The electronic device manufacturing system 65
`also comprises a load port configured to interface with a
`Reference will now be made in detail to example embodi
`substrate carrier . The load port comprises a backplane
`ents of the disclosure , which are illustrated in the accom
`
`5
`
`40
`
`m
`
`Case 6:20-cv-00636-ADA Document 92-3 Filed 03/31/21 Page 11 of 16
`
`

`

`US 10 , 446 , 428 B2
`
`Further details of example embodiments illustrating and
`panying drawings . Wherever possible , the same reference
`describing improved factory interface load ports in elec
`numbers will be used throughout the drawings to refer to the
`tronic device manufacturing systems , as well as other
`same or like parts .
`aspects including methods of operating a factory interface
`Electronic device manufacturing systems may provide
`controlled environments between various components , such 5 load port in an electronic device manufacturing system , will
`as , e . g . , substrate carriers , load ports , factory interfaces , and
`be explained in greater detail below in connection with
`process tools , in order to reduce or eliminate , e . g . , undesir -
`FIGS . 1 - 5 .
`able oxygen , moisture , and / or particles that may adversely
`FIG . 1 illustrates a side schematic view of an electronic
`affect substrate properties and / or substrate processing . A
`device manufacturing system 100 in accordance with one or
`controlled environment may be , e . g . , a positive - pressure 10 more embodiments . Electronic device manufacturing sys
`non - reactive gas environment , wherein nitrogen , e . g . , may
`tem 100 may include a substrate carrier 102 , a load port 104 ,
`a factory interface 106 , and a substrate process tool 108 .
`be used as the non - reactive gas .
`A load port operation may be performed to allow transfer
`Load port 104 may be coupled to factory interface 106 ,
`of one or more substrates from a substrate carrier into a
`which may be coupled to substrate process tool 108 . Elec
`factory interface . A load port operation may include the 15 tronic device manufacturing system 100 may include other
`following : receiving a substrate carrier on a load port
`components as well .
`docking tray , purging the substrate carrier of air ( i . e . , oxy
`Substrate carrier 102 may be a sealable container config
`gen ) and moisture by flowing a non - reactive gas , such as ,
`ured to carry one or more substrates . Substrates may be any
`e . g . , nitrogen , into the substrate carrier , docking the sub -
`suitable article used to make electronic devices or circuit
`strate carrier to the docking tray , clamping the substrate 20 components , such as silicon - containing discs or wafers ,
`carrier to a backplane of the load port to squeeze the
`patterned wafers , glass plates , or the like . Substrate carrier
`substrate carrier against the backplane , attaching a load port
`102 may be , e . g . , a Front Opening Unified Pod or FOUP in
`carrier door opener located at the backplane to a substrate
`some embodiments , and may include a substrate carrier door
`carrier door , purging a space between the carrier door opener
`110 . In some embodiments , substrate carrier door 110 may
`and the substrate carrier door by flowing , e . g . , nitrogen into 25 be a FOUP door .
`that space ( this purge may be referred to hereinafter as a
`Load port 104 may include a docking tray 111 and a
`" door purge ” ) , and opening the substrate carrier door with
`backplane 112 located adjacent to docking tray 111 . Docking
`the carrier door opener to allow transfer of one or more
`tray 111 may be configured to receive substrate carrier 102
`substrates from the substrate carrier into the factory interface
`thereon , and backplane 112 may have a backplane opening
`and then into a process tool .
`30 113 configured to receive substrate carrier 102 and substrate
`However , in some electronic device manufacturing sys -
`carrier door 110 therein .
`tems , such a load port operation may result in contamination
`Load port 104 may also have a carrier door opener 114
`of a controlled factory interface environment . The contami -
`configured to attach to , unlatch , and open substrate carrier
`nation may be caused by air ( i . e . , oxygen ) , moisture , and / or
`door 110 to allow the transfer of substrates into and out of
`particles contained therein that may be trapped in spaces 35 substrate carrier 102 . More particularly , carrier door opener
`around the substrate carrier door that are inaccessible during
`114 may open substrate carrier door 110 by attaching to and
`the door purge . The trapped air may then be released upon
`unlatching substrate carrier door 110 , moving substrate
`opening of the substrate carrier door , thus contaminating the
`carrier door 110 inward ( i . e . , to right as represented by arrow
`Al ) until backplane 112 is cleared , and then moving sub
`factory interface environment .
`In some electronic device manufacturing systems , varia - 40 strate carrier door 110 downward ( as represented by arrow
`A2 ) into an open position via an elevator mechanism 115
`tions of the above load port operation may also result in air
`and / or particle contamination of the factory interface envi -
`that may move along a rail or like structure ( not shown ) .
`ronment for the same reasons as described above . For
`FIG . 1A illustrates electronic device manufacturing system
`example , performing the door purge before the docking of
`100 ( although not all features are shown and / or labelled in
`the substrate carrier may cause an increase in pressure 45 FIG . 1A ) having substrate carrier door 110 and carrier door
`between the substrate carrier door and the carrier door
`opener 114 in an open position 116 in accordance with one
`opener , which may push open the carrier door opener and
`or more embodiments . Open position 116 may allow one or
`allow air ( i . e . , oxygen ) , moisture , and / or particles to con -
`more substrates to be transferred into and out of substrate
`taminate the factory interface environment . Similarly ,
`carrier 102 , as represented by double - headed arrow A3 .
`attaching the load port carrier door opener to the substrate 50
`Load port 104 may also include purge apparatus 105 , a
`carrier door after docking and then performing the door
`first inlet gas flow line 107a , a first outlet gas flow line 107b ,
`purge before clamping the substrate carrier to the backplane
`a second inlet gas flow line 109a , and a second outlet gas
`of the load port may still result in air and / or particle
`flow line 109b . Purge apparatus 105 may be configured to
`contamination of the factory interface environment for the
`provide an environmentally - controlled atmosphere , such as ,
`55 e . g . , a positive - pressure non - reactive and / or inert gas envi
`same reasons as described above .
`To address these contamination issues , electronic device
`ronment or the like . Purge apparatus 105 may include one or
`more valves , gas flow lines , pumps , flow controllers , flow
`manufacturing systems in accordance with one or more
`embodiments of the disclosure may include improved fac -
`meters , connections to external equipment and / or gas sup
`tory interface load ports and / or improved load port opera -
`plies / sources , etc . ( none shown ) . In some embodiments ,
`tion . The improved load ports may include a controller 60 purge apparatus 105 may include additional or alternative
`configured to perform a load port operation such that some
`equipment . First inlet gas flow line 107a and first outlet gas
`or all of any air ( and some or all of any undesirable particles
`flow line 107b may each be connected to purge apparatus
`contained therein ) that may otherwise be trapped in spaces
`105 and may each extend from purge apparatus 105 through
`around a substrate carrier door may be purged before the
`docking tray 111 for connection to substrate carrier 102 to
`substrate carrier door is opened . This may allow the con - 65 allow substrate carrier 102 to be purged ( e . g . , to allow a
`trolled factory interface environment to be maintained at an
`non - reactive gas to fill substrate carrier 102 ) . Second inlet
`acceptable level during a load port operation .
`gas flow line 109a and second outlet gas flow line 109b may
`
`Case 6:20-cv-00636-ADA Document 92-3 Filed 03/31/21 Page 12 of 16
`
`

`

`US 10 , 446 , 428 B2
`
`a carrier door opener 214 that seals backplane opening 213
`each be connected to purge apparatus 105 and may each
`when carrier door opener 214 is closed against backplane
`extend from purge apparatus 105 through carrier door
`212 as shown in FIG . 2 . In some embodiments , docking tray
`opener 114 to allow a door purge to be performed ( e . g . , to
`211 may be identical or similar to docking tray 111 ( FIG . 1 ) ,
`allow a non - reactive gas to
`fill spaces around and between
`5 backplane 212 may be identical or similar to backplane 112
`substrate carrier door 110 and carrier door opener 114 ) . In
`( FIG . 1 ) , and carrier door opener 214 may be identical or
`some embodiments , first inlet gas flow line 107a , first outlet
`similar to carrier door opener 114 ( FIG . 1 ) .
`gas flow line 107b , second inlet gas flow line 109a , and / or
`Docking tray 211 may be configured to receive thereon a
`second outlet gas flow line 109b may each be made of
`substrate carrier , such as , e . g . , substrate carrier 102 . Docking
`flexible material ( e . g . , to allow carrier door opener 114 to
`10 tray 211 may have one or more positioning pins 224 extend
`open without disconnecting gas flow line connections to
`ing upward from docking tray 211 that may be configured to
`purge apparatus 105 and / or carrier door opener 114 ) .
`cooperate with corresponding holes in a bottom of a sub
`Load port 104 may further include a controller 118 that
`strate carrier to guide the substrate carrier into a proper
`may be coupled to each of the active components of load
`position on docking tray 211 . Although two positioning pins
`port 104 to control operation thereof . In some embodiments ,
`the active components may include purge apparatus 105 , 15 224 are shown in FIG . 2 , other embodiments may have more
`docking tray 111 , and carrier door opener 114 ( along with
`or less positioning pins 224 . Docking tray 211 may also have
`elevator mechanism 115 ) . Controller 118 may include a
`a bottom clamp 225 , which may be , e . g . , a hook or claw - like
`programmed processor and memory storing processor
`device , configured to securely attach a substrate carrier to
`docking tray 211 via a corresponding feature located on the
`executable instructions .
`Factory interface 106 may be any suitable enclosure 20 bottom of the substrate carrier . Docking tray 211 may further
`having a housing 120 that has a front side 120F , a rear side
`have a first purging inlet 207a and a first purging outlet
`120R , a top 120T , a bottom 120B , and two side walls ( not
`207b . In some embodiments , first purging inlet 207a and
`separately shown ) . Front side 120F may have one or more
`first purging outlet 207b may each include an appropriately
`front side openings 122 configured to receive and couple to
`oriented one - way valve . First purging inlet 207a may be
`a respective load port 104 . Factory interface 106 may 25 configured to connect to purge apparatus 105 ( FIG . 1 ) via
`include a robot substrate handler ( not shown ) configured to
`first inlet gas flow line 107a , and first purging outlet 207b
`transfer substrates from substrate carrier 102 through factory
`may be configured to connect to purge apparatus 105 via first
`interface 106 to substrate process tool 108 . Factory interface
`outlet gas flow line 107b . Other embodiments may have
`106 may be maintained in a positive - pressure non - reactive
`more than one first purging inlet 207a and / or more than one
`gas environment ( using , e . g . , nitrogen as the non - reactive 30
`first purging outlet 207b . In some embodiments , docking
`gas ) using equipment ( e . g . , gas supply lines , one or more gas
`tray 211 may be configured to move toward backplane 212
`supplies or sources , vacuum pumps , valves , etc . ; not shown )
`from a substrate carrier placing / docking position to a clamp
`located within and / or coupled to electronic device manufac -
`ing position , as described in more detail below in connection
`turing system 100 . Factory interface 106 may , in other
`with FIGS . 4A and 4B .
`embodiments , be maintained in other non - reactive and / or 35
`Backplane 212 may include two or more side clamps 226
`configured to clamp a substrate carrier to backplane 212 . In
`inert gas environments , under vacuum , or the like .
`Substrate process tool 108 may perform one or more
`the embodiment shown in FIG . 2 , four side clamps 226 may
`processes , such as , e . g . , physical vapor deposition ( PVD ) ,
`be provided on backplane 212 , two located on the left
`chemical vapor deposition ( CVD ) , etching , annealing , pre
`vertical side of backplane opening 213 ( as shown ) and two
`cleaning , metal or metal oxide removal , or the like , on one 40 side clamps 226 located on the opposite right vertical side
`or more substrates . Other processes may be carried out on
`( not shown ) . After a substrate carrier has been placed on and
`substrates therein . Substrate process tool 108 may include
`docked to docking tray 211 and moved into the clamping
`one or more load lock chambers , a transfer chamber , and one
`position by docking tray 211 , each side clamp 226 may be
`or more process chambers ( none shown ) . The one or more
`configured to engage and squeeze the substrate carrier
`load lock chambers may be coupled to factory interface 106 , 45 against backplane 212 .
`while the transfer chamber may be coupled to the one or
`Carrier door opener 214 may have one or more connectors
`more load lock chambers and to the one or more process
`227 configured to contact and attach to substrate carrier door
`chambers . The robot substrate handler of factory interface
`110 of substrate carrier 102 . Connectors 227 may be , e . g . ,
`106 may transfer substrates into and out of the one or more
`suction pad or cup type devices coupled to a vacuum pump
`load lock chambers . Substrate process tool 108 may include 50 of load port 204 to create sufficient suction to securely attach
`a transfer robot ( not shown ) at least partially housed within
`carrier door opener 214 to substrate carrier door 110 . Other
`the transfer chamber . The transfer robot may be configured
`suitable types of connector devices capable of attaching to
`to transfer substrates to and from the one or more load lock
`carrier door 110 may be used .
`chambers and the one or more process chambers . As in
`Carrier door opener 214 may also have a second purging
`factory interface 106 , substrate process tool 108 may be 55 inlet 209a and a second purging outlet 209b . In some
`maintained in an environmentally - controlled atmosphere
`embodiments , second purging inlet 209a and second purging
`( e . g . , in
`a positive - pressure non - reactive and / or inert gas
`outlet 2096 may each include an appropriately oriented
`environment , under vacuum or the like ) using equipment
`one - way valve . Second purging inlet 209a may be config
`( e . g . , gas supply lines , one or more gas supplies or sources ,
`ured to connect to purge apparatus 105 ( FIG . 1 ) via second
`vacuum pumps , valves , etc . ; not shown ) located within 60 inlet gas flow line 109a , and second purging outlet 209b may
`and / or coupled to electronic device manufa