Case 6:20-cv-00636-ADA Document 77-5 Filed 03/10/21 Page 1 of 27
`
`Waveguide-to-fiber coupling loss
`
`Waveguide propagation loss
`Planarizing gap fill
`
`Mux & tap coupling efficiency
`
`Mode size conversion
`demonstrated
`
`Note; the dielectric test data by STMicro was the basis for high k
`capacitor applications of rare earth doped amorphous coatings by the
`bias PDC proces
`
`Damp heat testing of the optical waveguide amplifier with the sam
`dense refractory oxides , showing geological resistance to moisture
`was the basis for the development of the widely allowed dielectric
`barrier film patents and applications.
`
`<Presentation Name>
`
`1/15/2021
`
`C OMPANY CONFIDENTIAL
`
`DEFTS-PA_000271 8
`
`

`

`Case 6:20-cv-00636-ADA Document 77-5 Filed 03/10/21 Page 2 of 27
`
`ide
`nt
`
`E0
`Barrier
`OLED encapsulat
`Barrier
`
`Plastic
`substrate
`Barrier
`
`44,0"'
`Dense
`Ope
`Uniform .(0'
`Cal Conformal le
`Defect Free
`Multi Layer
`Large Area
`Low Temperature
`Low Contamination
`Wide Compositional Range
`Deposition of,
`
`<Presentation Name>
`
`1/15/2021
`
`C OMPANY CONFIDENTIAL
`
`DEFTS-PA_000271 9
`
`

`

`Case 6:20-cv-00636-ADA Document 77-5 Filed 03/10/21 Page 3 of 27
`
`ncapsulating Moisture & Oxygen Barrier for:
`— Organic Light Emitting Diode (OLED) Displays
`Inorganic Electro-Luminescent (EL) Displays
`Photovoltaic (PV) Cells
`Optical storage media
`ear-Resistant Dielectric Barrier Coating for:
`— Touch (Fingerprint) Sensors
`Displays / touch sensitive and pen based display and electonics
`Other Bio-contact sensors
`Optical polymers and devices, eyeglasses, optics
`Contamination & Thermal Barrier for:
`— OLED Displays and electronics on glass and Plastic Substrate
`— Flexible Electronics on Plastic Substrates
`Protective Anti-Reflective Optical Coating for
`Display glass — out coupling for OLEDs
`Polymer sheet substrate stock
`CD-DVD-R disks
`VCSELs and III/IV devices and modules
`SAW devices
`
`4
`
`<Presentation Name>
`
`1/15/2021
`
`C OMPANY CONFIDENTIAL
`
`DEFTS-PA_0002720
`
`

`

`Case 6:20-cv-00636-ADA Document 77-5 Filed 03/10/21 Page 4 of 27
`
`Substrate: glass or silicon wafer
`Aluminum: 100A sputtered aluminum (porous)
`— Blanket or
`Shadow mask patterned
`Barrier: 1000A or 2000A "35-65" aluminosilicate
`35% silica & 65% alumina
`— Two process recipes "A" and "B"
`Process Temperature: at ambient
`Test Conditions
`— Symmorphix 85°C /,‘,95% RH
`Philips
`85°C /50% RH
`Battelle
`60°C /90% RH
`Testing in both boiling water and in a pressure cooker (suggested by
`Dr. Kam Law, CEO of AKT) showed the latter to be much more effectiv
`in corrosion developments of barrier defects.
`
`<Presentation Name>
`
`1/15/2021
`
`C OMPANY CONFIDENTIAL
`
`DEFTS-PA_0002721
`
`

`

`Case 6:20-cv-00636-ADA Document 77-5 Filed 03/10/21 Page 5 of 27
`
`Barrier tests conducted on Al coated Si wafers covered with 1
`nm Alumino-Silicate show no degradation of Al after 500 hrs.
`under 85/95 condition, Q3 2002
`
`For comparison:
`Poor barrier
`after 232 hours
`
`h i t lour
`
`,11 1 , or, wafer
`o J.:Wed alummum (porous)
`o-nor /LIMA .fluninoSilirate
`a ambient
`1[[,, Tem lor.11
`— 10041n11H
`
`For comparison:
`Poor barrier
`after 157 hours
`
`i
`
`Al.
`tered alumhum (porous)
`ninosilicate
`15,1rrlor I 000,,
`Prorr,, orT,I,ItLIT • ot,nbient
`• —1010414.1-1
`m t
`Corclit000,
`
`<Presentation Name>
`
`1/15/2021
`
`C OMPANY CONFIDENTIAL
`
`DEFTS-PA_0002722
`
`

`

`Case 6:20-cv-00636-ADA Document 77-5 Filed 03/10/21 Page 6 of 27
`
`<Presentation Name>
`
`1/15/2021
`
`C OMPANY CONFIDENTIAL
`
`DEFTS-PA_0002723
`
`

`

`Case 6:20-cv-00636-ADA Document 77-5 Filed 03/10/21 Page 7 of 27
`
`Blank Si WV-
`P-1-112 Spectrum
`
`After 6 hours of 250 C
`superheated steam
`
`T hermal Oxide
`PTIM Spectrum
`
`1-1-ierrnal Oxide Pressure Cooked
`PTIP Spectrum
`
`AM Process Annealed
`P-1-11, Spectrum
`
`AZ Process Annealed Pressure
`cooked PTIR Spectrum
`
`Water undetectable in Symmorphix 'Arizona ' PVD film
`
`AZ Process Unannealed
`
`FTIR Spectrum
`
`AZ Process Unannealed Pressure
`
`Cooked FTIR Spectrum
`
`<Presentation Name>
`
`1/15/2021
`
`C OMPANY CONFIDENTIAL
`
`DEFTS-PA_0002724
`
`

`

`Case 6:20-cv-00636-ADA Document 77-5 Filed 03/10/21 Page 8 of 27
`
`Goal is to provide higher electrical
`performance and greater environmental
`protection simultaneously
`Deposited barrier and etched bond pad
`openings using existing process technology
`Devices tested by customer and exceeded
`their control device performance
`Impervious to all organic solvents, acetone,
`MEK, halogenated toluene, Carbon
`tetrachloride...oxidizing acids.
`
`<Presentation Name>
`
`1/15/2021
`
`C OMPANY CONFIDENTIAL
`
`DEFTS-PA_0002725
`
`

`

`Case 6:20-cv-00636-ADA Document 77-5 Filed 03/10/21 Page 9 of 27
`
`«11,400100...
`
`40.14**10F
`
`TOUCH AND GO:
`swapping
`PINs for
`fingerprints
`
`• .
`
`ARtinmativiAramdakaii;:.
`
`<Presentation Name>
`
`1/15/2021
`
`C OMPANY CONFIDENTIAL
`
`DEFTS-PA_0002726
`
`

`

`Case 6:20-cv-00636-ADA Document 77-5 Filed 03/10/21 Page 10 of 27
`
`Weight
`Wide viewing angle
`Color quality
`Impediments to near term market growth on glass substrates;
`"Biggest technical challenge is lifetime" (Km All
`nalyst, SR, Optics.org article 3/25/02)
`
`Etettran
`Trxisp.ort
`Laj, ;:EM
`
`Lifetim
`determined by moisture/oxygen reacting with
`organic layer and metal cathode (e.g., MgAg or
`Li) 4 Requires barrier coating
`
`Outcoupling
`determined by current/voltage conditions
`For brightness 4 Requires optical out
`coupling coating and active
`addressing
`
`<Presentation Name>
`
`1/15/2021
`
`C OMPANY CONFIDENTIAL
`
`DEFTS-PA_0002727
`
`

`

`Case 6:20-cv-00636-ADA Document 77-5 Filed 03/10/21 Page 11 of 27
`
`Low temperature processing
`Substrates and materials
`150 °C maximum temperature limit
`ubstrate versatility
`Glass — display
`Plastic — electronics, display
`Foils — display
`No standard substrate size or format
`arrier and Encapsulation Applications
`Good Barrier to contaminates, moisture and oxygen
`• Protection from substrate: organics and conduction paths
`• Protection from atmosphere: water & oxygen
`Low film stress
`Good adhesion of the films
`
`Mptimm,'
`
`DEFTS-PA_0002728
`
`

`

`Case 6:20-cv-00636-ADA Document 77-5 Filed 03/10/21 Page 12 of 27
`
`Active cooling system using electrostatic clamping
`Substrate surface temperatures of < 50°C have been achieved for
`high power deposition processes on plastic films
`Productivity Enhancement
`Process time reduction
`• Low duty cycle 250 nm film in 120 minutes w/o ESC, max temp > 50 °C
`• High duty cycle 250 nm film in 12 minutes with ESC, max temp < 50 °
`Lower Cost-of-Ownershi
`Higher Throughput of the deposition system
`Higher yield due to lower temperature processing.
`
`1
`
`DEFTS-PA_0002729
`
`

`

`Case 6:20-cv-00636-ADA Document 77-5 Filed 03/10/21 Page 13 of 27
`
`Dr. Hongmei Zhang and team (right) circa 2004
`Prototype Electro-Static Chuck for plastic substrates
`Performed extended time deposition test
`— Barrier process parameters, <50 °C maximum temperature
`
`DEFTS-PA_0002730
`
`

`

`Case 6:20-cv-00636-ADA Document 77-5 Filed 03/10/21 Page 14 of 27
`
`lobai OLED market is expected to be
`worth US $3051.2 million by 2015. The
`global market is expected to record a
`CAGR of 27.8% from 2010 to 2015
`(www.marketsandmarkets.com
`
`A=.'",,4=sizisais=atekin=
`
`IMVIZAINUMNIIIMMINIMIIMINIOWNINISINC=1•131•001
`
`.M7SMM=MO
`
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`
`,190MNIMMINIMMIIMIIIMaNN
`WIMUILZMUZ0113ISIKMBIE
`1
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`.111a1UP07.SELDNIWZOMI
`422=11111•11•11
`MOLMIUMMIHINELVONI
`02I2MCZMINNINIIIIMIIMIN
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`
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`113:1
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`IMI
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`ZSMXZMWEMMIZSZIMIIMINSIMilaNIMUNWZMIWZAIII
`L=MMINIMMUMMIK=IMININSINWENUIEEII3INVAI
`IMIWZDI
`WIMINIIIMMIU=11.111NINIMMININZNIUMHIMMHI.
`tEMMMIIIIMMN11~2MFSJIMMINOWA
`IMMJ, NUM=
`IfS
`
`WMISNIMININININIMEMMIMMEIAMIZNIUZAMPJNIM4S1,
`MI2M`
`Ota2MINIMINZAAIMIW.0 10MIWAIIIIIF=INI
`traMMONNINNIMIMMIINIMMIIMAIIIIMWE=INEINIMMENMIKIIMIMUM
`
`MEMEAMMIIMII
`MIIIIMONAU
`MBP121•06MMI
`.1.1
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`MM.V4aMMMum.:MMI
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`fa.Z*WWWWMTMVMMNIUMIIWINIM.300.,..IMUNIII&MIIIUMWM
`IMMININIIIMMI/
`ONIMIREMOMMIIILKMUMMOOMMU211S
`MILIT
`N/SMIMINOMM
`IEMMINIKINEWZMI
`PMFMNIMINIUMMINIIMIEMEPI
`MEMINECHIMEIIMIUNUO
`MCMINIMMIUMNIMMINMMINOMMISIN6911[...M.111
`,M1
`
`INNIEMEIIMMMN
`attaIMMNIMINNI
`MinliMMIMMOMNIHIMMIRSONIZINUMMIIMMISIESNIMMIMS3*
`tuu
`soniewilumwrswgraminammirim
`dMINNIMMIIMME=MAIEZNINIZNIKSIMMIEMMO
`.3.1MININIMMIliil
`lIZENEmLlenC.ON.20SMIMPAIMOSIEMI
`
`IINC.
`WMINOINIMINIMMIQWMINIANIMEMISV
`MIIIMlrEMMONIMMIMMINIIMIUOUNEMMINIMINNIEL
`MMIMPRZWMNIMMe74011MONIIIIMINULMEIIMM110/621•MMINIMINVIai
`Va. IINIMININIONEMMIPONVSNOLZUNIIIMINEIMMSNIUMPOitC•
`GIMMINONIMMIIImocrumwmi.,uosst.manwmartim
`, IMBNIIMMMIMMOMMNIMINNIWANN.AUN..11.
`
`1
`
`<Presentation Name>
`
`1/15/2021
`
`C OMPANY CONFIDENTIAL
`
`DEFTS-PA_0002731
`
`

`

`Case 6:20-cv-00636-ADA Document 77-5 Filed 03/10/21 Page 15 of 27
`
`Coated at < 75°C (suitable for plastic substrates)
`— Other coatings done at 29°C
`Coatings typical thickness of 500-2000A aluminosilicate
`— Amorphous thin film is flexible, scratch resistant and transparent
`eposited over wide area under production COO
`On panels or sheets up to 600x720mm sheets
`Typical cost estimated at — 20$/M2 direct plus indirect cost
`Continuous operation showed NO ingress through barrier o
`top or ingress from edge, 2000 hr. damp heat
`cq.. •ther films can be deposited using the Symmorphix system
`Lower temp. flexible barrier for plastic substrates
`Transparent TCO eg. Al-ZnOxide, ITO, Cd Stannate etc.
`Low-hydrogen amorphous si or ge (crystallization into polycrystalline TFTs)
`Electronic quality, low to high k gate electrode dielectric films
`Interconnect metals (e.g., A, Mo, ITO, etc.)
`
`<Presentation Name>
`
`1/15/2021
`
`C OMPANY CONFIDENTIAL
`
`DEFTS-PA_0002732
`
`

`

`Case 6:20-cv-00636-ADA Document 77-5 Filed 03/10/21 Page 16 of 27
`
`bstrate 2
`
`ITO E ectro e Stec
`A
`
`.e/
`
`OLED
`
`'-
`
`t /
`7
`
`ii
`
`-
`
`S-'S Su ra e
`,
`
`<Presentation Name>
`
`1/15/2021
`
`C OMPANY CONFIDENTIAL
`
`DEFTS-PA_0002733
`
`

`

`Case 6:20-cv-00636-ADA Document 77-5 Filed 03/10/21 Page 17 of 27
`
`Glovebox attached to the GEN3 Cluster
`tool
`Evap inside Glove Box
`
`<Presentation Name>
`
`1/15/2021
`
`C OMPANY CONFIDENTIAL
`
`DEFTS-PA_0002734
`
`

`

`Case 6:20-cv-00636-ADA Document 77-5 Filed 03/10/21 Page 18 of 27
`
`,
`e.iftwoo4raf.....e#.i,rea.;;Awmiugo
`
`<Presentation Name>
`
`1/15/2021
`
`C OMPANY CONFIDENTIAL
`
`DEFTS-PA_0002735
`
`

`

`Case 6:20-cv-00636-ADA Document 77-5 Filed 03/10/21 Page 19 of 27
`
`Plate6.9 -Device1
`
`Plate6.9 - Device2
`
`1 00E-0'
`2731
`1 -9 75 -67 -575 -4 55 -
`1 00E-01 1-00- 600
`
`500
`
`• Gusset-post
`
`• Re6erse I V-post
`
`1 00E 02 ( 500
`
`Current-Foe
`
`1 00E 03 p
`
` 0oo
`
`Re6erse IV-pre
`
`• Cu.nt-p05t2
`
`• Re6erse I V-post2
`(1554055)
`
`5 Luminance-post
`
`Luminance-post?
`
`.
`1 00E 00
`
`7"
`'4-8 -7 5 4 -3 -2:1 : 224 .
`coo
`
`1 00E-01
`
`• Current-post
`
`• 12500555 I V-post
`
`1 00E-02
`
`1 00E-03
`
`1X
`E
`
`
`
`1 00E 04 . .4
`
`1 00E-05 ,—
`
`- c-E4
`
`coo a
`
`'E
`ioo 1
`
`Cunont-pre
`
`Rmerse IC-pre
`
`300 :
`
`E
`
`2oo -.
`
`▪ Cunont-p05t2
`
`• Rmerse I V-post2
`(1554055)
`
`—9-Luminance-post
`
`— Luminance-post2
`
`1 00E 05 I—
`
`--40
`
`Ice
`
`1 00E-07
`
`Voltage (V)
`
`Plate6.9 - Device3
`
`P121e6.9 -Device4
`
`1 00E
`
`.1-1 -9
`1 00E-01 I
`
`1 00E 02
`
`(11 1 00E-03
`
`e 1 00E-04
`
`1 00E-05
`
`100
`
`0 600
`
`• Current-post
`
`▪ Rmerse I V-post
`
`500 a
`
`Current-pre
`
`, 400 ill.,
`
`Rmerse I V-pre
`
`300
`
`E
`( 200 3
`
`• Current-post2
`
`• Rmerse I V-poste
`(1654hrs)
`
`5 Luminance-post
`
`— Luminance-p.(2
`
`1 00E+00
`
`1 00E-0
`
`-1 -1 -9 -8
`
`1 00E-02
`
`• V ••
`
`,1•
`
`1 00E-03
`
`1 00E-04
`
`1 00E-05
`
`1 00E-06
`
`Voltage (V)
`
`100
`
`• Gwent-post
`
`Rmerse I V-post
`
`Gwent-pre
`
`Rmerse I V-pre
`
`Gurrent-post2
`
`• Rmerse I V-po5t2
`(1654hrs)
`
`Luminance-post
`
`—Luminance-post2
`
`1 00E36 • • 100
`
`1 00E-07
`
`Volta ge (V)
`
`Minimize I-V Shift due to Barrier Deposition
`
`<Presentation Name>
`
`1/15/2021
`
`C OMPANY CONFIDENTIAL
`
`DEFTS-PA_0002736
`
`

`

`Case 6:20-cv-00636-ADA Document 77-5 Filed 03/10/21 Page 20 of 27
`
`Percent change in Luminance
`[Plate-ID_7.4]
`
`Percent change in Luminance
`[Plate-ID_7.1]
`
`hange
`-•-nee-pos•
`• ne-pog• •:hange
`
`100
`
`Percent change In Lumina.*
`[Plate-1 DJ .3]
`
`eady for Accelerated Testing at Dup
`
`Thin-film encapsulated OLEDs lighting up wit
`minimal luminance change after 1654 hours i
`dam heat
`
`<Presentation Name>
`
`1/15/2021
`
`C OMPANY CONFIDENTIAL
`
`DEFTS-PA_0002737
`
`

`

`Case 6:20-cv-00636-ADA Document 77-5 Filed 03/10/21 Page 21 of 27
`
`7migticlIV
`
`a Test Results After 569 hours in 50 °C / 95% RH
`
`Substrate cleaning reduces pinholes from external causes
`
`DEFTS-PA_0002738
`
`

`

`Case 6:20-cv-00636-ADA Document 77-5 Filed 03/10/21 Page 22 of 27
`
`• Glass
`111 PEN Process1
`• PEN Process2
`— Linear (PEN Process1)
`— Linear (PEN Process2)
`— Linear (Glass)
`
`DEFTS-PA_0002739
`
`

`

`Case 6:20-cv-00636-ADA Document 77-5 Filed 03/10/21 Page 23 of 27
`
`Pi
`• - ikon-cm. —
`
`<Presentation Name>
`
`1/15/2021
`
`C OMPANY CONFIDENTIAL
`
`DEFTS-PA_0002740
`
`

`

`Case 6:20-cv-00636-ADA Document 77-5 Filed 03/10/21 Page 24 of 27
`
`Photographs of substrates w/ the Aluminum layer
`
`<Presentation Name>
`
`1/15/2021
`
`C OMPANY CONFIDENTIAL
`
`DEFTS-PA_0002741
`
`

`

`Case 6:20-cv-00636-ADA Document 77-5 Filed 03/10/21 Page 25 of 27
`
`Cross-section SEM with 2,500A AIOSi film
`(on substrate with the Al layer)
`
`S4700 16.0kV 6.9m
`
`001,
`
`05 12.66
`
`S4700 15.CAN 6.1mm x15.0k SE(M) 4/29/06 11:21
`
`Conformal
`barrier
`coverage
`underside of
`the separator
`
`<Presentation Name>
`
`1/15/2021
`
`C OMPANY CONFIDENTIAL
`
`DEFTS-PA_0002742
`
`

`

`Case 6:20-cv-00636-ADA Document 77-5 Filed 03/10/21 Page 26 of 27
`
`Barrier Film Slow Tapering Capability
`
`Great mushroom under coverage
`Single layer solution possible
`
`<Presentation Name>
`
`1/15/2021
`
`C OMPANY CONFIDENTIAL
`
`DEFTS-PA_0002743
`
`

`

`Case 6:20-cv-00636-ADA Document 77-5 Filed 03/10/21 Page 27 of 27
`
`Note the conformal
`barrier coverage
`underside and
`corner
`
`Cross-section SEM with 2,500A AIOSi film
`
`DEFTS-PA_0002744
`
`