`
`
`
`
`Exhibit A
`
`
`
`
`
`
`
`
`
`
`
`
`Case 6:20-cv-00636-ADA Document 48-2 Filed 02/16/21 Page 2 of 9
`Curriculum Vitae
`
`
`Alexander D. Glew, Ph.D., P.E.
`
`
`
`Employment History
`
`
`
`
`
`From: 1997
`To:
`Present
`
`Position:
`
`
`
`Glew Engineering Consulting, Inc.
`Mountain View, California
`President
`Clients include companies from semiconductor equipment,
`plasma generation, vacuum systems, fluid delivery systems, flow
`and pressure component suppliers, laser manufacturers,
`consumer electronics, industrial electronics, vehicle,
`telecommunications, and others. Consulting work includes thin
`film characterization, process development, project turn-
`around/rescue, gas flow and vacuum metrology, design of
`experiments, corrosive gas applications, finite element analysis
`and related market analysis.
`
`From: Aug 1987
`To:
`Jan 1997
`
`Titles
`
`Project Mgr.
`
`Jan 1996 to
`Jan 1997
`
`
`
`
`
`
`
`
`
`
`
`CVD
`Supplier
`Quality
`Engineering
`Manager
`
`Applied Materials, Inc.
`Santa Clara, California
`Engineering Manager, Core-Technologist
`• Sat on corporate engineering/technology (ET) council,
`one of 15 council members. Responsible for corporate direction
`in gas delivery technology for all divisions, including CVD, EPI,
`PVD, RTP, etch, thermal and others. Also, qualified gas and
`vacuum component selections. Consulted with all divisions on
`gas and vacuum systems, liquid source delivery systems,
`components, and supplier selections.
`• Received patent for improved tungsten (W) CVD
`deposition.
`• Successfully proposed and executed a project that
`SEMATECH S100 funded. The goal was to develop industry
`methods to determine the effects of trace chemicals on
`semiconductor processing and equipment reliability. This
`resulted in two SEMATECH Technology Transfers listed below.
`First, ppb levels of impurities were introduced into both a
`Tungsten CVD deposition process and an aluminum etching
`process. The effect on particle generation, deposition rate,
`uniformity, selectivity and incorporation into the film were
`examined. This work resulted in a 30% increase in deposition
`
`Alexander D. Glew Ph.D., P.E.
`
`
`
`
`
`Page 1
`
`
`
`
`
`Core
`Technologist
`
`
`
`CVD
`Engineering
`Manager
`
`
`
`
`
`
`
`
`
`
`Systems
`Engineer
`
`
`Case 6:20-cv-00636-ADA Document 48-2 Filed 02/16/21 Page 3 of 9
`Curriculum Vitae
`
`rate. Similarly, ppb-ppm levels of impurities were introduced
`into HBr gas systems and accelerated lifetime tests were
`conducted at three sites across the country. Measured by
`quadrapole mass spectrometry gas composition in situ of
`Tungsten CVD and Al Etch process.
`• Responsible for gas, vacuum and chemical components
`evaluation, testing and supplier quality management. Managed
`an engineering group that tested and recommended gas, vacuum
`and chemical components for the CVD division, and developed
`process controls at suppliers. Supervised laboratory and trained
`individuals to develop specialized testing capabilities to
`characterize gas delivery and vacuum components. Also
`supported Etch, PVD and other divisions with common suppliers
`including vacuum pumps, vacuum transducers, flow controllers,
`valves and similar.
`• Managed group of engineers and support personnel who
`developed gas panels and liquid source delivery systems for
`dielectric deposition. Delivered TEOS, TMP, TMB and many
`other organometallic precursors for SG, BPSG dielectric
`deposition. Developed organometallic CVD systems extensively.
`Designed multiple liquid source delivery systems for
`organometallic chemical precursors, i.e. bubblers, boilers,
`injectors.
`• Managed CVD division design support group: CAD
`designers, drafters and CAD systems for division. Brought in
`first 3D CAD systems. Brought in first FEA program.
`• Established and managed the customer engineering
`special group for the CVD division, which engineered all
`equipment modifications to meet customer specifications. These
`modifications included changes across the entire system,
`including process chambers, vacuum systems, gas delivery,
`power distribution, safety and robotics.
`• Worked on the development and release of the landmark
`product, Precision 5000 CVD, one of which is now in the
`Smithsonian Institute. This was the first cluster tool for
`semiconductor manufacturing.
`• Developed dielectric layers of silicon dioxide (glass or
`USG), boron phosphorous silicon glass (BPSG), phosphorous
`silicon glass (PSG), nitride, oxy-nitride, and others.
`• Responsible for flow and vacuum equipment suppliers
`for company including MFC, valves, mechanical vacuum pumps,
`cryo-pumps, dry pumps, and others. Supported multiple
`divisions on these matters.
`
`Alexander D. Glew Ph.D., P.E.
`
`
`
`
`
`Page 2
`
`
`
`Case 6:20-cv-00636-ADA Document 48-2 Filed 02/16/21 Page 4 of 9
`Curriculum Vitae
`
`
`Doctoral Dissertation:
`
`From:
`To:
`
`
`
`1996
`2002
`
`
`
`Consulting History
`
`From:
`To
`
`2020
`Ongoing
`
`
`
`Stanford University
`Stanford, California
`Ph.D.
`Completed a dissertation in the department of Materials Science &
`Engineering leading to the Ph.D. degree.
`Research includes:
`• Plasma Deposition of Diamond-Like Carbon and
`Fluorinated Amorphous Carbon and the Resultant Properties and
`Structure
`• Characterized stress, strain and hardness of films. Related
`the stress energy state to the diamond like nature of the thin films.
`Investigation of deposition mechanism fluorinated
`•
`amorphous carbon (FLAC) and diamond-like carbon (DLC), low k
`dielectric materials.
`• Modeled and conducted experiments on mechanism of ion
`energy, momentum and flux dependence for FLAC and DLC film
`synthesis in radio-frequency plasma discharges, including
`competing mechanisms of sub-plantation, ion-peening, sputtering,
`and etching.
`• Constructed and instrumented a multi-purpose processing
`chamber for CVD, etch, and sputtering with measurement
`capability.
`• Fabricated MIS capacitors to investigate the dielectric
`properties of fluorinated amorphous carbon (FLAC). Performed all
`wafer processing to construct MIS capacitors, including
`lithography, etch, CVD and PVD.
`• Conducted thin film analysis including UV absorption
`spectroscopy, spectral ellipsometry, multi incident angle
`ellipsometry, Fourier transform infrared spectroscopy, profilometry,
`nano-indentation, and gravimetric measurements.
`• Modeled dielectric properties and dispersion relationship of
`fluorinated amorphous carbon (FLAC), and compared spectral
`ellipsometric measurements to results of electrical CV tests and
`thickness measurements by profilometry using MIS structures.
`
`Sydney Metro, Australia
`Analysis of the equipment, replacement, and cost of moving a
`semiconductor FAB in order to put a metro rail line through the
`area.
`
`From:
`To:
`
`2019
`2020
`
`TDA Research Institute
`Analysis of high temperature reactor.
`
`Alexander D. Glew Ph.D., P.E.
`
`
`
`
`
`Page 3
`
`
`
`Case 6:20-cv-00636-ADA Document 48-2 Filed 02/16/21 Page 5 of 9
`Curriculum Vitae
`
`
`From:
`To:
`
`From:
`To:
`
`2019
`2019
`
`2019
`2019
`
`LED Manufacturer
`Thermal analysis of new LED designs.
`
`Elwood Mill Products
`Professional Engineering review of capital equipment. Finite
`element analysis.
`
`
`
`
`
`
`
`
`
`From: April 2017
`To:
`May 2017
`
`From: Sept. 2017 UNICO
`To:
`Jan 2018
`Finite element analysis of new product concepts.
`
`
`
`From: July 2017
`Elwood National Forge
`To:
`Dec 2017
`Professional Engineering review of capital equipment. Finite
`element analysis.
`
`Jon Richards Co. (for Disneyland)
`Professional Engineering review of electric vehicle used as float at
`Disneyland.
`
`
`
`From: 2017-2019 Licensed Mechanical Engineering
`To:
`Ongoing
`Professional Engineering letters and calculations for submission to
`building and environmental health departments. Miscellaneous
`clients.
`
`Sola;t
`Reverse engineering of OLED display technology.
`
`VWR
`Review of new semiconductor technologies for etching and
`particle reduction in semiconductor processing chambers.
`
`TDA Research
`Finite element analysis of effluent treatment system for power
`plant carbon reduction treatments.
`
`
`
`
`From: 2016
`To:
`Ongoing
`
`
`From: 2016
`To:
`2017
`
`From: 2016
`To:
`2017
`
`
`
`
`
`From: 2016
`To:
`Ongoing
`
`
`
`From: 2016
`
`Champion Telecom
`Engineering support, Finite element analysis, and design of “Cell
`Towers on Wheels” (COWs). Multiple projects. Analysis of
`trucks used to support emergency telecommunications.
`
`CarbonTech
`
`Alexander D. Glew Ph.D., P.E.
`
`
`
`
`
`Page 4
`
`
`
`To:
`
`Ongoing
`
`Case 6:20-cv-00636-ADA Document 48-2 Filed 02/16/21 Page 6 of 9
`Curriculum Vitae
`
`Pursue UL listing for thin film carbon heaters. Help productize the
`technology. Review codes for domestic use.
`
`Phiston Engineering
`Review ability of equipment to destroy flash memory. Generate
`report to submit to NSA.
`
`United States Air Force
`Concluded
`Advanced semiconductor process equipment engineering for Air
`Force Laboratory.
`
`VADA
`
`Fluid analysis of venting device.
`
`
`
`From: 2015
`To:
`2016
`
`
`
`From: 2015
`To:
`2015
`
`Duties
`
`
`
`From: 2015
`To:
`2016
`
`Duties
`
`Testimony
`
`Client
`
`Case
`Project
`Dates
`Status
`
`Client
`
`Continental Circuits (Caldell Cassidy and Curry) vs. Intel Corporation; Ibiden
`U.S.A. Corporation; and Ibiden Co. Ltd.
`
`No. CV16-2026 PHX DGC
`
`
`
`
`Electronics substrate (PCB) technology
`
` 2018 – 2020
`
`
`
`
`
`Submitted reports and testified at deposition. Settled.
`
`
`
`
`
`
`
`
`RENEE PLUNKETT, AN INDIVIDUAL )AND HEIR OF ESTATE OF
`SCOTT )6 PLUNKETT, GLOREE PLUNKETT, A )MINOR BY AND
`
`
`
`
`
`THROUGH HER )7 GUARDIAN AD LITEM, TERRY ALLEN
`
`
`
`
`
`)ROBERTSON (Michael Hirman Law) vs. LEATT CORP., A FOREIGN )11
`CORPORATION; TIFFANY NELLIS; AND ) DOES 2-100
`
`
`
`
`
`
`
`Case:
`Project
`Status
`
`19-cv-0629-H-AGS
`
`
`
`
`FEA analysis of safety device
`
`Submitted expert report.
`
`
`
`
`
`
`
`
`Moldanado et al v Apple Inc. (Morrison and Forrester)
`Case No. 3:16-cv-04067-WHO
`iPhone and iPad Class Action Law Suit
`2019-
`Submitted declaration and testified at deposition.
`
`Client
`Case
`Project
`Dates
`Status
`I
`
`Client
`
`Hanwa v REC et al (Finnegan).
`
`Alexander D. Glew Ph.D., P.E.
`
`
`
`
`
`Page 5
`
`
`
`Case 6:20-cv-00636-ADA Document 48-2 Filed 02/16/21 Page 7 of 9
`Curriculum Vitae
`
`
`Case
`Project
`Dates
`Status
`
`
`Client
`Case
`Project
`Dates
`Status
`
`Client
`Case
`
`Project
`Dates
`Status
`
`Client
`Case
`Project
`Dates
`Status
`
`Client
`Case
`
`Project
`Dates
`Status
`
`Client
`
`Case
`
`
`
`
`
`
`
`
`
`
`
`ITC 337-TA-1151
`Solar Panel Technology
`2019-
`Submitted declaration and testified at deposition.
`
`
`Micron vs. Northstar/WiLAN (Eckert Seamons)
`IPR2018-01000, U.S. Patent No. 6,465,743
`Semiconductor packaging and ball grid arrays
`2019
`Submitted declaration and testified at deposition. Settled.
`
`ASM (KMOB) vs. Kokusai Electric Corporation
`IPRs multiple: IPR2018-01584, IPR2018-01523, IPR2018-01479,
`IPR2018-01151, IPR2018-01357.
`Semiconductor processing equipment
`2018 -2019 Settle3
`Submitted declaration and testified at depositions. Settled.
`
`Veeco (Ropes and Gray)
`Veeco (Ropes and Gray) vs. SGL Carbon Group , QVl 7-2 217
`Semiconductor Processing Equipment
`2017
`Completed. Preliminary injunction granted for client and settlement reached.
`
`IP Bridge (Ropes and Gray)
`BROADCOM LIMITED, BROADCOM CORPORATION, AVAGO
`TECHNOLOGIES, LTD., AVAGO TECHNOLOGIES U.S., INC., and LSI
`CORPORATION, Case No. 2:16-cv-134, Eastern District of Texas, and
`IPR2016-1376, 1377 and 1379.
`
`Interconnect and back end of line patents.
`Spring 2015 – Spring 2017
`Submitted expert reports and testified at deposition. Settled.
`
`Elm 3DS Innovations (Mintz, Levin, Cohn, Ferris, Glovsky and
`Popeo PC)
`Elm vs. Samsung Electronics, Hynix and Micron
`Inter Partes Review (IPR) at the USPTO: IPR2016-00386,
`IPR2016-00387, IPR2016-00388, IPR2016-00389, IPR2016-
`00390, IPR2016-00391, IPR2016-00392, IPR2016-00393,
`
`Alexander D. Glew Ph.D., P.E.
`
`
`
`
`
`Page 6
`
`
`
`Case 6:20-cv-00636-ADA Document 48-2 Filed 02/16/21 Page 8 of 9
`Curriculum Vitae
`
`IPR2016-00394, IPR2016-00395, IPR2016-00687, IPR2016-
`00691, IPR2016-00708, IPR2016-00770, and IPR2016-00786.
`I performed a patent infringement analysis involving thinned and
`stacked wafers, low-stress dielectric materials, and other topics of
`IC memory.
`2016 - 2017
`Submitted declarations in IPR and gave testimony at deposition.
`
`Project
`
`Dates
`Status
`
`
`
`
`Education
`
`Stanford University
`2003
`Stanford University
`1995
`1987 University of California, Berkeley
`1985 University of California, Berkeley
`
`Ph.D., Materials Science and Engineering
`M.S., Materials Science and Engineering
`M.S., Mechanical Engineering
`B.S., Mechanical Engineering
`
`Publications and Conference Presentations (selected).
`
`A.D. Glew, M.A. Cappelli, "Characterization and dielectric properties of fluorinated
`amorphous carbon measured by capacitance-voltage versus spectral ellipsometry",
`Materials Research Society Symposium Proceedings, 593, Boston, MA, 1999, pp. 341-
`346.
`
`A.D. Glew, M.A. Cappelli, "In situ plasma analysis, fluorine incorporation,
`thermostability, stress, and hardness comparison of fluorinated amorphous carbon and
`hydrogenated amorphous carbon thin films deposited on Si by plasma enhanced chemical
`vapor deposition", Material Research Society Symposium Proc., 565, San Francisco, CA
`1999, pp 285-290.
`
`A.D. Glew, R. Saha, M.A. Cappelli and J.S. Kim, "Ion Energy and Flux Dependence of
`Diamond Like Carbon Film Synthesis in Radio-Frequency Discharges", International
`Conference on Metal Coatings and Thin Films, Surface and Coatings Technology 114
`(1999) 224-229.
`
`A. Glew, R. Saha, M. Cappelli and J. Kim, “Ion Energy and Flux Dependence of
`Diamond Like Carbon Film Synthesis in Radio-Frequency Discharges”, International
`Conference on Metal Coatings and Thin Films, San Diego, CA, April 1998
`
`A. Glew, J, Ammenheuser, M. Crockett, A. Johnson, W. Dax, R. Binder, J. Riddle,
`“SEMASPEC 97043272A Accelerated Life Tests of Gas System Performance and
`Reliability,” http://www.sematech.org/public/docubase/abstract/3272atr.htm.
`
`A. Glew, J. Ammenheuser, J. Riddle, A. Johnson, “SEMASPEC 96083175A-XFR
`Determining the Effects of Impurities on Semiconductor Thin Film Processing,”
`http://www.sematech.org/public/docubase/abstract/3175axfr.htm.
`
`
`Alexander D. Glew Ph.D., P.E.
`
`
`
`
`
`Page 7
`
`
`
`Case 6:20-cv-00636-ADA Document 48-2 Filed 02/16/21 Page 9 of 9
`Curriculum Vitae
`
`A Glew, “Selecting Gas Purity and Materials of Construction in High Purity Gas
`Systems,” Semicon West Symposium on Corrosion, July 1997
`
`Glew, J. Kim, K. Lee, M. Cappelli, “On the Characteristics of Diamond Like Carbon”,
`A. International Conference on Metal Coatings and Thin Films, San Diego, CA,
`April 1997
`
`
`A. Glew, D. Porter, “Gas System Reliability Testing in Chlorine”, Semiconductor
`Fabtech, May 1996.
`
`Professional Associations
`
`American Society of Mechanical Engineers (ASME)
`International Microelectronics and Packaging Society (IMAP)
`Materials Research Society (MRS)
`IEEE
`
`Professional License
`
`Licensed Mechanical Engineer, State of California, M26690
`
`
`Alexander D. Glew Ph.D., P.E.
`
`
`
`
`
`Page 8
`
`