Case 5:19-cv-00036-RWS Document 66-45 Filed 08/27/19 Page 1 of 13 PageID #: 3536
`Case 5:19-cv-00036—RWS Document 66-45 Filed 08/27/19 Page 1 of 13 PageID #: 3536
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`EXHIBIT 44
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`EXHIBIT 44
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`Case 5:19-cv-00036—RWS Document 66-45 Filed 08/27/19 Page 1 of 13 PageID #: 3536
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`EXHIBIT 44
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`EXHIBIT 44
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`Case 5:19-cv-00036-RWS Document 66-45 Filed 08/27/19 Page 2 of 13 PageID #: 3537
`8/22/2019
`As new iPhones go on sale, studies reveal chips from Intel and Toshiba - Reuters
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`BUSINESS NEWS
`SEPTEMBER 21, 2018 / 9:22 AM / A YEAR AGO
`
`As new iPhones go on sale, studies reveal chips from Intel and
`Toshiba
`
`Stephen Nellis
`
`SAN FRANCISCO (Reuters) - Apple Inc’s (AAPL.O) latest iPhones hit stores around the
`world on Friday, featuring components made by Intel Corp (INTC.O) and Toshiba (6502.T)
`among others, according to two firms that cracked open the iPhone Xs and Xs Max models.
`
`https://www.reuters.com/article/us-apple-iphones-teardown/as-new-iphones-go-on-sale-studies-reveal-chips-from-intel-and-toshiba-idUSKCN1M11NS
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`1/12
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`Case 5:19-cv-00036-RWS Document 66-45 Filed 08/27/19 Page 3 of 13 PageID #: 3538
`8/22/2019
`As new iPhones go on sale, studies reveal chips from Intel and Toshiba - Reuters
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`Boxes of iPhones purchased by customers are pictured next to an iPhone XS on display at the Apple Store in Singapore
`September 21, 2018. REUTERS/Edgar Su
`
`The studies by repair firm iFixit
`www.ifixit.com/Teardown/iPhone+XS++and+XS+Max+Teardown/113021 and chip analysis firm
`TechInsights here, published this week, are among the first detailed teardowns of the phones,
`which reviews suggested were a subtle upgrade from the tenth anniversary iPhone X.
`
`Supplying parts for Apple’s iPhones is considered a coup for chipmakers and other
`manufacturers. While Apple publishes a broad list of suppliers each year, it does not disclose
`which companies make which components and insists its suppliers keep quiet.
`
`That makes teardowns the only way of establishing the breakdown of parts in the phones,
`although analysts also recommend caution in drawing conclusions because Apple sometimes
`uses more than one supplier for a part. What is found in one iPhone may not be found in
`others.
`
`Apple could not immediately be reached for comment.
`
`The breakdowns listed no parts from Samsung (005930.KS) and no chips from Qualcomm Inc
`(QCOM.O).
`
`Samsung in the past has supplied memory chips for Apple’s iPhones and was believed by
`analysts to be the sole supplier of the costly displays for last year’s iPhone X.
`
`Qualcomm has been a supplier of components to Apple for years, but the two have been locked
`in a wide-ranging legal dispute in which Apple has accused Qualcomm of unfair patent
`licensing practices.
`
`A D V E R T I S E M E N T
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`https://www.reuters.com/article/us-apple-iphones-teardown/as-new-iphones-go-on-sale-studies-reveal-chips-from-intel-and-toshiba-idUSKCN1M11NS
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`2/12
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`Case 5:19-cv-00036-RWS Document 66-45 Filed 08/27/19 Page 4 of 13 PageID #: 3539
`8/22/2019
`As new iPhones go on sale, studies reveal chips from Intel and Toshiba - Reuters
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`U.S.-based Qualcomm, the world’s largest mobile phone chipmaker, has in turn accused Apple
`of patent infringement.
`
`Qualcomm said in July that Apple intended to solely use “competitor’s modems” in its next
`iPhone release.
`
`The iFixit teardown showed iPhone Xs and Xs Max used Intel’s modem and communication
`chips instead of Qualcomm’s hardware.
`
`The latest iPhones also had DRAM and NAND memory chips from Micron Technology
`(MU.O) and Toshiba, according to iFixit’s study. Previous teardowns of the iPhone 7 had
`shown DRAM chips made by Samsung in some models.
`
`TechInsights’ dissection of a 256-gigabyte storage capacity iPhone Xs Max, on the other hand,
`revealed DRAM from Micron but NAND memory from SanDisk, which is owned by Western
`Digital Corp (WDC.O) and works with Toshiba for its supply of NAND chips.
`
`Toshiba’s chip unit Toshiba Memory was purchased by a private equity-led consortium earlier
`this year that Apple joined.
`
`In the past, TechInsights found Apple used different DRAM and NAND suppliers in the same
`generation of phones.
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`https://www.reuters.com/article/us-apple-iphones-teardown/as-new-iphones-go-on-sale-studies-reveal-chips-from-intel-and-toshiba-idUSKCN1M11NS
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`3/12
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`Case 5:19-cv-00036-RWS Document 66-45 Filed 08/27/19 Page 5 of 13 PageID #: 3540
`8/22/2019
`As new iPhones go on sale, studies reveal chips from Intel and Toshiba - Reuters
`“For memory – Apple obviously competes with Samsung and wants to reduce their reliance as
`much as possible – so totally consistent that we’d see Toshiba for NAND flash storage and
`Micron for DRAM,” Morningstar analyst Abhinav Davuluri said.
`
`A D V E R T I S E M E N T
`
`Jim Morrison, vice president of TechInsights, said in an interview that it appeared that one of
`Dialog Semiconductor’s (DLGS.DE) chips had been replaced in the iPhone Xs Max by one of
`Apple’s own chips, but it was not yet known whether that also applied to the iPhone Xs.
`
`Dialog declined to comment. In May, the company said Apple had cut orders for its chips.
`
`IFixit and TechInsights technicians also found components from companies including
`Skyworks Solutions (SWKS.O), Broadcom (AVGO.O), Murata (6981.T), NXP
`Semiconductors (NXPI.O), Cypress Semiconductor (CY.O), Texas Instruments (TXN.O) and
`STMicroelectronics (STM.BN).
`
`Reporting by Stephen Nellis in San Francisco, additional reporting by Arjun Panchadar, Sonam Rai and
`Munsif Vengattil in Bengaluru; editing by Rosalba O'Brien and Phil Berlowitz
`
`Our Standards: The Thomson Reuters Trust Principles.
`
`M O R E F R O M R E U T E R S
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`https://www.reuters.com/article/us-apple-iphones-teardown/as-new-iphones-go-on-sale-studies-reveal-chips-from-intel-and-toshiba-idUSKCN1M11NS
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`4/12
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`Case 5:19-cv-00036-RWS Document 66-45 Filed 08/27/19 Page 6 of 13 PageID #: 3541
`8/22/2019
`As new iPhones go on sale, studies reveal chips from Intel and Toshiba - Reuters
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`https://www.reuters.com/article/us-apple-iphones-teardown/as-new-iphones-go-on-sale-studies-reveal-chips-from-intel-and-toshiba-idUSKCN1M11NS
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`5/12
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`Case 5:19-cv-00036-RWS Document 66-45 Filed 08/27/19 Page 7 of 13 PageID #: 3542
`8/22/2019
`As new iPhones go on sale, studies reveal chips from Intel and Toshiba - Reuters
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`https://www.reuters.com/article/us-apple-iphones-teardown/as-new-iphones-go-on-sale-studies-reveal-chips-from-intel-and-toshiba-idUSKCN1M11NS
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`Case 5:19-cv-00036-RWS Document 66-45 Filed 08/27/19 Page 8 of 13 PageID #: 3543
`8/22/2019
`As new iPhones go on sale, studies reveal chips from Intel and Toshiba - Reuters
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`Case 5:19-cv-00036-RWS Document 66-45 Filed 08/27/19 Page 9 of 13 PageID #: 3544
`8/22/2019
`As new iPhones go on sale, studies reveal chips from Intel and Toshiba - Reuters
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`8/12
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`Case 5:19-cv-00036-RWS Document 66-45 Filed 08/27/19 Page 10 of 13 PageID #: 3545
`8/22/2019
`As new iPhones go on sale, studies reveal chips from Intel and Toshiba - Reuters
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`https://www.reuters.com/article/us-apple-iphones-teardown/as-new-iphones-go-on-sale-studies-reveal-chips-from-intel-and-toshiba-idUSKCN1M11NS
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`9/12
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`Case 5:19-cv-00036-RWS Document 66-45 Filed 08/27/19 Page 11 of 13 PageID #: 3546
`8/22/2019
`As new iPhones go on sale, studies reveal chips from Intel and Toshiba - Reuters
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`Case 5:19-cv-00036-RWS Document 66-45 Filed 08/27/19 Page 12 of 13 PageID #: 3547
`8/22/2019
`As new iPhones go on sale, studies reveal chips from Intel and Toshiba - Reuters
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`https://www.reuters.com/article/us-apple-iphones-teardown/as-new-iphones-go-on-sale-studies-reveal-chips-from-intel-and-toshiba-idUSKCN1M11NS
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`Case 5:19-cv-00036-RWS Document 66-45 Filed 08/27/19 Page 13 of 13 PageID #: 3548
`8/22/2019
`As new iPhones go on sale, studies reveal chips from Intel and Toshiba - Reuters
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