A CMOSMicromachined Capacitive Sensor Array for Fingerprint Dete...
`
`https://ieeexplore.ieee.org/document/6020720
`
`IEEE.org
`
`IEEE Xplore
`
`\IEEESA
`
`IEEE Spectrum’ More Sites
`
`Subscribe
`
`Subscribe
`
`Create
`Cart
`&+ WAccount
`
`Pei
`Sig
`
`——
`=_—
`
`-
`Browse Y My Settings v Helpv
`
`.
`.
`.
`Institutional Sign In
`
`Institutional Sign In
`
`All
`
`v
`
`Q
`
`ADVANCED SEARCH
`
`Journals & Magazines > IEEE Sensors Journal > Volume: 12 Issue: 5 e
`
`A CMOS Micromachined Capacitive Sensor Array for Fingerprint Detection
`
`Publisher: IEEE
`
`B por
`
`Jiun-Chieh Liu ; Yung-Shih Hsiung; Michael S.-C.Lu
`
`All Authors ee
`
`25
`Paper
`Citations
`
`7
`Patent
`Citations
`
`1631
`Full
`Text Views
`
`Abstract
`
`
`DocumentSections
`
`Abstract:Biometric techniques, such asfingerprint detection, have been widely applied to identify a specific user for
`security and safety reasons. This work presents anintegrate... View more
`
`I.
`
`introduction
`
`I Methods
`
`Ill. Experiment
`V. Di
`ion
`Conclusion
`
`and
`
`Auth
`umnors
`.
`Figures
`
`> Metadata
`Abstract:
`
`Biometric techniques, such asfingerprint detection, have been widely applied to identify a specific user for security and
`safety reasons. This work presents an integrated capacitive sensorarray for fingerprint detection based on the
`difference of pressures induced bythe ridges andvalleys ofa finger tip. The 8 x 32 sensing membranes are released by
`wetetch of the complementary metal oxide semiconductor (CMOS) metal layers and no additionalthin-film deposition is
`required to form the capacitive electrodes. Each membrane contains the CMOSdielectric and metallayers with a total
`thickness of 3.375 um. Thesize of each sensing pixel is 65 x 65 ym 3 , equivalentto an imaging resolution of 390 dpi.
`The sensing capacitance and capacitive sensitivity are 12 fF and 1.41 fF/MPa, respectively. The measured spring
`constant of the membraneis close to the simulated value of 1400 N/m.Part ofthe fingerprint image is successfully
`produced by the CMOSsensorarray.
`
`References
`
`Published in: IEEE Sensors Journal ( Volume: 12 , Issue: 5, May 2012)
`
`Citati
`
`ions
`
`Keywords
`
`Metrics
`
`More L ke This
`
`Referenced in:IEEE Biometrics Compendium, IEEE RFIC Virtual Journal, IEEE RFID Virtual Journal
`Page(s): 1004 - 1010
`INSPEC Accession Number: 12650283
`
`Date of Publication: 15 September 2011 e
`
`> ISSN Information:
`
`DOI: 10.1109/JSEN.2011.2167748
`.
`Publisher: IEEE
`
`int
`Sion
`|. Introduction
`The use of biometric techniques, such aerecogn
`
`Reads
`‘i
`in ofhuman op ec , Iris patterns, and
`CARDWAREEXHIBIT 2029, Page 1 of 4
`SAMSUNG V. CARDWARE PGR2023-00013
`5/15/2023, 2:20 PM
`
`lof4
`
`-= Contents
`
`
`
`https://ieeexplore.ieee.org/document/6020720
`
`IEEE.org
`
`IEEE Xplore
`
`\IEEESA
`
`IEEE Spectrum’ More Sites
`
`Subscribe
`
`Subscribe
`
`Create
`Cart
`&+ WAccount
`
`Pei
`Sig
`
`——
`=_—
`
`-
`Browse Y My Settings v Helpv
`
`.
`.
`.
`Institutional Sign In
`
`Institutional Sign In
`
`All
`
`v
`
`Q
`
`ADVANCED SEARCH
`
`Journals & Magazines > IEEE Sensors Journal > Volume: 12 Issue: 5 e
`
`A CMOS Micromachined Capacitive Sensor Array for Fingerprint Detection
`
`Publisher: IEEE
`
`B por
`
`Jiun-Chieh Liu ; Yung-Shih Hsiung; Michael S.-C.Lu
`
`All Authors ee
`
`25
`Paper
`Citations
`
`7
`Patent
`Citations
`
`1631
`Full
`Text Views
`
`Abstract
`
`
`DocumentSections
`
`Abstract:Biometric techniques, such asfingerprint detection, have been widely applied to identify a specific user for
`security and safety reasons. This work presents anintegrate... View more
`
`I.
`
`introduction
`
`I Methods
`
`Ill. Experiment
`V. Di
`ion
`Conclusion
`
`and
`
`Auth
`umnors
`.
`Figures
`
`> Metadata
`Abstract:
`
`Biometric techniques, such asfingerprint detection, have been widely applied to identify a specific user for security and
`safety reasons. This work presents an integrated capacitive sensorarray for fingerprint detection based on the
`difference of pressures induced bythe ridges andvalleys ofa finger tip. The 8 x 32 sensing membranes are released by
`wetetch of the complementary metal oxide semiconductor (CMOS) metal layers and no additionalthin-film deposition is
`required to form the capacitive electrodes. Each membrane contains the CMOSdielectric and metallayers with a total
`thickness of 3.375 um. Thesize of each sensing pixel is 65 x 65 ym 3 , equivalentto an imaging resolution of 390 dpi.
`The sensing capacitance and capacitive sensitivity are 12 fF and 1.41 fF/MPa, respectively. The measured spring
`constant of the membraneis close to the simulated value of 1400 N/m.Part ofthe fingerprint image is successfully
`produced by the CMOSsensorarray.
`
`References
`
`Published in: IEEE Sensors Journal ( Volume: 12 , Issue: 5, May 2012)
`
`Citati
`
`ions
`
`Keywords
`
`Metrics
`
`More L ke This
`
`Referenced in:IEEE Biometrics Compendium, IEEE RFIC Virtual Journal, IEEE RFID Virtual Journal
`Page(s): 1004 - 1010
`INSPEC Accession Number: 12650283
`
`Date of Publication: 15 September 2011 e
`
`> ISSN Information:
`
`DOI: 10.1109/JSEN.2011.2167748
`.
`Publisher: IEEE
`
`int
`Sion
`|. Introduction
`The use of biometric techniques, such aerecogn
`
`Reads
`‘i
`in ofhuman op ec , Iris patterns, and
`CARDWAREEXHIBIT 2029, Page 1 of 4
`SAMSUNG V. CARDWARE PGR2023-00013
`5/15/2023, 2:20 PM
`
`lof4
`
`-= Contents
`
`
`
`A CMOSMicromachined Capacitive Sensor Array for Fingerprint Dete...
`
`https://ieeexplore.ieee.org/document/6020720
`
`fingerprints, has becomepopular foridentifying a specific user due to security and safety reasons.
`Conventionalfingerprint detection is based on optical measurement[1] where the finger surface is
`illuminated by visible light and photographed,and the imageis then stored for subsequent
`identification. Optical sensors are costly and bulky due to mechanical assembly ofthe prism,lens,
`and camera. Detected image may be affected by stained fingers, and an optical sensor may not be
`sufficiently sensitive to the differences betweena printed imageofa fingerprint anda true fingerprint.
`Thermal[2], [3], piezoresistive [4], and capacitive [5}-[12] fingerprint sensors have beenstudied in
`accordancewith the advancesin microfabrication and integrated-circuit technologies. Hanetal. [2]
`reported an array of micro heaters as the sensing elements to detect the temperature differences
`related to touching ridges and nontouchingvalleys ofa finger tip. The chip developed by ATMEL[3]
`utilized a pyroelectric material for detection. The piezoresistive cantilever array demonstrated by
`Chariotet al. [4] was monolithically integratedin a triple metal CMOSprocess.
`
`Authors
`
`Figures
`
`References
`
`Citations
`
`Keywords
`
`Metrics
`
`v
`
`v
`
`v
`
`v
`
`v
`
`v
`
`
`
`More Like This
`
`128 x 96 Pixel parallel three dimensional integrated CMOS image sensors with 16 bit A/D converters: By direct bonding with embedded Au electrodes
`2015 IEEE SOI 3D Subthreshold Microelectronics Technology Unified Conference (S3S)
`Published: 2015
`
`Modeling and Analysis of Charged Particle CMOS Image Sensor Arrays
`IEEE Transactions on Nuclear Science
`Published: 2009
`
`Show More
`
`2 of 4
`
`CARDWAREEXHIBIT 2029, Page 2 of 4
`SAMSUNG V. CARDWARE PGR2023-00013
`5/15/2023, 2:20 PM
`
`
`
`A CMOSMicromachined Capacitive Sensor Array for Fingerprint Dete...
`
`https://ieeexplore.ieee.org/document/6020720
`
`Personal Account
`
`Purchase Details
`
`Profile Information
`
`Need Help?
`
`CHANGE
`USERNAME/PASSWORD
`
`PAYMENT OPTIONS
`VIEW PURCHASED
`DOCUMENTS
`
`COMMUNICATIONS
`PREFERENCES
`PROFESSION AND
`EDUCATION
`
`US & CANADA:+1 800 678
`4333
`WORLDWIDE:+1 732 981
`0060
`
`TECHNICAL INTERESTS
`
`CONTACT & SUPPORT
`
`Follow
`
`f in
`
`About IEEE Xplore | Contact Us| Help | Accessibility | Terms of Use | Nondiscrimination Policy | IEEE Ethics Reporting (7 | Sitemap|
`IEEE Privacy Policy
`A not-for-profit organization, IEEE is the world's largest technical professional organization dedicated to advancing technology for the benefit of
`humanity.
`
`© Copyright 2023 IEEE- All rights reserved.
`
`IEEE Account
`
`» Change Usemame/Password
`
`» Update Address
`PurchaseDetails
`
`» Payment Options
`
`» Order History
`» View Purchased Documents
`
`Profile Information
`
`» Communications Preferences
`
`» Profession and Education
`
`» Technical Interests
`
`Need Help?
`
`» US & Canada: +1 800 678 4333
`
`» Worldwide: +1 732 981 0060
`
`» Contact & Support
`
`About EEE Xplore | Contact Us | Help | Accessibility | Terms of Use | Nondiscrimination Policy | Sitemap | Privacy & Opting Out of Cookies
`
`A not-for-profit organization, IEEE is the world's largest technical professional organization dedicated to advancing technology for the benefit of hum:
`CARDWAREEXHIBIT 2029, Page 3 of 4
`SAMSUNG V. CARDWARE PGR2023-00013
`
`3 of 4
`
`5/15/2023, 2:20 PM
`
`
`
`A CMOSMicromachined Capacitive Sensor Array for Fingerprint Dete...
`
`https://ieeexplore.ieee.org/document/6020720
`
`© Copyright 2023 EEE- All rights reserved. Use ofthis website signifies your agreementto the terms and conditions.
`
`A of 4
`
`CARDWAREEXHIBIT 2029, Page 4 of 4
`SAMSUNG V. CARDWARE PGR2023-00013
`5/15/2023, 2:20 PM
`
`
Accessing this document will incur an additional charge of $.
After purchase, you can access this document again without charge.
Accept $ Charge
Still Working On It
This document is taking longer than usual to download. This can happen if we need to contact the court directly to obtain the document and their servers are running slowly.
Give it another minute or two to complete, and then try the refresh button.
A few More Minutes ... Still Working
It can take up to 5 minutes for us to download a document if the court servers are running slowly.
Thank you for your continued patience.
This document could not be displayed.
We could not find this document within its docket. Please go back to the docket page and check the link. If that does not work, go back to the docket and refresh it to pull the newest information.
Your account does not support viewing this document.
You need a Paid Account to view this document. Click here to change your account type.
Your account does not support viewing this document.
Set your membership
status to view this document.
With a Docket Alarm membership, you'll
get a whole lot more, including:
- Up-to-date information for this case.
- Email alerts whenever there is an update.
- Full text search for other cases.
- Get email alerts whenever a new case matches your search.
One Moment Please
The filing “” is large (MB) and is being downloaded.
Please refresh this page in a few minutes to see if the filing has been downloaded. The filing will also be emailed to you when the download completes.
Your document is on its way!
If you do not receive the document in five minutes, contact support at support@docketalarm.com.
Sealed Document
We are unable to display this document, it may be under a court ordered seal.
If you have proper credentials to access the file, you may proceed directly to the court's system using your government issued username and password.
Access Government Site
