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`Sheraton Detroit Novi Hotel
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`Novi, MI
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`May 6, 7, & 8
`
`Reliability Workshop
`
`Automotive Electronics
`2008 - Thirteenth Annual
`
`(subject to change)
`
`Agenda
`
`Automotive Electronics Council
`
`Component Technical Committee
`
`Exhibit 1020
`PGR2017-00010
`AVX CORPORATION
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`000001
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`

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`Model
`ESD Characterization of Trench Power MOSFETs under CDM
`
`Failure Precursors for Insulated Gate Bipolar Transistors (IGBT)
`
`MOSFET in the Automotive Environment
`New Spiked Gate Stress for Robustness Validation of Power
`
`Characterization
`Copper Wire Bond: A Comprehensive Approach to Process
`
`Backside Emission Microscopy for Discrete Power Devices
`
`LUNCH (on own)
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`12:50 am - 2:15 pm
`
` Vishay SIliconix
`
`
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`
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`12:25 pm - 12:50 pmArthur Chiang
`
` University of Maryland (CALCE)
`
`
`
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`
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`12:00 am - 12:25 amNishad Patil
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` STMicroelectronics
`
`
`
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`
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`11:35 am - 12:00 amRomeo Letor
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` ON Semiconductor
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`
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`11:10 am - 11:35 amHarold Anderson
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` Vishay SIliconix
`
`
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`
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`10:45 am - 11:10 amArthur Chiang
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`2A.5
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`2A.4
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`2A.3
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`2A.2
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`2A.1
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`10:45 pm - 12:50 pm
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`Issues
`
`Discrete Semiconductor
`
`Session 2:
`
`Q200 Document Review & Discussion
`
`10:45 am - 12:50 pm
`
`Breakout Session
`
`BREAK: Coffee, drinks, snacks (provided)
`
`10:25 am - 10:45 am
`
`Temperature-Humidity-Bias Conditions
`Reliability of Flexible Termination Ceramic Capacitors in
`
` University of Maryland (CALCE)
`
`10:00 am - 10:25 amMichael Azarian
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`1A.5
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`Multilayer Varistor Performance in Automotive Environments
`
`for High Reliability and Better Performance Demands
`Advance Properties of Thin Film Resistors: Pb-free As A Vehicle
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`Components for TPSM
`Investigation of the Environmental Conditions of Electronic
`
`FlexiSafe MLCC Termination Device Performance
`
`Ron Demcko
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` AVX
`
`
`
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` Vishay BComponents
`
`
`
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`Reiner Kuehl
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`Kazuo Kasue
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` Murata
`
`
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`
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`Ron Demcko
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` AVX
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`
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`9:35 am - 10:00 am
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`1A.4
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`8:20 am - 10:25 am
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`9:10 am - 9:35 am
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`1A.3
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`Issues
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`Passive/Electro-Mechanical
`
`8:45 am - 9:10 am
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`1A.2
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`Session 1:
`
`8:20 am - 8:45 am
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`1A.1
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`Workshop Introductions
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`8:00 am - 8:20 am
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`Continental Breakfast (provided)
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`7:30 am - 8:00 am
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`Tuesday, May 6, 2008
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`000002
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`Q101 Document Review & Discussion
`
`7:00 pm - 9:00 pm
`
`AEC Panel Discussion
`
`DINNER (on own)
`
`5:05 pm - 7:00 pm
`
`The Embedded Path to Zero Defect Integrated Circuits
`
`Level Parameters and Performance
`Die-Level Process Monitors Provide Foundry-Independent Device-
`
`Outlier Management Solution
`
` LogicVision
`Stephen Pateras
`
`
`
`
`
` Ridgetop
`Justin Judkins
`
`
`
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` OptimalTest
`
`
`
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`
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`Yael Cohen
`
`4:40 pm - 5:05 pm
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`4A.3
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`3:50 pm - 5:05 pm
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`4:15 pm - 4:40 pm
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`4A.2
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`Zero Defects (Part 1)
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`3:50 pm - 4:15 pm
`
`4A.1
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`Session 4:
`
`BREAK: coffee, drinks, snacks (provided)
`
`3:30 pm - 3:50 pm
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`Automotive Component Quality Requirements
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`Prognostics and Health Monitoring of Electronic Products
`
`Manufacturers
`Organizational Reliability Capability Assessment of Electronics
`
` Continental
`
`
`
`
`Gerold Will
`
` University of Maryland (CALCE)
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`
`
`
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`
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`Sony Mathew
`
` University of Maryland (CALCE)
`
`
`
`
`
`
`
`Michael Azarian
`
`Tuesday, May 6, 2008 (continued)
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`3:05 pm - 3:30 pm
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`3A.3
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`2:40 pm - 3:05 pm
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`3A.2
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`2:15 pm - 2:40 pm
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`3A.1
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`2:15 pm - 3:30 pm
`
`Issues
`
`General Component
`
`Session 3:
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`Thermomechanical Stress Variations
`Impact of Mold compound Filler Particles on Local
`
` ON Semiconductor
`12:05 pm - 12:30 pmDaniel Vanderstraeten
`
`
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`
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`12:30 pm - 2:00 pm LUNCH (on own)
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`Device Performance in Function and Reliability
`A Study on the Relationship between Epoxy Fillet Height and
`
`Characterization of BGA Warpage in Simulated Solder Reflow
`
`Zero Defects Launch Approach
`
`Customer Returns
`Analysis of Wafer Bin Map Patterns for Lonely Die for Reduction of
`
` Integrated Silicon Solution Inc. (ISSI)
`
`
`
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`
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`11:40 am - 12:05 pmGalen Lin
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` Delphi Corporation
`
`
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`
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`11:15 am - 11:40 amMike Varnau
`
` Texas Instruments
`
`
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`10:50 am - 11:15 amJames Williams
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`10:25 am - 10:50 amDileepan Narayanan
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` Cypress
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`8A.3
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`8A.2
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`8A.1
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`7A.2
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`7A.1
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` BREAK: Coffee, drinks, snacks (provided)
`
`
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`10:05 am - 10:25 am
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`11:15 am - 12:30 pm
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`Packaging Issues
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`Session 8:
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`10:25 am - 11:15 am
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`Zero Defects (Part 3)
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`Session 7:
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`9:15 am - 10:05 am
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`Zero Defects (Part 2)
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`Session 6:
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`8:00 am - 9:15 am
`
`Environment
`Zero Defects Implementation-Holistic Approach in a Manufacturing
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`In-Situ Process Variation and Outlier Reduction
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`Tin Whisker Growth Evaluation on Solder Joint
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`Application on Ni-Au Finish
`Sn3.5Ag and Sn3.8Ag0.7Cu Pb-free Alloys for Automotive BGA
`
`Lead-Free Electronics: Tin Whisker Growth, Risk and Mitigation
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` Freescale
`
`
`
`
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`
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`Ruby Clark
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`Kuotung Cheng
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` TSMC
`
`
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`
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` NEC Electronics
`
`
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`
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`Hiroshi Yamashita
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` Freescale
`
`
`
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`
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`Min Ding
`
` University of Maryland (CALCE)
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`
`
`
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`
`
`Sony Mathew
`
`9:40 am - 10:05 am
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`6A.2
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`9:15 am - 9:40 am
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`6A.1
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`8:50 am - 9:15 am
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`5A.3
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`8:25am - 8:50am
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`5A.2
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`Pb-Free Issues
`
`8:00 am - 8:25 am
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`5A.1
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`Session 5:
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` Continental Breakfast (provided)
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`
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`7:30 am - 8:00 am
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`Wednesday, May 7, 2008
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`000004
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`Page 5 of 6
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` Q100 Document Review & Discussion
`
`
`
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`
`
`7:30 pm - 9:00 pm
`
`AEC Panel Discussion
`
`5:50 pm - 7:30 pm DINNER (on own)
`
`Participation)
`Proposal for the Reduction of ESD Compliance Levels (Audience
`
`Integrated Circuits
`The Significance of the Machine Model to the ESD Qualification of
`
`CDM Calibration Issues
`Comparison of JEDEC and Q100 Standards and New Q100 ESD-
`
`Charvaka Duvurry (et al)
`
` Texas Instruments
`
`
`
`
`
`
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`K.T. Kaschani
`
` Atmel
`
`
`
`
`
`
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` NXP Semiconductors
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`
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`
`
`Michal Polewski
`
`4:50 pm - 5:50 pm
`
`10A.3
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`4:00 pm - 5:50 pm
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`4:25 pm - 4:50 pm
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`10A.2
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`Electrostatic Discharge
`
`4:00 pm - 4:25 pm
`
`10A.1
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`Session 10:
`
` BREAK: Coffee, drinks, snacks (provided)
`
`
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`3:40 pm - 4:00 pm
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`FIB Assisted EMI and OBIRCH Analysis
`
`Fast Fault Diagnosis for Analog IC's
`
`RF Impedance Analysis for Reliability Monitoring
`
`Failure Analysis Techniques for Marginal Semiconductor Devices
`
` NEC Electronics Europe GmbH
`
`
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`
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`Michael Wieberneit
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` NXP Semiconductors
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`
`
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`
`
`Yizi Xing
`
` University of Maryland (CALCE)
`
`
`
`
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`
`
`Mike Azarian
`
` NEC Electronics America
`
`
`
`
`
`
`
`Eric Bedes
`
`Wednesday, May 7, 2008 (continued)
`
`3:15 pm - 3:40 pm
`
`9A.4
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`2:50 pm - 3:15 pm
`
`9A.3
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`2:25pm - 2:50pm
`
`9A.2
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`2:00 pm - 2:25 pm
`
`9A.1
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`2:15 pm - 3:30 pm
`
`Failure Analysis
`
`Session 9:
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`000005
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`Page 6 of 6
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`Closing Statements & Workshop Adjourned
`
`AEC Technical Committee
`
`12:55 pm - 1:10 pm
`
`NVM Products with Cycling Bake Intervals
`Thermal Acceleration Factors for Qualification of Trapping-Based
`
` Spansion
`12:30 pm - 12:55 pmM. Janai (et al)
`
`
`
`
`
`
`
`ParticleSingle Event Effects Failures
`Designing Safety Critical Systems for Neutron and Alpha
`
`Non-volatile Embedded Memory Solutions for Automotive Products
`
`To Bayes or Not to Bayes: ELFR (or How to Sharpen Those Limits)
`
`Unknown Defects
`Embedded Multi-Detect ATPG and Its Effect on the Detection of
`
`Why Statistical Bin Limits Fail
`
` Actel Corporation
`
`
`
`
`
`
`
`12:05 pm - 12:30 pmTerry Pence
`
`11:40 am - 12:05 pmChin-Piao Chang
`
` TSMC
`
`
`
`
`
`
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` Altera Corporation
`
`
`
`
`
`
`
`11:15 am - 11:40 amTim Haifley
`
` NXP Semiconductors
`
`
`
`
`
`
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`10:50 am - 11:15 amErik Marinissen
`
` Altera Corporation
`
`
`
`
`
`
`
`10:25 am - 10:50 amTim Haifley
`
`BREAK: Coffee, drinks, snacks (provided)
`
`10:05 am - 10:25 am
`
`13A.3
`
`13A.2
`
`13A.1
`
`12A.3
`
`12A.2
`
`12A.1
`
`WRAP-UP
`
`session
`
`** Refreshments available during
`
`11:40 am - 12:55 pm
`
`NVM & Memory Issues
`
`Session 13:
`
`10:25 am - 11:40 am
`
`Test & Statistics
`
`Session 12:
`
`Defect Detection With Cold Testing in Automotive Qualification
`
`in MIM Capacitors in Integrated Circuits
`Reliability Enhancement by Suppression of Nano-Dendritic Defects
`
`Guarantee NO Failures
`Knowledge Based Qualification at NXP: Know the Failures to
`
`Transfer
`Reliability Integration and Assurance in Manufacturing Process
`
`Automotive Applications
`Reliability - Technology Platforms of 0.8mm to 45nm and Beyond for
`Comprehensive Requirements and Qualifications of Die Fabrication
`
` NXP Semiconductors
`
`
`
`
`
`
`
`Kirsten Roedle
`
` ON Semiconductor
`
`
`
`
`
`
`
`Lieyi Sheng
`
` NXP Semiconductors
`
`
`
`
`Paul Ngan
`
` NEC Electronics
`
`
`
`
`
`
`
`Mike Wang
`
`An-Chi Kang
`
` TSMC
`
`
`
`
`
`
`
`9:40 am - 10:05 am
`
`11A.5
`
`9:15 am - 9:40 am
`
`11A.4
`
`8:50 am - 9:15 am
`
`11A.3
`
`Qualification Issues
`
`8:00 am - 10:05 am
`
`8:25 am - 8:50 am
`
`11A.2
`
`8:00 am - 8:25 am
`
`11A.1
`
`Session 11:
`
`Continental Breakfast provided
`
`7:30 am - 8:00 am
`
`COFFEE (provided)
`
`Thursday, May 8, 2008
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`000006
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