06/2024 / 2185 Horizon Run / The Villages, FL 32162
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`585-802-1532(M) / 352-751-1945(H) / mguidash@rmguidash-consulting.com
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`R. Michael Guidash
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`Brief Biography: Mr. Guidash received a BS in Electrical Engineering from the University of Delaware in
`1981, and an MS in Electrical Engineering from Rochester Institute of Technology in 1991. Michael joined
`Kodak in 1981 as a Product Engineer for photometer ASIC’s for Kodak film cameras. In 1986, he
`transferred to the Kodak Research Laboratories and CCD wafer fabrication facility. From 1986 – 1989, he
`developed 2um and 1um CMOS processes, and a 30V 4um BiCMOS process. These processes were used for
`gate arrays for many Kodak products, and output drivers Kodak copiers. From 1989 – 1996, Mr. Guidash
`managed the Smart Sensor Group which developed BiCMOS-CCD processes to provide fully integrated
`CCD systems on a chip. From 1993 – 1996, he also served as product and yield enhancement engineer for
`Kodak’s high volume CCD’s. In 1996 Michael helped form and led the CMOS Image Sensor (CIS) group.
`From 1996 to 2009, he managed the R&D and product development of CIS programs. Kodak closed the CIS
`business in August of 2009. From August of 2009 through April of 2012, Mr. Guidash worked as
`intellectual property technologist and coordinator. This included technical coordination of CIS patent
`applications and office actions, electronic components patent applications and office actions, and technical
`support for IP sales and licensing teams. Mr. Guidash left Kodak in May of 2012 to start a technology
`consulting company in the field of CIS. From 2012 to present, Mr. Guidash has continued development and
`innovation in CIS pixel and process technology, including pMOS pixels, Multi-bit binary pixels, low noise
`and high speed sensor readout design, high dynamic range image sensors, and BSI processes. He has
`authored or co-authored 34 papers/presentations in the fields of integrated circuits and image sensors. He has
`119 issued patents and several active patent applications in the field of image sensors.
`
`Career Highlights:
`• Chief Technologist and Innovator: Initiated and led development efforts in CIS at Kodak in pixel and
`process design. Inventor of many key patents in the field of CMOS Image sensors including Pinned
`Photodiode Pixels, Camera-on-a-Chip architecture, and shared amplifier pixel architectures. Continued
`to innovate and invent to drive CIS cost reduction, features and performance. Applies strategic thinking
`to align business goals with short and long term technology and product plans. Known as a creative
`thinker and innovator, providing vision and leadership to bring ideas and concepts to the marketplace.
`• Technology Development Management: Provided vision, roadmap and direction for a broad set of
`elements in circuit design, pixel architecture, process integration, and sensor/camera systems. Possesses
`technical and interpersonal skills to assemble, manage and motivate diverse cross-functional teams, that
`efficiently and successfully deliver to schedule.
`• Product Development: Provided technical voice to market attack and business plans. Guided ideas and
`concepts from invention phase through R&D and through commercialization.
`• Technical Due Diligence: Provided technical guidance and analysis for development partner selection,
`technology and resource acquisitions, and litigations.
`• Partner Management: Negotiated, coordinated and directed 3rd party technology providers and external
`development partners, including foundries. Directed integration of CIS processes into 6 foundries.
`• Technical Skills: CCD and CIS operation, design, device integration and fabrication technologies.
`Image sensor and ASIC yield enhancement; yield team management; rigorous and methodical problem
`solver, efficiently finding root causes and solutions for yield crises and problems.
`• Patents & Publications: 119 issued patents; 34 publications
`
`Professional Experience:
`R.M. Guidash Consulting LLC: President, (May 2012 - Present)
`Technical consulting services for CMOS Image Sensors (CIS):
`• Process, pixels, circuits, sensor architectures, systems and IP. General and customized tutorials and
`advisement. Short and long term projects and problem solving.
`• Development of CIS design and process technology, including pMOS pixels, multi-bit binary pixels, low
`noise and high speed sensor readout design, high dynamic range pixels, dark current and bright point
`reduction, and BSI device structures.
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`R. Michael Guidash
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`Eastman Kodak: Scientist and IP Specialist; Office of the CTO UU, (2010 - April 2012)
`Post closure of Kodak CIS Business - Patent generation; patent application management; technical support
`for patent attorneys; technical support for IP sales and licensing teams.
`• Continued patent generation for digital capture; technical support for pending patent applications;
`technical support for IP sales & licensing teams; Key member of team that sold CIS patents.
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`Eastman Kodak: Chief Technologist & Manager – CIS R&D; Image Sensor DivisionUU, (2001 - 2009)
`Managed group of ~25 people in R&D of CIS technology elements, including pixel and process
`development, chip level architectures, analog readout architectures, and camera/module systems.
`• Developed/demonstrated new technologies including Kodak panchromatic CFA patterns and processing,
`pMOS hole detector pixel, 3D hybrid stacked devices, and low read noise analog circuits. Designed and
`demonstrated 3D hybrid stacked BSI 1.4um pixel sensor in 2007-2008.
`• Led team to file over 100 patent applications. Filed patent applications on and led development of 1st 3D
`hybrid stacked BSI CIS architecture. This led to demonstration of very high performance, low dark
`current BSI prototype sensors with pixel sizes ranging from 0.9um to 5.0um.
`Initiated and led a cross-functional camera R&D team directed at CIS and other Kodak technologies for
`novel co-optimized cameras and camera sub-systems.
`• Provided technical guidance and analysis for selection and initiation of foundry and R&D partners.
`• Managed directed technical interface with external partners in design, process and pixel development
`(IBM, TSMC, Ziptronix and others).
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`•
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`Eastman Kodak: Chief Technologist & Mgr. - CIS R&D/Prod. Dev; Image Sensor Division, (’95 - ‘01)
`Managed and directed group of 10-15 people in all elements of CIS R&D and product development.
`• Pioneered and championed CIS initiatives at Kodak.
`•
`Inventor and co-inventor of many key patents in the field of CMOS Image sensors including Pinned
`Photodiode Pixels, Camera-on-a-Chip architecture, and shared amplifier pixel architectures.
`• Led the development teams to key achievements; World’s 1st commercialized pinned photodiode CIS,
`Megapixel CIS device, and Shared amplifier CIS pixel product.
`• Led transfer of world’s first commercial ½” optical format 1.3 megapixel CMOS image sensor into mass
`production, providing successful delivery to several compact digital camera products.
`• Managed and directed technical interface with external partners in design, process and pixel
`development, (JPL, Photobit, Motorola, Intel, Tower Semiconductor).
`Initiated and directed a cross-functional team including resources from Motorola and other Kodak
`organizations to develop a small, low cost image module for cell phone applications. This effort won the
`1997 Team Achievement Award at Kodak through development of a CIS cell phone module.
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`•
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`Eastman Kodak: Development Engineer – Smart Sensors; Image Sensor Division, (1989 – 1995)
`• Led product delivery and technology development of all ASIC and smart sensor products. Performed all
`device modeling, device and process integration.
`• Developed and demonstrated Interline CCD integrated with 2um CMOS on the same chip
`• Led team to design and demonstrate first reported pinned PD Active Pixel CMOS Sensor, and linear
`CCD image sensor with on-chip timing and control.
`• Led/coordinated world’s 1st commercial megapixel CCD yield enhancement team at commercialization
`ramp up of DC40 digital camera. Brought yield from 0% to 60% in ~3 months assisting on-time launch
`of DC40 camera.
`• Led/coordinated CCD yield enhancement team at commercialization ramp up of world’s 1st USB
`peripheral, Kodak TCAM1. Brought yield from 0% to 50% in ~3 months.
`• Led & directed CCD dark current and point defect reduction team.
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`06/2024 - page 3 of 6
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`R. Michael Guidash
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`Eastman Kodak: Product Engineer; Integrated Circuits Fabrication, Elmgrove Plant, (1984 – 1988)
`Product Engineer for all Kodak Copier Output Driver IC’s, DISC camera IC’s, and Instant Camera IC’s.
`Delivering ~6M devices per year. Responsible for all aspects of IC test, delivery, yield and cost.
`• Developed software for device and statistical yield modeling
`• Led and delivered on development of Smart Integrated Chemically Sensitive Field Effect Transistors for
`Kodak Harrow.
`• Awarded Special Opportunity Graduate Program for MSEE degree. (RIT)
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`Eastman Kodak: Product Engineer; Integrated Circuits Fabrication, Elmgrove Plant, (1981 -1983)
`• Product Engineer for all Kodak Instant Camera photometer IC’s: brought yield of 5 new devices from
`0% to 45% in ~4 months. Reached final yields of ~85%. Responsible for all aspects of IC test,
`packaging, delivery, customer interface and failure analysis, yield and cost.
`
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`Education:
` M.S. (Electrical Engineering), Rochester Institute of Technology, 1991
` B.S. (Electrical Engineering), University of Delaware, 1981
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`Publications and Presentations:
`1 L.J. D'Luna, K.A. Parulski, T.J. Kenney, R.H. Hibbard, R.M. Guidash, P.R. Shelley, W.A. Cook, G.W.
`Brown, T.J. Tredwell; “A digital video signal processor for color image sensors” IEEE International Solid-
`State Circuits Conference, 1989 ISSCC. Digest of Technical Papers
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` 2
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` W.A. Cook, K.A. Parulski, L.J. D'Luna, G.W. Brown, R.M. Guidash; “A digital signal processor for linear
`sensors”; IEEE Proceedings of the Custom Integrated Circuits Conference 1990 | Conference Paper
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` 3
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` L. D’Luna, W. Cook, M, Guidash, G. Brown, T. Tredwell, J. Fischer, T. Tarn; “An 8x8 discrete cosine
`transform chip with pixel rate clocks”; IEEE ASIC Seminar; Sept. 1990
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` 4
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` J.A. Vincent, W.A. Cook, L.J. D'Luna, G.W. Brown, R.M. Guidash; “A customizable timing controller for
`electronic imaging applications”; Proceedings of the IEEE 1991 Custom Integrated Circuits Conference
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` 5
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` G. Ting, R.M. Guidash, P. Lee, C. Anagnostopoulos; “A Low Cost Smart-Power BiCMOS Driver
`Chip for Medium Power Applications”; IEEE ASIC Conference Proceedings; p. 466-469 [1994]
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`6 L. D’Luna, K. Parulski, D. Maslyn, M. Hadley, T. Kenney, R. Hibbard, M. Guidash, P. Lee, C.
`Anagnostopoulos; “A digital video signal post-processor for color image sensors”; IEEE ASIC Conference
`[1994]
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` 7
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` P. Lee, R. Gee, M. Guidash, T. Lee, E. Fossum; “An active pixel sensor fabricated using CMOS/CCD
`process technology; 1995 IEEE Workshop on CCD’s and Advanced Image Sensors.
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` 8
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` M. Guidash, P. Lee, J. Andrus, A. Ciccarelli, H. Erhardt, J. Fischer, E. Meizenzahl; “A modular, high
`performance, 2um CCD-BiCMOS process technology for application-specific image sensors and image
`sensor systems on a chip; Proc. SPIE Vol. 2415, p. 256-264, April 1995
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` 9
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` M. Guidash, P. Lee, J. Andrus, A. Ciccarelli, H. Erhardt, J. Fischer, E. Meizenzahl; “A modular, high
`performance, 2um CCD-BiCMOS process technology for application-specific image sensors and image
`sensor systems on a chip; CCD & Advanced Image Sensor Workshop, 1995
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`10 M. Guidash, T. Lee, P. Lee, et. al., “A 0.6um CMOS pinned photodiode color imager technology”;
`IEDM Tech. Digest 1997 p. 927-929
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`R. Michael Guidash
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`Publications and Presentations (continued):
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`11 M. Guidash, K. Parulski, “Digital Capture – not all pixels are created equal”, Industrial and Applied
`Physics Symposium, Rochester NY, October 2001
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`12 M. Guidash, et. Al., “A High-Performance, 6 m 1.3 Megapixel, Pinned Photodiode CMOS Image
`Sensor”; SPIE Opto Northeast Conference; September 2001
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`13 M. Guidash, M. Mattern; “High-performance CMOS image sensor design, a combination of disciplines”,
`New York Microelectronics Design Conference, Rochester NY, Sept 2003
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`14 J. Zhang, S. Cooper, A. LaPietra, M. Mattern, M. Guidash, E. Friedman; “A low power thyristor-based
`CMOS programmable delay element. ISCAS (1) 2004; p. 769-772
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`15 D. McGrath, H. Fujita, M. Guidash, T. Kenney & W. Xu; “Shared pixels for CMOS imaging arrays”,
`CCD & Advanced Image Sensor Workshop, Kurizawa, Japan, 2005
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`16 F. Chu, M. Guidash, J. Compton, S. Coppola, W. Hintz; “Improving low-light CMOS performance with
`4-transistor 4-shared architecture and charge domain binning; SPIE proceedings Vol 6069; pp. 25-33; 2006
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`17 R. Michael Guidash, John T. Compton, R. Daniel McGrath, Edward T. Nelson, Christopher Parks, Joseph
`R. Summa, “A 1.4 um pixel front-side-illuminated image sensor for mobile phones”, IEEE International
`Image Sensor Workshop, Trondheim Norway, June 2009
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`18 Thomas Vogelsang, Michael Guidash, Song Xue, “Overcoming the Full Well Capacity Limit: High
`Dynamic Range Imaging Using Multi-Bit Temporal Oversampling and Conditional Reset”, IEEE
`International Image Sensor Workshop, Park City Utah, June 2013
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`19 Thomas Vogelsang, David G. Stork and Michael Guidash, “A Hardware Validated Unified Model of
`Multi-Bit Temporally and Spatially Oversampled Image Sensors with Conditional Reset”, SPIE Journal of
`Electronic Imaging 23(1), 013021 (Jan-Feb 2014).
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`20 Michael Guidash and Thomas Vogelsang, “Non-Destructive Threshold Assessment of a Pinned
`Photodiode Pixel with Correlated Double Sampling”, 18TH IEEE International Symposium on Consumer
`Electronics, June 22-25, 2014.
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`21 Thomas Vogelsang, Michael Guidash, Jay Endsley and Craig Smith, “A 2MP Oversampling Image
`Sensor with 2.75s Row Time and Conditional Threshold Comparison”, IEEE International Image Sensor
`Workshop, Vaals Netherlands, June 2015
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`22 Michael Guidash, JiaJu Ma, Thomas Vogelsang and Jay Endsley, “Reduction of CMOS Image Sensor
`Read Noise to Enable Photon Counting”, Sensors Magazine Special Issue on Photon Counting, April 2016
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`23 Salman Kabir, Craig Smith, Gerrit Barnard, Alex Schneider, Frank Armstrong, Michael Guidash, Thomas
`Vogelsang, and Jay Endsley; “Optimization of CMOS image sensor utilizing variable temporal multi-
`sampling partial transfer technique to achieve full-frame high dynamic range with superior low light and stop
`motion capability”; 2017 IS&T International Symposium on Electronic Imaging, Jan-Feb 2017
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`24 W. Gao, M. Guidash, et. al, Photodiode Barrier Induced Lag Characterization Using a New Lag vs. Idle
`Time Methodology”, IEEE International Image Sensor Workshop, Hiroshima Japan, June 2017
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`25 Salman Kabir, Michael Guidash, et. al., “A Small Pixel High Performance Full Frame HDR Sensor”,
`IEEE International Image Sensor Workshop, Hiroshima Japan, June 2017
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`R. Michael Guidash
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`Publications and Presentations (continued):
`26 Salman Kabir, Michael Guidash, et. al., “Optimization of CMOS image sensor utilizing variable temporal
`multisampling partial transfer technique to achieve full-frame high dynamic range with superior low light
`and stop motion capability”, SPIE Journal of Electronic Imaging27(2) 023030, April 24, 2018
`
`27 Minseok Oh, Michael Guidash, et. al., “3.0um Backside Illuminated, lateral overflow, high dynamic
`range, LED flicker mitigation image sensor”, IEEE International Image Sensor Workshop, Snowbird Utah,
`June 2019.
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`28 Michael Guidash, et. al., “Floating Diffusion Dark Current and Dark Signal Non-Uniformity Reduction
`for High Dynamic Range Overflow Collection Pixels in High Temperature Applications”, IEEE International
`Image Sensor Workshop, Snowbird Utah, June 2019.
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`29 Sergey Velichko, Michael Guidash, et. al., “Intrinsic Si Quantum Efficiency, Responsivity and Other
`Parameters Temperature Dependence for BSI Image Sensors”, IEEE International Image Sensor Workshop,
`Snowbird Utah, June 2019.
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`30 Minseok Oh, Michael Guidash, et. al., “Automotive 3.0um Pixel High Dynamic Range Sensor with LED
`Flicker Mitigation”, MDPI Sensors Magazine Special Issue on IISW 2019, March 2020
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`31 Sergey Velichko, Michael Guidash, et. al., “Automotive 3.m HDR Image Sensor with LED Flicker
`Mitigation and Distance Functionality”, IEEE International Image Sensor Workshop, September 2021.
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`32 Shou-Gwo Wuu, R. Michael Guidash, et. al., “A Review of 3-Dimensional Wafer Level Stacked
`Backside Illuminated CMOS Image Sensor Process Technologies”, IEEE Transactions on Electron Devices
`2022 Special Issue on Solid State Image Sensors, June 2022.
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`33 Sergey Velichko, Michael Guidash, et. al., “Automotive 3.m HDR Image Sensor with LED Flicker
`Mitigation and Distance Functionality”, IEEE Transactions on Electron Devices 2022 Special Issue on Solid
`State Image Sensors, June 2022.
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`34 Manuel Innocent, Michael Guidash, et. al., “Automotive CMOS Image Sensor family with 2.1um LFM
`pixel, 150 dB Dynamic Range and High Temperature Stability”, IEEE International Image Sensor
`Workshop, May 2023
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`US Patents: (119 issued)
`11,881,492 11,818,478 11,721,708 11,721,707 11,323,644 11,284,034 11,276,721 11,165,977
`11,114,482 11,012,629 10,798,322 10,659,715 10,652,493 10,594,973 10,567,683 10,535,690
`10,362,256 10,356,350 10,306,169 10,277,843 10,257,448 10,249,660 10,165,209 10,154,220
`10,136,090 10,104,318 10,103,190 10,070,084 10,002,895 9,894,304 9,883,130 9,681,071
`9,667,898 9,521,349 9,521,351 9,491,391 9,462,181 9,432,597 9,380,245 9,264,639
`9,241,118 9,070,611 9,001,251 8,957,981 8,946,612 8,836,784 8,829,637 8,736,728
`8,730,362 8,665,340 8,587,681 8,558,292 8,378,398 8,339,494 8,253,214 8,194,178
`8,178,938 8,164,682 8,158,453 8,101,450 8,076,749 8,049,256 8,018,016 7,973,876
`7,969,469 7,859,581 7,858,915 7,830,435 7,705,900 7,675,097 7,674,648 7,443,431
`7,361,877 7,342,213 7,238,926 7,092,017 6,730,899 6,730,897 6,721,008 6,714,239
`6,710,804 6,680,498 6,657,665 6,624,850 6,587,146 6,552,323 6,504,195 6,486,504
`6,466,266 6,423,994 6,365,926 6,352,869 6,323,476 6,307,195 6,297,070 6,259,124
`6,218,692 6,218,656 6,184,928 6,160,281 6,127,697 6,107,655 6,100,556 6,100,551
`6,069,377 6,051,447 6,027,955 5,986,257 5,949,061 5,904,493 5,903,021 5,841,159
`5,625,210 5,621,230 5,591,997 5,387,536 5,338,946 5,881,184 5,872,371
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`06/2024 - page 6 of 6
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`R. Michael Guidash
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`Organizations:
`• Member IEEE
`•
`International Image Sensor Workshop; Member Technical Program Committee 2017, 2019, 2021, 2023, 2025
`• Board of Directors – International Image Sensor Society 2018 – 2023
`• Guest Editor in Chief: 2022 Solid State Image Sensors Special Issue, IEEE Trans. on Electron Devices
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`Awards:
`• Eastman Kodak Company – Distinguished Inventor
`• Rambus – Qualified as a Gold Distinguished Inventor
`• CMOS Image Sensor work at Kodak awarded a 2019 - 2020 Technical Emmy
`• 2022 Kepner-Tregoe Problem Solving Excellence Award
`
`Expert Consultant Cases:
`(italic text indicates client; listed as Plaintiff vs. Defendant(s) or Petitioner vs. Patent Owner)
`1. Cal-Tech vs. ST Microelectronics; Infringement Analysis; October 2012
`2. Imperium Holdings vs. Motorola Mobility, Kyocera, Sony Mobile; Infringement analysis; Civil Action No. 4:11-
`cv-00163-RC-ALM; February 2013
`3. Cal-Tech vs. Omnivision Technologies; Validity Analysis; December 2013
`4. HSM LLC vs. ST Microelectronics et. al.; Infringement and Validity Analysis; April-October 2014
`5. Fujian Newland Computer Co. Ltd. vs. Hand Held Products Inc.; Validity Analysis; Case IPR2013-00595;
`August 2014
`6. Fujian Newland Computer Co. Ltd. vs. Honeywell Inc.; Validity analysis; Chinese Invalidity; May 2017
`7. Kyocera vs. e-Watch;; Validity Analysis; 2 IPR Petitions; December 2014
`8. Aptina, ON Semi vs. Collabo Innovations; Infringement and Validity Analysis; Case No. 1:14-cv-01093-SLR;
`April-October 2015
`9. Sony Corp. vs. Collabo Innovations Inc.; Validity Analysis; IPR2016-00939, IPR2016-00940, IPR2016-0094,
`IPR2017-00958, IPR2017-00960; January 2016-May 2017
`10. Hamamatsu vs. SiOnyx: Validity Analysis; IPR2016-01910; 2017;
`11. SiOnyx vs. Hamamatsu: Infingement Analysis; Civil Action No. 15-cv-13488-FDS; 2018
`12. Lenovo vs. Photonic Imaging Solutions: IPR2019-01075
`13. Honeywell Inc. vs. Opticon Inc., ITC Inv. No. 337-TA-1165; Infringement Analysis; July 2019
`14. SmartSens Technology Inc. vs. Omnivision Technologies Inc.; IPR2019-01263; Validity Analysis; April 2019
`15. Honeywell Inc. vs. Zebra Technologies Corp. , ITC Inv. No. 337-TA-1285; Infringement Analysis; April 2021
`16. Hand Held Products, Inc. and Metrologic Instruments, Inc. -v- Zebra Technologies Europe Limited and Zebra
`Technologies Corp., Claim No. HP2021000036;
`17. Symbol Technologies LLC and Zebra Technologies Europe Limited -v- Honeywell International Inc. and (2)
`Honeywell Control Systems Limited, Claim No. HP-2022-000001
`18. VisionX Technologies, LLC v. Sony Corporation; Validity Analysis; 2 IPR declarations; Fall 2022
`19. Greenthread LLC v. Sony Group Corporation; Validity Analysis; 4 IPR declaration; Fall 2022
`20. IPR matter in progress: 2024
`
`
`Expert Consultant Depositions or Trial Testimony:
`1. Imperium Holdings vs. Motorola Mobility, Kyocera, Sony Mobile; Deposition testimony, Civil Action No. 4:11-
`cv-00163-RC-ALM; February 2013
`2. Fujian Newland Computer Co. Ltd. vs. Hand Held Products Inc. ; Deposition testimony; Case IPR2013-00595;
`August 2014, May 2015
`3. Sony vs. Collabo Innovations Inc.; Deposition testimony; (Total of 5 depositions 1/2017 – 10/2017)
`4. Hamamatsu vs. SiOnyx: Deposition testimony; IPR2016-01910; July 2017
`5. SiOnyx vs. Hamamatsu: Deposition testimony; 1:15-cv-13488; April 2018
`6. Fujian Newland Computer Co. Ltd. vs. Hand Held Products Inc. ; Trial testimony; Chinese Invalidity case; May
`2017
`7. Fujian Newland Computer Co. Ltd. vs. Hand Held Products Inc. ; Trial testimony; Chinese Invalidty case;
`August 2018
`8. Honeywell Inc. vs. Opticon Inc., ITC Inv. No. 337-TA-1165; Deposition testimony; December 2019
`9. SmartSens Technology Inc. vs. Omnivision Technologies Inc.; IPR2019-01263; Deposition testimony; February
`2020, June 2020, September 2020
`10. Honeywell Inc. vs. Zebra Technologies Corporation, ITC Inv. No. 337-TA-1285; Infringement Deposition
`testimony; May 2022
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