(19) United States
`(12) Patent Application Publication (10) Pub. No.: US 2008/0298014 A1
`(43) Pub. Date:
`Dec. 4, 2008
`Franco
`
`US 20080298O14A1
`
`(54) MODULAR ELECTRONIC ENCLOSURE
`(76) Inventor:
`Michael John Franco, Madison,
`WI (US)
`Correspondence Address:
`Phillip M. Wagner
`1627 Foxworthy Avenue
`San Jose, CA 95118 (US)
`(21) Appl. No.:
`11/807,935
`
`(22) Filed:
`
`May 29, 2007
`
`Publication Classification
`
`(51) Int. Cl.
`(2006.01)
`H05K 7/20
`(2006.01)
`H05K 7/00
`(52) U.S. Cl. ......................................... 361/688; 361/728
`(57)
`ABSTRACT
`A modular electronic enclosure having a maximum height of
`1 U and a width adapted to fit between the rails of a 19 inch
`
`rack is adapted to receive up to ten single-width Advanced
`Mezzanine Cards (AMCs) installed horizontally in the enclo
`sure. Some modules that are not compliant with AMC stan
`dards may be installed in the modular electronic enclosure. A
`backplane, backplane structural Support, combined card
`guide, chassis cover, and chassis bottom cooperate mechani
`cally to provide a stiff, stable enclosure resistant to mechani
`cal flexure. The modular electronic enclosure includes two
`hot-swappable cooling units which cooperate to establish
`push-pull cooling airflow. The modular electronic enclosure
`is further adapted to receive a Power Unit and an MCH. In
`another embodiment, the modular electronic enclosure
`includes a backplane with more than one core and has mount
`ing locations and electrical connectors for up to twenty
`single-width 4 HP electronic modules. A backplane having
`more than one core is included in some embodiments. In
`Some embodiments, the modular electronic enclosure is
`adapted to receive a combination of electronic modules com
`prising single-width, dual-width, and quad-width electronic
`modules. Some embodiments optionally include an MCH, a
`power unit module, or a J-TAG Switch module, or combina
`tions of these and other modules.
`
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`US 2008/0298O14 A1
`
`Dec. 4, 2008
`
`MODULARELECTRONICENCLOSURE
`
`FIELD OF THE INVENTION
`0001. The present disclosure relates generally to computer
`and telecommunications equipment and more specifically to
`a modular electronic enclosure adapted for operation of
`Advanced Mezzanine Cards.
`
`BACKGROUND
`0002 Manufacturers and users of telecommunications
`equipment, networking equipment, computer systems, and
`other types of electronic systems comprising computing and
`communications functions have proposed several non-propri
`etary standards to reduce costs, reduce time to market, and
`improve performance. The dissemination and use of Such
`non-proprietary standards, also known as open architecture
`standards, is believed to improve interoperability and
`increase reliability in products compliant with those stan
`dards. Open architecture standards for telecommunications
`and computing equipment may include, for example,
`mechanical dimensions of enclosures, racks, and electronic
`modules, power dissipation limits, and thermal management
`schemes. Open architecture standards may also include defi
`nitions of communications and control signals to be
`exchanged between functional elements inside a system and
`between the system and the outside world, electrical connec
`tor styles and pin assignments, operating Voltages and cur
`rents, software commands, and data formats.
`0003. Some examples of open architecture standards for
`telecommunications, networking, and computer equipment
`include Advanced Telecommunications Computing Archi
`tecture, Advanced Mezzanine Card, and Micro Telecommu
`nications Computing Architecture. Advanced Telecommu
`nictions Computing Architecture, also known as ATCA and
`AdvancedTCA, comprises an open architecture for high-per
`formance, high-reliability telecommunications modules.
`More than one AdvancedTCA module may be mechanically
`and electrically connected to an enclosure known in the art as
`a telecom shelf. A telecom shelf may have an open-frame
`chassis or be partially or fully enclosed. Each telecom shelf is
`further adapted for attachment to an equipment rack. Equip
`ment racks having a width of 19 inches (482.6 mm) are most
`common, but racks with other widths are also used. More than
`one telecom shelf may be connected to a rack, and the rack
`may further be located inside a cabinet to aid in thermal
`management, provide electrical shielding, and provide
`mechanical protection. A large system may comprise more
`than one rack, cabinet, or a combination of racks and cabinets.
`0004. A height measurement for an AdvancedTCA mod
`ule is 14.0 inches (355.6 mm), known in the art as a height of
`8 U. The 8U designation is in reference to widely recognized
`conventions for describing a panel height for rack-mounted
`equipment, wherein a height increment of 1 U corresponds to
`1.75 inches (44.5 mm). The relatively large size of an
`AdvancedTCA module enables many complex functions to
`be incorporated into a single module, making AdvancedTCA
`an attractive Solution for large, high performance systems.
`0005 One type of AdvancedTCA module is a carrier
`board, also known as an ATCA carrier. An ATCA carrier
`couples functional modules to AdvancedTCA infrastructure
`services such as power, ground, timing signals, data and com
`mand buses, status signals, error signals, and other input and
`output signals. A type of functional module designed to oper
`
`ate with an ATCA carrier is known as an Advanced Mezza
`nine Card. Advanced Mezzanine Cards, also referred to as
`AdvancedMCs or AMCs, comply with mechanical, electri
`cal, power, Software, and other requirements in the
`AdvancedTCA standard.
`0006 Up to eight AdvancedMCs may be connected to an
`ATCA carrier. An AdvancedMC may be connected to or
`disconnected from an ATCA carrier without turning off
`power to other modules on the carrier, a feature known in the
`art as hot-swapping. Hot-swapping enables maintenance to
`be performed on one AdvancedMC without removing other
`AdvancedMCs from service. AdvancedMCs help improve
`the overall reliability of an ATCA system because a failure in
`a single module will not cause the entire system to fail.
`Furthermore, uninterrupted system availability, a measure of
`system reliability, may be increased by installing as many
`redundant AdvancedMCs as are needed to have a desired
`confidence level that a preferred minimum number of
`AdvancedMCs is always in operation. Also, by adding or
`removing AdvancedMCs from a system, performance
`attributes such as storage capacity or rate of data transfer may
`be readily scaled up or downto address changes in application
`requirements.
`0007 While AdvancedTCA telecom shelves are well
`Suited for many large-scale applications, they may be too
`large and expensive for Some applications. Another open
`architecture standard called Micro Telecommunications
`Computing Architecture, also known as MicroTCA, connects
`the same types of AdvancedMCs compatible with
`AdvancedTCA to a backplane, thereby eliminating ATCA
`carrier modules and enabling size and cost reductions com
`pared to AdvancedTCA. A first version of a MicroTCA stan
`dard was released by the Compact PCI Industrial Computer
`Manufacturers Group (PICMG) in July 2006.
`0008 A MicroTCA system comprises at least one
`AdvancedMC, at least one MicroTCA Carrier Hub (MCH),
`and the interconnect, power, cooling, and mechanical infra
`structure to Support them. MicroTCA systems may vary in
`size from Small, stand-alone enclosures comprising a small
`number of AdvancedMCs to installations including multiple
`telecom shelves with hundreds of cards. MicroTCA systems
`are well Suited to, but are not limited to, applications requiring
`a smaller enclosure or applications that may operate with a
`lower reliability target than is generally offered by an ATCA
`system. Examples of MicroTCA applications include wire
`less Internet access points, medical instrumentation, indus
`trial monitoring and control, digital imaging, and enterprise
`applications.
`0009. The MicroTCA standard recommends a height
`range of 2 U to 6 U (3.5 inches to 10.5 inches) (88.9 mm to
`266.7 mm) for a MicroTCA telecom shelf to be mounted in a
`rack. Modules having a height of about 0.5 inch (14 mm) are
`referred to as 3 HP or alternatively as half-height. Modules
`having a height of about 0.7inch (19 mm) are referred to as 4
`HP or alternatively mid-size. Modules having a height of
`about 1.1 inch (29 mm) are referred to as 6HP or alternatively
`full-size. Modules having a width of approximately 2.9 inch
`(74 mm) are referred to as single-width. A module with about
`twice the width of a single module is referred to as having
`double-width and one with about four times the width of a
`single module is referred to as having quad-width. Full-size,
`mid-size, and half-height modules may alternatively be made
`with single-width, double-width, or quad-width.
`
`

`

`US 2008/0298O14 A1
`
`Dec. 4, 2008
`
`0010 Previously, the smallest rack-mountable MicroTCA
`enclosure had a height of 2 U and was limited to two 6 HP
`AdvancedMCs. An enclosure having a height of approxi
`mately 1 U is also known in the art, but it is not rack-mount
`able and is limited to two 6HP AdvancedMCs. For applica
`tions needing more than two AdvancedMCs in a rack
`mountable enclosure, the solution was to use a relatively large
`enclosure, thereby increasing the size and cost of the finished
`system. Furthermore, reductions in the size of structural ele
`ments, backplanes, connectors, and other components used in
`enclosures having a height of 2 U or more was expected to
`result in rack-mountable enclosures Smaller than 2 U having
`insufficient mechanical strength, thereby leading to reduced
`reliability. What is needed is a MicroTCA enclosure system
`that can be mounted in a 19 inch rack, holds up to ten single
`width 4 HP electronic modules having a size comparable to
`AMCs in an enclosure having a height of 1 U, is able to
`operate with Some electronic modules that are not fully com
`pliant with AdvancedMC standards, and includes all neces
`sary infrastructure for power, cooling, monitoring, and input/
`output, and giving adequate mechanical Support to all
`components.
`
`SUMMARY
`0011. In one embodiment, a modular electronic enclosure
`has a height of 1 U. The modular electronic enclosure has a
`width and mounting features adapted for attachment to a 19
`inch rack and has a depth adapted to contain a 4 HP single
`width electronic module having a size comparable to an
`AdvancedMC. The modular electronic enclosure comprises a
`rear Surface comprising a backplane structural Support, a
`chassis cover connected to a top surface of the backplane
`structural Support, and a chassis bottom connected to a bot
`tom Surface of the backplane structural Support. The chassis
`cover is formed into an enclosure top, an enclosure right side,
`and an enclosure left side, wherein the enclosure right side
`and enclosure left side are parallel to each other and at right
`angles to the enclosure top. A plurality of perforations formed
`in the chassis cover right side and the chassis cover left side
`enable air to flow into and out of the interior of the modular
`electronic enclosure.
`0012. In some embodiments, a backplane is attached to an
`inner Surface of the backplane structural Support. A sufficient
`number of connectors are installed on a large Surface of the
`backplane facing the interior of the enclosure to enable con
`nection of up to ten single-width AMCs. Optionally, some
`electronic modules which are not fully compliant with
`AdvancedMC specifications may be installed in the modular
`electronic enclosure and may be connected to the backplane,
`for example, an electronic module which is a power unit oran
`electronic module which is a J-TAG switch module. The
`backplane also provides hot-swappable electrical connec
`tions to a first cooling unit near one end of the backplane and
`a second cooling unit near an opposite end of the backplane.
`The backplane further provides electrical and mechanical
`connections for an MCH. In some embodiments, some con
`nectors attached to the backplane are compression-type con
`nectOrS.
`0013 A plurality of combined card guides is provided to
`align connectors on mid-size AdvancedMCs with corre
`sponding connectors on the backplane. A combined card
`guide has a height adapted to fit between an inner Surface of
`the chassis cover and an inner Surface of the chassis bottom
`and is formed with two parallel channels along a length of the
`
`guide to provide support for two AdvancedMCs or similar
`electronic modules, one above the other. In some embodi
`ments, a combined card guide has one channel and provides
`Support for a single electronic module. Support Surfaces
`along a top edge and a bottom edge of a combined card guide
`are connected to the chassis cover and chassis bottom with
`threaded fasteners. The combination comprising the chassis
`cover, chassis bottom, backplane structural Support, and com
`bined card guides cooperate to provide a stiff, stable mechani
`cal structure. In other embodiments, a number and location of
`single-channel and two-channel combined card guides are
`selected to enable installation of double-width Advanced
`MCs or similar electronic modules. In other embodiments, a
`number and location of single-channel and two-channelcom
`bined card guides are selected to enable installation of quad
`width electronic modules.
`0014. The first and second cooling units are adapted for
`hot-swapping and cooperate in a push-pull cooling arrange
`ment to cool the interior of the modular electronic enclosure.
`At least one filter is provided adjacent to a cooling unit to
`remove large particles entrained in airflowing into the enclo
`Sure. A cooling unit comprises four axial-flow fans mounted
`side by side in a tray connected to a front panel having a
`handle and lighted cooling unit status indicators.
`0015. In another embodiment, a multiple-core backplane
`is adapted for connection of up to ten AdvancedMCs on each
`side of the backplane. The multiple-core backplane has a
`thickness chosen to provide a sufficient number of layers for
`the number of interconnections to be made. Additional com
`bined card guides are coupled to the backplane, the chassis
`cover, and the chassis bottom to enable AdvancedMCs to
`enter the enclosure from the front or the back, thereby pro
`viding connections and mounting locations for up to twenty 4
`HP single-width AdvancedMCs in a 1U modular electronic
`enclosure. In other embodiments, a backplane may have more
`than two cores.
`0016. This section summarizes some features of the
`present embodiment. These and other features, aspects, and
`advantages of the embodiments of the invention will become
`better understood with regard to the following description and
`upon reference to the following drawings, wherein:
`
`BRIEF DESCRIPTION OF THE DRAWINGS
`
`0017 FIG. 1 is an isometric view of the front, top, and left
`side of a modular electronic enclosure having a height of 1 U.
`0018 FIG. 2 is an isometric view of the enclosure of FIG.
`1 with the chassis cover removed and further showing an
`example installation of two 4 HP AdvancedMCs and an
`MCH.
`0019 FIG. 3 is an isometric view of a backplane and
`backplane structural support for the embodiment of FIG. 1.
`0020 FIG. 4 is top view (rotated 90 degrees) of the back
`plane of FIG. 3.
`0021
`FIG. 5 is a top view of an example of a backplane
`having more than one core.
`0022 FIG. 6 is a simplified top view of the embodiment of
`FIG. 1, showing a row of five electronic modules installed in
`the modular electronic enclosure.
`0023 FIG. 7 is a simplified top view of an embodiment of
`a modular electronic enclosure having a multiple-core back
`plane and showing two rows of five electronic modules
`installed in the enclosure.
`
`

`

`US 2008/0298O14 A1
`
`Dec. 4, 2008
`
`0024 FIG. 8 is a partial enlarged sectional view of an
`example of a backplane having two cores. The viewing direc
`tion for FIG. 8 is shown by the line marked A-A in FIG. 7.
`0025 FIG. 9 is a partial sectional view of an embodiment
`of a backplane structural Support.
`
`DESCRIPTION
`0026. Embodiments of the invention include a modular
`electronic enclosure having a height of 1 U and adapted to
`operate with electronic modules having a size, an electrical
`interface, and a power requirement compatible with an
`AdvancedMC. Some electronic modules that are not compat
`ible with AdvancedMC standards may optionally be installed
`in the modular electronic enclosure. In an embodiment shown
`in FIG. 1, a modular electronic enclosure 1 comprises a chas
`sis cover 2, a chassis bottom 3, two cooling units 4, six
`combined card guides 5, and a pair of rack mounting flanges
`6. An open side of the modular electronic enclosure 1 through
`which several card guides 5 are visible is referred to hereinas
`the front of the enclosure. The modular electronic enclosure 1
`has a width adapted to fit between the rails of a 19-inch (482.6
`mm) rack. Two rack mounting flanges 6, one on either side of
`the chassis, enable attachment of the modular electronic
`enclosure 1 to the rails of a rack. In other embodiments, the
`modular electronic enclosure 1 has a width adapted to fit other
`rack sizes. The modular electronic enclosure 1 has a depth
`adapted to contain a 4 HP single-height AdvancedMC, a
`backplane, and related mechanical elements. In one embodi
`ment, the modular electronic enclosure has a depth of 7.87
`inches (200 mm).
`0027. The chassis cover 2 is formed into an enclosure top,
`an enclosure right side, and an enclosure left side, wherein the
`enclosure right side and enclosure left side are parallel to each
`other and at right angles to the enclosure top. A plurality of
`perforations formed in the chassis cover right side and the
`chassis cover left side enable air to flow into and out of the
`interior of the modular electronic enclosure 1. A first mount
`ing bracket 6 connected to the enclosure left side near the
`front of the enclosure and a second mounting bracket 6 con
`nected to the enclosure right side near the front enable attach
`ment of the modular electronic enclosure 1 to the rails of an
`equipment rack.
`0028. The embodiment of FIG.1 is shown with the chassis
`cover 2 removed in FIG. 2, thereby exposing components
`located in the interior of the enclosure. A cooling unit 4
`comprises four axial-flow fans and a front panel coupled to a
`metal tray that slides into the enclosure 1. The cooling unit 4
`is adapted to be hot-swappable. In other embodiments, a
`different number and type of fans may be used. The front
`panel of the cooling unit 4 includes lighted indicators to
`visually indicate the operating status of the cooling unit 4. A
`handle on the front panel of the cooling unit 4 is connected to
`a latching mechanism inside the cooling unit that helps retain
`the cooling unit 4 into the enclosure 1. The cooling unit is
`connected at a back surface to a backplane 9. Power is Sup
`plied to the cooling unit and status and monitoring signals
`pass between the cooling unit and an MCH 14, through the
`backplane 9 connection.
`0029. The combined card guides 5, six of which are shown
`in FIG.2, provide structural support to the modular electronic
`enclosure 1 and facilitate proper alignment and retention of
`AdvancedMCs installed in the enclosure. Some combined
`card guides 5 have one mounting channel for an electronic
`module and some card guides 5 have two parallel mounting
`
`channels for two electronic modules, coupled to the com
`bined card guide 5 one above another with a sliding fit in the
`mounting channel. The combined card guides 5 are attached
`to the chassis bottom 3 with threaded fasteners. The com
`bined card guides 5 are also connected to the chassis cover 2
`with threaded fasteners when the chassis cover 2 is in place. A
`distance separating two adjacent combined card guides 5 is
`chosen to enable a single-width AdvancedMC or an elec
`tronic module having a similar size to fit between the card
`guides 5 and couple with a sliding fit into channels formed in
`the card guides 5. In other embodiments, a number and loca
`tion of single-channel and two-channel combined card guides
`5 are selected to enable installation of double-width elec
`tronic modules. In other embodiments, a number and location
`of single-channel and two-channel combined card guides are
`selected to enable installation of quad-width electronic mod
`ules or alternatively, combinations of single-width, double
`width, and quad-width electronic modules. The combined
`card guides 5 are further positioned so as to align electrical
`connectors included as part of an electronic module to be
`installed in the modular electronic enclosure with corre
`sponding electrical connectors (10, 11, 12) attached to a Sur
`face of a backplane 9. A card guide 5 also includes attachment
`points to which a latching mechanism included with an elec
`tronic module connects when the electronic module is
`installed in the modular electronic enclosure 1.
`0030. An example of an MCH 14 installed in the modular
`electronic enclosure 1 is shown in FIG. 2. The MCH 14 is
`adjacent to a cooling unit 14 near the right side of the modular
`electronic enclosure 1. The MCH 14 is connected to the
`backplane 9 and exchanges control, data, and status signals
`with other parts of the modular electronic enclosure 1, with
`other electronic modules installed in the enclosure 1, and with
`external systems.
`0031. An example installation of electronic modules is
`shown in FIG. 2. Two electronic modules 13 having a size
`comparable to a 4 HP single-width AMC are coupled to
`combined card guides 5 near the right side of the modular
`electronic enclosure 1. A bar protruding from a face plate on
`an electronic module 13 in FIG. 2 represents an ejection and
`latching mechanism that couples an electronic module 13 to a
`combined card guide 5 and disconnects electronic module 13
`from the backplane 9 when removal of the electronic module
`13 from the enclosure is desired. As can be seen in FIG. 2,
`positions for up to ten single-width 4 HP electronic modules
`are provided in the enclosure embodiment described.
`0032. A back surface of the modular electronic enclosure
`embodiment of FIG. 1 and FIG. 2 comprises a backplane
`structural support 8. The backplane structural support 8 is
`also shown in FIG. 3. In the illustrated embodiment, the
`backplane structural support 8 is formed from extruded alu
`minum alloy. In other embodiments, the backplane structural
`support 8 is formed from machined or bent steel alloy or
`aluminum alloy. The backplane structural support 8 is formed
`with apertures and channels to engage with mechanical fas
`teners used to connect the backplane structural Support 8 to
`the backplane 9, the chassis bottom 3, the chassis cover 2
`(shown in FIG. 1), and support brackets for the cooling units
`4. The backplane structural support 8 cooperates with the
`chassis cover 2, chassis bottom 3, combined card guides 5.
`and Support brackets for the cooling units 4 to form a stiff,
`stable mechanical structure for the modular electronic enclo
`sure 1.
`
`

`

`US 2008/0298O14 A1
`
`Dec. 4, 2008
`
`0033. In some embodiments, the backplane structural Sup
`port includes an adjustable element to provide firm mounting
`of backplanes that may have variations in a thickness dimen
`Sion. Such variation may occur, for example, when the num
`ber of layers in a backplane is changed. FIG. 9 illustrates a
`cross-sectional view of a backplane structural Support 8 hav
`ing a movable backplane clamp 25 in contact with a surface of
`a backplane 9 and a surface of the backplane structural Sup
`port 8. A plurality of threaded fasteners 26 passing through
`threaded holes formed in the backplane structural support 8
`apply an adjustable amount of pressure to an angled Surface of
`the backplane clamp 25, thereby moving the backplane clamp
`25 until it comes into contact with a surface of the backplane
`9 and holding the backplane 9 firmly against the backplane
`structural Support 8. This configuration has the advantage of
`providing a fixed positional reference for an outer Surface of
`the backplane 9, that is, a surface of the backplane 9 upon
`which connectors are attached, where such positional refer
`ence is not dependent on a thickness dimension of the back
`plane 9.
`0034 Power and other electrical signals pass between
`components in the modular electronic enclosure 1 through the
`backplane 9. Timing, data, command, status, and other sig
`nals also pass between electronic modules and an MCH
`installed in the enclosure through the backplane 9. The back
`plane 9 is shown attached to the backplane structural support
`8 in FIG. 2 and FIG. 3. A top view of the backplane 9 and
`backplane structural support 8 from FIG. 3 is shown in FIG.
`4. Connectors attached to the backplane 9 enable connection
`of up to ten single-width 4 HP electronic modules. A first
`power connector 10 and a second power connector 11 located
`near an end of the backplane 9 are provided for connection of
`an AdvancedMC Power Unit. In a location adjacent to the
`power connector 12, two mating connectors for an edge con
`nector 12 are attached to the backplane 9, one immediately
`above the other. In other locations, a single mating connector
`for an edge connector 12 is provided for connection to an
`electronic module. In the embodiment shown in FIG. 4, a
`connector backing plate 15 is installed behind each connector
`on the backplane 9 to provide additional stiffness to the back
`plane 9. In other embodiments, the connector backing plate
`15 may be omitted.
`0035. In the embodiment shown in FIG. 2, FIG. 3, and
`FIG. 4, the first power connector 10 and the second power
`connector 11 are shown as separate connectors. In other
`embodiments, the functions of the first power connector 10
`and the second power connector 11 are combined into a single
`connector. Also, in other embodiments the order and arrange
`ment of power connectors (10, 11), mating connectors for an
`edge connector 12, and connectors for MCH 14 and cooling
`units 4 are changed to provide for a different arrangement of
`AdvancedMCs, electronic modules, MCH, and cooling units.
`In some embodiments, some of the connectors are compres
`Sion-type connectors.
`0036) A simplified top view of the embodiment of FIG. 1
`is shown in FIG. 6. FIG. 6 illustrates five single-width elec
`tronic modules 13 next to each other inside the modular
`electronic enclosure 1. A second row of five electronic mod
`ules may be installed below the row visible in the figure. The
`relative positions of the chassis cover 2, backplane Support 8,
`backplane 9, cooling units 4, power connectors (10, 11),
`mating connectors for an edge connector 12, and MCH14 are
`also indicated. A position for an air filter 17 is shown next to
`
`a cooling unit 4. The air filter 17 prevents large solid particles
`entrained in air from being drawn into the enclosure.
`0037. In an alternate embodiment, a length of the modular
`enclosure 1 is increased to enable the enclosure to contain up
`to twenty single-width 4 HP electronic modules. A simplified
`top view of the alternate embodiment is shown in FIG. 7. In
`comparison to the embodiment of FIG. 6, the embodiment of
`FIG. 7 has a multiple-core backplane 16 having at least two
`cores and electronic modules 13 may be installed from both
`the frontandback sides of the modular electronic enclosure 1.
`In the embodiment shown in FIG. 7, a first set of power
`connectors (10,11), mating connectors for an edge connector
`12, and other connectors are installed on a first side of a
`multiple-core backplane 16. A second set of power connec
`tors (18, 19) and mating connectors for an edge connector 12
`are installed on a second side of multiple-core backplane 16.
`The multiple-core backplane 16 has a thickness chosen to
`provide a sufficient number of layers for the number of inter
`connections to be made. In an alternate embodiment, the third
`power connector 18 and the fourth power connector 19 are
`replaced by mating connectors for an edge connector 12,
`thereby removing a position for a second Power Unit and
`increasing capacity for other types of AdvancedMCs. In other
`embodiments, the order and arrangement of power connec
`tors and mating connectors for an edge connector is changed
`to permit other arrangements of AdvancedMCs, electronic
`modules, cooling units, and MCH.
`0038 An enlarged sectional view of the multiple-core
`backplane 16 from FIG. 7 is shown in FIG.8. FIG.8 shows an
`example of the layers and vias comprising a multilayer
`printed circuit board having two cores. Some layers are insu
`lating layers and some layers contain electrical conductors.
`The multilayer printed circuit board is divided into two por
`tions, a first core 20 and a second core 21, separated by an
`insulating layer 22. In other embodiments, the multiple-core
`backplane 16 may have more than two cores.
`0039 Electrical connections are made between electrical
`conductors on separate layers by metallic-plated holes called
`vias. As shown in the example of FIG. 8, some vias 24 pen
`etrate all layers of the printed circuit board and are selectively
`connected to individual layers by joining the metallic plating
`in the via to a metallic electrical conductor in the circuit layer.
`Other vias, known as blind vias 23, do not penetrate all layers
`of the printed circuit board. Blind vias 23 may be selectively
`connected electrically to individual layers. A multiple-core
`backplane 16 requires the use of both regular vias 24 and
`blind vias 23 to form electrical connections between passive
`and active components and connectors on both sides of the
`backplane.
`0040. The present disclosure is to be taken as illustrative
`rather thanas limiting the scope, nature, or spirit of the Subject
`matter claimed below. Numerous modifications and varia
`tions will become apparent to those skilled in the art after
`studying the disclosure, including use of equivalent func
`tional and/or structural substitutes for elements described
`herein, use of equivalent functional couplings for couplings
`described herein, or use of equivalent functional steps for
`steps described herein. Such insubstantial variations are to be
`considered within the scope of what is contemplated here.
`Moreover, if plural examples are given for specific means, or
`steps, and extrapolation between or beyond Such given
`examples is obvious in view of the present disclosure, then the
`disclosure is to be deemed as effectively disclosing and thus
`covering at least Such extrapolations.
`
`

`

`US 2008/0298O14 A1
`
`Dec. 4, 2008
`
`Unless expressly stated otherwise herein, ordinary
`0041
`terms have their corresponding ordinary meanings within the
`respective contexts of their presentations, and ordinary terms
`of art have their corresponding regular meanings.
`What is claimed is:
`1. A modular electronic enclosure, comprising:
`a chassis, wherein said chassis is adapted for attachment to
`a nineteen-inch equipment rack;
`a backplane comprising a first Surface and a second Sur
`face, wherein said backplane is attached to said chassis,
`said backplane and said chassis are adapted to receive a
`first and a second mid-size single-width electronic mod
`ule in a horizontal orientation with said first electronic
`module positioned above said second electronic mod
`ule, said first and second electronic modules are
`AdvancedMCs; and
`a maximum height dimension of 1 U.
`2. The modular electronic enclosure as in claim 1, further
`comprising:
`a chassis cover, wherein said chassis cover is removably
`attached to a top side of said chassis;
`a chassis bottom, wherein said