`
`Re: JPH0942973A
`
`To Whom It May Concern:
`
`This is to certify that the above-referenced documents (390-45460_JPH0942973A_JA into
`EN) have been translated from Japanese into English by a professional translator on our
`staff who is skilled in the Japanese language.
`
`The English translation conforms essentially to the original Japanese except for those
`words or phrases for which there are no equivalents. Such words or phrases are noted
`in the translation along with the best English meaning.
`
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`knowledge, the aforementioned documents are a true, full, and accurate translation into
`English of the specified document.
`
`________________________
`TONJA SHEPARD
`
`Subscribed and sworn to before me on September 1, 2023.
`
`My commission expires on April 12, 2026
`
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`
`Nintendo Exhibit 1009
`Page 001
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`.(19) Japan Patent Office (JP)
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`(12) KOKAI LAID-OPEN
`PATENT PUBLICATION (A)
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`(51) Int.Cl.6
`G01C 19/56
`G01P
` 9/04
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`Identification Code
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`JPO File No.
`9402-2F
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`19/56
` 9/04
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`(11) Patent Application Publication No.
`Unexamined Patent Application
`No. Hei 9[1997]-42973
`(43) Publication date: February 14, 1997
`
`Technical Disclosure
`
`
`FI
`G01C
`G01P
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`Examination Request: Not requested Number of Claims: 20 OL (total of 27 pages)
`
`(21) Application No.
`
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`(22) Application Date
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`Japanese Patent Application
`No. H7[1995]-196404
`
`August 1, 1995
`
`(71) Applicant
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`(72) Inventor
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`(74) Representative
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`000003997
`Nissan Motor Co., Ltd.
`2 Takara-cho, Kanagawa-ku,
`Yokohama-shi, Kanagawa-ken
`Takeshi MITAMURA
`℅ 2 Takara-cho, Kanagawa-ku,
`Yokohama-shi, Kanagawa-ken
`Junnosuke NAKAMURA,
`patent attorney (and 1 other)
`
`
`
`(54) [Title of Invention]
`
` ANGULAR VELOCITY SENSOR
`
`(57) [Abstract]
`[Problem] To mass-produce and provide at low cost a compact
`and lightweight angular velocity sensor which is not susceptible
`to the effects of noise acceleration and other types of noise and
`achieves high
`sensitivity and high precision using
`semiconductor technology.
`[Solution] The present invention comprises a substrate; a
`vibrating mass, which is formed so as to be isolated from a main
`surface of the substrate, and which vibrates in first and second
`orthogonal axial directions; at least two supports which support
`the vibrating mass, are arranged symmetrically to the first and
`second axes, and have spring constants which are equal in both
`axial directions; driving electrodes and drive means, which are
`affixed to the substrate and drive the vibrating mass in the first
`axial direction; and detection electrodes and detection means,
`which are affixed to the substrate and detect displacement of the
`vibrating mass in the second axial direction. wherein the
`vibrating mass and the supports are maintained at a common
`potential, the driving electrodes are segmented in a manner
`allowing application of multiple voltage values, and when the
`vibrating mass is rotated around a third axis, which is
`perpendicular to the main surface of the substrate, while
`vibrating in the first axial direction, the Coriolis force produced
`in the second axial direction is detected, and the angular velocity
`around the third axis is measured.
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`Nintendo Exhibit 1009
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`Patent Application No. H9-42973
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`[SCOPE OF THE PATENT CLAIMS]
`[Claim 1] A angular velocity sensor, comprising: a substrate; a vibrating mass which is formed so as to be
`isolated from a main surface of the substrate and which vibrates in first and second orthogonal axial
`directions within the main surface of the substrate; at least two supports which support the vibrating mass,
`one end of each being affixed to the vibrating mass and the other end being affixed to the substrate, are
`arranged symmetrically to the first and second axes, and have spring constants which are equal in both axial
`directions; driving electrodes and drive means which are affixed to the substrate and drive the vibrating
`mass in the first axial direction; and detection electrodes and detection means which are affixed to the
`substrate and detect displacement of the vibrating mass in the second axial direction; wherein the vibrating
`mass and the supports are maintained at a common potential, the driving electrodes are segmented so that
`a plurality of voltage values can be applied, and when the vibrating mass is rotated around a third axis
`which is perpendicular to the main surface of the substrate while vibrating in the first axial direction, the
`Coriolis force produced in the second axial direction is detected, and the angular velocity around the third
`axis is measured.
`[Claim 2] The angular velocity sensor as claimed in claim 1, wherein the supports can displace and deform
`within the main surface of the substrate, have a structure symmetrical to axes bisecting the angles formed
`by the first and second axes within the main surface of the substrate, and have spring constants which are
`equal to each other in the first and second axial directions.
`[Claim 3] The angular velocity sensor as claimed in claim 2, wherein the supports are configured such that
`a plurality of elastic structures capable of displacement and deformation within the main surface of the
`substrate are disposed symmetrically to axes bisecting the angles formed by the first and second axes within
`the main surface of the substrate and have spring constants which are equal to each other in the first and
`second axial directions.
`[Claim 4] The angular velocity sensor as claimed in claim 1, wherein the driving electrodes are pairs of
`electrodes arranged opposite side surfaces of the vibrating mass so as to produce driving force in the positive
`and negative directions of the first axis, and are two capacitance terminals connected to the common
`potential of the vibrating mass and the supports.
`[Claim 5] The angular velocity sensor as claimed in claim 1, wherein the Coriolis force detection electrodes
`are pairs of electrodes disposed opposing side surfaces of the vibrating mass to detect displacement in the
`positive and negative directions of the second axis, being pairs of capacitance terminals connected to the
`common potential of the vibrating mass and the supports.
`[Claim 6] The angular velocity sensor as claimed in claim 4, further comprising a means for detecting the
`amplitude of the vibration of the vibrating mass when driven and controlling the amplitude of the vibration
`so as to be constant.
`[Claim 7] The angular velocity sensor as claimed in claim 5, wherein a reference capacitance is connected
`to each of the detection electrode terminals, a read-out signal is input into the detection electrodes via the
`reference capacitances, and displacement of the vibrating mass in the second axial direction is detected
`based on signals produced in the detection electrode terminals.
`[Claim 8] The angular velocity sensor as claimed in claim 6, wherein a reference capacitance is connected
`to each of the driving electrode terminals in the first axial direction of the vibrating mass, drive voltage is
`input into the driving electrodes via the reference capacitances, the drive amplitude is detected based on the
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`Nintendo Exhibit 1009
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`voltage produced in the detection electrode terminals, the drive voltage is controlled based on the voltage
`produced in the detection electrodes, and the drive amplitude is controlled so as to be constant.
`[Claim 9] The angular velocity sensor as claimed in claim 1, wherein the vibrating mass and the supports
`are made of deposited polysilicon, and the substrate is a semiconductor substrate.
`[Claim 10] The angular velocity sensor as claimed in claim 9, wherein the drive means for the vibrating
`mass and the displacement detection means for the vibrating mass are integrated on the same semiconductor
`substrate.
`[Claim 11] The angular velocity sensor as claimed in claim 1, wherein the vibrating mass, the supports, and
`the substrate are configured using a semiconductor substrate.
`[Claim 12] The angular velocity sensor as claimed in claim 1, wherein the vibrating mass and the supports
`are made of metal deposited using a plating method, and the substrate is a semiconductor substrate.
`[Claim 13] The angular velocity sensor as claimed in claim 11 or 12, wherein the drive means for the
`vibrating mass and the displacement detection means for the vibrating mass are integrated on the same
`semiconductor substrate.
`[Claim 14] A angular velocity sensor, provided with a pair of the angular velocity sensors as claimed in
`claim 1, wherein the vibrating masses are driven in opposite phases in the first axial direction, the angular
`velocity around the third axis is measured using the difference in detected output in the second axial
`direction, and acceleration in the second axial direction is measured by the sum of the detected output in
`the second axial direction.
`[Claim 15] The angular velocity angular velocity sensor as claimed in claim 1, wherein the driving
`electrodes are opposing electrodes made up of at least four electrically independent electrodes, drive
`voltages V1 and V2 are simultaneously applied to at least two of the four electrodes to drive the vibrating
`mass in the first axial direction using the electrostatic force produced between the opposing electrodes, and
`information relating to the drive amplitude in the first axial direction of the vibrating mass is detected from
`the sum of C1 and C2 and information relating to displacement of the vibrating mass in the second axial
`direction due to the Coriolis force is detected from the difference between C1 and C2, where C1 and C2 are
`the electrostatic capacitances between the vibrating mass and at least two of the electrodes making up the
`opposing electrodes.
`[Claim 16] The angular velocity sensor as claimed in claim 15, comprising a control mechanism, which
`detects information relating to displacement of the vibrating mass in the second axial direction due to the
`Coriolis force from the difference between C1 and C2, where C1 and C2 are the electrostatic capacitances
`between the vibrating mass and at least two of the electrodes making up the opposing electrodes, uses the
`information thus obtained to adjust the amplitudes of the drive voltages V1 and V2 applied simultaneously
`to at least two of the electrodes making up the opposing electrodes relative to the potential of the vibrating
`mass, and cancels out the Coriolis force produced in the vibrating mass.
`[Claim 17] The angular velocity sensor as claimed in claim 15 or 16, comprising a control mechanism,
`which detects information relating to the drive amplitude in the first axial direction of the vibrating mass
`from the sum of C1 and C2, where C1 and C2 are the electrostatic capacitance between the vibrating mass
`and at least two of the electrodes making up the opposing electrodes, uses the information thus obtained to
`adjust the amplitude of the drive voltages V1 and V2 applied simultaneously to at least two of the electrodes
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`Nintendo Exhibit 1009
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`making up the opposing electrodes relative to the potential of the vibrating mass, and makes the drive
`amplitude of the vibrating mass constant.
`[Claim 18] The angular velocity sensor as claimed in any one of claims 15 to 17, wherein the drive voltage
`applied to the vibrating mass is the sum signal of a voltage that varies over time at a first frequency and a
`voltage that varies over time at a second frequency which is higher than the first frequency, a reference
`capacitance Cref is connected to at least two of the electrodes making up the opposing electrodes, the drive
`voltage is applied to the opposing electrodes via the reference capacitance Cref, and the potential of the
`connection points between at least two of the electrodes making up the opposing electrodes and the
`reference capacitance Cref is detected in sync with the second frequency and the first frequency, thereby
`measuring the electrostatic capacitances C1 and C2 between the vibrating mass and at least two of the
`electrodes making up the opposing electrodes.
`[Claim 19] The angular velocity sensor as claimed in any one of claims 15 to 17, wherein the drive voltage
`of the vibrating mass is a voltage which varies over time at a first frequency, a first time band being provided
`during which the drive voltage is not applied and instead a carrier voltage is applied; a reference
`capacitance Cref is connected to at least two electrodes making up the opposing electrodes; the drive
`voltage is applied to the opposing electrodes via the reference capacitances Cref; and the potential of the
`connection points between at least two of the electrodes making up the opposing electrodes and the
`reference capacitances Cref is detected in sync with the carrier voltage, thereby measuring the electrostatic
`capacitances C1 and C2 between the vibrating mass and at least two of the electrodes making up the
`opposing electrodes.
`[Claim 20] The angular velocity sensor as claimed in any one of claims 15 to 17, wherein the drive voltage
`of the vibrating mass is a voltage which varies over time at a first frequency and is provided with a first
`time band during which the voltage is not applied; a reference capacitance Cref is connected to at least two
`of the electrodes making up the opposing electrodes; the drive voltage is applied to the opposing electrodes
`via the reference capacitances Cref; the carrier voltage is applied to the vibrating mass during the first time
`band; and the potential at the connection points between the reference capacitances Cref and at least two of
`the electrodes making up the opposing electrodes is detected in sync with the carrier voltage[sic; not
`mentioned in the cited claims 15 to 17], thereby measuring the electrostatic capacitances C1 and C2 between
`the vibrating mass and at least two of the electrodes making up the opposing electrodes.
`[DETAILED DESCRIPTION OF THE INVENTION]
`[0001]
`[Technical Field of the Invention] The present invention relates to an angular velocity sensor, which is
`lightweight, mass-producible, and highly accurate.
`[0002]
`[Prior Art] The first conventional example shown in Figure 30 is an example of a conventional angular
`velocity sensor. Figure 2 shows an oscillator which has a square cross-section, is formed from a constant-
`elasticity metal such as Elinvar, and is supported by supports 3. A piezoelectric drive element 4 and a
`piezoelectric detection element 1 are affixed to side surfaces of the oscillator. The oscillator is driven and
`oscillated in the x-axis direction in the figure by applying an AC voltage having a resonant frequency in the
`x-axis direction to the piezoelectric drive element 4, causing it to become strained. In this state, if the
`oscillator is rotated at an angular velocity Ω around the z-axis direction in the figure, a Coriolis force is
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`Nintendo Exhibit 1009
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`produced in the y-axis direction in the figure. The Coriolis force Fc(t) produced in the entire oscillator is
`represented by equation (1) below.
`[0003]
`
`
`Here, Vm(r,t) is the velocity in the x-axis direction of a differential element with mass dm(r), produced by
`driving the oscillator. The integration range is the entire oscillator. The oscillator flexes in the y-axis
`direction due to the produced Coriolis force, and the strain produced by this flexing is detected by the
`detection piezoelectric element 1.
`It can be seen from equation (1) that, in order to produce a greater Coriolis force, it is useful to a: increase
`the mass of the oscillator, b: drive at the resonant frequency to increase Vm, and c: make the resonant
`frequency the same for the drive axis and the detection axis to increase displacement along the detection
`axis, and that to precisely detect the produced Coriolis force, it is necessary to d: keep the oscillation
`amplitude of the oscillator constant. However, the angular velocity sensor in this first conventional example
`entails the following problems, among others, a: there is a limit to how small it can be made since the
`oscillator and supports are fabricated by machining, and b: it is difficult to adjust the resonant frequencies
`in the various axial directions of the oscillator, which increases mechanical adjustment costs.
`[0004] To solve these problems, JP H5-248872 A discloses an angular velocity sensor as shown in
`Figure 31 and Figure 32 (which is a cross-sectional view along line A-A' in Figure 31). This configuration
`is described with reference to these drawings. In this second conventional example, an oscillator is
`configured on a substrate 12 made out of silicon or the like. The oscillation system consists of a vibrating
`mass 10, intermediate supports 11, and supports 8. The vibrating mass 10, the intermediate supports 11,
`and the supports 8 are formed from a polysilicon layer. The supports 8 are affixed to the silicon substrate 12
`by anchors 7 and electrically connected to a conductive pattern. 5 indicates securing sections. Wiring is left
`out of the figure for the sake of simplicity. The intermediate supports 11 are supported between the
`anchors 7 by the supports 8. The vibrating mass 10 is supported by the supports 8 arranged in a cross shape
`in the x- and y-axis directions with the vibrating mass at the center. A pair of driving electrodes 6 for driving
`the vibrating mass 10 in the x-axis direction using electrostatic force are formed on side surfaces of the
`intermediate supports 11. Detection electrodes 9 for detecting displacement in the y-axis direction due to
`the Coriolis force are formed on side surfaces of the other pair of intermediate supports.
`[0005] Next, the operation of the second conventional example will be described. The vibration system is
`
`driven using electrostatic force by applying drive voltages Vp + vd ⋅ sin ωt and Vp − vd ⋅ sin ωt to the pair
`of driving electrodes 6. Note that Vp is a DC bias power supply and vd ⋅ sin ωt is a drive AC power supply.
`
`The drive frequency ω is made to match the resonant frequency of the vibration system in the x-axis
`direction. In this state, if the vibration system made up of the vibrating mass, the intermediate supports, and
`the supports is rotated at an angular velocity Ω around the z-axis direction, a Coriolis force is produced in
`the y-axis direction. The Coriolis force produced is represented by equation (2) below.
`[0006]
`
`
`Here, m is the mass of the vibrating mass 10, and Vm(t) is the velocity of the vibrating mass 10 driven by
`electrostatic force. Note that the mass of the intermediate supports is assumed to be significantly less than
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`the vibrating mass. The angular velocity Ω can thus be detected from the capacitance values between the
`detection electrodes 9.
`[0007] The configuration of this second conventional example provides the following advantages, among
`others, over the problems described above with respect to the first conventional example a: semiconductor
`manufacturing technology makes it possible to realize an inexpensive and lightweight angular velocity
`sensor (for problem an in the first conventional example); b: the vibration system is configured as a flat
`structure formed from a polysilicon layer and the directions of driving and detection are horizontal to the
`plane of the substrate, so a three-dimensional structure is not needed, making it possible to simplify the
`structure (for problem a in the first conventional example); c: the vibration system is a flat structure formed
`from a polysilicon layer and is symmetrical to the directions of driving and detection, so the resonant
`frequencies are the same in each direction, improving sensitivity (for problem b in the first conventional
`example); d: the driving and detection directions are horizontal to the plane of the substrate, so the
`dependencies on the cross-sectional shape of the supports are the same in the drive axis and detection axis
`directions, meaning there is no relative variation in the values of the resonant frequencies in each direction
`due to fabrication process variations (for problem b in the first conventional example); and e: the drive axis
`and the detection axis are both horizontal to the plane of the substrate, so in a vibrating state the effect of
`air viscosity is reduced, the Q value during resonance is greater, and detection sensitivity is improved.
`[0008] However, in the second conventional example, the vibrating mass is supported by the supports in a
`manner allowing displacement in only one direction, so the second conventional example entails the
`following problems, among others a: the vibrating mass is connected to the intermediate supports via pairs
`of supports extending in the y-axis direction, so the intermediate supports on either side in the x-axis
`direction are drawn in the direction of the vibrating mass together with the supports when driven in the x-
`axis direction (see Figure 33), resulting in the intermediate supports 11 vibrating in the y-axis direction at
`twice the drive frequency in positions offset towards the vibrating mass from their positions when at rest,
`which causes a difference in the vibration modes in the detection direction and the drive direction, making
`the vibration control of the vibrating mass needed for high-precision measurement of the angular velocity
`difficult, and any differences arising in the left-right vibration due to manufacturing variations, etc., in the
`supports will produce a drive signal-induced output signal, resulting in a drop in the detection signal S/N
`ratio; b: the drive and detection directions have the same resonance frequency, so there is the possibility of
`resonance in the detection axis direction due to any detection-direction components in the driving force
`caused by asymmetry in the structure due to manufacturing variations, etc., in the supports, and in the case
`of this second conventional example, such drive-induced vibration cannot be controlled and might be
`detected as an output signal, reducing the measurement precision.
`[0009] A angular velocity sensor utilizing semiconductor technology is disclosed in JP H5-312576 A. This
`third conventional example is described with reference to Figure 34 and Figure 35 (a cross-sectional view
`along line A-A' in Figure 34). In the figures, 63 and 65 are silicon substrates and 64 is an oxide film. The
`oxide film 64 is formed on the silicon substrate 65, patterned, and joined to the silicon substrate 63 using a
`direct bonding method, after which the silicon substrate 63 is polished to a prescribed thickness. 59 indicates
`trenches formed by etching the silicon substrate 63 using semiconductor manufacturing technology. The
`vibrating mass, first and second supports, and frame described hereafter are formed by these trenches 59.
`61 is a vibrating mass which is supported by first supports 60. The sides of the first supports 60 opposite
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`the connections to the vibrating mass 61 form connections to the frame 57. The frame 57 is supported by
`second supports 56. Comb electrodes 62 are configured on the frame 57 for driving the vibrating mass 61
`to vibrate in the x-axis direction using electrostatic force. To detect displacement of the vibrating mass 61
`caused by the Coriolis force, resistor bridges are configured by piezo resistors 55 disposed in parallel pairs
`on each support near where the first supports 60 connect to the frame 57, and detection electrodes 58 are
`configured on the vibrating mass 61 and the frame 57 (detailed electrical wiring is left out of the diagram
`for the sake of simplicity).
`[0010] The frame 57 supported by the second supports 56 is driven by electrostatic force in the x-axis
`direction when voltage is applied to the comb electrodes 62 (detailed electrical wiring is left out of the
`diagram for the sake of simplicity). When the entire system is rotated at an angular velocity Ω around the
`z-axis direction. which is perpendicular to the plane of the substrate in this state, the same Coriolis force as
`represented in equation (2) above is produced in the y-axis direction. The displacement of the vibrating
`mass 61 in the y-axis direction due to the Coriolis force produced is detected as the difference in resistance
`between the piezo resistors 55 and changes in the capacitance between the detection electrodes 58.
`[0011] This third conventional example provides the following advantages, among others a: semiconductor
`technology is used, so an inexpensive, lightweight angular velocity sensor can be realized; b: the drive axis
`and the Coriolis force detection axis are both parallel to the plane of the substrate, so the resonant frequency
`in the drive axis and detection axis directions can be determined using a flat structure; and c: the drive axis
`and the detection axis are both parallel to the plane of the substrate, so in a vibrating state the effect of air
`viscosity is reduced, the Q value during resonance is greater, and detection sensitivity is improved.
`However, because the vibrating mass consists of a semiconductor in the third conventional example, the
`mass m in equation (2) is small, making the Coriolis force that is produced small enough to be practically
`undetectable by the resistor bridges configured using the piezo resistors 55, meaning displacement of the
`vibrating mass has to be measured using changes in the electrostatic force of the detection electrodes 58.
`But since the detection electrodes 58 are formed on side surfaces of the vibrating mass 61 and the frame 57,
`the area of opposition is small, making it impossible to achieve a sufficiently large capacitance value. This
`results in the problem of being unable to achieve a sufficiently high S/N ratio when measuring displacement
`of the vibrating mass. It is also difficult to achieve a sufficiently large area of opposition even for the comb
`electrodes 62 which are for driving the vibrating mass, resulting in the problem of being unable to obtain
`sufficiently large drive amplitude. Furthermore, electrical connections have to be established via the
`supports to the comb electrodes 62 and either the piezo resistors 55 (which detect displacement of the
`vibrating mass 61 due to the produced Coriolis force) or the detection electrodes 58 (which detect
`displacement of the vibrating mass relative to the frame 57), and moreover the various parts also have to be
`electrically isolated, but making the supports and driving electrodes sufficiently fine is difficult, which is a
`problem. Moreover, if a metal such as aluminum is used in the aforementioned electrical connections,
`differences arise in the thermal expansion coefficients between the metal and the insulation film or silicon,
`which are the structures forming the supports, thereby producing warping, etc., in the structure due to any
`heat stress that might be generated and resulting in possible offsets in the output, as well as plastic
`deformation in the metal parts due to significant deformation of the supports, possibly creating deterioration
`over time in the output, which are also problems.
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`[0012]
`[Problem to be Solved by the Invention] The present invention provides an angular velocity sensor that is
`compact and lightweight, provides accurate detection results, and can easily be mass-produced, thereby
`solving the various problems of the prior art described above.
`[0013]
`[Means for Solving the Problem] To solve this problem, the present invention comprises: a substrate; a
`vibrating mass. which is formed so as to be isolated from a main surface of the substrate, and which vibrates
`in first and second orthogonal axial directions within the main surface of the substrate; at least two supports
`which support the vibrating mass, one end of each being affixed to the vibrating mass and the other end
`being affixed to the substrate, are arranged symmetrically to the first and second axes, and have spring
`constants which are equal in both axial directions; driving electrodes and drive means which are affixed to
`the substrate and drive the vibrating mass in the first axial direction; and detection electrodes and detection
`means which are affixed to the substrate and detect displacement of the vibrating mass in the second axial
`direction; wherein the vibrating mass and the supports are maintained at a common potential, the driving
`electrodes are segmented so that a plurality of voltage values can be applied, and when the vibrating mass
`is rotated around a third axis which is perpendicular to the main surface of the substrate while vibrating in
`the first axial direction, the Coriolis force produced in the second axial direction is detected, and the angular
`velocity around the third axis is measured.
`[0014] Instead of separately providing the driving electrodes which drive in the first axial direction and the
`detection electrodes which detect displacement in the second axial direction, as described above, it is also
`possible, while keeping the configuration of using opposing electrodes consisting of two [sic? pairs of?]
`electrically independent electrodes, to apply drive voltages V1 and V2 simultaneously to these two
`electrodes so as to use the electrostatic force produced between the opposing electrodes to drive the
`vibrating mass in the first axial direction, and to detect information relating to the drive amplitude of the
`vibrating mass in the first axial direction from the sum of C1 and C2, and to detect information relating to
`displacement of the vibrating mass due to the Coriolis force in the second axial direction from the difference
`between C1 and C2, where C1 and C2 are the electrostatic capacitances between the two fixed electrodes
`comprising the opposing electrodes and the electrodes on the vibrating mass, thereby using one type of
`electrode for both driving and Coriolis force detection.
`[0015]
`[Operation] The driving electrodes are segmented to allow a plurality of voltage values to be applied
`independently, so problems can be avoided even if the vibrating mass or supports are formed
`asymmetrically to the first axial direction during the manufacturing process.
`[0016]
`[Embodiments] The present invention will now be described below in further detail with reference to
`embodiments.
`[0017] First embodiment: The first embodiment is described with reference to Figure 1 and Figure 2 (a
`cross-sectional view along line B-B' in Figure 1). This embodiment corresponds to claims (1), (2), and (4)-
`(15). The basic configuration is described first. 14 is a vibrating mass formed from a thin-film structural
`material. The vibrating mass 14 is connected at each of four corners to supports 16 which are formed from
`the same thin-film structural material and have spring constants which are equal in the x (first axis) and y
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`(second axis) axial directions. Note that in the diagrams, the supports are shown schematically. The
`supports 16 are arranged symmetrically to the x- and y-axes as shown in the diagram. The other ends of the
`supports are affixed to the substrate at securing sections 17 and are electrically connected to a conductive
`material (the wiring is not shown in order to simplify the drawings). Comb-shaped electrodes are formed
`on side surfaces of the vibrating mass 14, with driving electrode pairs 13 being formed for driving the
`vibrating mass 14 in the x-axis direction using the electrostatic force between themselves and the comb-
`shaped opposing electrodes which are connected to the securing sections 17. The driving electrode pairs 13
`are shown enlarged in Figure 5(a). The comb-shaped driving electrodes affixed to the substrate consist of
`electr