Alexander D. Glew, Ph.D., P.E.
`
`Employment History
`
`From: 1997
`To:
`Present
`Position:
`
`From: Aug 1987
`To:
`Jan 1997
`Titles
`Project Mgr.
`Jan 1996 to
`Jan 1997
`
`CVD
`Supplier
`Quality
`Engineering
`Manager
`
`Glew Engineering Consulting, Inc.
`Mountain View, California
`President & CEO
`Clients include semiconductor equipment, plasma generation,
`vacuum systems, fluid delivery systems, flow and pressure
`component suppliers, laser manufacturers, consumer electronics,
`industrial electronics, vehicles, telecommunications, etc.
`Consulting work includes thin film characterization, process
`development, project turn-around/rescue, gas flow and vacuum
`metrology, design of experiments, corrosive gas applications,
`finite element analysis, and related market analysis.
`Applied Materials, Inc.
`Santa Clara, California
`Engineering Manager, Core-Technologist
`I sat on the corporate engineering/technology (ET)
`•
`council, one of 15 council members. Responsible for corporate
`direction in high purity processing, gas, and chemical delivery
`technology for all divisions, including CVD, EPI, PVD, RTP,
`ETCH, PRS, Thermal Processing, CMP, Flat Panel Display, and
`others. Also, qualified gas and vacuum component selections. In
`addition, I consulted with all divisions on gas and vacuum
`systems, liquid source delivery systems, components, chemical
`and process gas, and supplier selections.
`I received a patent for improved tungsten (W) CVD
`•
`deposition with carbon doping.
`I successfully proposed and executed a project that
`•
`SEMATECH S100 funded. The goal was to develop industry
`methods to determine the effects of trace chemicals on
`semiconductor processing and equipment reliability. This work
`resulted in two SEMATECH Technology Transfers listed below.
`First, we introduced ppb levels of impurities into both a
`Tungsten CVD deposition process and an aluminum etching
`process. Subsequently, we examined the effect on particle
`generation, deposition rate, uniformity, selectivity, and
`incorporation into the film. This work resulted in a 30% increase
`
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`Core
`Technologist
`
`
`
`CVD
`Engineering
`Manager
`
`
`
`
`
`
`
`
`
`
`Systems
`Engineer
`
`
`in deposition rate. Similarly, we introduced ppb-ppm levels of
`impurities into HBr gas systems and conducted accelerated
`lifetime tests at three sites across the country. Also, we measured
`gas composition in situ of Tungsten CVD and Al Etch process
`by quadrupole mass spectrometry.
`I managed gas, vacuum, and chemical components,
`•
`evaluation, testing, and supplier quality management. Also, I led
`an engineering group that tested and recommended gas, vacuum,
`and chemical component for the CVD division and developed
`process controls at suppliers. In addition, I supervised the
`laboratory and trained individuals to create specialized testing
`capabilities to characterize gas delivery and vacuum
`components. Also, I supported Etch, PVD, and other divisions
`with shared suppliers, including vacuum pumps, vacuum
`transducers, flow controllers, valves, etc.
`I managed a group of engineers and support personnel
`•
`who developed gas panels and liquid source chemical delivery
`systems for dielectric deposition. Delivered TEOS, TMP, TMB,
`and many other organometallic precursors for USG, PSG, and
`BPSG dielectric deposition. Developed organometallic CVD
`systems extensively. We designed multiple liquid source
`delivery systems for organometallic chemical precursors, i.e.
`bubblers, boilers, and injectors.
`I managed the CVD division design support group: CAD
`•
`designers, drafters, and CAD systems for division. I brought in
`first 3D CAD systems and the first FEA program.
`I established and managed the customer engineering
`•
`special group for the CVD division, which engineered all
`equipment modifications to meet customer specifications. These
`modifications included changes across the entire system,
`including process chambers, vacuum systems, gas delivery,
`power distribution, safety, and robotics.
`I worked on the development and release of a landmark
`•
`product, the Precision 5000 CVD, one of which is now in the
`Smithsonian Institute. This was the first cluster tool for
`semiconductor manufacturing.
`I developed dielectric layers of silicon dioxide (glass or
`•
`USG), boron phosphorous silicon glass (BPSG), phosphorous
`silicon glass (PSG), nitride, oxy-nitride, and others.
`I was responsible for flow and vacuum equipment
`•
`suppliers for the company including MFC, valves, mechanical
`vacuum pumps, cryo-pumps, dry pumps, and others. Supported
`multiple divisions on these matters.
`
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`Doctoral Dissertation:
`
`From:
`To:
`
`
`
`1996
`2002
`
`
`
`Consulting History
`
`From: 2022
`To
`Ongoing
`
`
`
`Stanford University
`Stanford, California
`Ph.D.
`Completed a dissertation in the department of Materials Science &
`Engineering leading to the Ph.D. degree.
`Research includes:
`• Plasma Deposition of Diamond-Like Carbon and
`Fluorinated Amorphous Carbon and the Resultant Properties and
`Structure.
`• Characterized stress, strain and hardness of films. Related
`the stress energy state to the diamond like nature of the thin films.
`Investigation of deposition mechanism fluorinated
`•
`amorphous carbon (FLAC) and diamond-like carbon (DLC), low k
`dielectric materials.
`• Modeled and conducted experiments on mechanism of ion
`energy, momentum and flux dependence for FLAC and DLC film
`synthesis in radio-frequency plasma discharges, including
`competing mechanisms of sub-plantation, ion-peening, sputtering,
`and etching.
`• Constructed and instrumented a multi-purpose processing
`chamber for PE-CVD, etch, and sputtering with measurement
`capability.
`• Fabricated MIS capacitors to investigate the dielectric
`properties of fluorinated amorphous carbon (FLAC). Performed all
`wafer processing to construct MIS capacitors, including
`lithography, etch, CVD and PVD.
`• Conducted thin film analysis including UV absorption
`spectroscopy, spectral ellipsometry, multi-incident angle
`ellipsometry, Fourier transform infrared spectroscopy, profilometry,
`nano-indentation, RBS, HFS, nano-indentation, and gravimetric
`measurements.
`• Modeled dielectric properties and dispersion relationship of
`fluorinated amorphous carbon (FLAC), and compared spectral
`ellipsometric measurements to results of electrical CV tests and
`thickness measurements by profilometry using MIS structures.
`
`JRCO
`Professional Engineering review and FEA analysis of an electric
`vehicle used as float at Disneyland,”It’s a Small World.”
`
`From: 2021
`To:
`2021
`
`Global Foundries
`Review patent portfolio.
`
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`From: 2020
`To
`2022
`
`Sydney Metro, Australia
`Analysis of the all of the equipment, its replacement, startup, and
`the cost of moving a semiconductor FAB in order to put a metro
`rail line through the area. Client (Syndey Metro) received a
`favorable ruling from the Valuer General.
`
`From: 2019
`To:
`2020
`
`TDA Research Institute
`Analysis of a high-temperature battlefield hydrogen reactor.
`
`From: 2019
`To:
`2019
`
`From: 2019
`To:
`2019
`
`LED Manufacturer
`FEA thermal analysis of new LED designs.
`
`Elwood Mill Products
`Professional Engineering review of capital equipment. Finite
`element analysis.
`
`
`
`
`
`
`
`
`
`
`
`From: July 2017
`To:
`Dec 2017
`
`
`
`From: April 2017
`To:
`May 2017
`
`
`
`From: 2017
`To:
`Ongoing
`
`From: Sept. 2017 UNICO
`To:
`Jan 2018
`Finite element analysis of new product concepts.
`
`
`Elwood National Forge
`Professional Engineering review of capital equipment. Finite
`element analysis.
`
`Jon Richards Co. (for Disneyland)
`Professional Engineering review of electric vehicle used as a float
`at Disneyland, the Marvel Avenger’s Mobile™.
`
`Licensed Mechanical Engineering
`Professional Engineering letters and calculations for submission to
`building and environmental health departments. Miscellaneous
`clients.
`
`Carbontech
`Obtain UL listing for thin film carbon heaters.
`
`
`Solas
`Reverse engineering of OLED displays and technology.
`
`
`Tashjian & Padian
`Reverse engineering of OLED displays and technology.
`
`
`
`From: 2016
`To:
`2018
`
`
`From
`To
`
`
`2018
`2018
`
`
`
`From: 2016
`To:
`2018
`
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`From: 2016
`To:
`2017
`
`From: 2016
`To:
`2017
`
`
`
`From: 2016
`To:
`2016
`
`
`
`From: 2015
`To:
`2016
`
`
`
`From: 2015
`To:
`2015
`
`Duties
`
`
`
`From: 2015
`To:
`2016
`
`Duties
`
`
`
`
`
`
`
`From: 2013
`To:
`2014
`
`Duties
`
`
`
`
`
`From: 2012
`To:
`2013
`
`Duties
`
`
`
`
`
`
`
`
`
`
`
`VWR
`Review of new semiconductor technologies for etching and
`particle reduction in semiconductor processing chambers
`
`
`TDA Research
`Finite element analysis of effluent treatment system for power
`plant carbon reduction treatments.
`
`Champion Telecom
`Engineering support, Finite element analysis, and design of “Cell
`Towers on Wheels” (COWs). Multiple projects. Analysis of trucks
`used to support emergency telecommunications.
`
`
`Phiston Engineering
`Review the ability of equipment to destroy flash memory.
`Generate reports for clients to submit to NSA and others.
`
`United States Air Force
`Concluded
`Advanced semiconductor process equipment engineering for Air
`Force Laboratory. CVD equipment design, control circuitry, and
`related hardwar.
`
`VADA
`
`Fluid analysis of venting device to avoid building catastrophy..
`
`
`
`
`Watlow
`
`Development of wafer chuck heating device for silicon processing.
`This has led to multiple patents.
`
`
`Solar Cell Manufacturing Factory Explosion at SolarWorld, OR.
`
`Analysis, measurement, and report on explosion of CVD
`equipment in solar manufacturing factory: PECVD Silicon Nitride
`Process. Work performed for insurance company.
`
`
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`Testimony
`
`Client
`Case
`
`Project
`Dates
`Status
`
`Client
`
`Case
`
`Project
`Dates
`Status
`
`Client
`Case
`Project
`Dates
`Status
`
`Client
`Case
`Project
`Dates
`Status
`
`BOE Technology Group Co
`In the Matter of Certain Organic Light-Emitting Diode Display Modules and
`Components Thereof(Inv. No. 337-TA-1378)
`
`Samsung Display Corp v BOE Technology Group Co et al.
`ITC matter
`March 2024 ongoing
`Ongoing
`
`Kawasaki Jukogyo Kabushiki Kaisha (Crowell Moromg LLP) vs. Rorze
`Corporation and Rorze Automation, Inc.,
`UNITED STATES DISTRICT COURT
`NORTHERN DISTRICT OF CALIFORNIA
`SAN JOSE DIVISION
`Case No. 5:22-cv-04947-EJD (SVK)
`Semiconductor equipment patents
`2023 - ongoing
`Ongoing
`
`Daedulus Prime (Mintz Levin) vs. Samsung and TSMC
`International Trade Commission 337-TA-1336
`Semiconductor patents
`2022
`Settled in September 2023
`
`IFT (Mintz Levin) vs. Samsung and TSMC
`IFT v. Micron
`Semiconductor patents
`2022
`Settled
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`Client
`
`Case
`
`
`Project
`Dates
`
`Status
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`
`
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`
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`
`
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`
`
`
`Silanna vs. Sydney Metro West (Ashurst)
`
`Class 3 Proceedings in the Land & Environment Court Case: Silanna
`
`Semiconductor Pty Ltd v Sydney Metro (2022/00004763).
`
`
`
`Eminent domain of a semiconductor facility
`
`2021 – 2022.
`
`
`
`
`Settled in mediation.
`
`
`
`
`
`
`
`
`
`
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`Client
`Case
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`Project
`Dates
`Status
`
`Client
`
`Case
`
`Project
`Dates
`Status
`
`Client
`Case
`
`Project
`Dates
`
`Client
`
`Demaray (Irell and Manella) vs. Samsung Corp.
`Western District of Texas Waco Division, Case No. 6:20-CV-00636-ADA
`
`Semiconductor PVD processing, Pulsed DC and RF plasma power filtering.
`2020 – 2024
`The trial was held in February 2024.
`
`
`
`Demaray (Irell and Manella) vs. Intel Corporation and Samsung Corp (6:20-cv-
`
`00636-ADA)
`
`Western District of Texas Waco Division, Case No. 6:20-CV-00636-ADA.
`
`Semiconductor PVD processing, Pulsed DC and RF plasma power filtering.
`2020 – 2023
`
`Settled with Intel in September 2023. Testified on Samsung matter in Feb. 2024.
`
`
`
`Demaray (Irell and Manella) vs. Intel Corporation and Samsung Corp.
`
`International Trade Commission
`IPR2021-00103, IPR2021-00104
`Semiconductor PVD processing, Pulsed DC and RF plasma power filtering.
`2020 – 2021
`
`Tokyo Ohka Kogyo Co., Ltd. ( Knobbe) v. Fujifilm Electronic Materials
`U.S.A., Inc.
`
`
`
`
`
`
`
`
`
`
`
`Case
`Project
`Dates
`Status
`
`
`
`Case
`
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`Project
`Dates
`Status
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`Client
`
`Case
`Project
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`
`Page 7 of 16
`
`Case No. PGR2022-00010
`
`Semiconductor patent dispute.
`
`2021 – 2022
`
`
`Submitted report. IPR granted. Settled.
`
`
`
`
`
`
`
`Hanwa vs REC (Gilbert Tobin) et al .
`
`
`
`
`
`
`Federal Court of Australia, NSD 458 of 2019.
`
`
`
`Solar panel manufacturing patent dispute.
`
`
`
`
`
`
`
`2021 – 2022
`
`
`
`
`
`Testified in Federal Court in Sydney, NSW, Australia.
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`Ocean Semiconductor LLC vs Western Digital Corp (Shearman & Sterling
`
`
`
`
`
`
`
`
`
`
`
`LLP)
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`IPR2021-00929
`
`
`
`
`
`
`
`
`Semiconductor processing/metrology patent dispute.
`
`
`
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`
`
`
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`2020 – 2020
`Concluded.
`
`
`Settled
`
`
`Continental Circuits (Caldell, Cassidy, and Curry) vs. Intel Corporation; Ibiden
`
`
`
`
`
`
`No. CV16-2026 PHX DGC
`
`
`
`
`Electronics substrate (PCB) technology.
`
` 2018 – 2020
`
`
`
`
`
`Submitted reports and testified at deposition. Settled.
`
`
`RENEE PLUNKETT, AN INDIVIDUAL AND HEIR OF ESTATE OF
`
`
`
`
`
`SCOTT PLUNKETT, GLOREE PLUNKETT, A MINOR BY AND
`THROUGH HER GUARDIAN AD LITEM, TERRY ALLEN
`
`
`
`
`
`ROBERTSON (Michael Hirman Law) vs. LEATT CORP., A FOREIGN
`
`
`
`
`
`CORPORATION; TIFFANY NELLIS; AND DOES 2-100
`
`
`
`
`
`
`
`19-cv-0629-H-AGS
`FEA analysis of safety device
`
`
`
`
`Submitted expert report. Settled.
`
`
`
`Moldanado et al v. Apple Inc. (Morrison and Forrester)
`Case No. 3:16-cv-04067-WHO
`iPhone and iPad Class Action Law Suit
`2019-
`Submitted declaration and testified at deposition.
`
`Hanwa v REC et al (Finnegan).
`ITC 337-TA-1151
`Solar Panel Technology
`2019-2020.
`Submitted declaration and testified at deposition.
`
`Micron vs. Northstar/WiLAN (Eckert Seamons)
`IPR2018-01000, U.S. Patent No. 6,465,743
`Semiconductor packaging and ball grid arrays
`2019
`Submitted declaration and testified at deposition. Settled.
`
`Dates
`Status
`
`
`Status
`
`
`Client
`
`Case
`Project
`
`Dates
`Status
`
`Client
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`
`
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`
`
`
`
`
`Case:
`Project
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`Status
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`Client
`
`Case
`
`Project
`Dates
`
`Status
`I
`
`Client
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`Case
`Project
`
`Dates
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`Status
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`Client
`Case
`Project
`Dates
`Status
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`
`
`Client
`
`ASM (KMOB) vs. Kokusai Electric Corporation
`
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`Case
`
`Project
`Dates
`Status
`
`Client
`Case
`Project
`Dates
`Status
`
`Client
`Case
`Project
`Dates
`Status
`
`Client
`Case
`Project
`Dates
`Status
`
`Client
`Case
`
`Project
`Dates
`Status
`
`Client
`
`Case
`
`
`
`
`
`
`
`
`
`
`
`IPRs multiple: IPR2018-01584, IPR2018-01523, IPR2018-01479,
`IPR2018-01151, IPR2018-01357.
`Semiconductor processing equipment.
`2018 -2019
`Submitted declaration and testified at depositions. Settled.
`
`IP Bridge, (Ropes & Gray)
`IP Bridge vs Qualcom
`Patent review.
`2018 -2019
`Settled
`
`IP Bridge, (Wolf, Greenfield & Sacks)
`IP Bridge vs TSMC
`Patent review.
`2018
`Settled
`
`Veeco (Ropes and Gray)
`Veeco (Ropes and Gray) vs. SGL Carbon Group , QVl 7-2 217
`Semiconductor Processing Equipment for process chamber chucks.
`2017
`
`Completed. Preliminary injunction granted for client and settlement reached.
`
`IP Bridge (Ropes and Gray)
`BROADCOM LIMITED, BROADCOM CORPORATION, AVAGO
`TECHNOLOGIES, LTD., AVAGO TECHNOLOGIES U.S., INC., and LSI
`CORPORATION, Case No. 2:16-cv-134, Eastern District of Texas, and
`IPR2016-1376, 1377 and 1379.
`
`Interconnect and back end of line patents.
`Spring 2015 – Spring 2017
`Submitted expert reports and testified at deposition. Settled.
`
`Elm 3DS Innovations (Mintz, Levin, Cohn, Ferris, Glovsky and
`Popeo PC)
`Elm vs. Samsung Electronics, Hynix and Micron
`Inter Partes Review (IPR) at the USPTO: IPR2016-00386,
`IPR2016-00387, IPR2016-00388, IPR2016-00389, IPR2016-
`00390, IPR2016-00391, IPR2016-00392, IPR2016-00393,
`IPR2016-00394, IPR2016-00395, IPR2016-00687, IPR2016-
`00691, IPR2016-00708, IPR2016-00770, and IPR2016-00786.
`
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`Project
`
`Dates
`Status
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`
`Client
`Case
`
`Project
`
`Dates
`Status
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`Client
`Case
`Project
`
`Dates
`Status
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`Client
`Case
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`Project
`Dates
`Status
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`Client
`Case
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`Project
`
`Dates
`Status
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`
`
`
`
`
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`
`
`
`
`I performed a patent infringement analysis involving thinned and
`stacked wafers, low-stress dielectric materials, and other topics of
`IC memory.
`2016 – 2017
`Submitted declarations in IPR and gave testimony at deposition.
`
`
`Semcon, (Russ, August & Kabat)
`Semcon v. Micron Inc.
`CASE NO. 12-532-RGA
`UNITED STATES DISTRICT COURT
`FOR THE DISTRICT OF DELAWARE
`Advanced process control and metrology
`processing patent case regard CMP.
`2013
`Submitted expert reports and testified at deposition.
`
`in semiconductor
`
`Department of Justice, Anti-Trust Division, USA
`Applied Materials Tokyo Electron Merger
`Provide industry expert analysis to the Anti-Trust Division of the
`DOJ in the merger for competitive equipment across all of the
`product lines, as well as other analyses.
`2013 – 2014
`Parties abandoned the merger, action completed.
`
`Caterpillar Inc., (Baker & Hostetler)
`Miller UK Limited v. Caterpillar Inc.
`CASE NO. 10-cv-3770, UNITED STATES DISTRICT COURT
`FOR THE NORTHERN DISTRICT OF ILLINOIS
`EASTERN DIVISION
`Trade secret case related to CAD drawings.
`2013
`Submitted expert reports and testified at deposition and at trial.
`Completed.
`
`Carr & Farrell (LAM Research)
`LAM RESEARCH CORPORATION v. XYCARB CERAMICS
`CASE NO. 3:03-cv-1335 CRB
`UNITED STATES DISTRICT COURT
`NORTHERN DISTRICT OF CALIFORNIA
`SAN FRANCISCO DIVISION
`Review product for patent infringement related to process chamber
`components..
`2013
`Submitted reports and was deposed.Settled
`
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`Client
`Case
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`Dates
`Status
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`Client
`Case
`Project
`
`Dates
`Status
`
`Schwegman, Lundberg & Woessner, P.A. (Amkor)
`Tessera v. Amkor. Petition for inter partes review of U.S. patent at
`USPTO
`Semiconductor manufacturing technology relating to packaging.
`2013 – present
`Submitted declarations in IPR and gave testimony at deposition.
`
`Fish & Richardson (3M)
`TransWeb v. 3M, District Court of NJ, 2:10-cv-04413 (FSH/PS)
`Litigation for plasma fluorinated electrets. Trade secret litigation
`for plasma fluorination of electrets and filter media, woven polymer
`fabric forming HEPA filters.
`2011
`Expert report, deposed, trial.
`
`Client
`Case
`
`Project
`
`
`
`
`
`
`Allegaert Berger & Vogel LLP (Taiwan Glass)
`CVD Equipment v. Taiwan Glass, 10 Civ. 0573 (RH-I) (RLE),
`Eastern District of NY
`Litigation for breach of contract in CVD conveyor coating
`equipment used in the manufacture of coated low emissivity (low
`E) window glass, coated display glass (ITO), and coated solar glass.
`2010
`Dates
`Expert report, deposed, judgement.
`Status
`Description Analyzed viability of unfinished manufacturing equipment and processes.
`
`
`Client
`Case
`Project
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`Dates
`Status
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`Client
`Case
`Project
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`Dates
`Status
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`Client
`Case
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`Knobbe, Martens, Olson & Bear (ATS)
`ATS v. AMI SACV07-1384 JVS (JWJx)
`Litigation for correction of inventor-ship of patents, and breach of
`contract, for heat exchangers used in semiconductor processing
`equipment.
`2009
`Expert report, deposed, Trial.
`Submitted and testified.
`
`Lee and Li (American Insurance Underwriters.)
`AIU v. Applied Materials, Centrotherm, M&W and others.
`Insurance claims re destruction of Semiconductor Fab. Reviewed
`plans, standards, equipment, processes and related.
`2009
`Report, Tried in High Court of Taiwan. Testified.
`
`Robbins, Kaplan, Miller, & Ciresi (AMD)
`AMD v. Samsung
`
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`Project
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`Dates
`Status
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`Client
`Case
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`Project
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`Dates
`Status
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`Client
`Case
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`Project
`Dates
`Status
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`Client
`Case
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`Project
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`Dates
`Status
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`Client
`Case
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`Project
`Dates
`Status
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`Client
`
`Case
`
`Project
`
`Patent litigation for AMD Semiconductor TiN patent relating to
`DRAM and FLASH memory products.
`2007-2010
`Expert report, deposed, settled.
`
`King & Spalding, Redwood Shores, CA (Qimonda)
`Qimonda v. LSI and others at the International Trade Commission,
`Certain Semiconductor Integrated Circuits And Products
`Containing Same, Inv. No. 337-TA-665
`Semiconductor processing patent relating to crack stop patents in
`silicon oxide glass layers.
`2009
`Expert report, deposed, trial, testified at the International Trade
`Commission.
`
`Wilmer Hale, Palo Alto, CA ( IDT)
`LSI v. IDT at the International Trade Commission, Certain
`Semiconductor Integrated Circuits Using Tungsten Metallization
`And Products Containing Same, Inv. No. 337-TA-648
`Semiconductor processing patent relating to TiN patents.
`2008
`Expert report, deposed, trial, testified at ITC.
`
`Morrison and Forrester (Advance Micro-Fabrication Equipment)
`Applied Materials v. Advanced Micro-Fabrication
`Equipment C07 05248 JW (PVT)
`Semiconductor equipment manufacturer trade secret case.
`Reviewed numerous CAD documents related to equipment design.
`2008
`Expert report, deposed, settled.
`
`Ropes and Gray (Entegris)
`Pall v. Entegris,
`05-CV-5894 (BMC)(WDW), United States District Court,
`Eastern District of New York
`Patent dispute, filter patents.
`2006 to present
`Settled.
`
`Thelen Reid and Priest, San Jose, CA ( Celerity)
`Keith Slenkovich (attorney)
`Celerity vs. Ultra-Clean Technologies
`CASE NO. 05-CV-04374 MMC, United States District Court,
`Northern District of California
`Patent disputes, semiconductor processing equipment, ultra high
`purity gas delivery systems.
`
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`Dates
`Status
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`Client
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`Case
`Project
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`Dates
`Status
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`Client
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`Case
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`Project
`Dates
`Status
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`Client
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`Case
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`Project
`Dates
`Status
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`Client
`Case
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`Project
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`Dates
`Status
`
`Client
`
`Case
`Project
`
`2005-2007
`Tried. Testified.
`
`Foran Glennon Palandech and Ponzi, Chicago, IL (American
`Insurance Underwriters)
`James Glennon (attorney)
`International Arbitration, Tokyo
`Analysis of complete destruction of an entire FAB due to facility
`design, equipment design, installation, process monitoring and
`control, etc.
`2004-2007
`Arbitrated. Testified in International Arbitration.
`
`Morgan & Finnegan LLP, NY, NY ( ATMI)
`Kramer, Levin, Naftalis & Frankel LLP
`Ted Mlynar (attorney)
`ATMI vs. Praxair,
`Case No. 03 CV 5161, US District Court, Delaware
`Patent dispute, high purity hazardous chemical cylinder patents.
`2004-2006
`Tried. Testified.
`
`Cooley Goddard LLP, Broomfield, CO (Advanced Energy)
`Jim Brogan (attorney)
`MKS Instruments Inc. vs. Advanced Energy
`C.A. No. 03-469 (JJF), US District Court, Delaware
`Patent dispute regarding remote plasma technology.
`2004-2005
`Tried. Testified
`
`Kerr & Wagstaffe LLP, Attorneys (HT Components)
`General Components, Inc. V. HT. Components, U.S.A., Inc.
`Case No. C 01-20925 JF
`Review of breach of contract for semiconductor equipment
`components. Reviewed CAD drawings for high purity fittings.
`Approximately 2002
`Settled
`
`Keker & Van Nest, San Francisco, CA, (ASM)
`ASM America, Inc. et al v. Genus, Inc.
`Stuart Gassner (attorney)
`Civil Action No. C 01-02190 EDL
`Atomic Layer Deposition (Secquential CVD) patent infringement.
`Patents:
`6,015,590 Method for growing thin films.
`5,916,365 Sequential Chemical Vapor Depositions.
`
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`Dates
`Status
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`Client
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`Case
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`Project
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`Dates
`Status
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`Client
`Case
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`Project
`Dates
`Status
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`Client
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`Case
`Project
`Dates
`Status
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`Client
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`Case
`Project
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`Dates
`Status
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`Client
`
`Case
`Project
`
`Dates
`Status
`
`2001-2002
`Settled
`
`Orrick Herrington & Sutcliffe, LLP ( Applied Materials)
`Gary Weiss (attorney)
`Applied Materials, Inc. v. LTD Ceramics et al
`U.S.D.C. Case No. C01-20478 JF PVT ADR
`Misappropriation of trade secrets. Reviewed numerous CAD
`documents related to semiconductor equipment design.
`2001-2003
`Settled
`
`Knobbe Martens, Olsen Bear, Newport Beach, CA, (Air Products)
`Advanced Delivery & Chemical Systems v. Air Products and
`Chemical, Inc.
`Case A 99-CA-406 SS
`Patents for chemical delivery.
`2000-2001
`Settled
`
`Mitsubishi Silicon America vs. Semitool, Inc.
`Harrang Long Gary Rudnick (Salem, OR)
`CV 98-826-AA
`Semiconductor equipment breach of contract.
`1999-2000
`Settled
`
`Applied Materials, Inc. v. McDowell & Company, et al
`Orrick Herrington & Sutcliffe LLP (Menlo Park, CA)
`3-98CV-907-R
`Misappropriation of trade secrets. I reviewed numerous CAD
`documents related to semiconductor equipment design.
`1999
`Settled civil case.
`
`Applied Materials, Inc. v. David Biehl, et al
`Orrick Herrington & Sutcliffe LLP (Menlo Park, CA)
`CR95-20082 RMT PVT
`Misappropriation of trade secrets. I reviewed numerous CAD
`documents related to semiconductor equipment design.
`1999
`Settled civil case. Criminal Conviction.
`
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`

`Education
`
`Stanford University
`2003
`Stanford University
`1995
`1987 University of California, Berkeley
`1985 University of California, Berkeley
`
`Ph.D., Materials Science and Engineering
`M.S., Materials Science and Engineering
`M.S., Mechanical Engineering
`B.S., Mechanical Engineering
`
`Patents
`
`Patent Number
`10,658,206
`
`10,395,953
`9,224,626
`7,118,090
`6,679,476
`6,204,174
`
`
`
`
`Title
`Date Issued
`May 19, 2020 Method of forming a composite substrate for
`layered heaters
`Composite substrate for layered heaters
`Aug. 27, 2019
`Composite substrate for layered heaters
`Dec. 29, 2015
`Control Valves
`Jan 20, 2007
`Control Valves
`Jan. 20, 2004
`Mar. 20, 2001 Method and Apparatus Rate Deposition of
`Tungsten.
`
`
`
`
`Publications and Conference Presentations (selected).
`
`A.D. Glew, M.A. Cappelli, "Characterization and dielectric properties of fluorinated
`amorphous carbon measured by capacitance-voltage versus spectral ellipsometry",
`Materials Research Society Symposium Proceedings, 593, Boston, MA, 1999, pp. 341-
`346.
`
`A.D. Glew, M.A. Cappelli, "In situ plasma analysis, fluorine incorporation,
`thermostability, stress, and hardness comparison of fluorinated amorphous carbon and
`hydrogenated amorphous carbon thin films deposited on Si by plasma enhanced chemical
`vapor deposition", Material Research Society Symposium Proc., 565, San Francisco, CA
`1999, pp 285-290.
`
`A.D. Glew, R. Saha, M.A. Cappelli and J.S. Kim, "Ion Energy and Flux Dependence of
`Diamond Like Carbon Film Synthesis in Radio-Frequency Discharges", International
`Conference on Metal Coatings and Thin Films, Surface and Coatings Technology 114
`(1999) 224-229.
`
`A. Glew, R. Saha, M. Cappelli and J. Kim, “Ion Energy and Flux Dependence of
`Diamond Like Carbon Film Synthesis in Radio-Frequency Discharges”, International
`Conference on Metal Coatings and Thin Films, San Diego, CA, April 1998
`
`A. Glew, J, Ammenheuser, M. Crockett, A. Johnson, W. Dax, R. Binder, J. Riddle,
`“SEMASPEC 97043272A Accelerated Life Tests of Gas System Performance and
`Reliability,” http://www.sematech.org/public/docubase/abstract/3272atr.htm.
`
`
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`A. Glew, J. Ammenheuser, J. Riddle, A. Johnson, “SEMASPEC 96083175A-XFR
`Determining the Effects of Impurities on Semiconductor Thin Film Processing,”
`http://www.sematech.org/public/docubase/abstract/3175axfr.htm.
`
` A
`
` Glew, “Selecting Gas Purity and Materials of Construction in High Purity Gas
`Systems,” Semicon West Symposium on Corrosion, July 1997
`
`Glew, J. Kim, K. Lee, M. Cappelli, “On the Characteristics of Diamond Like Carbon”,
`A. International Conference on Metal Coatings and Thin Films, San Diego, CA,
`April 1997
`
`
`A. Glew, D. Porter, “Gas System Reliability Testing in Chlorine”, Semiconductor
`Fabtech, May 1996.
`
`Professional Associations
`
`American Society of Mechanical Engineers (ASME)
`International Microelectronics and Packaging Society (IMAPS)
`Materials Research Society (MRS)
`IEEE
`
`Civic Role
`
`Los Altos Rotary Club
`
`Professional License
`
`Licensed Mechanical Engineer, State of California, M26690
`
`
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