Intel® RealSenseTM
`D400 Series Product Family
`Datasheet
`
`Intel®
`Processor D4 Board, Intel®
`
`, Intel®
`
`, Intel®
`
`0, Intel®
`Depth Camera D415, Intel®
`
`Intel®
`D435i
`
`Depth
`
`Intel®
`D420, Intel®
`Camera D435
`
`Revision 005
`
`January 2019
`
`
`
`Document Number: 337029-005
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`Intel products described herein. You agree to grant Intel a non-exclusive, royalty-free license to any patent claim thereafter
`drafted which includes subject matter disclosed herein.
`No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this document.
`
`e
`
`activation. Performance varies depending on system configuration. No computer system can be absolutely secure. Check with
`your system manufacturer or retailer or learn more at intel.com.
`Intel technologies may require enabled hardware, specific software, or services activation. Check with your system manufacturer
`or retailer.
`The products described may contain design defects or errors known as errata which may cause the product to deviate from
`published specifications. Current characterized errata are available on request.
`Intel disclaims all express and implied warranties, including without limitation, the implied warranties of merchantability, fitness
`for a particular purpose, and non-infringement, as well as any warranty arising from course of performance, course of dealing, or
`usage in trade.
`All information provided here is subject to change without notice. Contact your Intel representative to obtain the latest Intel
`product specifications and roadmaps.
`Copies of documents which have an order number and are referenced in this document may be obtained by calling 1-800-548-
`4725 or visit www.intel.com/design/literature.htm.
`®
`Intel and the Intel logo, Intel®
`, trademarks of Intel Corporation in the U.S. and/or other countries.
`*Other names and brands may be claimed as the property of others.
`© 2019 Intel Corporation. All rights reserved.
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`Description and Features
`
`Contents
`
`1
`
`2
`
`3
`
`Description and Features .................................................................................. 11
`
`Introduction .................................................................................................... 12
`2.1
`Purpose and Scope of this Document....................................................... 12
`2.2
`Terminology ......................................................................................... 12
`2.3
`Stereo Vision Depth Technology Overview................................................ 13
`2.4
`Camera System Block Diagram............................................................... 15
`2.5
`Intel®
`...................... 16
`2.6
`Intel®
`..................... 17
`
`Component Specification .................................................................................. 18
`3.1
`Vision Processor D4 Camera System Components ..................................... 18
`3.2
`Host Processor ..................................................................................... 18
`3.3
`Intel®
`................................................... 18
`3.3.1
`Vision Processor D4 Features .................................................... 18
`3.3.2
`Vision Processor D4 Signal Description ....................................... 19
`3.3.3
`Vision Processor D4 Package Mechanical Attributes ...................... 24
`3.3.4
`Vision Processor D4 Power Requirements.................................... 30
`3.3.5
`Vision Processor D4 Power Sequencing ....................................... 30
`3.3.6
`Vision Processor D4 Spec Code.................................................. 31
`3.3.7
`Vision Processor D4 Storage and Operating Conditions ................. 31
`3.3.8
`Vision Processor D4 Thermals ................................................... 32
`Clock................................................................................................... 32
`Serial (SPI) Flash Memory...................................................................... 32
`Stereo Depth Module............................................................................. 32
`3.6.1
`Left and Right Imagers............................................................. 34
`3.6.2
`Infrared Projector .................................................................... 35
`3.6.3
`Color Sensor ........................................................................... 36
`3.6.4
`Depth Module Connector .......................................................... 37
`3.6.5
`Stereo Depth Module Label ....................................................... 37
`3.6.6
`Stiffener ................................................................................. 38
`3.6.7
`Temperature Sensor ................................................................ 38
`3.6.8
`Other Stereo Depth Module Components .................................... 38
`3.6.9
`Mechanical Dimensions............................................................. 39
`3.6.10
`Stereo Depth Module Power Sequence........................................ 40
`3.6.11
`Stereo Depth Module Storage and Operating Conditions ............... 40
`.......................................... 41
`Intel®
`3.7.1
`Mechanical Dimensions............................................................. 42
`3.7.2
`Depth Module Receptacle.......................................................... 42
`3.7.3
`Flex and Rigid Interposer Interconnect ....................................... 42
`3.7.4
`External Sensor Sync Connector ................................................ 47
`3.7.5
`USB Peripheral Connector Type-C ........................................... 47
`3.7.6
`Color Image Signal Processor (ISP)............................................ 49
`3.7.7
`Vision Processor D4 Board Power Requirements .......................... 49
`3.7.8
`Vision Processor D4 Board Thermals .......................................... 49
`3.7.9
`Vision Processor D4 Board Storage and Operating Conditions ........ 50
`3.7.10
`Intel®
`Material Code.......................................................................... 50
`......................................... 50
`
`3.4
`3.5
`3.6
`
`3.7
`
`3.8
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`Depth Camera D400 Series Mechanical Dimensions ..................... 51
`3.8.1
`Depth Camera D400 Series Thermals ......................................... 52
`3.8.2
`Depth Camera D400 Series Storage and Operating Conditions ...... 52
`3.8.3
`(1) Controlled conditions should be used for long term storage of product. (2)
`Short exposure represents temporary max limits acceptable for
`transportation conditions. ......................................................... 53
`Depth Camera D400 Series Product Identifier and Material Code ... 53
`Camera Lens Cleaning Procedure............................................... 53
`
`3.8.4
`3.8.5
`
`Functional Specification .................................................................................... 54
`4.1
`Vendor Identification (VID) and Device Identification (DID)........................ 54
`4.2
`Vision Processor D4 Data Streams .......................................................... 54
`4.3
`Depth Field of View (FOV) ...................................................................... 57
`4.4
`Depth Field of View at Distance (Z) ......................................................... 57
`4.5
`Invalid Depth Band ............................................................................... 58
`4.6
`Minimum-Z Depth ................................................................................. 60
`4.7
`Depth Quality Specification .................................................................... 60
`4.8
`Measured Power ................................................................................... 62
`4.9
`Depth Start Point (Ground Zero Reference) .............................................. 63
`4.9.1
`Depth Origin X-Y Coordinates.................................................... 65
`Depth Camera Functions........................................................................ 66
`Color Camera Functions ......................................................................... 67
`IMU Specifications................................................................................. 68
`
`4.10
`4.11
`4.12
`
`Firmware ........................................................................................................ 69
`5.1
`Update ................................................................................................ 69
`5.1.1
`Update Limits.......................................................................... 69
`Recovery ............................................................................................. 69
`
`5.2
`
`Software......................................................................................................... 70
`6.1
`Intel®
`..................................... 70
`
`7.3
`7.4
`
`System Integration .......................................................................................... 71
`7.1
`System Level Block Diagram .................................................................. 71
`7.2
`Vision Processor D4 System Integration................................................... 71
`7.2.1
`Vision Processor D4 Board ........................................................ 71
`7.2.2
`Vision Processor D4 on Motherboard .......................................... 72
`D4 Camera System Power Delivery ......................................................... 73
`Vision Processor D4 Board for Integrated Peripheral .................................. 74
`7.4.1
`USB 3.1 Gen 1 Receptacle ........................................................ 74
`7.4.2
`USB 3.1 Gen 1 High Speed Cable Assembly ................................ 74
`7.4.3
`Transmit to Receive Crossover .................................................. 75
`7.4.4
`Motherboard Receptacle ........................................................... 76
`7.4.5
`Vision Processor D4 Board for Integrated Peripheral Power
`Requirements.......................................................................... 76
`Thermals ............................................................................................. 76
`Stereo Depth Module Flex ...................................................................... 78
`Stereo Depth Module Mounting Guidance ................................................. 78
`7.7.1
`Screw Mount ........................................................................... 78
`7.7.2
`Bracket Mount......................................................................... 79
`7.7.3
`Stereo Depth Module Air gap..................................................... 81
`Thermal Interface Material ..................................................................... 81
`Heat Sink............................................................................................. 81
`
`7.5
`7.6
`7.7
`
`7.8
`7.9
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`Description and Features
`
`7.10
`7.11
`
`Cover Design and Material Guidance ....................................................... 81
`Gaskets ............................................................................................... 82
`7.11.1 Optical Isolation ...................................................................... 83
`7.11.2 Dust Protection ....................................................................... 84
`Firmware Recovery ............................................................................... 84
`7.12
`Calibration Support ............................................................................... 85
`7.13
`7.14 Multi-Camera Hardware Sync ................................................................. 85
`7.15
`Handling Conditions .............................................................................. 86
`
`8
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`9
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`10
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`11
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`12
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`13
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`Platform Design Guidelines ............................................................................... 87
`8.1
`Vision Processor D4 on Motherboard ....................................................... 87
`8.2
`Kaby Lake U and Kaby Lake Y platforms .................................................. 88
`8.2.1
`Kaby Lake Platform Introduction................................................ 88
`8.2.2
`Supported PCB Stack-Up and Routing Geometries ....................... 88
`8.2.3
`Vision Processor D4 on Motherboard with USB Host Interface........ 89
`8.2.4
`Vision Processor D4 on Motherboard with MIPI Host Interface ....... 90
`8.2.5
`Vision Processor D4 Board for Integrated Peripheral (USB 3.1 Gen 1
`Host to Vision Processor D4 Routing) ......................................... 92
`USB2.0 Design Guidelines (USB2 Host to Vision Processor D4
`Routing) ................................................................................. 93
`Cherry Trail T4 Platform......................................................................... 94
`8.3.1
`Cherry Trail T4 Platform Introduction ......................................... 94
`8.3.2
`Vision Processor D4 Platform Design Guidelines........................... 94
`
`8.2.6
`
`8.3
`
`Regulatory Compliance..................................................................................... 95
`9.1
`System Laser Compliance ...................................................................... 95
`9.1.1
`Certification Statement............................................................. 95
`9.1.2
`Explanatory Label .................................................................... 95
`9.1.3
`Cautionary Statements............................................................. 95
`....................................................... 96
`9.1.4
`9.1.5
`US FDA Accession Number........................................................ 96
`9.1.6
`NRTL Statement ...................................................................... 96
`Ecology Compliance .............................................................................. 97
`9.2.1
`China RoHS Declaration............................................................ 97
`9.2.2
`Waste Electrical and Electronic Equipment (WEEE)....................... 98
`
`9.2
`
`Mechanical Drawings........................................................................................ 99
`
`Connector Drawings ........................................................................................107
`
`Appendix A Vision Processor D4 on Motherboard Schematic Checklist .................109
`12.1
`Power Delivery ....................................................................................116
`
`Appendix B- Cover Material..............................................................................119
`
`Figures
`
`Figure 2-1. Active Infrared (IR) Stereo Vision Technology ......................................................... 14
`Figure 2-2. Depth Measurement (Z) versus Range (R).............................................................. 14
`Figure 2-3. Vision Processor D4 Camera System Block Diagram ................................................ 15
`Figure 3-1. Vision Processor D4 Package Drawing .................................................................... 26
`Figure 3-2. Vision Processor D4 Ball-out ................................................................................. 27
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`Figure 3-3. Vision Processor D4 Power Sequencing .................................................................. 31
`Figure 3-4. Stereo Depth Module (Intel®
`................................. 33
`................................. 33
`Figure 3-5. Stereo Depth Module (Intel®
`Figure 3-6. Stereo Depth Module Power Sequence ................................................................... 40
`Figure 3-7. Vision Processor D4 Board (USB Peripheral Type-C)................................................. 41
`Figure 3-8. Flex Interposer (Illustration)................................................................................. 43
`Figure 3-9. Rigid Interposer (Illustration) ............................................................................... 43
`Figure 3-10. Depth Module Receptacle and Plug Connector Pin Position ...................................... 44
`Figure 3-11. Depth Module Connector Orientation and Pin Position............................................. 46
`Figure 3-12. USB Type-C Receptacle Pin Map .......................................................................... 48
`Figure 3-13. Intel® RealSenseTM Depth Camera D415 ............................................................... 50
`..................................................... 51
`Figure 3-14. Intel®
`Figure 4-1. Depth Field of View to Depth Map illustration .......................................................... 58
`Figure 4-2. Left Invalid Depth Band ....................................................................................... 59
`Figure 4-3. Depth Module Depth Start Point Reference ............................................................. 63
`Figure 4-4. Depth Camera Depth Start Point Reference ............................................................ 64
`Figure 4-5. Depth Module X-Y Depth Origin Reference.............................................................. 65
`Figure 4-6. Depth Camera X-Y Depth Origin Reference ............................................................. 66
`Figure 7-1. System Block Diagram ......................................................................................... 71
`........................................................ 72
`Figure 7-2. Intel®
`Figure 7-3. Vision Processor D4 on Motherboard (Illustration) ................................................... 72
`Figure 7-4. D4 Camera System Power Scheme ........................................................................ 73
`Figure 7-5. Host Motherboard USB 3.1 Gen 1 Routing .............................................................. 75
`Figure 7-6. Receptacle Ground Bar Motherboard Connections .................................................... 76
`Figure 7-7. Bottom Stiffener Depth Module D410..................................................................... 78
`Figure 7-8. Bottom Stiffener Depth Module D430..................................................................... 78
`Figure 7-9. Stereo Depth Module Screw Mount ........................................................................ 79
`Figure 7-10. Stereo Depth Module Bracket .............................................................................. 79
`Figure 7-11. Stereo Depth Module Bracket Mount .................................................................... 80
`Figure 7-12. Stereo Depth Module Bracket Install .................................................................... 80
`Figure 7-13. Stereo Depth Module Air Gap .............................................................................. 81
`Figure 7-14. Illustration of Gasket Placement and Cover Material............................................... 83
`Figure 7-15. Example of Light Leakage Effects......................................................................... 84
`Figure 7-16. Firmware Recovery Sequence ............................................................................. 85
`Figure 7-17. External Sensor Sync Connector Location on D4 Vision Processor D4 Board .............. 85
`Figure 7-18. External Sensor Sync Connector Location on Depth Camera D435/D435i.................. 86
`Figure 8-1. Vision Processor D4 with USB Host Interface .......................................................... 87
`Figure 8-2. Vision Processor D4 with MIPI Host Interface .......................................................... 87
`Figure 8-3. Vision Processor D4 on Board for USB Integrated Peripheral ..................................... 88
`Figure 8-4. Host Processor - Vision Processor D4 ..................................................................... 89
`Figure 8-5. Vision Processor D4 Transmit - Host Receive ......................................................... 90
`Figure 8-6. Stereo Depth Transmit - Vision Processor D4 Receive .............................................. 91
`Figure 8-7. Flex Interposer PCB Stack-Up ............................................................................... 92
`Figure 8-8. USB 3.1 Gen 1 Host to Vision Processor D4 Topology............................................... 92
`Figure 8-9. USB2.0 Host to Vision Processor D4....................................................................... 93
`Figure 9-1. NRTL Certifications .............................................................................................. 97
`................................................................ 99
`Figure 10-1. Intel® R
`...............................................................100
`Figure 10-2. Intel®
`...............................................................101
`Figure 10-3. Intel®
`...............................................................102
`Figure 10-4. Intel®
`...............................................................103
`Figure 10-5. Intel®
`or D4
`Figure 10-6. Vision Processor D4 Board USB Type-C (Intel®
`Board)...........................................................................................................104
`..............................................................105
`Figure 10-7. Intel®
`....................................................106
`Figure 10-8. Intel®
`
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`Figure 11-1. Receptacle Mechanical Drawing (50 Pin Depth Module Receptacle)..........................107
`Figure 11-2. Plug Mechanical Drawing (50 pin Depth Module Plug)............................................108
`Figure 12-1. Vision Processor D4 Laser PWM Reference Platform Schematic ...............................116
`Figure 12-2. Vision Processor D4 24MHz Crystal Clock Reference Platform Schematic..................116
`Figure 12-3. DC-DC Reference Platform Schematic (3.3V, 1.8V, 0.9V).......................................117
`Figure 12-4. Vision Processor D4 VDD_PG and AVDD Reference Platform Schematic ...................118
`
`Tables
`
`Table 2-1. Depth Module Product SKU Descriptions .................................................................. 16
`Table 2-2. Depth Camera Product SKU Descriptions ................................................................. 17
`Table 3-1. Component Descriptions........................................................................................ 18
`Table 3-2. Vision Processor D4 Signal Descriptions .................................................................. 19
`Table 3-3. Hardware Straps .................................................................................................. 24
`Table 3-4. Vision Processor D4 Package Mechanical Attributes................................................... 25
`Table 3-5. Vision Processor D4 Ball-out by Signal Name ........................................................... 27
`Table 3-6. Vision Processor D4 Power Requirements ................................................................ 30
`Table 3-7. Vision Processor D4 Power Sequencing Timing Parameters ........................................ 30
`Table 3-8. Vision Processor D4 SPEC Code .............................................................................. 31
`Table 3-9. Vision Processor D4 Storage and Operating Conditions.............................................. 31
`Table 3-10. Stereo Depth Module........................................................................................... 32
`Table 3-11. Stereo Depth Module SKU Properties..................................................................... 33
`Table 3-12. Standard Left and Right Imager Properties ............................................................ 34
`Table 3-13. Wide Left and Right Imager Properties .................................................................. 34
`Table 3-14. Standard Infrared Projector Parameters ................................................................ 35
`Table 3-15. Wide Infrared Projector Parameters ...................................................................... 35
`Table 3-16. Color Sensor Properties ....................................................................................... 36
`Table 3-17. Depth Module 50-pin Connector Plug Details .......................................................... 37
`Table 3-18. Stereo Depth Module Product Labeling .................................................................. 37
`Table 3-19. Stereo Depth Module Label Fields ......................................................................... 37
`Table 3-20. Intel®
`Material Code .................................................................................................. 38
`Table 3-21. Other Stereo Depth Module Components ............................................................... 38
`............................... 39
`Table 3-22. Intel®
`Table 3-23. Intel®
`............................... 39
`Table 3-24. Intel®
`Mechanical Dimensions ............................... 39
`Table 3-25. Intel®
`............................... 39
`Table 3-26. Intel®
`............................... 40
`Table 3-27. Stereo Depth Module Storage and Operating Conditions .......................................... 40
`Table 3-28. Vision Processor D4 Board .................................................................................. 41
`Table 3-29. Vision Processor D4 Board Components................................................................. 41
`Table 3-30. Vision Processor D4 USB Type-C Board Mechanical Dimensions ................................ 42
`Table 3-31. Depth Module Receptacle Details .......................................................................... 42
`Table 3-32. Interposer Interconnect Signal Description............................................................ 44
`Table 3-33. Custom Flex Interposer Ordering Logistics ............................................................. 46
`Table 3-34. External Sensor Connector Details ........................................................................ 47
`Table 3-35. External Sensor Sync Connector Pin List ................................................................ 47
`Table 3-36. USB Peripheral Connector Pin List ......................................................................... 48
`Table 3-37. Custom USB Type C cable Assemblies Ordering Logistics ......................................... 49
`Table 3-38. ISP Properties .................................................................................................... 49
`Table 3-39. Vision Processor D4 Board Power Requirements ..................................................... 49
`Table 3-40. Vision Processor D4 Board Storage and Operating Conditions ................................... 50
`Table 3-41. Vision Processor D4 Board Product Identifier and Material Code................................ 50
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`Table 3-42. Depth Camera SKU properties.............................................................................. 51
`Table 3-43. Intel®
`............................... 51
`.................... 52
`Table 3-44. Intel®
`Table 3-45. Max Skin Temperature ........................................................................................ 52
`Table 3-46. Depth Camera D400 Series Storage and Operating Conditions ................................. 52
`Table 3-47. Depth Camera D400 Series Product Identifier and Material Code .............................. 53
`Table 4-1. Vendor ID and Device ID Table .............................................................................. 54
`Table 4-2. Image Formats (USB 3.1 Gen1) ............................................................................. 54
`Table 4-3. Image Formats (USB 2.0)...................................................................................... 55
`Table 4-4. Simultaneous Image Streams (USB 3.1 Gen1 & USB2.0)........................................... 56
`Table 4-5. Depth Field of View............................................................................................... 57
`Table 4-6. Minimum-Z Depth ................................................................................................ 60
`Table 4-7: Depth Quality Metric............................................................................................. 60
`Table 4-8: Depth Quality Metric Illustration............................................................................. 61
`Table 4-9. Depth Quality Specification .................................................................................... 61
`Table 4-10. Power- Ubuntu 16.04 .......................................................................................... 62
`Table 4-11. Power Windows 10 (RS4).................................................................................. 62
`Table 4-12. Depth Module Depth Start Point .......................................................................... 63
`Table 4-13. Depth Cameras Depth Start Point ........................................................................ 64
`Table 4-14. Depth Module X-Y Depth Origin Coordinates.......................................................... 65
`Table 4-15. Depth Camera X-Y Depth Origin Coordinates......................................................... 66
`Table 4-16. Depth Camera Controls ....................................................................................... 66
`Table 4-17. RGB Exposed Controls......................................................................................... 67
`Table 4-18. IMU Specifications .............................................................................................. 68
`Table 7-1. USB 3.1 Gen 1 Receptacle Characteristics................................................................ 74
`Table 7-2. USB 3.1 Gen 1 Receptacle Pin Out .......................................................................... 74
`Table 7-3. USB 3.1 Gen 1 Plug Characteristics......................................................................... 74
`Table 7-4. Cable Assembly Specification ................................................................................. 75
`Table 7-5. Motherboard Receptacle Properties ......................................................................... 76
`Table 7-6. Vision Processor D4 Board as Embedded Peripheral Power Requirements .................... 76
`Table 7-7. Vision Processor D4 Board Component Power and TDP at Max Operating Mode(1)....... 77
`Table 7-8. Stereo Depth Module (Standard) Component Power and TDP at Max Operating
`Mode(1)........................................................................................................... 77
`Table 7-9. Stereo Depth Module (Wide) Component Power and TDP at Max Operating Mode(1).... 77
`Table 7-10. Vision Processor D4 Board Components Case Temperature Limits (Still Air) ............ 77
`Table 7-11. Bracket Ordering Logistics ................................................................................... 80
`Table 7-12. Component Transmission..................................................................................... 82
`Table 7-13. Electrostatic Discharge Caution ............................................................................ 86
`Table 8-1. Host Transmit Vision Processor D4 Receive Routing Guidelines ................................ 89
`Table 8-2. Vision Processor D4 Transmit - Host Receive Routing Guidelines ................................ 89
`Table 8-3. Vision Processor D4 Transmit Host Receive Routing Guidelines ................................ 90
`Table 8-4. Stereo Depth Module Transmit - Vision Processor D4 Receive Routing Guidelines ........ 91
`Table 8-5. USB 3.1 Gen 1 Host to Vision Processor D4 Routing Guidelines ................................. 93
`Table 9-1. U.S. FDA Accession Number................................................................................... 96
`Table 12-1. Vision Processor D4 on Motherboard Schematic Checklist .......................................109
`Table 12-2. Vision Processor D4 Decoupling and Filter Requirements ........................................118
`Table 13-1. Example: Cover Material Parameters....................................................................119
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