United States
`(19)
`(12) Patent Application Publication (10) Pub. No.: US 2013/0108082 A1
`Dave et al.
`(43) Pub. Date:
`May 2, 2013
`
`US 2013 0108082A1
`
`(54) MICROPHONE ASSEMBLY
`
`(52) U.S. Cl.
`USPC .......................................................... 381A122
`ABSTRACT
`(57)
`(75) Inventors: Ruchir M. Dave, San Jose, CA (US);
`Embodiments of the invention include a microphone assem
`Sawyer Isaac Cohen, Sunnyvale, CA
`(US); Christopher Wilk, Sunnyvale, CA bly having a microphone soldered on a bottom side of a
`(US)
`bottom ported microphone flex circuit carrier, and a rigid
`coupler soldered on the top side of the carrier, opposite to the
`microphone. The coupler is inserted into and sealed to a
`microphone boot made out of a soft material. The top of the
`boot may be sealed to an electronic audio device into which
`the assembly is integrated. Acoustic openings through the
`housing, boot, coupler and carrier allow acoustic signals to
`reach the microphone. However, the seals between the hous
`ing, boot, coupler, carrier and microphone provide Sound
`isolation, as well as a moisture and dust seal between the
`ambient and the inside of the electronic device. Such seals
`may include rings, grooves, threads, 0-rings between the boot
`and coupler, or a reinforcing ring around the Soft material of
`the boot.
`
`(73) Assignee: Apple Inc., Cupertino, CA (US)
`
`(21) Appl. No.: 13/283,506
`
`(22) Filed:
`
`Oct. 27, 2011
`
`Publication Classification
`
`(51) Int. Cl.
`H04R 3/00
`
`(2006.01)
`
`AUDIO SIGNALS 30
`
`FRONT SIDE OF BOOT 13 -
`FRONTSIDE OF COUPLER 11 - \
`
`OPENING 12
`OPENING 10
`
`MCROPHONE
`1. ASSEMBLY 1
`
`COMPLIANT BOOT 9A
`
`
`
`INNER PERMETER 23
`
`SEAL 22
`OUTER PERMETER 26
`
`-
`
`4 GROOVE
`25
`
`ACOUSTC PORT
`7
`------
`SODER JOINTS ---
`---
`s
`-
`2
`S
`PRINTED CIRCUIT CARRIER2- /1 -
`SOLDER JOINTS -
`
`RGD COUPLER 8A
`
`/
`
`OPENING3
`- FRONT SIDE 6
`^
`
`Tf
`
`BACK
`
`SEE
`
`-----
`--
`
`Y MICROPHONE 4
`
`AliveCor, Inc. Exhibit 1020
`IPR2023-00949
`Ex. 1020.1
`
`

`

`Patent Application Publication
`
`US 2013/0108082 A1
`
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`
`AliveCor, Inc. Exhibit 1020
`IPR2023-00949
`Ex. 1020.2
`
`

`

`Patent Application Publication
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`May 2, 2013 Sheet 2 of 8
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`AliveCor, Inc. Exhibit 1020
`IPR2023-00949
`Ex. 1020.3
`
`

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`Patent Application Publication
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`May 2, 2013 Sheet 3 of 8
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`AliveCor, Inc. Exhibit 1020
`IPR2023-00949
`Ex. 1020.4
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`AliveCor, Inc. Exhibit 1020
`IPR2023-00949
`Ex. 1020.5
`
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`

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`AliveCor, Inc. Exhibit 1020
`IPR2023-00949
`Ex. 1020.6
`
`

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`AliveCor, Inc. Exhibit 1020
`IPR2023-00949
`Ex. 1020.7
`
`

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`Patent Application Publication
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`May 2, 2013 Sheet 7 of 8
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`IPR2023-00949
`Ex. 1020.8
`
`

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`Patent Application Publication
`
`US 2013/0108082 A1
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`AliveCor, Inc. Exhibit 1020
`IPR2023-00949
`Ex. 1020.9
`
`

`

`US 2013/01 08082 A1
`
`May 2, 2013
`
`MCROPHONE ASSEMBLY
`0001 Embodiments of the invention relate to microphone
`assemblies, particularly those that are integrated within an
`electronic audio device Such as a mobile phone, tablet com
`puter, notebook computer or desktop computer.
`
`BACKGROUND
`0002. In the field of electronic audio devices such as per
`Sonal computers, laptop computers, tablet computers, and
`Smart phones (e.g., a typical mobile phone such as an
`iPhoneTM device by Apple Inc., of Cupertino Calif.), micro
`phones are used to sense speech and other audio signals. The
`audio signals are converted to electronic signals. Such as for
`communicating by phone, or making audio recordings. The
`device typically has a housing with an acoustic aperture or
`opening through which audio signals reach a microphone
`assembly that includes the microphone.
`0003. However, ambient moisture and dirt may enter the
`device through the opening or through the assembly. This
`may cause problems for the microphone or other circuitry of
`the device. For example, this may cause the microphone or
`other circuitry of the device to fail or become unusable. In
`addition, Stray or unwanted Sound in the ambient and vibra
`tion of the housing can effect the microphone assembly. In
`Some situations, this may cause feedback or cause the micro
`phone circuitry to otherwise become unusable for converting
`Verbal input by the user into electronic audio signals.
`
`SUMMARY
`0004 Embodiments of the invention include a micro
`phone assembly having a microphone bonded to a bottom
`side of a printed circuit carrier. The microphone's acoustic
`input port is aligned with a port thought the carrier and a rigid
`coupler is bonded to the top side of the carrier, opposite to the
`microphone. An opening through the coupler is aligned with
`the other side of the carrier port. The coupler is inserted into
`and sealed to a microphone boot made out of a soft material.
`An opening through the boot is aligned with the opening
`through the coupler. The top of the boot may be bonded to a
`housing of an electronic audio device such as a mobile phone,
`tablet computer, notebook computer or desktop computer
`into which the assembly is integrated. The openings through
`the housing, boot, coupler and carrier allow acoustic signals
`in the ambient to reach the microphone. However, seals
`between the housing, boot, coupler, carrier and microphone
`provide Sound isolation, as well as a dust and moisture-tight
`seal between the ambient and other components within the
`electronic device. For example, seals between the boot and
`coupler may include rings in an inner perimeter of the boot
`that engage grooves in an outer perimeter of the coupler, one
`large ring around the upper outer perimeter of the coupler to
`engage a large groove in the boot inner perimeter, threads
`around the outer perimeter of the coupler to engage threads in
`the boot, an O-ring in a groove of the coupler to engage the flat
`Surface of the boot, a metal reinforcing ring around and inter
`locked to the soft material of the boot, a metal reinforcing ring
`within and interlocked to the soft material of the boot, or a
`reinforcing hard material ring around the outer base of the soft
`material boot.
`0005. The above summary does not include an exhaustive
`list of all aspects of the present invention. It is contemplated
`that the invention includes all systems and methods that can
`be practiced from all suitable combinations of the various
`
`aspects Summarized above, as well as those disclosed in the
`Detailed Description below and particularly pointed out in the
`claims filed with the application. Such combinations have
`particular advantages not specifically recited in the above
`Summary.
`
`BRIEF DESCRIPTION OF THE DRAWINGS
`0006. The embodiments of the invention are illustrated by
`way of example and not by way of limitation in the figures of
`the accompanying drawings in which like references indicate
`similar elements. It should be noted that references to “an or
`“one' embodiment of the invention in this disclosure are not
`necessarily to the same embodiment, and they mean at least
`OC.
`0007 FIG. 1 is a side view of one type of microphone
`assembly.
`0008 FIG. 2 is a side view of another type of microphone
`assembly, and includes parts of an electronic device the
`assembly is integrated into.
`0009 FIG. 3A is a side view of another type of coupler.
`0010 FIG. 3B is a cross-section view of FIG. 3A.
`0011
`FIG. 4 is a cross-section view of another type of
`coupler and boot.
`0012 FIG. 5A is a perspective view of another type of
`boot.
`0013 FIG. 5B is a cross-section view of FIG. 5A.
`0014 FIG. 6A is a perspective view of another type of
`boot.
`0015 FIG. 6B is a cross-section view of FIG. 6A.
`0016 FIG. 7A is a perspective view of another type of
`boot.
`0017 FIG. 7B is a cross-section view of FIG. 7A.
`0018 FIG. 8 depicts an example electronic device into
`which embodiments of the microphone assembly may be
`installed.
`
`DETAILED DESCRIPTION
`0019. Several embodiments of the invention with refer
`ence to the appended drawings are now explained. Whenever
`the shapes, relative positions and other aspects of the parts
`described in the embodiments are not clearly defined, the
`Scope of the invention is not limited only to the parts shown,
`which are meant merely for the purpose of illustration. Also,
`while numerous details are set forth, it is understood that
`some embodiments of the invention may be practiced without
`these details. In other instances, well-known circuits, struc
`tures, and techniques have not been shown in detail so as not
`to obscure the understanding of this description.
`0020 Microphone assemblies are often integrated within
`electronic audio devices Such as mobile phones, tablet com
`puters, notebook computers and desktop computers to detect
`audio signals (e.g., Sound). However, ambient moisture and
`dirt (e.g., dust) may enter the electronic device due to gaps
`through components of the assembly or through the acoustic
`apertures (e.g., openings) of the assembly, and may cause the
`microphone or other circuitry within the device to fail or have
`reduced functionality. Thus, it can be important to provide a
`microphone assembly that has sound isolation, and a moisture
`and dirt tight seal between the ambient and spaces, compo
`nents and circuitry inside the housing of the electronic device.
`For example, a microphone assembly may be designed with
`proper sealing technology between the device housing, com
`ponents of the assembly and the microphone to provide Sound
`
`AliveCor, Inc. Exhibit 1020
`IPR2023-00949
`Ex. 1020.10
`
`

`

`US 2013/01 08082 A1
`
`May 2, 2013
`
`isolation, as well as a moisture, dustandair-tight seal between
`the ambient and the inside of the electronic device.
`0021 More specifically, FIG. 1 shows one type of such a
`microphone assembly. Microphone assembly 1 includes
`printed circuit carrier 2 (PCC) having opening 3 (e.g., an
`acoustic aperture) through the carrier. Microphone 4 is
`attached to and facing back side 5 of the carrier 2, such as by
`having its input acoustic port 7 (or its transducer) facing and
`open to the surface of back side 5. The microphone has
`acoustic input port 7 aligned with the opening 3, Such as by
`having the axis of port 7 aligned or parallel to the axis of
`opening 3. Port 7 may also be described as facing and open to
`opening 3.
`0022 FIG. 1 also shows coupler 8A attached to and facing
`front side 6 of the carrier 2, such as by having its opening 10
`facing and open to the surface of front side 6. The rigid
`acoustic coupler 8A has opening 10 through the coupler 8A
`and aligned with the opening 3. The coupler has its opening
`10 aligned with the opening 3, Such as by having opening 10
`facing and open to opening 3. Compliant boot 9A is installed
`over the rigid acoustic coupler 8A. Compliant boot 9A has
`opening 10 through the boot and aligned with opening 3.
`Opening 10 extends from the front side 11 of the coupler to
`opening 3, and opening 12 extends from the front side 13 of
`boot 9A to opening 10.
`0023 Printed circuit carrier 2 may be a “flex” circuit car
`rier, a microphone flex circuit board, a flexible circuit, a
`printed circuit board (PCB), and/or a printed circuit carrier.
`Such a carrier may include signal and other traces on (and
`possibly in) a flexible material (e.g., PCB material). A “flex”
`circuit carrier may include a flexible plastic Substrate. Such as
`polyimide, PEEK or a transparent conductive polyester film.
`It may also include Screen printed technology, photolitho
`graphic technology, metal strips laminated between two lay
`ers of PET, and/or technology used to manufacture compo
`nents of rigid PCBs. It may allow the carrier to conform to a
`desired shape, or to flex during its use. It may also include
`solder around a perimeter of opening 3 on sides 5 and 6.
`contacts and signal traces for connecting the microphone to
`audio processing circuitry.
`0024 Microphone 4 may be a MEMS (MicroElectrical
`Mechanical System) microphone, such as a microphone chip
`or silicon microphone. In some cases, microphone 4 may use
`a field effect transistor or amplification system to amplify a
`sensed signal in the audio range, such as from a human Voice.
`0025. Rigid acoustic coupler 8A may be made of or may
`include a metal material Such nickel, iron, bronze, copper,
`aluminum, or steel). In some cases, coupler 8A is a metal cap
`of one metal plated with another. It is considered that coupler
`8A may be a metal cap of nickel plated steel.
`0026 Compliant boot 9A may be made of or may include
`a soft compression molded material. In some cases, boot 9A
`is made of a soft compression molded silicon, rubber, or
`polymer.
`0027 Carrier 2, microphone 4, coupler 8A and boot 9A
`may be described as components of assembly 1. Gaps through
`the components, between the ambient (e.g., moisture, dirt and
`possibly air) and the inside of a device the assembly is inte
`grated into can be avoided by ensuring appropriate seals and
`bonds between components. For instance, the assembly may
`have seals (e.g., moisture, dirt and possibly air) between its
`acoustic apertures (e.g. holes or openings between the ambi
`ent and the microphone input port) and the inside of the
`device. The assembly may also be sealed to an acoustic aper
`
`ture of the housing of the device, under which the assembly is
`located. The components and seals may also provide Sound
`isolation from Stray or unwanted Sound in the ambient and
`vibration of the housing.
`0028. To provide such seals, FIG. 1 shows an embodiment
`having microphone 4 bonded to back side 5 of the carrier,
`Such as using glue, adhesive, solder, or by being otherwise
`joined. In some cases, microphone 4 is soldered to back side
`5 of the carrier. For example, a solder seal may be formed
`between microphone 4 and back side 5 around a perimeter of
`opening 3 so that the microphone is sealed to carrier 2. A
`perimeter may have various shapes such as a circle, oval,
`square, rectangle, etc. Such a seal may include being sealed
`with respect to air and dust; and being sound isolated (e.g.,
`providing Substantial Sound isolation, muffling or deadening)
`with respect to stray or unwanted Sound in the ambient and
`vibration of the housing. In some cases, the solder may hold
`the microphone 4 with enough force (e.g., tight enough)
`against back side 5 to form such a seal, even though the Solder
`may not form a complete perimeter. The acoustic input port of
`microphone 4 may be described as aligned with and adjoining
`opening 3. In some embodiments, microphone 4 is disposed
`entirely behind or below a surface of back side 5 of carrier 2
`and does not extend within opening 3. It is also considered
`that microphone 4 may be contained within an encasement or
`housing that is outside and behind back side 5 of carrier 2, and
`external to opening 3.
`0029. The seals may also include coupler 8A being
`bonded to front side 6 of the carrier, such as using glue,
`adhesive, Solder, or by being otherwise joined. In some cases,
`coupler 8A is soldered to front side 6 of the carrier. For
`example, a solder seal may be formed between coupler 8A
`and front side 6 around a perimeter of opening 3 so that the
`coupler is sealed to carrier 2. Such a seal may include being
`sealed with respect to air and dust; and being Sound isolated
`(e.g., providing Substantial Sound isolation, muffling or dead
`ening) with respect to stray or unwanted Sound in the ambient
`and vibration of the housing. In some cases, the Solder holds
`the coupler 8A with enough force against front side 6 to form
`Such a seal, even though the solder may not form a complete
`perimeter. In some embodiments, coupler 8A is disposed
`entirely in front of or above a surface of front side 6 of carrier
`2 and does not extend within opening 3.
`0030 The bonding between microphone 4 and back side 5
`and/or the bonding between coupler 8A and front side 6 may
`be or include of one or more different or repeated bonding
`techniques (e.g., overlapping solder joints). In some cases,
`Such bonding includes other material Such as signal traces,
`adhesive, solder, and/or tape between Surfaces of microphone
`4 and back side 5 and/or between surfaces of coupler 8A and
`front side 6. In some cases, microphone 4 is secured to and
`sealed to the back side of carrier 2 by a soldering process or
`glue; and coupler 8A is secured to and sealed to the front side
`of carrier 2 by a soldering process or glue.
`0031. In some embodiments, the solder between micro
`phone 4 and back side 5 and/or the solder between coupler 8A
`and front side 6 does not conduct signals to any circuitry of the
`device. It is considered that the solder may be grounded to
`help reduce unwanted electronic effects or signals due to the
`existence of the Solder. In some cases, such solder includes at
`least one bias or signal path, to or from the microphone, in
`addition to the bonding Solder. In some cases, such solder
`includes exposed metal traces to which microphone 4 and
`back side 5 and/or coupler 8A and front side 6 are bonded.
`
`AliveCor, Inc. Exhibit 1020
`IPR2023-00949
`Ex. 1020.11
`
`

`

`US 2013/01 08082 A1
`
`May 2, 2013
`
`0032 Compliant boot 9A may be sealed (vial seal 22) to
`acoustic coupler 8A by mechanical friction and/or mechani
`cal structure. This seal may be caused by the material and
`shape of inner perimeter 23 of boot 9A nominally interfering
`with outer perimeter 26 of coupler 8A along one or more
`discrete paths to ensure a dirt and moisture tight seal. Such
`paths may be formed by Surfaces of rings nominally interfer
`ing with (e.g., causing friction when moved with respect to)
`with corresponding Surfaces of corresponding grooves. In
`Some cases, the seal includes at least one ring in an inner
`perimeter of the boot that engages at least one groove in an
`outer perimeter of the coupler (e.g., see FIGS. 1 and 2), at
`least one large ring around the upper outer perimeter of the
`coupler boot to engage a large groove in the boot inner perim
`eter, at least one thread around the outer perimeter of the
`coupler to engage threads in the boot (e.g., see FIGS. 3A-B).
`at least one O-ring in a groove of the coupler to engage the flat
`Surface of the boot (e.g., see FIG. 4), a metal reinforcing ring
`around and interlocked to the soft material of the boot (e.g.,
`see FIGS. 5A-B), a metal reinforcing ring within and inter
`locked to the soft material of the boot (e.g., see FIGS. 6A-B),
`ora reinforcing hard material ring around the outer base of the
`soft material boot (e.g., see FIGS. 7A-B).
`0033. In some embodiments, such as shown in FIG. 1,
`coupler 8A is or includes a metal cap; boot 9A is or includes
`a soft compression molded material; and an inner perimeter
`of the compliant boot is sealed to an outer perimeter of the
`coupler, where the seal includes using rings (e.g., in the boot
`or coupler) that engage (e.g., mate with) grooves (e.g., in the
`coupler or boot). It can be appreciated that there may be 1, 2,
`3, 4, or more rings to provide Some of the seal. In some cases
`only 1 or 2 rings may be needed.
`0034) For example, as shown in FIG. 1, compliant boot 9A
`has inner perimeter 23 having rings 24 that engage or mate
`with corresponding grooves 25 in outer perimeter 26 of the
`coupler to from a dirt and moisture (an possibly air) tight seal
`between the boot and the coupler (e.g., by sealing inner
`perimeter 23 to outer perimeter 26). Rings 24 may be ring
`shaped protrusions that extend outward from the outer perim
`eteralongaring around the perimeter. They may extend out to
`form a half circle or semi-circular cross section shape with
`respect to the path of the ring around the perimeter. It is
`considered that they may also extend out to form other curved
`orangled cross section shapes. For example, they may extend
`out to form an arc, an arch, a half oval, a sine wave bump, a
`Gaussian curve bump, or other protruding shapes with curved
`Surface and/or flat Surfaces shape cross section with respect to
`the path. Grooves 25 may extend inward along the inner
`perimeter in a shape that is the same as (e.g., receives) the ring
`shape (e.g., with respect to the path of the ring around the
`perimeter). Also, Some other embodiments may have grooves
`in boot 9A inner perimeter 23, and corresponding rings in
`outer perimeter 26 of the coupler to from a dirt and moisture
`(and possibly air) tight seal between the boot and the coupler.
`In some embodiments, the rings do not necessarily engage
`grooves to from a dirt and moisture (and possibly air) tight
`seal between the boot and the coupler, such as embodiments
`including the rings in the boot, without the grooves in the
`coupler to mate into, or embodiments that have rings in the
`coupler but not grooves in the boot.
`0035. The compliance of the material of boot 9A and of
`coupler 8A may be selected so to ensure a seal between the
`boot and the coupler. The number of rings and grooves, thick
`
`ness and height of the rings, and thickness and height of the
`grooves may also be selected so to ensure a seal between the
`boot and the coupler.
`0036. In some cases, a mechanical friction seal 22 (e.g., by
`the rings and grooves; or by other similar structure) may be
`formed between boot 9A and coupler 8A around perimeters
`23 and 26 so that the boot is sealed to the coupler. Such a seal
`may include being sealed with respect to air and dust; and
`being Sound isolated (e.g., providing Substantial Sound isola
`tion, muffling or deadening) with respect to stray or unwanted
`Sound in the ambient and vibration of the housing. In some
`cases, the mechanical friction holds the boot 9A with enough
`force against coupler 8A to form such a seal. For example, this
`may occur, even though the rings, thread, and/or grooves do
`not form (e.g., do not exist, or exist but do not form) a
`complete seal around a complete perimeter. In some embodi
`ments, glue or adhesive may help the seal between compliant
`boot 9A and acoustic coupler 8A. Similar concepts apply to
`embodiments described below for FIGS. 2-7.
`0037 FIG. 2 is a side view of another type of microphone
`assembly, and includes parts of an electronic device the
`assembly is integrated into. For instance, FIG. 2 shows a
`housing 18 and support structure 29 of an electronic device in
`which assembly 1 is mounted or contained. Although some
`similar feature numbers are used for FIGS. 1 and 2, there is a
`distinction between the engaging or mating of coupler 8B and
`boot 9B of FIG. 2 as compared to coupler 8A and boot 9A of
`FIG.1. Thus, descriptions above for coupler 8A and hoot 9A
`may apply to coupler 8B and boot 9B, such as with the
`exceptions of the differences described below. For example,
`as compared to rings 24 and grooves 25 of coupler 8A and
`boot 9A in FIG. 1, in embodiments shown in FIG. 2, coupler
`8B has an outer perimeter with one large ring or disc shape 30
`that engages or mates with one corresponding groove 32 in
`the inner perimeter of compliant boot 9B. This may from a
`dirt and moisture (and possibly air) tight seal between the
`boot and the coupler (e.g., by sealing inner perimeter 23 to
`outer perimeter 26). In some embodiments, groove 32 has at
`least two flat surfaces that engage and seal to corresponding
`flat surfaces in ring 30. More particularly, flat surfaces 33 and
`35 of ring 30 may be nominally interfering with (e.g., causing
`friction when moved with respect to) with corresponding flat
`surfaces 34 and 36 of groove 32.
`0038. In some cases, surfaces 33 and 35 may form a pro
`trusion that extend outward from the outer perimeter along a
`ring around the perimeter. They may extend out to form an
`angled edge cross section shape with respect to the path of the
`ring around the perimeter, Such as forming an angle of 45
`degrees where they meet. It is considered that ring 30 may
`also extend out to form other curved or angled cross section
`shapes, such as noted above for ring 24. Surfaces 34 and 36
`may extend inward along the inner perimeter in a shape that is
`the same as (e.g., receives) the ring shape (e.g., with respect to
`the path of the ring around the perimeter).
`0039 FIG. 2 also shows an embodiment having boot 9B
`attached to device housing 18 (e.g., of a device such as device
`50 of FIG. 8) with an adhesive 16, and opening 3 aligned with
`acoustic aperture 19 (e.g., a hole) of the housing. In some
`embodiments, cosmetic mesh 17 is disposed over opening 12.
`and is attached to front side 13 of the boot with adhesive 16.
`Cosmetic mesh 17 may provide a visually appealing look for
`aperture 19, such as by providing a noticeable location of the
`microphone assembly so that a user will know which part of
`
`AliveCor, Inc. Exhibit 1020
`IPR2023-00949
`Ex. 1020.12
`
`

`

`US 2013/01 08082 A1
`
`May 2, 2013
`
`the device to speak at or aim at audio signals the user desired
`to be picked up by the microphone.
`0040 Adhesive 16 may hold the boot in place vertically
`and horizontally so that a seal is formed between the boot
`front side 13 and the back side of housing 18. In some cases,
`the outer side surfaces of the boot are sealed horizontally to
`inner side surfaces of acoustic aperture 19 of housing 18, such
`as by adhesive. Such a seal may include being sealed with
`respect to air and dust; and being Sound isolated (e.g., pro
`viding Substantial Sound isolation, muffling or deadening)
`with respect to stray or unwanted Sound in the ambient and
`vibration of the housing. In some cases, the adhesive 16 holds
`the boot 9B with enough force against housing 18 to form
`Such a seal, even though the adhesive may not form a com
`plete perimeter. Boot may be described as being bonded to
`edges of aperture 19 of a mobile housing.
`0041. In accordance with embodiments, compliant boot
`9B may not touch the printed circuit carrier 2. In some cases,
`boot 9B also touches or is attached (e.g., by adhesive and/or
`mechanical pressure) to Support structure 29 within housing
`18 or an electronic device.
`0042. Also, in some cases, acoustic mesh 15 is disposed
`under cosmetic mesh 17 and over opening 12, and is attached
`to front side 13 of the boot with adhesive 14. Acoustic 15 may
`provide physical audio filtering to help pass speech audio
`frequencies but filter out or mute frequency ranges above and
`below typical human speech. This way, undesired audio sig
`nals picked up by the microphone will not interfere with a
`user's speech received by the microphone.
`0043. This design allows audio signals 30 in the ambient
`or incident upon assembly 1 (e.g., opening 12) to be received
`by microphone 4 and converted into electronic audio signals.
`In some cases, audio signals incident upon the compliant boot
`and front side of the carrier are converted by the microphone
`into electronic signals. For example, assembly 1 (e.g., micro
`phone 4) may be used to convert verbal input by a user (or
`other audio signals) into electronic audio signals. The micro
`phone may be soldered to signal traces and/or circuitry of
`carrier 2 for processing the electronic signals. In some
`embodiments, microphone 4 is described as soldered and
`connected to through signal contacts on back side 5 of printed
`circuit carrier 2. Carrier 2 may be attached to housing 18,
`support structure 29, and/or to other internal components of
`an electronic device containing assembly 1 or into which the
`assembly is integrated (e.g., device 50 of FIG. 8). In some
`cases, carrier 2 is attached or bonded to support structure 29
`within or inside housing 18 of an electronic device. Thus,
`analog audio electrical signals transmitted through the elec
`trical traces of the printed circuit carrier may be stored and/or
`transmitted by an electronic device that includes assembly 1.
`0044 FIG. 3A is a side view of another type of coupler.
`FIG. 3B is a cross-section view of FIG. 3A. Although some
`similar feature numbers are used for FIGS. 1-3, there is a
`distinction between the engaging or mating of coupler 8C of
`FIG. 3 (e.g., and the boot) as compared to couplers 8A-Band
`boots 9A-B of FIGS. 1-2. Thus, descriptions above for cou
`plers 8A-B and boots 9A-B may apply to coupler 8C and the
`boot, such as with the exceptions of the differences described
`below. For example, as compared to rings 24 and grooves 25
`of coupler 8A and boot 9A in FIG. 1, and as compared to disc
`shape.30 and groove 32 of coupler 8B and boot 9B of FIG.2,
`in embodiments shown in FIG. 3, coupler 8C has an outer
`perimeter 26 with threads 37 on the coupler that engage or
`screw into corresponding threads (e.g., grooves) in the inner
`
`perimeter of a hard boot (e.g., corresponding to boot 9A but
`with threaded grooves instead of rings 24). This may from a
`dirt and moisture (and possibly air) tight seal between the
`boot and the coupler (e.g., by sealing inner perimeter 23 to
`outer perimeter 26). In some embodiments, coupler 8C has at
`least two threads around its perimeter that engage and seal to
`corresponding threads of the boot, Such as by nominally
`interfering with (e.g., causing friction when moved with
`respect to) the corresponding threads. The number of threads,
`and thickness and height of the threads may be selected so to
`ensure a seal between the boot and the coupler.
`004.5 FIGS. 3A-B also show that the bottom side(s) 38 of
`the coupler may be angled (e.g., forms an angle greater than
`90 degrees) with respect to front side 6 of PCC2. Such an
`angle may be 100 degrees or some other angle between 95 and
`105 degrees. In some cases, bottom side(s) 38 of the coupler
`may be have knurled surfaces for better bonding or attach
`ment of the coupler with a solder joint to front side 6 of CCA
`2, such as by providing a better solder interlock when solder
`ing the coupler to the CCA. For instance, knurling can be
`added to the sides of the coupler to add mechanical strength to
`the joint between the coupler and CCA. Such knurling may be
`performed in a manufacturing process, such as using a lathe,
`to cut a diamond-shaped (criss-cross) pattern into the material
`ofsides 38. The knurling may also be rolled into sides 38. This
`allows a better grip on the knurled object than would be
`provided by a smooth metal Surface. In some cases, the
`knurled pattern is a series of Straight ridges or a helix of
`“straight ridges rather than a criss-cross pattern.
`0046 FIG. 4 is a cross-section view of another type of
`coupler and boot. Although some similar feature numbers are
`used for FIGS. 1-4, there is a distinction between the engag
`ing or mating of coupler 8D and boot 9D of FIG. 4 as com
`pared to couplers and boots of FIGS. 1-2. Thus, descriptions
`above for couplers 8A-B and boots 9A-B may apply to cou
`pler 8D and boot 8D, such as with the exceptions of the
`differences described below. For example, as compared to
`rings 24 and grooves 25 in FIG. 1, and as compared to disc
`shape.30 and groove 32 of FIG. 2, in embodiments shown in
`FIG. 3, coupler 8D has an outer perimeter 26 with groove 25
`and O-ring 39 on the coupler that engage or form a friction
`seal onto the Surface (e.g., Smooth) of the inner perimeter 23
`of a hard boot 9D. This may from a dirt and moisture (and
`possibly air) tight seal between the boot and the coupler (e.g.,
`by sealing inner perimeter 23 to outer perimeter 26). In some
`embodiments, coupler 8D has at least one O-ring 39 around
`its perimeter that engages and seals to corresponding Surface
`of the boot, Such as by nominally interfering with (e.g., caus
`ing friction when moved with respect to) the corresponding
`Surface.
`0047 Hard boot 9D may be made of or may include a
`metal material such as described above for coupler 8A. The
`compliance of the material of boot 9D, O-ring 39, and of
`coupler 8D may be selected so to ensure a seal between the
`boot and the coupler. The number of O-rings and grooves,
`thickness and height of the rings, and thickness and height of
`the grooves may also be selected so to ensure a seal between
`the boot and the coupler.
`0048 FIG. 5A is a perspective view of another type of
`boot. FIG. 5B is a cross-section view of FIG. 5A. Although
`some similar feature numbers are used for FIGS. 1-2, there is
`a distinction between the engaging or mating of boot 9E of
`FIGS. 5A-B (e.g.,