(19) United States
`(12) Patent Application Publication (10) Pub. No.: US 2016/0100499 A1
`(43) Pub. Date:
`Apr. 7, 2016
`JUNG et al.
`
`US 201601 00499A1
`
`(54)
`
`(71)
`
`(72)
`
`ELECTRONIC DEVICE ADOPTING
`KEY WATERPROOF STRUCTURE AND
`METHOD FORWATERPROOFING KEY
`THEREOF
`
`Applicant: Samsung Electronics Co., Ltd.,
`Suwon-si (KR)
`Inventors: Youngjun JUNG, Daegu (KR); Taewon
`KIM, Daegu (KR); Eonseog CHEON,
`Daegu (KR); Junghee HWANG,
`Gumi-si (KR)
`
`(21)
`
`Appl. No.: 14/876,294
`
`Filed:
`
`Oct. 6, 2015
`Foreign Application Priority Data
`
`(22)
`(30)
`Oct. 6, 2014 (KR) ........................ 10-2014-O134423
`
`Publication Classification
`
`(51) Int. Cl.
`H05K 5/06
`G06F I/I6
`(52) U.S. Cl.
`CPC .............. H05K5/062 (2013.01); G06F 1/1656
`(2013.01)
`
`(2006.01)
`(2006.01)
`
`ABSTRACT
`(57)
`An electronic device and a method of waterproofing a key
`thereofare provided. The electronic device includes a body, a
`display device disposed in the body, a key disposed in the
`body, and a key-waterproof structure including an insert
`injected product that includes an insert-injected sealing area,
`and a bonding area where a silicon-not-attached portion is
`formed. The method includes assembling a flexible printed
`circuit board, to which a key is attached, through a silicon
`not-attached portion of an insert-injected product, which is
`made by insert-injecting a bracket and silicon rubber, and
`bonding the silicon-not-attached portion.
`
`
`
`AliveCor, Inc. Exhibit 1005
`IPR2023-00949
`Ex. 1005.1
`
`

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`Patent Application Publication
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`US 2016/01.00499 A1
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`AliveCor, Inc. Exhibit 1005
`IPR2023-00949
`Ex. 1005.2
`
`

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`Patent Application Publication
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`Apr. 7, 2016 Sheet 2 of 13
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`US 2016/01.00499 A1
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`AliveCor, Inc. Exhibit 1005
`IPR2023-00949
`Ex. 1005.3
`
`

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`Patent Application Publication
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`Apr. 7, 2016 Sheet 3 of 13
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`US 2016/01.00499 A1
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`AliveCor, Inc. Exhibit 1005
`IPR2023-00949
`Ex. 1005.4
`
`

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`Patent Application Publication
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`Apr. 7, 2016 Sheet 4 of 13
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`US 2016/01.00499 A1
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`FG. AA
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`AliveCor, Inc. Exhibit 1005
`IPR2023-00949
`Ex. 1005.5
`
`

`

`Patent Application Publication
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`Apr. 7, 2016 Sheet 5 of 13
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`US 2016/01.00499 A1
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`FG. AB
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`AliveCor, Inc. Exhibit 1005
`IPR2023-00949
`Ex. 1005.6
`
`

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`Patent Application Publication
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`Apr. 7, 2016 Sheet 6 of 13
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`US 2016/01.00499 A1
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`F.G. 5
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`AliveCor, Inc. Exhibit 1005
`IPR2023-00949
`Ex. 1005.7
`
`

`

`Patent Application Publication
`
`Apr. 7, 2016 Sheet 7 of 13
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`US 2016/01.00499 A1
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`
`
`SC
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`AliveCor, Inc. Exhibit 1005
`IPR2023-00949
`Ex. 1005.8
`
`

`

`Patent Application Publication
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`Apr. 7, 2016 Sheet 8 of 13
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`US 2016/01.00499 A1
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`G. 7
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`AliveCor, Inc. Exhibit 1005
`IPR2023-00949
`Ex. 1005.9
`
`

`

`Patent Application Publication
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`Apr. 7, 2016 Sheet 9 of 13
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`US 2016/01.00499 A1
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`FG.
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`AliveCor, Inc. Exhibit 1005
`IPR2023-00949
`Ex. 1005.10
`
`

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`Patent Application Publication
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`Apr. 7, 2016 Sheet 10 of 13
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`US 2016/01.00499 A1
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`F. G. 9
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`AliveCor, Inc. Exhibit 1005
`IPR2023-00949
`Ex. 1005.11
`
`

`

`Patent Application Publication
`
`Apr. 7, 2016 Sheet 11 of 13
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`US 2016/01.00499 A1
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`
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`AliveCor, Inc. Exhibit 1005
`IPR2023-00949
`Ex. 1005.12
`
`

`

`Patent Application Publication
`
`Apr. 7, 2016 Sheet 12 of 13
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`US 2016/01.00499 A1
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`
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`AliveCor, Inc. Exhibit 1005
`IPR2023-00949
`Ex. 1005.13
`
`

`

`Patent Application Publication
`
`Apr. 7, 2016 Sheet 13 of 13
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`US 2016/01.00499 A1
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`
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`AliveCor, Inc. Exhibit 1005
`IPR2023-00949
`Ex. 1005.14
`
`

`

`US 2016/01 00499 A1
`
`Apr. 7, 2016
`
`ELECTRONIC DEVICE ADOPTING
`KEY WATERPROOF STRUCTURE AND
`METHOD FORWATERPROOFING KEY
`THEREOF
`
`CROSS-REFERENCE TO RELATED
`APPLICATION(S)
`0001. This application claims the benefit under 35 U.S.C.
`S119(a) of a Korean patent application filed on Oct. 6, 2014 in
`the Korean Intellectual Property Office and assigned Serial
`number 10-2014-0134423, the entire disclosure of which is
`hereby incorporated by reference.
`
`TECHNICAL FIELD
`0002 The present disclosure relates to an electronic
`device adopting a key-waterproof structure and a method for
`waterproofing a key thereof.
`
`BACKGROUND
`0003 Mobile phones of the related art are limited to a
`Voice call function, and personal computers are provided at
`home or offices in order to be used by a few users.
`0004. However, recently introduced smartphones and tab
`let personal computers (PCs) are not limited to specific uses in
`the same way as related-art mobile phones and personal com
`puters, and are manufactured to be Small so that users carry
`the device as a necessity anytime and anywhere.
`0005 With the development of mobile technology and the
`advancement of computing devices, portable devices, such as
`the Smart phones and the table PCs, adopt a high-capacity
`data storage medium, a high-performance calculating and
`processing unit, and a high-speed communication module
`therein in order to thereby perform the operation that was
`previously possible only by the related-art PCs.
`0006. The portable device, such as the Smartphone and the
`tablet PC, adopts a home-key that implement various func
`tions in a one-touch type to enhance the user's convenience.
`0007. The home-key, which implements various functions
`using one touch, should be provided with a waterproof struc
`ture. To this end, in the related art, the components of the
`home-key are assembled in a stack to be bonded to a bracket
`portion of a circuit board using dedicated equipment or a jig,
`and silicon rubberis placed on the same to then be pressed and
`assembled.
`0008. However, according to the prior art, it is not easy to
`implement the waterproof structure because of the compli
`cated assembly process, and it causes a wide bonding area and
`a bonding failure in a bonding and silicon assembly process,
`So it is difficult to find and manage water-seepage due to the
`bonding failure.
`0009. In addition, since the whole area should be bonded
`using an adhesive, the equipment and the jig may be exces
`sively used, and thus it is hard to manage the use of the jig as
`well.
`0010. The above information is presented as background
`information only to assist with an understanding of the
`present disclosure. No determination has been made, and no
`assertion is made, as to whether any of the above might be
`applicable as prior art with regard to the present disclosure.
`
`SUMMARY
`0011 Aspects of the present disclosure are to address at
`least the above-mentioned problems and/or disadvantages
`
`and to provide at least the advantages described below.
`Accordingly, an aspect of the present disclosure is to provide
`an electronic device adopting a key-waterproof structure and
`a method for waterproofing a key, a circuit board bracket and
`silicon rubber are sealed through the insert injection process
`while the area where a flexible circuit board passes remains
`unbonded, and the flexible circuit board is assembled through
`the flexible circuit board passing area, i.e., the unbonded area,
`to then perform a bonding operation with respect to the
`unbonded area. Therefore, the waterproofing process can be
`simplified, and the waterproof performance can be enhanced
`while waterproof points and the processing cost can be
`reduced.
`0012. In accordance with an aspect of the present disclo
`sure, an electronic device is provided. The device includes a
`body, a display device disposed in the body, a key disposed in
`the body, and a key-waterproof structure including an insert
`injected product that includes an insert-injected sealing area,
`and a bonding area where a silicon-not-attached portion is
`formed.
`0013. In accordance with another aspect of the present
`disclosure, a method is provided. The method includes
`assembling a flexible printed circuit board, to which a key is
`attached, through a silicon-not-attached portion of an insert
`injected product, which is made by insert-injecting a bracket
`and silicon rubber, and bonding the silicon-not-attached por
`tion.
`0014. Other aspects, advantages, and salient features of
`the disclosure will become apparent to those skilled in the art
`from the following detailed description, which, taken in con
`junction with the annexed drawings, discloses various
`embodiments of the present disclosure.
`
`BRIEF DESCRIPTION OF THE DRAWINGS
`
`0015 The above and other aspects, features, and advan
`tages of certain embodiments of the present disclosure will be
`more apparent from the following description taken in con
`junction with the accompanying drawings, in which:
`0016 FIG. 1 illustrates a network environment including
`an electronic device according to various embodiments of the
`present disclosure;
`0017 FIG. 2 is a block diagram of an electronic device
`according to various embodiments of the present disclosure;
`0018 FIG. 3 is a block diagram of a program module
`according to various embodiments of the present disclosure;
`(0019 FIGS. 4A and 4B illustrate portable terminals as
`examples of an electronic device adopting a key-waterproof
`structure, according to various embodiments of the present
`disclosure, wherein FIG. 4A shows a mobile phone and
`(0020 FIG. 4B shows a tablet personal computer (PC)
`according to various embodiments of the present disclosure;
`0021
`FIG. 5 is an exploded perspective view illustrating a
`key-waterproofstructure of the portable terminal of FIGS. 4A
`and 4B according to various embodiments of the present
`disclosure;
`0022 FIG. 6 is a combined plan view of the key-water
`proof structure of FIG. 5 according to various embodiments
`of the present disclosure;
`0023 FIG. 7 is a perspective view illustrating a bracket of
`the key-waterproof structure of FIG. 5 according to various
`embodiments of the present disclosure;
`
`AliveCor, Inc. Exhibit 1005
`IPR2023-00949
`Ex. 1005.15
`
`

`

`US 2016/01 00499 A1
`
`Apr. 7, 2016
`
`0024 FIG. 8 is a perspective view illustrating an insert
`injected product in which silicon rubber is bonded to the
`bracket of FIG. 7 according to various embodiments of the
`present disclosure;
`0025 FIG. 9 is a schematic diagram to explain the assem
`bly of a flexible printed circuit board with respect to the
`insert-injected product of FIG. 8 according to various
`embodiments of the present disclosure;
`0026 FIG. 10 illustrates the insert-injected product to
`which the flexible printed circuit board of FIG. 9 has been
`assembled according to various embodiments of the present
`disclosure;
`0027 FIG. 11 is a detailed view of the area “A” of FIG. 10
`according to various embodiments of the present disclosure;
`and
`0028 FIG. 12 is a plan view illustrating a key-waterproof
`structure assembled to the back surface of a display device of
`the portable terminal of FIG. 4A according to various
`embodiments of the present disclosure.
`0029. Throughout the drawings, it should be noted that
`like reference numbers are used to depict the same or similar
`elements, features, and structures.
`
`DETAILED DESCRIPTION
`0030 The following description with reference to the
`accompanying drawings is provided to assistina comprehen
`sive understanding of various embodiments of the present
`disclosure as defined by the claims and their equivalents. It
`includes various specific details to assist in that understanding
`but these are to be regarded as merely exemplary. Accord
`ingly, those of ordinary skill in the art will recognize that
`various changes and modifications of the various embodi
`ments described herein can be made without departing from
`the Scope and spirit of the present disclosure. In addition,
`descriptions of well-known functions and constructions may
`be omitted for clarity and conciseness.
`0031. The terms and words used in the following descrip
`tion and claims are not limited to the bibliographical mean
`ings, but, are merely used by the inventor to enable a clearand
`consistent understanding of the present disclosure. Accord
`ingly, it should be apparent to those skilled in the art that the
`following description of various embodiments of the present
`disclosure is provided for illustration purpose only and not for
`the purpose of limiting the present disclosure as defined by
`the appended claims and their equivalents.
`0032. It is to be understood that the singular forms “a.”
`“an and “the include plural referents unless the context
`clearly dictates otherwise. Thus, for example, reference to “a
`component Surface' includes reference to one or more of such
`Surfaces.
`0033. The expressions such as “include and “may
`include” which may be used in the present disclosure denote
`the presence of the disclosed functions, operations, and con
`stituent elements and do not limit one or more additional
`functions, operations, and constituent elements. In the
`present disclosure, the terms such as “include” and/or “have
`may be construed to denote a certain characteristic, number,
`step, operation, constituent element, component or a combi
`nation thereof, but may not be construed to exclude the exist
`ence of or a possibility of addition of one or more other
`characteristics, numbers, steps, operations, constituent ele
`ments, components or combinations thereof.
`0034) Furthermore, in the present disclosure, the expres
`sion and/or” includes any and all combinations of the asso
`
`ciated listed words. For example, the expression A and/or B'
`may include A, may include B, or may include both A and B.
`0035. In the present disclosure, expressions including
`ordinal numbers, such as “first and “second, etc., may
`modify various elements. However, Such elements are not
`limited by the above expressions. For example, the above
`expressions do not limit the sequence and/or importance of
`the elements. The above expressions are used merely for the
`purpose to distinguish an element from the other elements.
`For example, a first user device and a second user device
`indicate different user devices although both of them are user
`devices. For example, a first element could be termed a sec
`ond element, and similarly, a second element could be also
`termed a first element without departing from the scope of the
`present disclosure.
`0036. In the case where a component is referred to as being
`“connected” or “accessed to other component, it should be
`understood that not only the component is directly connected
`or accessed to the other component, but also there may exist
`another component between them. Meanwhile, in the case
`where a component is referred to as being “directly con
`nected' or “directly accessed to other component, it should
`be understood that there is no component therebetween. The
`terms used in the present disclosure are only used to describe
`specific various embodiments, and are not intended to limit
`the present disclosure. As used herein, the singular forms are
`intended to include the plural forms as well, unless the con
`text clearly indicates otherwise. Singular forms are intended
`to include plural forms unless the context clearly indicates
`otherwise.
`0037. An electronic device according to the present dis
`closure may be a device including a communication function.
`For example, the device corresponds to a combination of at
`least one of a Smartphone, a tablet personal computer (PC), a
`mobile phone, a video phone, an e-book reader, a desktop PC,
`a laptop PC, a netbook computer, a personal digital assistant
`(PDA), a portable multimedia player (PMP), a digital audio
`player, a mobile medical device, an electronic bracelet, an
`electronic necklace, an electronic accessory, a camera, a
`wearable device, an electronic clock, a wrist watch, home
`appliances (for example, an air-conditioner, vacuum, an oven,
`a microwave, a washing machine, an air cleaner, and the like),
`an artificial intelligence robot, a television (TV), a digital
`video disc (DVD) player, an audio device, various medical
`devices (for example, magnetic resonance angiography
`(MRA), magnetic resonance imaging (MRI), computed
`tomography (CT), a scanning machine, a ultrasonic wave
`device, or the like), a navigation device, a global positioning
`system (GPS) receiver, an event data recorder (EDR), a flight
`data recorder (FDR), a set-top box, a TV box (for example,
`Samsung HomeSynctM, Apple TVTM, or Google TVTM), an
`electronic dictionary, vehicle infotainment device, an elec
`tronic equipment for a ship (for example, navigation equip
`ment for a ship, gyrocompass, or the like), avionics, a security
`device, electronic clothes, an electronic key, a camcorder,
`game consoles, a head-mounted display (HMD), a flat panel
`display device, an electronic frame, an electronic album, fur
`niture or a portion of a building/structure that includes a
`communication function, an electronic board, an electronic
`signature receiving device, a projector, and the like. It is
`obvious to those skilled in the art that the electronic device
`according to the present disclosure is not limited to the afore
`mentioned devices.
`
`AliveCor, Inc. Exhibit 1005
`IPR2023-00949
`Ex. 1005.16
`
`

`

`US 2016/01 00499 A1
`
`Apr. 7, 2016
`
`0038 FIG. 1 is a block diagram illustrating a configuration
`of a network environment according to an embodiment of the
`present disclosure.
`0039 Referring to FIG. 1, the network environment 100
`includes electronic device 101, electronic device 102, elec
`tronic device 104, server 106, and network 162. The elec
`tronic device 101 may include a bus 110, a processor 120, a
`memory 130, a user input module 140, a display module 150,
`a communication module 160, and other similar and/or Suit
`able components.
`0040. The bus 110 may be a circuit which interconnects
`the above-described elements and delivers a communication
`(e.g., a control message) between the above-described ele
`mentS.
`0041. The processor 120 may receive commands from the
`above-described other elements (e.g., the memory 130, the
`user input module 140, the display module 150, the commu
`nication module 160, etc.) through the bus 110, may interpret
`the received commands, and may execute calculation or data
`processing according to the interpreted commands.
`0042. The memory 130 may store commands or data
`received from the processor 120 or other elements (e.g., the
`user input module 140, the display module 150, the commu
`nication module 160, etc.) or generated by the processor 120
`or the other elements. The memory 130 may include pro
`gramming modules, such as a kernel 131, middleware 132, an
`application programming interface (API) 133, an application
`134, and the like. Each of the above-described programming
`modules may be implemented in software, firmware, hard
`ware, or a combination of two or more thereof.
`0043. The kernel 131 may control or manage system
`resources (e.g., the bus 110, the processor 120, the memory
`130, etc.) used to execute operations or functions imple
`mented by other programming modules (e.g., the middleware
`132, the API 133, and the application 134). Also, the kernel
`131 may provide an interface capable of accessing and con
`trolling or managing the individual elements of the electronic
`device 101 by using the middleware 132, the API 133, or the
`application 134.
`0044) The middleware 132 may serve to go between the
`API 133 or the application 134 and the kernel 131 in such a
`manner that the API 133 or the application 134 communicates
`with the kernel 131 and exchanges data therewith. Also, in
`relation to work requests received from one or more applica
`tions 134 and/or the middleware 132, for example, may per
`form load balancing of the work requests by using a method
`of assigning a priority, in which system resources (e.g., the
`bus 110, the processor 120, the memory 130, etc.) of the
`electronic device 101 can be used, to at least one of the one or
`more applications 134.
`0045. The API 133 is an interface through which the appli
`cation 134 is capable of controlling a function provided by the
`kernel 131 or the middleware 132, and may include, for
`example, at least one interface or function for file control,
`window control, image processing, character control, or the
`like.
`0046. The user input module 140, for example, may
`receive a command or data as input from a user, and may
`deliver the received command or data to the processor 120 or
`the memory 130 through the bus 110. The display module 150
`may display a video, an image, data, or the like to the user.
`0047. The communication module 160 may connect com
`munication between another electronic device 102 and the
`electronic device 101. The communication module 160 may
`
`Support a predetermined short-range communication proto
`col (e.g., Wi-Fi, bluetooth (BT), and near field communica
`tion (NFC)), or predetermined network communication (e.g.,
`the Internet, a local area network (LAN), a wide area network
`(WAN), a telecommunication network, a cellular network, a
`satellite network, a plain old telephone service (POTS), or the
`like). Each of the electronic devices 102 and 104 may be a
`device which is identical (e.g., of an identical type) to or
`different (e.g., of a different type) from the electronic device
`101. Further, the communication module 160 may connect
`communication between a server 164 and the electronic
`device 101 via the network 162.
`0048 FIG. 2 is a block diagram illustrating a configuration
`of hardware 201 according to an embodiment of the present
`disclosure.
`0049. The hardware 201 may be, for example, the elec
`tronic device 101 illustrated in FIG. 1.
`0050 Referring to FIG. 2, the hardware 201 may include
`one or more processors 210, a subscriber identification mod
`ule (SIM) card 224, a communication module 220, a memory
`230, a sensor module 240, a user input module 250, a display
`module 260, an interface 270, an audio coder/decoder (codec)
`280, a camera module 291, a power management module 295,
`a battery 296, an indicator 297, a motor 298 and any other
`similar and/or suitable components.
`0051. The processor 210 (e.g., the processor 120) may
`include one or more application processors (APs), or one or
`more communication processors (CPs). The processor 210
`may be, for example, the processor 120 illustrated in FIG. 1.
`The AP and the CP are illustrated as being included in the
`processor 210 in FIG. 2, but may be included in different
`integrated circuit (IC) packages, respectively. According to
`an embodiment of the present disclosure, the AP and the CP
`may be included in one IC package.
`0.052 The AP may execute an operating system (OS) oran
`application program, and thereby may control multiple hard
`ware or software elements connected to the AP and may
`perform processing of and arithmetic operations on various
`data including multimedia data. The AP may be implemented
`by, for example, a system on chip (SoC). According to an
`embodiment of the present disclosure, the processor 210 may
`further include a graphical processing unit (GPU) (not illus
`trated).
`0053. The CP may manage a data line and may convert a
`communication protocol in the case of communication
`between the electronic device (e.g., the electronic device 101)
`including the hardware 201 and different electronic devices
`connected to the electronic device through the network. The
`CP may be implemented by, for example, a SoC. According to
`an embodiment of the present disclosure, the CP may perform
`at least some of multimedia control functions. The CP for
`example, may distinguish and authenticate a terminal in a
`communication network by using a SIM 224. Also, the CP
`may provide the user with services, such as a voice telephony
`call, a video telephony call, a text message, packet data, and
`the like.
`0054 Further, the CP may control the transmission and
`reception of data by the communication module 220. In FIG.
`2, the elements such as the CP, the power management mod
`ule 295, the memory 230, and the like are illustrated as ele
`ments separate from the AR However, according to an
`embodiment of the present disclosure, the AP may include at
`least some (e.g., the CP) of the above-described elements.
`
`AliveCor, Inc. Exhibit 1005
`IPR2023-00949
`Ex. 1005.17
`
`

`

`US 2016/01 00499 A1
`
`Apr. 7, 2016
`
`0055 According to an embodiment of the present disclo
`sure, the AP or the CP may load, to a volatile memory, a
`command or data received from at least one of a non-volatile
`memory and other elements connected to each of the AP and
`the CP, and may process the loaded command or data. Also,
`the AP or the CP may store, in a non-volatile memory, data
`received from or generated by at least one of the other ele
`mentS.
`0056. The SIM224 may be inserted into a slot formed in a
`particular portion of the electronic device 101. The SIM 224
`may include unique identification information (e.g., inte
`grated circuit card identifier (ICCID)) or subscriber informa
`tion (e.g., international mobile subscriber identity (IMSI)).
`0057 The memory 230 may include an internal memory
`232 and an external memory 234. The memory 230 may be,
`for example, the memory 130 illustrated in FIG.1. The inter
`nal memory 232 may include, for example, at least one of a
`Volatile memory (e.g., a dynamic random access memory
`(DRAM), a static RAM (SRAM), a synchronous dynamic
`RAM (SDRAM), etc.), and a non-volatile memory (e.g., a
`one time programmable ready only memory (OTPROM), a
`programmable ROM (PROM), an erasable and program
`mable ROM (EPROM), an electrically erasable and program
`mable ROM (EEPROM), a mask ROM, a flash ROM, a not
`AND (NAND) flash memory, a not OR (NOR) flash memory,
`etc.). According to an embodiment of the present disclosure,
`the internal memory 232 may be in the form of a solid state
`drive (SSD). The external memory 234 may further include a
`flash drive, for example, a compact flash (CF), a secure digital
`(SD), a micro-SD, a mini-SD, an extreme Digital (xD), a
`memory stick, or the like.
`0058. The communication module 220 may be, for
`example, the communication module 160 illustrated in FIG.
`1. The communication module 220 may include at least one
`of for example, a cellular module 221, a Wi-Fi module 223,
`a BT module 225, a GPS module 227, a NFC module 228, or
`radio frequency (RF) module 229. For example, the commu
`nication module 220 may provide a wireless communication
`function by using a radio frequency. Additionally or alterna
`tively, the communication module 220 may include a network
`interface (e.g., a LAN card), a modulator/demodulator (mo
`dem), or the like for connecting the hardware 201 to a network
`(e.g., the Internet, a LAN, a WAN, a telecommunication net
`work, a cellular network, a satellite network, a POTS, or the
`like).
`0059. The RF module 229 may be used for transmission
`and reception of data, for example, transmission and recep
`tion of RF signals or electronic signals. Although not illus
`trated, the RF module 229 may include, for example, a trans
`ceiver, a power amplifier module (PAM), a frequency filter, a
`low noise amplifier (LNA), or the like. Also, the RF module
`229 may further include a component for transmitting and
`receiving electromagnetic waves in a free space in a wireless
`communication, for example, a conductor, a conductive wire,
`or the like.
`0060. The sensor module 240 may include, for example, at
`least one of a gesture sensor 240A, a gyro sensor 240B, a
`barometer sensor 240C, a magnetic sensor 240D, an accel
`eration sensor 240E, a grip sensor 240F, a proximity sensor
`240G, a red, green and blue (RGB) sensor 240H, a biometric
`sensor 240I, a temperature/humidity sensor 240J, an illumi
`nance sensor 240K, and a ultra violet (UV) sensor 240L. The
`sensor module 240 may measure a physical quantity or may
`sense an operating State of the electronic device 101, and may
`
`convert the measured or sensed information to an electrical
`signal. Additionally/alternatively, the sensor module 240 may
`include, for example, an E-nose sensor (not illustrated), an
`electromyography (EMG) sensor (not illustrated), an electro
`encephalogram (EEG) sensor (not illustrated), an electrocar
`diogram (ECG) sensor (not illustrated), a fingerprint sensor
`(not illustrated), and the like. Additionally or alternatively, the
`sensor module 240 may include, for example, an E-nose
`sensor (not illustrated), an EMG sensor (not illustrated), an
`EEG sensor (not illustrated), an ECG sensor (not illustrated),
`a fingerprint sensor, and the like. The sensor module 240 may
`further include a control circuit (not illustrated) for control
`ling one or more sensors included therein.
`0061 The user input module 250 may include a touch
`panel 252, a pen sensor 254 (e.g., a digital pen sensor), keys
`256, and an ultrasonic input unit 258. The user input module
`250 may be, for example, the user input module 140 illus
`trated in FIG.1. The touch panel 252 may recognize a touch
`input in at least one of for example, a capacitive scheme, a
`resistive scheme, an infrared scheme, and an acoustic wave
`scheme. Also, the touch panel 252 may further include a
`controller (not illustrated). In the capacitive type, the touch
`panel 252 is capable of recognizing proximity as well as a
`direct touch. The touch panel 252 may further include a tactile
`layer (not illustrated). In this event, the touch panel 252 may
`provide a tactile response to the user.
`0062. The pen sensor 254 (e.g., a digital pen sensor), for
`example, may be implemented by using a method identical or
`similar to a method of receiving a touch input from the user,
`or by using a separate sheet for recognition. For example, a
`key pad or a touch key may be used as the keys 256. The
`ultrasonic input unit 258 enables the terminal to sensea sound
`wave by using a microphone (e.g., a microphone 288) of the
`terminal through a pen generating an ultrasonic signal, and to
`identify data. The ultrasonic input unit 258 is capable of
`wireless recognition. According to an embodiment of the
`present disclosure, the hardware 201 may receive a user input
`from an external device (e.g., a network, a computer, or a
`server), which is connected to the communication module
`220, through the communication module 220.
`0063. The display module 260 may include at least one of
`a panel 262, a hologram device 264, or a projector 266. The
`display module 260 may be, for example, the display module
`150 illustrated in FIG.1. The panel 262 may be, for example,
`a liquid crystal display (LCD) and an active matrix organic
`light emitting diode (AM-OLED) display, and the like. The
`panel 262 may be implemented so as to be, for example,
`flexible, transparent, or wearable. The panel 262 may include
`the touch panel 252 and one module. The hologram device
`264 may display a three-dimensional image in the airby using
`interference of light. According to an embodiment of the
`present disclosure, the display module 260 may further
`include a control circuit for controlling the panel 262, the
`hologram device 264, or the projector 266.
`0064. The interface 270 may include, for example, a high
`definition multimedia interface (HDMI) 272, a universal
`serial bus (USB) 274, an optical interface 276, and a d-sub
`miniature (D-sub) 278. Additionally or alternatively, the
`interface 270 may include, for example, SD/multi-media card
`(MMC) (not illustrated) or infrared data association (IrDA)
`(not illustrated).
`0065. The audio codec 280 may bidirectionally convert
`between a voice and an electrical signal. The audio codec 280
`may convert Voice information, which is input to or output
`
`AliveCor, Inc. Exhibit 1005
`IPR2023-00949
`Ex. 1005.18
`
`

`

`US 2016/01 00499 A1
`
`Apr. 7, 2016
`
`from the audio codec 280, through, for example, a speaker
`282, a receiver 284, an earphone 286, the microphone 288 or
`the like.
`0066. The camera module 291 may capture an image and
`a moving image. According to an embodiment, the camera
`module 291 may include one or more image sensors (e.g., a
`front lens or a backlens), an image signal processor (ISP) (not
`illustrated), and a flash LED (not illustrated).
`0067. The power management module 295 may manage
`power of the hardware 201. Although not illustrated, the
`power management module 295 may include, for example, a
`power management integrated circuit (PMIC), a charger inte
`grated circuit (IC), or a battery fuel gauge.
`0068. The PMIC may be mounted to, for example, an IC or
`a SoC semiconductor. Charging methods may be classified
`into a wired charging method