TOMMAND DIE ON A MAN UNIT MAN AT THE
`
`US010078354B2
`
`( 12 ) United States Patent
`Eriksen
`
`( 10 ) Patent No . : US 10 , 078 , 354 B2
`( 45 ) Date of Patent :
`* Sep . 18 , 2018
`
`( * ) Notice :
`
`( 54 ) COOLING SYSTEM FOR A COMPUTER
`SYSTEM
`( 71 ) Applicant : Asetek Danmark A / S , Aalborg East
`( DK )
`( 72 ) Inventor : André Sloth Eriksen , Nibe ( DK )
`( 73 ) Assignee : Asetek Danmark A / S , Aalborg East
`( DK )
`Subject to any disclaimer , the term of this
`patent is extended or adjusted under 35
`U . S . C . 154 ( b ) by 0 days .
`This patent is subject to a terminal dis
`claimer
`( 21 ) Appl . No . : 15 / 626 , 393
`( 22 ) Filed :
`Jun . 19 , 2017
`( 65 )
`Prior Publication Data
`US 2017 / 0329375 A1 Nov . 16 , 2017
`Related U . S . Application Data
`Continuation of application No . 15 / 347 , 938 , filed on
`Nov . 10 , 2016 , now Pat . No . 9 , 715 , 260 , which is a
`( Continued )
`
`( 60 )
`
`( 51 ) Int . Ci .
`F28F 7700
`( 2006 . 01 )
`G06F 1 / 20
`( 2006 . 01 )
`( Continued )
`( 52 ) U . S . CI .
`CPC . . . . . . . . . . . G06F 1 / 206 ( 2013 . 01 ) ; G06F 1 / 20
`( 2013 . 01 ) ; H05K 7 / 20154 ( 2013 . 01 ) ;
`( Continued )
`Field of Classification Search
`CPC . . . . . . GO6F 1 / 206 ; G06F 1 / 20 ; G06F 2200 / 201 ;
`HO5K 7 / 20154 ; HO5K 7 / 20263 ; HO5K
`7 / 20272 ; F28D 15 / 00 ; F28F 2250 / 08
`( Continued )
`
`( 58 )
`
`( 56 )
`
`CN
`CN
`
`References Cited
`U . S . PATENT DOCUMENTS
`3 , 810 , 509 A
`5 / 1974 Kun
`4 , 109 , 707 A
`8 / 1978 Wilson et al .
`( Continued )
`FOREIGN PATENT DOCUMENTS
`2514544 Y
`10 / 2002
`1387311 A
`12 / 2002
`( Continued )
`OTHER PUBLICATIONS
`Office Action dated Mar . 23 , 2016 in U . S . Appl . No . 13 / 942 , 922 ( 13
`pages )
`
`( Continued )
`
`Primary Examiner — Davis Hwu
`( 74 ) Attorney , Agent , or Firm — Finnegan , Henderson ,
`Farabow , Garrett & Dunner LLP
`
`( 57 )
`ABSTRACT
`A cooling system for a computer system comprises at least
`one unit such as a central processing unit ( CPU ) generating
`thermal energy and a reservoir having an amount of cooling
`liquid , said cooling liquid intended for accumulating and
`transferring of thermal energy dissipated from the process
`ing unit to the cooling liquid . The cooling system has a heat
`exchanging interface for providing thermal contact between
`the processing unit and the cooling liquid for dissipating
`heat from the processing unit to the cooling liquid . Different
`embodiments of the heat exchanging system as well as
`means for establishing and controlling a flow of cooling
`liquid and a cooling strategy constitutes the invention of the
`cooling system .
`
`19 Claims , 9 Drawing Sheets
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`Cooler Master Co., Ltd. Ex. 1010, Page 1 of 22
`Cooler Master Co., Ltd. v. Asetek Danmark A/S
`IPR2023-00667
`
`

`

`( 51 )
`
`( 52 )
`
`( 58 )
`
`( 56 )
`
`Related U . S . Application Data
`continuation of application No . 13 / 942 , 922 , filed on
`Jul . 16 , 2013 , which is a continuation of application
`No . 13 / 547 , 240 , filed on Jul . 12 , 2012 , which is a
`continuation of application No . 12 / 826 , 768 , filed on
`Jun . 30 , 2010 , now Pat . No . 8 , 240 , 362 , which is a
`division of application No . 10 / 578 , 578 , filed as ap
`plication No . PCT / DK2004 / 000775 on Nov . 8 , 2004 ,
`now Pat . No . 7 , 971 , 632 .
`Int . CI .
`( 2006 . 01 )
`H05K 7 / 20
`F28D 15 / 00
`( 2006 . 01 )
`U . S . Cl .
`CPC . . . . . H05K 7 / 20263 ( 2013 . 01 ) ; H05K 7 / 20272
`( 2013 . 01 ) ; F28D 15 / 00 ( 2013 . 01 ) ; F28F
`2250 / 08 ( 2013 . 01 ) ; G06F 2200 / 201 ( 2013 . 01 )
`Field of Classification Search
`. . . . .
`. . . 165 / 80 . 4
`USPC . . . . . . . . . . . . . . . . . .
`See application file for complete search history .
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`1510310 A
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`M24451
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`
`OTHER PUBLICATIONS
`Office Action dated Aug . 10 , 2016 in U . S . Appl . No . 13 / 942 , 922 ( 18
`pages ) .
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`pages ) .
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`U . S . Appl . No .
`15 / 347 , 938 ( 18 pages ) .
`Office Action dated Oct . 12 , 2012 in U . S . Appl . No . 11 / 919 , 974 ( 14
`pages ) .
`
`Cooler Master Co., Ltd. Ex. 1010, Page 2 of 22
`Cooler Master Co., Ltd. v. Asetek Danmark A/S
`IPR2023-00667
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`

`US 10 , 078 , 354 B2
`Page 3
`
`( 56 )
`
`References Cited
`OTHER PUBLICATIONS
`Office Action dated Oct . 6 , 2016 in U . S . Appl . No . 13 / 861 , 593 ( 8
`pages ) .
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`( 16 pages )
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`( 18 pages ) .
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`
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`pages ) .
`* cited by examiner
`
`Cooler Master Co., Ltd. Ex. 1010, Page 3 of 22
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`IPR2023-00667
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`

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`Sep . 18 , 2018
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`Cooler Master Co., Ltd. Ex. 1010, Page 4 of 22
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`IPR2023-00667
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`Sep . 18 , 2018
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`Cooler Master Co., Ltd. Ex. 1010, Page 5 of 22
`Cooler Master Co., Ltd. v. Asetek Danmark A/S
`IPR2023-00667
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`Cooler Master Co., Ltd. Ex. 1010, Page 6 of 22
`Cooler Master Co., Ltd. v. Asetek Danmark A/S
`IPR2023-00667
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`Sep . 18 , 2018
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`Cooler Master Co., Ltd. Ex. 1010, Page 7 of 22
`Cooler Master Co., Ltd. v. Asetek Danmark A/S
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`Cooler Master Co., Ltd. Ex. 1010, Page 8 of 22
`Cooler Master Co., Ltd. v. Asetek Danmark A/S
`IPR2023-00667
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`

`

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`Sep . 18 , 2018
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`FIG . 10
`
`Cooler Master Co., Ltd. Ex. 1010, Page 9 of 22
`Cooler Master Co., Ltd. v. Asetek Danmark A/S
`IPR2023-00667
`
`

`

`U . S . Paten
`
`atent
`
`Sep . 18 , 2018
`
`Sheet 7 of 9
`
`US 10 , 078 , 354 B2
`
`um
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`FIG . 11
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`FIG . 12
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`FIG . 13
`
`Cooler Master Co., Ltd. Ex. 1010, Page 10 of 22
`Cooler Master Co., Ltd. v. Asetek Danmark A/S
`IPR2023-00667
`
`

`

`atent
`
`Sep . 18 , 2018
`
`Sheet 8 of 9
`
`US 10 , 078 , 354 B2
`
`Lebensmitted
`penduduk setempat tento produktimento
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`FIG . 14
`
`Cooler Master Co., Ltd. Ex. 1010, Page 11 of 22
`Cooler Master Co., Ltd. v. Asetek Danmark A/S
`IPR2023-00667
`
`

`

`U . S . Patent
`
`atent
`
`Sep . 18 , 2018
`
`Sheet 9 of 9
`
`US 10 , 078 , 354 B2
`
`h
`
`appened
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`FIG . 15
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`FIG . 16
`
`Cooler Master Co., Ltd. Ex. 1010, Page 12 of 22
`Cooler Master Co., Ltd. v. Asetek Danmark A/S
`IPR2023-00667
`
`

`

`US 10 , 078 , 354 B2
`
`COOLING SYSTEM FOR A COMPUTER
`SYSTEM
`
`create a liquid - cooling arrangement , which can be used with
`existing CPU types , and which can be used in existing
`computer systems .
`This is a continuation application of application Ser . No .
`This object may be obtained by a cooling system for a
`15 / 347 , 938 filed Nov . 10 , 2016 , which is a continuation 5 computer system , said computer system comprising : at least
`application of application Ser . No . 13 / 942 , 922 filed Jul . 16 ,
`one unit such as a central processing unit ( CPU ) generating
`2013 , which is a continuation application of application Ser .
`thermal energy and said cooling system intended for cooling
`No . 13 / 547 , 240 filed Jul . 12 , 2012 , which is a continuation
`the at least one processing unit , a reservoir having an amount
`application of application Ser . No . 12 / 826 , 768 filed Jun . 30 ,
`of cooling liquid , said cooling liquid intended for accumu
`2010 ( issued on Aug . 14 , 2012 as U . S . Pat . No . 8 , 240 , 362 ) , 10 lating and transferring of thermal energy dissipated from the
`which is a divisional of application Ser . No . 10 / 578 , 578 ,
`processing unit to the cooling liquid , a heat exchanging
`filed May 5 , 2006 ( issued on Jul . 5 , 2011 as U . S . Pat . No .
`interface for providing thermal contact between the process
`7 , 971 , 632 B2 ) , which is a U . S . national phase application of
`ing unit and the cooling liquid for dissipating heat from the
`PCT / DK2004 / 000775 filed on Nov . 8 , 2004 . These applica is processing unit to the cooling liquid , a pump being provided
`tions are incorporated by their entirety herein by reference . 15 as part of an integrate element , said integrate element
`comprising the heat exchanging interface , the reservoir and
`BACKGROUND OF THE INVENTION
`the pump , said pump intended for pumping the cooling
`The present invention relates to a cooling system for a
`liquid into the reservoir , through the reservoir and from the
`central processing unit ( CPU ) or other processing unit of a
`20 reservoir to a heat radiating means , — said heat radiating
`computer system . More specifically , the invention relates to
`means intended for radiating thermal energy from the cool
`a liquid - cooling system for a mainstream computer system
`ing liquid , dissipated to the cooling liquid , to surroundings
`of the heat radiating means .
`such as a PC .
`During operation of a computer , the heat created inside
`By providing an integrate element , it is possible to limit
`the CPU or other processing unit must be carried away fast 25 the number of separate elements of the system . However ,
`and efficiently , keeping the temperature within the design
`there is actually no need for limiting the number of elements ,
`range specified by the manufacturer . As an example of
`because often there is enough space within a cabinet of a
`cooling systems , various CPU cooling methods exist and the
`computer system to encompass the different individual ele
`most used CPU cooling method to date has been an air -
`ments of the cooling system . Thus , it is surprisingly that , at
`cooling arrangement , wherein a heat sink in thermal contact 30 all , any attempt is conducted of integrating some of the
`with the CPU transports the heat away from the CPU and as
`elements .
`an option a fan mounted on top of the heat sink functions as
`In preferred embodiments according to this aspect of the
`an air fan for removing the heat from the heat sink by
`invention , the pump is placed inside the reservoir with at
`blowing air through segments of the heat sink . This air -
`least an inlet or an outlet leading to the liquid in the
`cooling arrangement is sufficient as long as the heat pro - 35 reservoir . In an alternative embodiment the pump is placed
`duced by the CPU is kept at today ' s level , however it
`outside the reservoir in the immediate vicinity of the reser
`becomes less useful in future cooling arrangements when
`voir and wherein at least an inlet or an outlet is leading
`considering the development of CPUs since the speed of a
`directly to the liquid in the reservoir . By placing the pump
`CPU is said to double perhaps every 18 months , thus
`inside the reservoir or in the immediate vicinity outside the
`increasing the heat production accordingly .
`40 reservoir , the integrity of the combined reservoir , heat
`Another design used today is a CPU cooling arrangement
`exchanger and pump is obtained , so that the element is easy
`where cooling liquid is used to cool the CPU by circulating
`to employ in new and existing computer systems , especially
`a cooling liquid inside a closed system by means of a
`mainstream computer systems .
`pumping unit , and where the closed system also comprises
`The object may also be obtained by a cooling system for
`a heat exchanger past which the cooling liquid is circulated . 45 a computer system , said computer system comprising : at
`A liquid - cooling arrangement is more efficient than an
`least one unit such as a central processing unit ( CPU )
`air - cooling arrangement and tends to lower the noise level of
`generating thermal energy and said cooling system intended
`the cooling arrangement in general . However , the liquid
`for cooling the at least one processing unit , a reservoir
`cooling design consists of many components , which
`having an amount of cooling liquid , said cooling liquid
`increases the total installation time , thus making it less 50 intended for accumulating and transferring of thermal
`desirable as a mainstream solution . With a trend of produc -
`energy dissipated from the processing unit to the cooling
`ing smaller and more compact PCs for the end - users , the
`liquid , a heat exchanging interface for providing thermal
`greater amount of components in a typical liquid - cooling
`contact between the processing unit and the cooling liquid
`arrangement is also undesirable . Furthermore , the many
`for dissipating heat from the processing unit to the cooling
`components having to be coupled together incurs a risk of 55 liquid , a pump intended for pumping the cooling liquid into
`leakage of cooling liquid from the system .
`the reservoir , through the reservoir and from the reservoir to
`a heat radiating means , said cooling system being intended
`SUMMARY OF INVENTION
`for thermal contact with the processing unit by means of
`existing fastening means associated with the processing unit ,
`It may be one object of the invention to provide a small 60 and said heat radiating means intended for radiating from the
`and compact liquid - cooling solution , which is more efficient
`cooling liquid thermal energy , dissipated to the cooling
`than existing air - cooling arrangements and which can be
`liquid , to surroundings of the heat radiating means .
`produced at a low cost enabling high production volumes . It
`The use of existing fastening means has the advantage
`may be another object to create a liquid - cooling arrange
`that fitting of the cooling system is fast and easy . However ,
`ment , which is easy - to - use and implement , and which 65 once again there is no problem for the person skilled in the
`requires a low level of maintenance or no maintenance at all .
`art to adopt specially adapted mounting means for any
`It may be still another object of the present invention to
`element of the cooling system , because there are numerous
`
`Cooler Master Co., Ltd. Ex. 1010, Page 13 of 22
`Cooler Master Co., Ltd. v. Asetek Danmark A/S
`IPR2023-00667
`
`

`

`US 10 , 078 , 354 B2
`
`chosen by the skilled person . In preferred embodiments
`possibilities in existing cabinets of computer systems for
`according to any aspect of the invention , an electrical motor
`mounting any kind of any number of elements , also elements
`of a cooling system .
`is intended both for driving the pump for pumping the liquid
`and for driving the a fan for establishing a flow of air in the
`In preferred embodiments according to this aspect of the
`vicinity of the reservoir , or an electrical motor is intended
`invention , the existing fastening means are means intended 5
`both for driving the pump for pumping the liquid and for
`for attaching a heat sink to the processing unit , or the
`driving the a fan for establishing a flow of air in the vicinity
`existing fastening means are means intended for attaching a
`of the heat radiating means , or an electrical motor is
`cooling fan to the processing unit , or the existing fastening
`intended both for driving the pump for pumping the liquid ,
`means are means intended for attaching a heat sink together
`with a cooling fan to the processing unit . Existing fastening 10 and for driving the a fan for establishing a flow of air in the
`means of the kind mentioned is commonly used for air
`vicinity of the reservoir , and for driving the a fan for
`cooling of CPUs of computer systems , however , air cooling
`establishing a flow of air in the vicinity of the heat radiating
`arrangements being much less complex than liquid cooling
`means .
`systems . Nevertheless , it has ingeniously been possible to
`By utilising a single electrical motor for driving more than
`develop a complex and effective liquid cooling system
`15 one element of the cooling system according to any of the
`capable of utilising such existing fastening means for simple
`aspects of the invention , the lesser complexity and the
`and less effective air cooling arrangements .
`reliability of the cooling system will be further enhanced .
`According to an aspect of the invention , the pump is
`The heat exchanging interface may be an element being
`selected from the following types : Bellows pump , centrifu -
`separate from the reservoir , and where the heat exchanging
`gal pump , diaphragm pump , drum pump , flexible liner 20 interface is secured to the reservoir in a manner so that the
`pump , flexible impeller pump , gear pump , peristaltic tubing
`heat exchanging interface constitutes part of the reservoir
`pump , piston pump , processing cavity pump , pressure
`when being secured to the reservoir . Alternatively , the heat
`washer pump , rotary lobe pump , rotary vane pump and
`exchanging interface constitutes an integrate surface of the
`electro - kinetic pump . By adopting one or more of the
`reservoir , and where the heat exchanging surface extends
`solution of the present invention , a wide variety of pumps 25 along an area of the surface of the reservoir , said area of
`may be used without departing from the scope of the
`surface being intended for facing the processing unit and
`said area of surface being intended for the close thermal
`invention .
`According to another aspect of the invention , driving
`contact with the processing unit . Even alternatively , the heat
`means for driving the pump is selected among the following
`exchanging interface is constitutes by a free surface of the
`driving means : electrically operated rotary motor , piezo - 30 processing unit , and where the free surface is capable of
`electrically operated motor , permanent magnet operated
`establishing heat dissipation between the processing unit and
`motor , fluid - operated motor , capacitor - operated motor . As is
`the cooling liquid through an aperture provided in the
`the case when selecting the pump to pump the liquid , by
`reservoir , and where the aperture extends along an area of
`adopting one or more of the solution of the present inven
`the surface of the reservoir , said surface being intended for
`tion , a wide variety of pumps may be used without departing 35 facing the processing unit .
`The object may also be obtained by a cooling system for
`from the scope of the invention .
`The object may also be obtained by a cooling system for
`a computer system , said computer system comprising : at
`a computer system , said computer system comprising : at
`least one unit such as a central processing unit ( CPU )
`least one unit such as a central processing unit ( CPU )
`generating thermal energy and said cooling system intended
`generating thermal energy and said cooling system intended 40 for cooling the at least one processing unit comprising , a
`for cooling the at least one processing unit , a reservoir
`reservoir having an amount of cooling liquid , said cooling
`having an amount of cooling liquid , said cooling liquid
`liquid intended for accumulating and transferring of thermal
`intended for accumulating and transferring of thermal
`energy dissipated from the processing unit to the cooling
`energy dissipated from the processing unit to the cooling
`liquid , a heat exchanging interface for providing thermal
`liquid , a heat exchanging interface for providing thermal 45 contact between the processing unit and the cooling liquid
`contact between the processing unit and the cooling liquid
`for dissipating heat from the processing unit to the cooling
`for dissipating heat from the processing unit to the cooling
`liquid , a pumping means being intended for pumping the
`liquid , a pump intended for pumping the cooling liquid into
`cooling liquid into the reservoir , through the reservoir and
`the reservoir , through the reservoir and from the reservoir to
`from the reservoir to
`a heat radiating means , said heat
`a heat radiating means , and said cooling system further 50 radiating means intended for radiating thermal energy from
`comprising a pump wherein the pump is driven by an AC
`the cooling liquid , dissipated to the cooling liquid , to sur
`electrical motor by a DC electrical power supply of the
`roundings of the heat radiating means , said heat exchanging
`computer system , where at least part of the electrical power
`interface constituting a heat exchanging surface being manu
`from said power supply is intended for being converted to
`factured from a material suitable for heat conducting , and
`AC being supplied to the electrical motor .
`55 with a first side of the heat exchanging surface facing the
`It may be advantageous to use an AC motor , such as a 12V
`central processing unit being substantially plane and with a
`AC motor , for driving the pump in order to obtain a stabile
`second side of the heat exchanging surface facing the
`unit perhaps having to operate 24 hours a day , 365 days a
`cooling liquid being substantially plane and said reservoir
`year . However , the person skilled in the art will find it
`being manufactured from plastic , and channels or segments
`unnecessary to adopt as example a 12V motor because high 60 being provided in the reservoir for establishing a certain
`voltage such as 220V or 110V is readily accessible as this is
`flow - path for the cooling liquid through the reservoir .
`the electrical voltage used to power the voltage supply of the
`Providing a plane heat exchanging surface , both the first ,
`computer system itself . Although choosing to use a 12V
`inner side and on the second , outer side , results in the costs
`motor for the pump , it has never been and will never be the
`for manufacturing the heat exchanging surface is reduced to
`choice of the person skilled in the art to use an AC motor . 65 an absolute minimum . However , a plane first , inner surface
`The voltage supplied by the voltage s