(12) United States Patent
`Nakano et al.
`
`USOO6915653B2
`(10) Patent No.:
`US 6,915,653 B2
`(45) Date of Patent:
`Jul. 12, 2005
`
`(54) SEMICONDUCTOR COOLING DEVICE
`
`(75) Inventors: Masao Nakano, Shiga (JP); Akira
`Ikeda, Kusatsu (JP); Hiromasa
`O
`O
`Ashitani, Otsu (JP)
`rr. A
`(73) Assignee: Matsushita Electric Industrial Co.,
`Ltd., Osaka (JP)
`-
`Subject to any disclaimer, the term of this
`patent is extended or adjusted under 35
`U.S.C. 154(b) by 0 days.
`
`(*) Notice:
`
`(21) Appl. No.: 10/821,219
`(22) Filed:
`Apr. 8, 2004
`(65)
`Prior Publication Data
`US 2004/0250558 A1 Dec. 16, 2004
`Foreign Application Priority Data
`(30)
`Jun. 13, 2003 (JP) ....................................... 2003-169081
`(51) Int. Cl. ................................................ F25D 23/12
`(52) U.S. Cl. ................................ 62/259.2; 165/104.33;
`361/695; 361/699; 361/698
`(58) Field of Search ....................... 62/132, 183,228.4,
`62/229, 259.2; 165/80.3, 80.4, 104.33, 122;
`361/689, 695, 699, 698; 257/714, 716;
`174/15. 1, 16.1, 16.3
`
`(56)
`
`References Cited
`U.S. PATENT DOCUMENTS
`4,812,733 A * 3/1989 Tobey ........................ 323/285
`5,455,458 A * 10/1995 Quon et al. ................. 257/714
`
`5,729.995 A * 3/1998 Tajima ...................... 62/259.2
`5,747,728 A * 5/1998 Fleurial et al. ............. 136/203
`5,859,763 A
`1/1999 Nam et al. ........
`... 361/699
`E. A : 20 t
`- - - - - - -
`- - - 35.
`2Y- -
`aIISC . . . . . . . . . . . . . . . . . . . . . . . . . . .
`6,101,815. A
`8/2000 van Oort et al. ............... 62/3.4
`6,158,232 A * 12/2000 Tsuji et al. ................ 62/259.2
`6,367,543 B1
`4/2002 Calaman et al. ........... 165/80.4
`6,458.319 B1 * 10/2002 Caillat et al. ............... 420/576
`6,578,626 B1
`6/2003 Calaman et al. ........... 165/80.4
`6,623,596 B1 * 9/2003 Collins et al. ......... 156/345.48
`FOREIGN PATENT DOCUMENTS
`
`JP
`405121604 A * 5/1993
`JP
`406037219 A * 2/1994
`JP
`2000-208683
`7/2000
`* cited by examiner
`Primary Examiner William E. Tapolcai
`ASSistant Examiner Mohammad M. Ali
`(74) Attorney, Agent, or Firm-RatnerPrestia
`(57)
`ABSTRACT
`A Semiconductor cooling device includes a cold plate for
`cooling a Semiconductor element, a condenser, and an
`inverter-controlled refrigerant pump, all of which are fluid
`connected in Series with each other to define a refrigerating
`cycle. The Semiconductor cooling device also includes a fan
`for cooling the condenser, a temperature detector disposed in
`proximity to the Semiconductor element, and a controller for
`controlling the refrigerant pump and the fan. The controller
`controls the number of revolutions of the refrigerant pump
`and that of the fan depending on a value measured by the
`temperature detector.
`
`6 Claims, 2 Drawing Sheets
`
`)
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`
`
`CONTROL
`
`
`
`POWER
`CONTROL
`
`asala
`INVERTER
`
`
`
`
`
`CONDENSER
`S -
`
`FLOW OF
`REFRGERANT
`
`Cooler Master Co., Ltd. Ex. 1008, Page 1 of 5
`Cooler Master Co., Ltd. v. Asetek Danmark A/S
`IPR2023-00667
`
`

`

`U.S. Patent
`
`Jul. 12, 2005
`
`Sheet 1 of 2
`
`US 6,915,653 B2
`
`Fig.1 F
`PRIOR ART
`
`
`
`power.....
`As
`
`EY
`
`V
`
`as
`
`a
`
`EEE
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`grrrr arr appas
`
`w
`
`Y
`a
`
`as in
`
`ext
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`Cooler Master Co., Ltd. Ex. 1008, Page 2 of 5
`Cooler Master Co., Ltd. v. Asetek Danmark A/S
`IPR2023-00667
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`

`

`U.S. Patent
`
`Jul. 12, 2005
`
`Sheet 2 of 2
`
`US 6,915,653 B2
`
`Fig.2
`
`
`
`9
`
`
`
`CONTROL
`mu-m
`
`------m
`
`Fs
`
`8
`)
`- (-
`- CONDENSER
`POWER
`st
`CONTROL
`--- Ed
`INVERTER
`7)
`CONTROL
`v-
`-
`3
`(
`7
`
`-mun
`
`------
`i. a as
`
`1N E. -
`
`
`
`Fig. 3
`8
`) -- (-
`POWER
`CONTROL
`
`CONTROL
`
`
`
`----------
`NVERTER
`CONTROL
`---
`(
`
`
`
`
`
`
`
`
`
`FLOW OF
`REFRIGERANT
`
`FLOW OF
`REFRIGERANT
`
`Cooler Master Co., Ltd. Ex. 1008, Page 3 of 5
`Cooler Master Co., Ltd. v. Asetek Danmark A/S
`IPR2023-00667
`
`

`

`1.
`SEMICONDUCTOR COOLING DEVICE
`
`US 6,915,653 B2
`
`BACKGROUND OF THE INVENTION
`1. Field of the Invention
`The present invention relates generally to a cooling device
`for cooling a semiconductor element which generates a
`Substantial quantity of heat and, in particular but not
`eXclusively, to a compact, easy-to-handle and efficient cool
`ing device for cooling Such a semiconductor element by
`utilization of a change in phase between a liquid phase and
`a vapor phase of a refrigerant.
`2. Description of the Related Art
`Japanese Laid-Open Patent Publication No. 2000-208683
`discloses a natural circulation type cooling device for cool
`ing a heating element by utilization of a change in phase
`between a liquid phase and a vapor phase of a refrigerant, as
`shown in FIG. 1. The cooling device shown therein is
`provided with a refrigerant tank 20 for storing a liquid
`refrigerant, a radiator 22 for radiating heat from a vapor
`refrigerant, and a fan (not shown) for cooling the radiator 22.
`Because this cooling device is not provided with an
`inverter-controlled refrigerant pump, it controls the required
`cooling power merely by changing the number of revolu
`tions of the fan depending on the amount of heat generated
`by the Semiconductor element.
`Furthermore, Japanese Laid-Open Patent Publication No.
`2000-208683 lacks any disclosure of an avoidance system in
`an abnormal situation.
`
`15
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`25
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`2
`reached a maximum value, if the value measured by the
`temperature detector does not become less than the set value,
`the controller outputs an alarm signal.
`Alternatively, the controller watches a signal indicative of
`a current value of the refrigerant pump, and if such current
`Value becomes greater than a value set in the controller, the
`controller outputs an alarm signal.
`Again alternatively, the controller watches an operating
`time of the refrigerant pump, and if a total operating time of
`the refrigerant pump has reached a service life set in the
`controller, the controller outputs an alarm signal.
`BRIEF DESCRIPTION OF THE DRAWINGS
`The above and other objectives and features of the present
`invention will become more apparent from the following
`description of preferred embodiments thereof with reference
`to the accompanying drawings, throughout which like parts
`are designated by like reference numerals, and wherein:
`FIG. 1 depicts a front elevational view of a conventional
`cooling device;
`FIG. 2 depicts a refrigerating cycle of a semiconductor
`cooling device according to a first embodiment of the
`present invention; and
`FIG. 3 depicts a refrigerating cycle of a semiconductor
`cooling device according to a second embodiment of the
`present invention.
`DETAILED DESCRIPTION OF THE
`PREFERRED EMBODIMENTS
`This application is based on an application No. 2003
`169081 filed Jun. 13, 2003 in Japan, the content of which is
`herein expressly incorporated by reference in its entirety.
`Referring now to the drawings and in particular to FIG. 2,
`there is shown a refrigerating cycle of a semiconductor
`cooling device according to a first embodiment of the
`present invention. The semiconductor cooling device shown
`in FIG. 2 includes a cold plate 1 for cooling a highly
`exothermic Semiconductor element 5 that tends to emit a
`Substantial amount of heat when in operation, a condenser 2,
`and an inverter-controlled refrigerant pump 3, all connected
`in Series with each other to define a refrigerating cycle. A
`refrigerant is filled in this refrigerating cycle. The condenser
`2 is adapted to be cooled by a fan 4.
`The cooling device is So designed that a liquid refrigerant
`emerging first from the condenser 2 is supplied towards the
`cold plate 1 by the refrigerant pump 3. The cold plate 1 so
`Supplied with the refrigerant absorbs heat generated by the
`highly exothermic semiconductor element 5 and, in the
`course of absorption of the heat, a change in phase from the
`liquid refrigerant to a vapor refrigerant takes place within
`the cold plate 1. The vapor refrigerant is then supplied to the
`condenser 2 that is then cooled by the fan 4 So that the vapor
`refrigerant within the condenser2 undergoes a phase change
`to a liquid refrigerant.
`In this embodiment, the cold plate 1 is provided with a
`temperature Sensor 6 mounted thereon in proximity to the
`Semiconductor element 5, and the temperature sensor 6 is
`electrically connected to a controller 9. The refrigerant pump
`3 is electrically connected to an inverter controller 7, while
`the fan 4 is electrically connected to a power controller 8.
`Both the inverter controller 7 and the power controller 8 are
`electrically connected to the controller 9.
`The controller 9 appropriately controls the number of
`revolutions of the refrigerant pump 3 and that of the fan 4
`based on a value measured by the temperature sensor 6. The
`
`SUMMARY OF THE INVENTION
`The present invention has been developed to overcome
`the above-described disadvantages.
`It is accordingly an objective of the present invention to
`provide a highly reliable Semiconductor cooling device that
`is low in noise level and can conduct an appropriate control
`by changing the amount of circulation of refrigerant depend
`ing on the amount of heat generated by a semiconductor
`element.
`In accomplishing the above and other objectives, the
`Semiconductor cooling device according to the present
`invention includes a cold plate for cooling a semiconductor
`element, a condenser, and an inverter-controlled refrigerant
`pump, all of which are fluid connected in series with each
`other to define a refrigerating cycle. The semiconductor
`cooling device also includes a fan for cooling the condenser,
`a temperature detector disposed in proximity to the semi
`conductor element, and a controller for controlling the
`refrigerant pump and the fan. The controller controls the
`number of revolutions of the refrigerant pump and that of the
`fan depending on a value measured by the temperature
`detector. The temperature detector may be accommodated in
`the Semiconductor element.
`When the amount of heat emitted from the semiconductor
`element is less than a predetermined level, the controller
`reduces the number of revolutions of the fan before that of
`the refrigerant pump.
`When the value measured by the temperature detector
`increases more than a predetermined value within a prede
`termined period of time, the controller maximizes the num
`ber of revolutions of the fan and thereafter increases the
`number of revolutions of the refrigerant pump step by step
`While comparing the value measured by the temperature
`detector with a value set in the controller. Furthermore,
`when the number of revolutions of the refrigerant pump has
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`40
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`45
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`50
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`60
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`Cooler Master Co., Ltd. Ex. 1008, Page 4 of 5
`Cooler Master Co., Ltd. v. Asetek Danmark A/S
`IPR2023-00667
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`

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`3
`controller 9 is designed So as to preferentially reduce, when
`the amount of heat emitted from the Semiconductor element
`5 is less than a predetermined level, the number of revolu
`tions of the fan 4 before that of the refrigerant pump 3,
`making it possible to provide a cooling device that is low in
`noise level.
`When the value measured by the temperature sensor 6
`increases more than a predetermined value within a prede
`termined period of time, the controller 9 first maximizes the
`number of revolutions of the fan 4 and then increases the
`number of revolutions of the refrigerant pump 3 Step by Step
`while comparing the measured value by the temperature
`sensor 6 with a value set in the controller 9. When the
`number of revolutions of the refrigerant pump 3 has reached
`a maximum value, if the measured value by the temperature
`Sensor 6 does not become less than the Set value, the
`controller 9 outputs an alarm Signal to a computer that is
`electrically connected to the Semiconductor element 5, mak
`ing it possible to enhance the reliability of the cooling
`device.
`Although the above-described embodiment employs the
`temperature Sensor 6, temperature measurement may be
`carried out by the semiconductor element 5 itself. In this
`case, a Signal from the Semiconductor element 5 is inputted
`into the controller 9.
`FIG. 3 depicts a refrigerating cycle of a Semiconductor
`cooling device according to a Second embodiment of the
`present invention.
`As shown in FIG. 3, the semiconductor element 5 is
`provided with a temperature detector 6 accommodated
`therein. A signal indicative of the current value of the
`refrigerant pump 3 is outputted from the inverter controller
`7 to the controller 9, which in turn watches the signal and
`outputs, if Such current value becomes greater than a value
`Set therein, an alarm Signal to a computer that is electrically
`connected to the Semiconductor element 5. Accordingly, the
`refrigerant pump 3 can be replaced with a new one before its
`Service life ends, enhancing the reliability of the cooling
`device.
`Alternatively, the controller 9 may be designed so as to
`watch the operating time of the refrigerant pump 3. In this
`case, if the total operating time of the refrigerant pump 3 has
`reached a service life set in the controller 9, the controller 9
`outputs an alarm Signal to the computer. Accordingly, the
`refrigerant pump 3 can be replaced with a new one when its
`Service life ends, enhancing the reliability of the cooling
`device.
`Although the present invention has been fully described
`by way of examples with reference to the accompanying
`drawings, it is to be noted here that various changes and
`modifications will be apparent to those skilled in the art.
`
`4
`Therefore, unless Such changes and modifications otherwise
`depart from the Spirit and Scope of the present invention,
`they should be construed as being included therein.
`What is claimed is:
`1. A Semiconductor cooling device comprising:
`a cold plate for cooling a Semiconductor element;
`a condenser;
`an inverter-controlled refrigerant pump, Said cold plate,
`condenser and refrigerant pump being fluid connected
`in Series with each other to define a refrigerating cycle;
`a fan for cooling Said condenser;
`a temperature detector disposed in proximity to Said
`Semiconductor element; and
`a controller for controlling Said refrigerant pump and Said
`fan;
`wherein said controller controls the number of revolutions
`of Said refrigerant pump and that of Said fan depending
`on a value measured by Said temperature detector.
`2. The Semiconductor cooling device according to claim
`1, wherein the temperature detector is accommodated in Said
`Semiconductor element.
`3. The Semiconductor cooling device according to claim
`1, wherein when the amount of heat emitted from said
`Semiconductor element is less than a predetermined level,
`said controller reduces the number of revolutions of said fan
`before that of Said refrigerant pump.
`4. The Semiconductor cooling device according to claim
`1, wherein when the value measured by Said temperature
`detector increases more than a predetermined value within a
`predetermined period of time, said controller maximizes the
`number of revolutions of Said fan and thereafter increases
`the number of revolutions of Said refrigerant pump Step by
`Step while comparing the value measured by Said tempera
`ture detector with a value Set in Said controller, and wherein
`when the number of revolutions of Said refrigerant pump has
`reached a maximum value, if the value measured by Said
`temperature detector does not become less than the Set value,
`Said controller outputs an alarm Signal.
`5. The Semiconductor cooling device according to claim
`1, wherein Said controller watches a Signal indicative of a
`current value of Said refrigerant pump, and if Such current
`value becomes greater than a value Set in Said controller, Said
`controller outputs an alarm Signal.
`6. The Semiconductor cooling device according to claim
`1, wherein Said controller watches an operating time of Said
`refrigerant pump, and if a total operating time of Said
`refrigerant pump has reached a Service life Set in Said
`controller, Said controller outputs an alarm Signal.
`
`k
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`k
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`k
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`k
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`k
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`US 6,915,653 B2
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`1O
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`15
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`25
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`35
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`40
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`45
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`50
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`Cooler Master Co., Ltd. Ex. 1008, Page 5 of 5
`Cooler Master Co., Ltd. v. Asetek Danmark A/S
`IPR2023-00667
`
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