(19) Japan Patent Office (JP)
`
`(12) Japanese Unexamined Patent
`Application Publication(A)
`
`(51) Int.Cl6
`
`Identification Codes JPO file number
`
`FI
`
` H05K 7/20
`
`
`
`
`
`
`
`
`
` H05K 7/20
`
`
`(11) Patent application publication
`number
`
`H11-68363
`(43) Publication date: March 9, 1999
`
`
`
`G
`H
`
`Technical
`Indications
`
`
`
`Request for examination: Not yet requested
`
`Number of claims: 7
`
`OL
`
`(total of 4 claims)
`
`
`(21) Application number Japanese Patent Application H9-223710
`
`(22) Application date
`
`August 20, 1997
`
`
`
`(71) Applicant 000006611
`Fujitsu General Co., Ltd.
`1116 Suenaga, Takatsu-ku, Kawasaki-shi,
`Kanagawa-ken
`(72) Inventor Takahashi Atsushi
`c/o Fujitsu General Co., Ltd., 1116 Suenaga,
`Takatsu-ku, Kawasaki-shi
`
`
`
`
`(54)【Title of the invention】 Heat dissipation structure for
`electronics
`
`(57)【Abstract】
`【Problem】 The objective is to provide a heat dissipation
`structure for electronics that can prevent air leakage even if a
`through-hole is provided in the air guide plate.
`【Means for solving】 By providing a through-hole 8a
`corresponding to an insertion hole 3a of a substrate 3 in an air
`guide plate 8; providing this through-hole with an air leak
`prevention part 9 consisting of a hollow body having an
`opening 9a and an insertion hole 9b formed in the base
`thereof for the insertion of a screw 10; and inserting the
`aforesaid substrate attachment screw through the opening in
`this air leak prevention part and threading it onto the
`aforesaid screw hole via the insertion hole in the aforesaid
`substrate, thereby fastening the aforesaid substrate, air
`leakage from the through-hole formed in the air guide plate
`can be prevented, and in the event of maintenance or
`
`
`inspection, the substrate mounting screw can be removed
`from the opening in the aforesaid air leak prevention part
`without needing to remove the air guide, thereby making it
`possible to unmount the substrate by moving it downward.
`
`
`
`
`
`
`
`SEC et al. v. MRI
`SEC Exhibit 1008.001
`IPR 2023-00199
`
`

`

`【Scope of patent claims】
`【Claim 1】 Heat dissipation structure for electronics in
`which an attachment screw hole is provided on the rear of a
`partition plate that divides the front part of the housing for
`mounting display components, which has an air exhaust
`located at the rear of the top surface and is open on at least
`the back side, from the back part for mounting substrates
`including the control board and the power board for
`mounting heat-emitting components;
`the substrates are
`fastened by threading a substrate attachment screw through a
`through-hole provided in each of the aforesaid substrates and
`thereby into this attachment screw hole, and a ventilation fan
`is fastened to the fan attachment part formed at the top
`thereof near the aforesaid air exhaust; whereas on the rear of
`the aforesaid housing, a rear cover with a rear air inlet near
`the bottom thereof is fastened in such a way that air inspired
`through the rear air inlet travels along an air guide plate
`formed into a thick sheet shape as it travels the distance from
`said rear air inlet to the ventilation fan, capturing heat from
`the substrates along the way, and the ventilation fan blows
`this heated air to the exterior through the air exhaust;
`characterized in that a through-hole is provided on the
`aforesaid air guide plate in a location corresponding to the
`aforesaid insertion hole, which through-hole is provided with
`an air leak prevention part consisting of a hollow body
`having an open end and an insertion hole formed in the base
`thereof, such that the aforesaid substrate attachment screw is
`able to penetrate through the open side of this air leak
`prevention part, and the aforesaid substrates are fastened by
`threading this screw through the insertion hole into the
`aforesaid screw hole via the insertion hole in the aforesaid
`substrate.
`【Claim 2】 The heat dissipation structure for electronics set
`forth in claim 1, characterized in that the aforesaid air leak
`prevention part was formed separately, and a concave part
`that fits into the aforesaid through-hole was formed at the
`peripheral edge of opening of said air leak prevention part.
`【Claim 3】 The heat dissipation structure for electronics
`set forth in claim 2, characterized in that the aforesaid
`concave part is formed in a location corresponding to the
`height from the substrate surface to the air guide plate.
`【Claim 4】 The heat dissipation structure for electronics
`set forth in claim 2, characterized in that the width of the
`aforesaid concave section is wider than the thickness of the
`aforesaid air guide plate, and the depth is slightly larger than
`the aforesaid through-hole.
`【Claim 5】 The heat dissipation structure for electronics
`set forth in claim 2, characterized in that the aforesaid
`concave part was formed into a cross-sectional waveform.
`【Claim 6】The heat dissipation structure for electronics
`set forth in claim 1 or claim 2, characterized in that the
`aforesaid air leak prevention part is formed of an elastic
`material.
`【Claim 7】 The heat dissipation structure for electronics
`set forth in Claim 1, characterized in that the aforesaid air
`leak prevention part is formed integrally with the air guide
`plate.
`【Detailed description of invention】
`
`
`
`Japanese Unexamined Patent Application Publication H11-68363
`
`【0001】
`【Technical field of the invention】 The present invention
`relates to the heat dissipation structure of electronic devices,
`and in particular to the prevention of air leakage at the
`mounting part of the substrate.
`【0002】
`【Prior art】 Conventionally, as shown in FIG. 1, the heat
`dissipation structure of electronic devices such as PDP
`(plasma display) devices is furnished with an attachment
`screw hole 5a in the back of a partition plate 5 that divides
`the front part 2 of the housing 1 for mounting display
`components such as the PDP (plasma display), which has an
`air exhaust 1a located at the rear of the top surface and is
`open on at least the back side, from the back part 4 for the
`mounting of substrates 3 including the control board and the
`power board for mounting heat-emitting components; the
`substrates 3 are fastened by threading a substrate attachment
`screw 10 through a through-hole 3a provided in each of the
`aforesaid substrates 3 and into this attachment screw hole 5a,
`and a ventilation fan 6 is fastened to the fan attachment part
`5b formed at the top thereof near the aforesaid air exhaust 1a;
`whereas on the rear of the aforesaid housing 1, a rear cover 7
`with a rear air inlet 7a near the bottom thereof is fastened in
`such a way that air inspired through the rear air inlet 7a
`travels along an air guide plate 8 formed into a thick sheet
`shape as it travels the distance from said rear air inlet 7a to
`the ventilation fan 6, capturing heat from the substrate 3
`along the way, whereupon the ventilation fan 6 blows this
`heated air to the exterior through the air exhaust 1a.
`However, in this structure, because the substrates 3 are
`covered by the air guide plate 8, in order to remove a
`substrate 3, it is necessary to either remove or lift up the air
`guide plate 8, which complicates the task of performing
`maintenance and inspection. In view of this, one conceivable
`solution, as shown in FIG. 4, would be to provide a through-
`hole 8a for an attachment screw 10
`in a
`location
`corresponding to the through-hole 3a in the air guide plate 8
`to facilitate removal of the substrates 3. However, in the
`event that a through-hole 8a is provided, a problem is that
`cooling efficiency is reduced, as air leakage into the air guide
`plate 8 via this through-hole 8a causes a reduction in the
`amount of air aspired into the rear air inlet 7a.
`【0003】
`【Problem to be solved by the invention】 The objective
`of the present invention is to provide a heat dissipation
`structure for electronics
`that overcomes
`the problem
`described above by preventing air leakage even when a
`through-hole is provided in the air guide plate.
`【0004】
`【Means for solving the problem】 In order to solve the
`problem described above, the present invention is a heat
`dissipation structure for electronics in which an attachment
`screw hole is provided on the rear of a partition plate that
`divides the front part of the housing for mounting display
`components, which has an air exhaust located at the rear of
`the top surface and is open on at least the back side, from the
`back part for the mounting of substrates including the control
`board and the power board for mounting heat-emitting
`components; the substrates are fastened by threading a
`
`SEC et al. v. MRI
`SEC Exhibit 1008.002
`IPR 2023-00199
`
`

`

`substrate attachment screw through a through-hole provided
`in each of the aforesaid substrates and thereby into this
`attachment screw hole, and a ventilation fan is fastened to the
`fan attachment part formed at the top thereof near the
`aforesaid air exhaust; whereas on the rear of the aforesaid
`housing, a rear cover with a rear air inlet near the bottom
`thereof is fastened in such a way that air inspired through the
`rear air inlet travels along an air guide plate formed into a
`thick sheet shape as it travels the distance from said rear air
`inlet to the ventilation fan, capturing heat from the substrates
`along the way, and the ventilation fan blows this heated air to
`the exterior through the air exhaust; characterized in that a
`through-hole is provided on the aforesaid air guide plate in a
`location corresponding to the aforesaid insertion hole, which
`through-hole is provided with an air leak prevention part
`consisting of a hollow body having an open end and an
`insertion hole formed in the base thereof, such that the
`aforesaid substrate attachment screw is able to penetrate
`through the open side of this air leak prevention part, and the
`aforesaid substrates are fastened by threading this screw
`through the insertion hole into the aforesaid screw hole via
`the insertion hole in the aforesaid substrate.
`【0005】Additionally, a concave part that fits into the
`aforesaid through-hole is formed at the peripheral edge of the
`opening of
`the aforesaid air
`leak prevention part.
`Additionally, the aforesaid concave part is formed in a
`location corresponding to the height from the aforesaid
`substrate surface to the air guide plate. Additionally, the
`width of the aforesaid concave part is formed to be wider
`than the thickness of the aforesaid air guide plate, and the
`depth of the same is formed to be slightly greater than that of
`the aforesaid
`through-hole. Additionally,
`the aforesaid
`concave part is formed to have a cross-sectional waveform.
`【0006】Additionally, the aforesaid air leak prevention
`part is formed of an elastic material. Additionally, the
`aforesaid air leak prevention part is formed integrally with
`the air guide plate.
`【0007】
`【Embodiment of the invention】 As described above, in
`the heat dissipation structure for electronics of the present
`invention, a through-hole is provided on the aforesaid air
`guide plate in a location corresponding to the aforesaid
`insertion hole, which through-hole is provided with an air
`leak prevention part consisting of a hollow body having an
`open end and an insertion hole formed in the base thereof,
`such that the aforesaid substrate attachment screw is able to
`penetrate through the open side of this air leak prevention
`part, and the aforesaid substrates are fastened by threading
`this screw through the insertion hole into the aforesaid screw
`hole via the insertion hole in the aforesaid substrate.
`Consequently, in the event of maintenance or inspection, it is
`possible to remove the substrate attachment screw from the
`opening in the aforesaid air leak prevention part without
`needing to remove the air guide plate, thereby making it
`possible to unmount the substrate by moving it downward.
`【0008】Additionally, because a concave part that fits into
`the aforesaid through-hole is formed at the peripheral edge of
`the opening of the aforesaid air leak prevention part, it is easy
`to fit the air leak prevention part into the through-hole, and it
`
`
`Japanese Unexamined Patent Application Publication H11-68363
`
`is also possible to reliably prevent air leakage. Additionally,
`because the aforesaid concave part is formed in a location
`corresponding to the height from the aforesaid substrate
`surface
`to
`the air guide plate, gaps are eliminated.
`Furthermore, because the width of the aforesaid concave part
`is made to be wider than the thickness of the aforesaid air
`guide plate, and the depth thereof is made to be slightly
`greater than that of the aforesaid through-hole, and the
`aforesaid concave part is formed into a cross-sectional
`waveform, air leakage can be reliably prevented.
`leak
`【0009】Additionally, because
`the aforesaid air
`prevention part is formed from an elastic material, it is easy
`to fit, and air leakage can be reliably prevented. Additionally,
`because the air leak prevention part is formed integrally with
`the air guide plate, costs can be reduced.
`【0010】
`【Embodiment examples】 The heat dissipation structure
`for electronics according to the present invention will be
`described in detail below based on the drawings. FIG. 1 is a
`diagram
`illustrating
`the heat dissipation structure of
`conventional electronics; FIG. 1-(A) is a plan view taken
`from the back; FIG. 1-(B) is a cross-sectional view along line
`A-A in FIG. (A); FIG. 2 is a diagram illustrating one
`embodiment of the heat dissipation structure for electronics
`according to the present invention; and the c part of FIG. 1 is
`an enlarged cross-sectional view of the key components
`thereof. In the drawings, the same symbols are used to
`represent the same functionality, and FIG. 1 is not described,
`as it was described in the prior art section. 9 is the air leak
`prevention part that is fitted to the aforesaid through-hole 8a,
`which is formed into a hollow body having, as shown in FIG.
`2, an opening 9a corresponding to the aforesaid through-hole
`8a; an insertion hole 9b for insertion of the substrate
`attachment screw 10 formed in the base thereof; and a
`concave part 9c that fits into the aforesaid through-hole 8a
`formed at the peripheral edge of the opening 9a thereof. This
`concave part 9c is formed as shown below to improve mating
`to the through-hole 8a and to ensure that air leakage is
`prevented. First, a concave part 9c is formed in a location
`corresponding to a height from the aforesaid substrate 3
`surface to the air guide plate 8. Additionally, the width of the
`aforesaid concave part 9c is made to be wider than the
`thickness of the aforesaid air guide plate 8, and the depth
`thereof is formed to be slightly greater than that of the
`aforesaid
`through-hole 8a. Additionally,
`the aforesaid
`concave part 9c is formed into a cross-sectional waveform.
`【0011】FIG. 3 is a cross-sectional view of the key
`components of another embodiment example of the heat
`dissipation structure for electronics according to the present
`invention. In the present embodiment example, the aforesaid
`air leak prevention part 9 is integrally formed with the
`aforesaid air guide plate 8, and, as shown in the drawings, a
`tubular recess 8b is formed in the air guide plate 8, thereby
`forming an opening 8c, and an insertion hole 8d is formed in
`the base of the same recess 8b. Additionally, a thin section 8e
`is provided at the top of the air guide plate 8, which thin
`section 8e enables the air guide plate 8 rotate.
`【0012】Next, the assembly procedure for the above-
`described configuration will be described. First, after
`
`SEC et al. v. MRI
`SEC Exhibit 1008.003
`IPR 2023-00199
`
`

`

`attaching the air guide plate 8 to the partition plate 5 with
`screws, etc., the substrate 3 is inserted from below the air
`guide plate 8. Next, in the case of the embodiment example
`in FIG. 2, the air leak prevention part 9 is fitted into the
`through-hole 8a provided in the air guide plate 8, and the
`screw 10 is inserted through the opening 9a in this air leak
`prevention part 9 and threaded through the attachment screw
`hole 5a in the partition plate 5 via the insertion hole 9b and
`the insertion hole 3a in the substrate 3, thereby fastening the
`substrate 3 to the partition plate 5. In the case of the
`embodiment example in FIG. 3, the thin section 8e formed at
`the top of the air guide plate 8 is rotated, the air guide plate 8
`is lifted up, and the substrate 3 is inserted to the designated
`position, after which the air guide plate 8 is placed on the
`substrate 3, and the mounting screw 10 is inserted into the
`recess 8b via the opening 8c, whereupon it passes through the
`insertion hole 3a in the substrate 3 via the insertion hole 8d
`provided in the base of this recess 8b, and is threaded into the
`attachment screw hole 5a in the partition plate 5, thereby
`fastening the substrate 3 to the partition plate 5. Finally, the
`rear cover 7 is placed on the back of the housing 1.
`【0013】Contrary to the above, the board 3 can be
`removed from the partition plate 5 by removing the back
`cover 7 from the back of the housing 1 and removing the
`mounting screws 10.
`【0014】
`【Effect of Invention】 As described above, according to
`the heat dissipation structure for electronics of the present
`invention, by providing a through-hole corresponding to an
`insertion hole in the air guide plate; providing this through-
`hole with an air leak prevention part consisting of a hollow
`body having an opening and an insertion hole formed in the
`base thereof; and inserting the aforesaid substrate attachment
`screw through the opening in this air leak prevention part,
`and threading it onto the aforesaid screw hole via the
`insertion hole in the substrate, thereby fastening the substrate,
`air leakage from the through-hole formed in the air guide
`plate can be prevented, and in the event of maintenance or
`inspection, the substrate mounting screw can be removed
`from the opening in the air leak prevention part without
`needing to remove the air guide plate, thereby making it
`
`
`
`Japanese Unexamined Patent Application Publication H11-68363
`
`possible to unmount the substrate by moving it downward.
`【Brief description of the drawings】
`【Fig. 1】Schematic structure of conventional electronic
`equipment, where (A) is a plan view seen from the back, and
`(B) is a cross-sectional view along line A-A in (A).
`【Fig. 2】 Enlarged cross-sectional view of a key
`components showing one embodiment example of the heat
`dissipation structure for electronics according to the present
`invention.
`【Fig. 3】Cross-sectional view of the key components
`showing another embodiment example of the heat dissipation
`structure for electronics according to the present invention.
`【Figure 4】Enlarged cross-sectional view of the key
`components showing
`the heat dissipation structure of
`conventional electronic equipment.
`【Description of the symbols】
`1
` Housing
`1a
` Air exhaust
`2
` Front
`3
` Substrates
`3a Insertion hole
`4 Rear
`5 Partition plate
`5a Attachment screw hole
`5b Fan attachment part
`6 Ventilation fan
`7
`Back cover
`7a
` Back air inlet
`8 Air guide plate
`8a Through-hole
`8b Recess
`8c Opening
`8d Insertion hole
`8e Thin section
`9 Air leak prevention part
`9a Opening
`9b Insertion hole
`9c Concave part
` 10
` Screw
`
`
`
`SEC et al. v. MRI
`SEC Exhibit 1008.004
`IPR 2023-00199
`
`

`

`Japanese Unexamined Patent Application Publication H11-68363
`
`【Figure 1】
`
`【Figure 2】
`
`【Figure 3】
`
`
`
`
`
`View along
`line A - A
`
`【Figure 4】
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`SEC et al. v. MRI
`SEC Exhibit 1008.005
`IPR 2023-00199
`
`

`

`CERTIFICATE OF TRANSLATION
`
`
`
`I, Dan McCourt, hereby certify that the document identified below, translated from Japanese into
`English, is true and accurate, to the best of my knowledge and belief.
`
`
`
`Reference: JP 1999-068363A
`
` I
`
` declare under penalty of perjury under the laws of the United States of America that the foregoing is
`true and correct. I hereby declare that all statements made herein of my own knowledge are true and
`that all statements made on information and belief are believed to be true; and further that these
`statements were made with the knowledge that willful false statements and the like so made are
`punishable by fine or imprisonment, or both, under Section 1001 of Title 18 of the United States Code.
`
`
`
`
`
`__________________________________________
`Dan McCourt
`
`
`Sworn to before me this
`15th day of November 2022
`
`
`
`__________________________________________
`Signature, Notary Public
`
`
`
`
`
`
`
`__________________________________________
`Signature, Notary Public
`
`
`SEC et al. v. MRI
`SEC Exhibit 1008.006
`IPR 2023-00199
`
`