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`1/153
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`MICRON 1011
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`
`
`
`
`FILE HISTORY
`US RE38,806
`
`RE38,806
`PATENT:
`INVENTORS: FUKUI YASUKI
`SOTA YOSHIKI
`MATSUNE YUJI
`NARAI ATSUYA
`FUKUI YASUKI
`SOTA YOSHIKI
`MATSUNE YUJI
`NARAI ATSUYA
`
`TITLE:
`
`Semiconductor device and method of
`manufacturing the same
`
`APPLICATION
`NO:
`FILED:
`ISSUED:
`
`US2003428013A
`
`02 MAY 2003
`04 OCT 2005
`
`COMPILED:
`
`29 JUL 2022
`
`2/153
`
`MICRON 1011
`
`
`
`RE38,806
`SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING
`THE SAME
`Transaction History
`Transaction Description
`Date
`05-02-2003 Request for Foreign Priority (Priority Papers May Be Included)
`05-02-2003
`Initial Exam Team nn
`06-04-2003 Notice Mailed--Application Incomplete--Filing Date Assigned
`06-11-2003 Payment of additional filing fee/Preexam
`06-11-2003 A statement by one or more inventors satisfying the requirement under 35 USC
`115, Oath of the Applic
`06-11-2003 The identification of one or more legal entities other than the inventor(s), each
`such legal entity
`09-02-2003 Application Dispatched from OIPE
`09-03-2003 Application Is Now Complete
`10-07-2003 Notice of Reissue Published in Official Gazette
`03-26-2004 Case Docketed to Examiner in GAU
`05-12-2004
`IFW TSS Processing by Tech Center Complete
`06-29-2004 Notice of Allowance Data Verification Completed
`01-21-2005 Mail Notice of Allowance
`02-07-2005 Workflow - File Sent to Contractor
`02-23-2005 Workflow - File Sent to Contractor
`04-18-2005
`Issue Fee Payment Verified
`04-18-2005
`Issue Fee Payment Received
`07-25-2005 Receipt into Pubs
`07-27-2005 Dispatch to FDC
`07-27-2005 Application Is Considered Ready for Issue
`07-28-2005 Receipt into Pubs
`09-14-2005
`Issue Notification Mailed
`10-04-2005 Recordation of Patent Grant Mailed
`06-05-2006 Correspondence Address Change
`
`
`3/153
`
`MICRON 1011
`
`
`
`
`
`Application No.
`
`Applicant(s)
`
`FUKUI ET AL.
`
`Art Unit
`
`111 f1111lOlfllll lAl I Examiner
`
`
`
`Isu lsIiain
`
`10/428013
`
`
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`
`Part of Paper No. 0
`
`4/153
`
`MICRON 1011
`
`
`
`IdxoClisApplIcaton
`
`No.
`
`10/428,013
`Examiner
`
`_ S. V. Clark
`
`] N
`
`oat
`
`e
`
`
`
`__ __
`
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`
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`
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`
`__
`
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`
`_
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`
`2
`33=
`-4
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`5 5
`6 6
`
`9 9
`
`1
`
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`
`12
`12
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`
`37
`38
`39
`40
`41
`42
`43
`44
`45
`48
`47
`48
`49
`50
`
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`51
`52
`53
`54
`551
`56
`57
`-98
`59
`601
`861-
`
`64
`845
`65
`67
`68
`
`70
`
`73
`74
`75
`
`77
`78
`
`79
`83
`81
`
`67
`
`88
`
`-89
`
`90
`191
`92
`93
`942 -
`95
`98
`97
`98
`99
`100
`
`Apiplicant(s)
`
`FUKU1 ET AL.
`Art Unit
`
`2815
`
`on-lcezAApa
`Claim
`
`IDate
`
`101
`102
`103
`104
`105
`108
`107
`108
`109
`110
`
`112
`113
`114
`1 15
`116
`
`_
`
`119
`120
`121
`122
`123
`124
`125
`128
`127
`128
`1129
`1130
`1131
`132
`133
`1341
`135
`136
`137
`138
`139
`140
`141
`142
`143
`144
`145
`146
`147
`
`1
`
`1 1 1
`
`1
`
`U.S. Patent and Trademark Office
`
`Pdo ae o
`Part of Paper No. 0
`
`5/153
`
`MICRON 1011
`
`
`
`Search Notes
`
`
`
`lii! lii N 1101110S. V.
`
`Appilicaton No.
`10/428,013
`Examiner
`
`Clark
`
`Applicantgs)
`FUKUI ET AL.
`Art Unit
`
`2815
`
`SEARCHED
`
`SEARCH NOTES
`(INCLUDING SEARCH STRATEGY)
`
`Class
`
`Subclass
`
`Oate
`
`Examiner
`
`DATE
`
`EXMR
`
`257
`
`777
`
`6/2412DO4
`
`Svc
`
`585
`
`688
`
`723
`
`724
`
`778
`
`108
`
`109
`
`110
`
`107
`
`438
`
`INTERFERENCE SEARCHED
`
`Clans
`
`26?
`
`Subclass
`
`Date
`
`Examiner
`
`6/2412DO4
`
`Svc
`
`777
`
`685
`
`U.S. Patent and Trademark OfficePatoPaeN.0
`
`Part of Paper No. 0
`
`6/153
`
`MICRON 1011
`
`
`
`STIC SWQh Repor
`
`4F)AIt~h
`
`f R
`
`-p
`
`2800
`
`US PTO
`
`STIC DaaaeTrcigNubr
`
`TO: Jose Does
`Location: JEF - 8D59
`Art Unit: 2800
`Monday, March 29, 2004
`
`Case Serial Number: 101428013
`sa
`
`-
`
`Re: 101428,013 US 6,229,217
`
`Attached are search results.
`
`om: Darcy Bates
`Fr
`cation: EIC 2800
`L
`F- 4B68
`JE
`none: 571-272-2540
`Ph
`
`da
`
`rcy.bates@uspto.gov
`
`No U. S. litigation was found in searches of
`Lexis-Nexis and Questel-Orbit databases.
`
`If more searching or explanation is needed, please let
`me know.
`
`Thanks,
`Darcy Bates
`
`I'd
`
`d~b
`
`7/153
`
`MICRON 1011
`
`
`
`Application Number Information
`
`http://expowcb 1:8001I/cgi-bin/expo/Genlnfo/snquery.pl..
`
`PALM INTRANET
`
`Application Number information
`
`Day: Monclay
`Dale: 3129/2004
`Time: 10:05:15
`
`Application Number: 101428013 Assignmenb
`ExaminerNumber: 62286 / CLARK, SHEIL
`Piling Date: 05102/2003
`Giroup Art Unit: 2815
`Class/Subclass: 257/777.000
`Effective Date: 0510212003
`Lost Case: NO
`Application Received: 05/02/2003
`Interference Number:
`Patent Number:
`Unmatched Petition: NO
`Issue Dat: 00100/0000
`LIAKCodc Secrecy Code: I
`Date of Abandonment: 00/00/0000
`Third Level Review: NO
`Attorney Docket Number: 1035-439
`Status: 30 /DOCKETED NEWV CASE - READY FOR EXAMINATION
`Oral Hearing: NO
`Confirmation Number: 6893
`Title of Invention: SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
`
`Secrecy Order: NO
`Status Date: 03/26f2004
`
`BarCod PAM ocation
`L04.MLI1h3
`
`Location Date- ChretLe
`03/26o7O04
`
`hrge to Name
`LAK.SHEILA
`U(,
`
`Employee Name
`DEESJOSE
`
`Lcto
`JEF/081D 59
`
`m a -
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`-
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`Appinr
`
`Search Another: Application# rnor
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`Contiuity ntbrmtionhttp://expowebl1:8001 /cgi-bintexpo/ContData/contData....
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`i -t PALM INTRANET
`Continuity Information for 10/428013
`Parent Data
`
`Dlay : Monday
`Date: 3fl9f2004
`Time: 10:05:21
`
`is a reissue of 0960407
`Which is a continuation off022327l
`
`Child Data
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`r-
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`:8001 /cgi-bin/expolGenliilo/snquery.pl...
`Appliatio Numer ltbrmtionhttp://expowebl
`
`PALM INTRANET
`
`Application Number Information
`
`Application Number: 09/604079 Assignments
`Filing Dale: 06/27/2000
`Effective Date; 06/27t2000
`Application Rceived: 06/7/2000
`Patent Number 6229212
`Issue Date: 05/08/2001
`Date of Abandonment: 00/0010000
`Attorney Docket Number: 1035-272
`Status: 150 /PATENTED CASE
`Oral Hearing: NO
`Confirmnation Number: 4828
`Title of Invention: SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
`
`Examiner Number: 622861/CLARK,.SHEILA
`Group Art Unit: 2815
`Class,/Subclass: 257n777.OOD
`Lost Case: YES
`Interference Number:
`Unmatched Petition: NO
`LkRKCode Secrecy Code:l
`T'hird Level Review: NO
`
`SecrecyC
`StausD
`
`Day: Monday
`Date: 3129/2004
`Time: 10:05:26
`
`Wrer: NO
`te: 04/20/2001
`
`to Loc
`
`Charge to Name
`TuBBs, TONGELINA
`
`EmlyeNm
`NG-0
`
`L~
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`
`-
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`m -
`
`or Patent#
`or PG PUBS N F-
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`flfCharge
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`PALM INTRANET
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`
`Day: Monday
`Date: 3Y29/200N
`Time: 10:05:32
`
`Parent Data
`0960407S
`is a continuation of 0922327?
`
`Child Data
`10428013 is a reissue ofM0964079
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`Data
`
`Search Another: Application# r-
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`Appliatio Numer Itbrmtionhttp:f/expoweb 1:800lkIgi-bin/expo/Genlnfo/snquery.pI...
`
`PALM INTRANET
`
`Application Number Information
`
`Application Number: 091223272 Order This File
`
`Examiner Number: 62286/t CLARK, SHEIL
`
`Day: Monday
`Date: 3/29/2004
`Time: 10:05:36
`
`Filing Date: I2/30/1998
`Eftbmive Date: 12130/1998
`Application Received: 12/30/1998
`Patent Number: 61lf059
`Issue Date: 08/08/2000
`Date of Abandonment: 00/00/0000
`Attorney Docket Number: 1035-210
`Status: 150 /PATENTED CASE
`Oral Hearing: NO
`Confirmation Number: 3847
`Title of Invention: SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
`
`Group Art Unit: 2815
`Class/Subclass: 257n777.000
`Lost Case: NO
`Interference Number:
`Unmatched Petition: NO
`L&R Code: Secrecy Codc:I
`Third Level Review: NO
`
`Secrecy Order: NO
`Status Date: 07/20/2000
`
`BarCoe PLMLoatin octio Dte
`~~72 Qjl
`s
`]~o
`
`Charge to Loc
`Charge to Name
`Employee Name
`oCharge to Location No Charge to Name KAA
`
`1
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`jnl
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`Parent Data
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`
`Child Data
`096040791is a continuation o( 09223272
`0960408t1is a division ofh022327f
`10428013 i a reissue of 09604079
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`
`PALM INTRANET
`
`Application Number Information
`
`Application Number: 09/604081 OQnrde.hi ilke
`
`Examiner Number: 77923 /JJLUIUCHU±N
`
`Day: Monday
`Date: 3Y29/2004
`Time: 10:05:53
`
`Filing Date: 06127/2000
`Effective Date: 06/27/2000
`Application Received: 06/27/2000
`Patent Number: 6352879
`Issue Date: 03/0.IW2002
`Date of Abandonment: 00/00/0000
`Attorney Docket Number 1035-271
`Status: ISO /PATENTED CASE
`Oral Hearing: NO
`Continuation Number: 4328
`Title of Invention: SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THlE SAME
`
`Group An Unit: 2825
`Class/Subclass: 4391106.000
`Lost Case: NO
`Interference Number:
`Unmatched Petition: NO
`L&R Code: Secrecy Code: I
`Third Level Review: NO
`
`Secrecy Order: NO
`Status Date: 02/14t2002
`
`Bar ode ALMLocaionrge~ to Loc
`o Carge toLct
`F~6fl03
`____ flO
`
`No
`
`,Employee Name
`rg to Name
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`'Litigation involving patent 6,229,217
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`Source: Le"a > Area of Law - By Topic> Patent Law> Patenta > U.S.Patents > Utility Patents
`
`Terms: patno=6229217 (Edit Smarchi
`
`604079 (09) 6229217 May 8, 2001
`
`UNITED STATES PATENT AND TRADEMARK OFFICE GRANTED PATENT
`
`6229217!
`
`*Get Drawing Sheet 1 of 16
`Access PDF of Official Patent *
`Check for Patent Family Report PDF availability*
`* Note: A transactional charge will be incurred for
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`
`Link to Claims Section
`
`May 8, 2001
`
`Semiconductor device and method of manufacturing the same
`
`REISSUE:.May 2, 2003 - Reissue Application filed Ex. Gp.: 2815; Re. S.N.
`10/428,013 (O.G. October 7, 2003)
`
`INVENTOR: Fukui, Yasuki - Tenri, Japan (JP); Sota, Yoshiki - Nara, Japan
`(JP3); Matsune, Yuji - Tendi, Japan (31P); Narai, Atsuya - Yamatokoriyama,
`Japan (JP)
`
`APPL-NO: 604079 (09)
`
`FILED-DATE: June 27, 2000
`
`GRANTED-DATE: May 8, 2001
`
`PRIORITY: January 14, 1998 - 105221, Japan (JP)
`
`ASSIGNEE-AT-ISSUE: Sharp Kabushiki Kaisha, Osaka, Japan (JP), 03
`
`LEGAL-REP: Nixon & Vanderhye, P.C.
`
`PUB-TYPE: May 8, 2001 - Utility Patent having no previously published
`pre-grant publication (Bl)
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`3/29/04
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`US 6,229,217
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`10/428013
`
`WELCOME to QUESTEL.ORBIT- Your Guide to INTELLECTUAL PROPERTY
`
`Query/Commuand
`
`:file
`
`pluspat
`
`Query/Command :us6229217/pn/
`
`Selected file: PLUSPAT
`
`Search statement
`
`1
`
`SB 1: Results 1
`
`Search statement
`
`2
`
`Query/Command : prt fu legalall max
`
`I / I
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`PLUSPAT
`- CQUESTEL-ORRIT -
`US56229217 El 20010508 [US6229217]
`(81) Semiconductor device and method of manufacturing the same
`(B1) SHARP [KI (US)
`Sharp Kabushiki Kaisha, Osaka [JP]
`(Bl) FUKUQI YASUKI (JP); MATSUNE YUJI (JP); NARAI ATSUYA (JP);
`SOTA YOSHIKI (JP)
`US60407900 20000627 [20001US-0604079]
`US5223272 19981230 (19961US-02232723
`Cont. of
`Continuation of: US56100594
`US60407900 20000627 [2000US-06040791
`3P522198 19980114 [1998JP-00052211
`US522327290 19981230 (199BUS-02232721
`(Bl) H01L-023/48 HOIL-023/52
`HOIL-021/98
`H01L-023/31H2
`H01L-025/065S
`ORIGINAL (0) :257171000; CROSS-REFERENCE (X) 257E21705
`257E23125 257E25013 257685000 257686000
`Corresponding document
`UJS6077724; JPS-90486; JP9-121002
`(B1) U.S. Patent (no pre-grant pub.) after Jan. 2, 2001
`A first semiconductor chip is produced by affixing a
`thermo-compression sheet to the back surface of a wafer having a
`circuit formed on its front surface. The first semiconductor chip
`is mounted on a circuit board including an insulating substrate
`and a wiring layer provided on the insulating substrate so that
`the back surface of the first semiconductor chip faces the circuit
`board. A second semiconductor chip produced in the same manner as
`the first semiconductor chip is mounted on the first
`semiconductor chip with its back surface facing the first
`semiconductor chip. Each of the first and second semiconductor
`chips is wire-bonded to the wiring layer with a wire. The first
`and second semiconductor chips and the wire are sealed with a
`sealing resin. The wiring layer is connected to external
`connection terminals through via holes provided in the insulating
`substrate.
`2001-22
`
`I/I LGST-COEPO
`([U56229211
`US6229217 B1 20010508
`PN -
`AP
`US560407900 20000627 120001US-0604079)
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`1 / 1
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`REISSUE APPLICATION FILED/
`EFFECTIVE DATE: 20030502
`2003-42
`
`CRXX
`- CLA XNSIRRX
`3507443/
`6,229,217 A 20010508 (US6229217]i
`Sharp K KJP
`E (Electrical)
`20030502 REISSUE REQUESTED
`ISSUE DATE OF O.G.: 20031007-
`REISSUE REQUEST NUMBER: 10/420013
`EXAMINATION GROUP RESPONSIBLE FOR REISSUEPROCESS: 2815
`
`Reissue Patent Number:
`
`UP -
`UACT-
`
`2003-41
`2003-10-07
`
`1 Patent Groups
`** SS 2: Results 4
`
`Search statement
`
`3
`
`Query/Commnd : fa us6229217/pn
`
`Query/Comnand : famstate nonstop
`
`image/
`PLUSPAT - CQUESTEL-ORBIT -
`JP11204720 A 19990730 (3211204720]
`(A) Doc. Laid open to publ. Inspec.
`(A) SEMICONDUCTOR DEVICE AND ITS MANUFACTURE
`(A) SHARP KK
`(A) SHARP CORP
`(A) FUJKUI YASUKI; MATSUNE YUJI; NAMII ATSUYA; SODA YOSHIKI
`(A) H01L-025/065 HOlL-025/O7 H01L-025/18
`JP3481444 32 20031222 [3234814443
`(B2) Grant. Pat. With A from 2500000 on
`(B2) HOIL-025/065 H01L-025/07 H01L-025/18
`32522198 19980114 [1998JP-00052211
`JP522198 19980114 [19983P-0005221)
`
`PLUSPAT - CQUESTEL-ORBIT - image?
`US6100594 A 20000808 JUS61005941'
`(A) United States patent
`(A) Semiconductor device and method of manufacturing the same
`(A) SHARP KK (32)
`Sharp Kabushiki Kaisha, Osaka [3PJ
`(A) FUKUI YASUKI (J2); MATSUNE YUJJI
`SOTA YOSHIKI (32)
`(A) H01L-023/48 H01L-023/52 HO1L-029/40
`US22327298 19981230 [1998US-02232721
`J2522198 19980114 (1998JP-0005221J
`HOIL-021/98
`H01L-023/31H12
`
`(JP); NARAI ATSUYA (32);
`
`I / 4
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`
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`
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`10/428013
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`ORIGINAL (0) : 257777000; CROSS-REFERENCE (X) : 257E21705
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`- CQUESTEL-ORBIT -
`US6229217 Bl 20010508 (US62292171/
`(Bl) U.S. Patent (no pre-grant pub.) after Jan. 2, 2001
`(El) Semiconductor device and method of manufacturing the same
`(Bl) SHARP KK1 (US)
`Sharp Kabushiki Kaisha, Osaka (JPJ
`(El) FUKUI YASUKI (JP); MATSUNE YUJI (ON; NARAI ATSUYA (JP);
`SOTA YOSHIKI (JP)
`(El) HOlL-023/48 HOIL-023/52
`US560407900 20000627 [2000(US-0604079)
`US560407900 20000627 (2000U5-06040791
`JP522198 19980114 (1998JP-00052211
`US522327298 19981230 (1998US-02232721
`H01L-021/98
`H01L-023/31H2
`H01L-025/0 65S
`ORIGINAL (0) : 257777000; CROSS-REFERENCE (X) 257E21705
`257E23125 257E25013 257685000 257686000
`Corresponding document
`2001-22
`
`LEGALI-C0EPO
`US6229217 Bl 20010508 ([US62292171
`US60407900 20000627 (2000US-06040q9]
`20031007 US/RF-A
`REISSUE APPLICATION FILED
`EFFECTIVE DATE: 20030502I
`2003-42
`
`]
`- OQUESTEL-ORBIT
`PLUSPAT
`US56352879 Bl: 20020305 [US56352879]
`(Bl) U.S. Patent (no pre-grant pub.) after Jan. 2, 2001
`(Bl) Semiconductor device and method of manufacturing the same
`(Bl) SHARP KK1 (JP)
`Sharp Kabushiki Kaisha, Osaka (3P]
`(Bl) FUJKUI YASUKI (3P); MIATSUNE YUJI (32); NARAI ATSUYA (3P);
`SOTA YOSHIKI (JP)
`(Bl) HO1L-021/44 H01L-021/48 HOIL-021/50
`US860408100 20000627 [2000US-0604081J
`US60408100 20000627 [2000US-0604081]
`JP522198 19980114 [1998JP-00052211
`US522327298 19981230 [1998(US-02232721
`H01L-021/98
`H01L-023/3l1H2
`H01L-025/065S
`ORIGINAL (0) : 438106000; CROSS-REFERENCE (X) :257E21705
`257E23125 257E25013 438107000 438109000 438118000 438127000
`Corresponding document
`2002-11
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`Stic EIC 2800
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`Darcy Bates
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`
`(19) United States
`(12) Reissued Patent
`Fukui et al.
`
`U UUKLi55UOL
`
`US RE38,806 E
`(to) Patent Number:
`(45) Date of Reissued Patent:
`Oct. 4, 2005
`
`(54) SEMICONDUCTOR DEVICE AND METHOD
`OF MANUFACTURING THE SAME
`
`(56)
`
`References Cited
`
`U.S. PATENT DOCUMENTS
`
`(75)
`
`Inventors: Yasuki Fukui, Tenri (JP); Yoshiki Sota,
`Nara (JP); Yuji Matsune, Tenri (JP);
`Atsuya Narai, Yamatokoriyama (JP)
`
`(73) Assignee: Sharp Kabushiki Kaisha, Osaka (JP)
`
`(21) Appl. No.: 10/428,013
`
`(22) Filed:
`
`May 2, 2003
`
`Related U.S. Patent Documents
`
`Reissue of:
`(64) Patent No.:
`Issued:
`Appl. No.:
`Filed:
`
`6,229,217
`May 8, 2001
`09/604,079
`Jun.27,2000
`
`U.S. Applications:
`(63) Continuation of application No. 09/223,272, filed on Dec.
`30, 1998, now Pat. No. 6,100,594.
`Foreign Application Priority Data
`
`(30)
`
`(JP)
`
`Jan. 14, 1998
`
`10-5221
`..............................................
`. ... ..... H01L 23/48; HO1L 23/52
`Int. Cl.7 .................
`(51)
`(52) U.S. Cl. ........................
`257/777; 257/685; 257/686
`(58) Field of Search .................................
`257/777, 685,
`257/686, 723, 724, 778; 438/108, 109,
`110, 107
`
`6,077,724 A * 6/2000 Chen ..........................
`
`438/107
`
`FOREIGN PATENT DOCUMENTS
`
`5-90486
`JP
`JP
`9-121002
`* cited by examiner
`
`4/1993
`5/1997
`
`Primary Examiner-S. V. Clark
`(74) Attorney, Agent, or Firm-Nixon & Vanderhye, P.C.
`ABSTRACT
`
`(57)
`
`A first semiconductor chip is produced by affixing a thermo-
`compression sheet to the back surface of a wafer having a
`circuit formed on its front surface. The first semiconductor
`chip is mounted on a circuit board including an insulating
`substrate and a wiring layer provided on the insulating
`substrate so that the back surface of the first semiconductor
`chip faces the circuit board. A second semiconductor chip
`produced in the same manner as the first semiconductor chip
`is mounted on the first semiconductor chip with its back
`surface facing the first semiconductor chip. Each of the first
`and second semiconductor chips is wire-bonded
`to the
`wiring layer with a wire. The first and second semiconductor
`chips and the wire are sealed with a sealing resin. The wiring
`layer is connected to external connection terminals through
`via holes provided in the insulating substrate.
`
`33 Claims, 15 Drawing Sheets
`
`(2
`
`2
`
`(7
`7
`(
`
`1
`
`I K
`
`8S
`
`6
`t
`
`-5
`
`93
`
`12
`
`10
`
`29/153
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`U.S. Patent
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`Oct. 4, 2005
`
`Sheet 1 of 15
`
`US RE38,806 E
`
`FIG.1
`
`( 6
`
`12
`
`10
`
`30/153
`
`MICRON 1011
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`
`
`U.S. Patent
`
`Oct. 4, 2005
`
`Sheet 2 of 15
`
`US RE38,806 E
`
`FIG. 2 (a)
`
`lb
`
`0
`0
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`FIG.2(b)
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`12
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`Sheet 3 of 15
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`US RE38,806 E
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`FI G.3(a)
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`@@@@*@@
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`12
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`FIG.3(b)
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`14--1'
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`Sheet 4 of 15
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`US RE38,806 E
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`FIG.4
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`7
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`7a
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`1
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`Sheet 5 of 15
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`US RE38,806 E
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`FIG.5(a)
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`FI G.5 (b)
`
`FIG.5(c)
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`FIG.5(d)
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`FIG. 5 (e)
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`FIG.5(g)
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`Sheet 6 of 15
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`US RE38,806 E
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`FIG. 6 (a)
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`FIG.6(b)9
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`Sheet 7 of 15
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`US RE38,806 E
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`FIG.7(a)
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`77
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`7
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`Sheet 8 of 15
`Seto1
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`SE886
`US RE38,806 E
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`FIG .8 (a)
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`17b
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`137
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`G. 8 (b)
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`17b
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`2
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`18
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`Sheet 9 of 15
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`US RE38,806 E
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`FIG.9(a)
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`2
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`17b
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`38/153
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`Sheet 10 of 15
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`US RE38,806 E
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`FIG.10
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`8
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`21
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`f,
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`22
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`23
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`Sheet 11 of 15
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`US RE38,806 E
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`5
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`e
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`FIG.11(c)
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`F[G.11(d)
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`FIG.11(e)
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`40/153
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`Sheet 12 of 15
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`US RE38,806 E
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`2,22
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`-
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`',,21
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`FI G.2 (a)
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`17 b
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`FIG .12 (b)
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`22
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`17b9
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`Sheet 13 of 15
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`US RE38,806 E
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`FIG.13(a)
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`43
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`42
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`FIG.13(b)
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`42/153
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`Sheet 14 of 15
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`US RE38,806 E
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`FIG.14(a)
`
`89
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`FI G.14 (b)
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`0 %
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