Trials
`Howard Lim; Trials
`Simpson, Amy E (CCC - X68925); tessar-ptab@perkinscoie.com; TMatthew@perkinscoie.com; Sargeant, Heath M
`(BOS - X71420); Michael Pomeroy; Scott Breedlove
`RE: IPR2023-00071, -00072, -00073 - Patent Owner"s Unopposed Motions for Leave to Refile and Expunge
`Exhibits
`Thursday, October 12, 2023 10:24:46 AM
`image001.png
`
`From:
`To:
`Cc:
`
`Subject:
`
`Date:
`Attachments:
`
`Counsel,
`
`The Board grants the parties’ unopposed requests. The Board will proceed as set forth below:
`
`1. The Board will expunge the PORs and duplicate exhibits identified in the table in counsel’s
`email. Following the expungement, Patent Owner may file the corrected PORs and
`exhibits without substantive changes.
`2. The Board will expunge Exhibits 2007 and 2008. Following the expungement, Patent
`Owner may file the corrected exhibits without substantive changes.
`3. The Board will expunge Patent Owner’s responses to objections (Paper 22 in -0071, Paper
`25 in -0072, Paper 22 in -0073) and supplemental Exhibits 2019-2028.
`
`Regards,
`
`Esther Goldschlager
`Supervisory Paralegal Specialist
`Patent Trial & Appeal Board
`U.S. Patent & Trademark Office
`
`From: Howard Lim <hlim@carterarnett.com>
`Sent: Friday, September 29, 2023 10:51 PM
`To: Trials <Trials@USPTO.GOV>
`Cc: Simpson, Amy E (CCC - X68925) <Amy.Simpson@hklaw.com>; tessar-ptab@perkinscoie.com;
`TMatthew@perkinscoie.com; Sargeant, Heath M (BOS - X71420) <Heath.Sargeant@hklaw.com>;
`Michael Pomeroy <mpomeroy@carterarnett.com>; Scott Breedlove
`<sbreedlove@carterarnett.com>
`Subject: IPR2023-00071, -00072, -00073 - Patent Owner's Unopposed Motions for Leave to Refile
`and Expunge Exhibits
`
`CAUTION: This email has originated from a source outside of USPTO. PLEASE CONSIDER THE SOURCE before
`responding, clicking on links, or opening attachments.
`
`Dear Honorable Board,
`
`Katana Silicon Technologies, LLC (“Patent Owner”), together with Micron Technology, Inc. et al.
`(“Petitioner”), jointly seek the Board’s permission and guidance regarding the three issues outlined
`below. The parties met and conferred. None of the issues are opposed. As to issue 3, Patent Owner
`seeks the Board’s guidance on how to proceed on correcting the exhibits on file.
`
`Exhibit 3004
`
`

`

`
`1. Patent Owner’s Unopposed Motion for Leave to Refile Exhibits to (1)
`remove Duplicate Exhibits and (2) Expunge and Refile Duplicate Exhibit Numbers
`
`In IPR2023-00071 and -00073, Ex. 2002 and Ex. 2004 filed Feb 17 are duplicates of Ex. 2002 and Ex.
`2013 filed Aug 14 respectively. Ex. 2001 filed Aug 14, Ex. 2003 filed Feb 17, Ex. 2005 filed Mar 29
`have duplicate exhibit numbers with other exhibit numbers.
`
`In IPR2023-00073, Ex. 2004 and Ex. 2005 filed Feb 17 are duplicates of Ex. 2013 and Ex. 2002 filed
`Aug 14 respectively. Ex. 2001 filed Aug 14, Ex. 2006 filed Feb 17, and Ex. 2007 file Mar 29 have
`duplicate exhibit numbers with other exhibit numbers.
`
`Petitioner objected that this potentially causes confusion in the record. Patent Owner seeks leave
`to (1) expunge duplicate exhibits, (2) expunge the duplicate exhibit numbers and refile so that each
`exhibit has a unique number that appears only once on the record and (3) expunge and refile the
`PORs to reference the corrected exhibit numbers. Petitioner does not oppose. A proposed table of
`the requested corrections is set forth below. Please let Patent Owner know if there is a different
`approach the Board prefers to correct the exhibits on the record.
`
`2. Patent Owner’s Unopposed Motion for Leave to Refile Exhibits 2007 and 2008
`
`Exs. 2007 and 2008 filed August 14, 2023 are chapters excerpted from a text. The cover page,
`copyright page, table of contents, and table of illustrations of the text were not filed with the
`excerpted chapters. Patent Owner seeks leave from the Board to expunge Exs. 2007 and 2008 and
`refile the chapters to include the cover page, copyright page, table of contents, and table of
`illustrations. No substantive changes will be made. Petitioner does not oppose.
`
`3. Petitioner’s Unopposed Motion to Expunge Exhibit Numbers 2019-2028
`
`On August 21, 2023 Petitioner served objections to evidence submitted by Patent Owner to support
`its PORs. On September 4, 2023, Patent Owner filed and served responses (e.g., Paper no. 22 in
`-00071) and supplemental exhibits (Exs. 2019-2028) to Petitioner’s objections. Petitioner objected
`that the Patent Owner’s responses and supplemental exhibits should have only be served and not
`filed at this stage of the proceeding. Patent Owner does not oppose and the parties stipulate to
`expunge the responses (Paper No. 22) and exhibits (Ex. 2019-2028) while reserving the Patent’s
`Owner’s rights to refile if Petitioner moves to exclude. Petitioner seeks leave of the Board to
`expunge the responses and exhibits.
`
`
`
`
`-071 / -073 – Current PO Exhibits.
`
`-072 IPR – Current PO Exhibits
`
`Exhibit Filing Date Description
`
`2001
`
`Filed
`
`Declaration of
`
`Requested
`Corrective
`Action
`None
`
`Exhibit Filing Date Description
`
`Requested
`Corrective
`Action
`Declaration of Peter None
`
`2001
`
`Filed
`
`

`

`Filed
`8/14/2023
`
`Filed
`2/17/2023
`
`Filed
`8/14/2023
`
`2/17/2023 Peter Elenius ISO
`Patent Owner’s
`Preliminary
`Response
`Declaration of
`Peter Elenius in
`support of Patent
`Owner’s Response
`Yasuki Fukui, Yuji
`Yano, Hiroyuki Juso,
`Yuji Matsume, Koji
`Miyata, Atsuya
`Narai, Yoshiki Sota,
`Yoshikazu Takeda,
`Kazuya Fujita, and
`Morihiro
`Kada, Triple-Chip
`Stacked CSP,
`published at 2000
`Electronic
`Components and
`Technology
`Conference
`Yasuki Fukui, Yuji
`Yano, Hiroyuki Juso,
`Yuji Matsume, Koji
`Miyata, Atsuya
`Narai, Yoshiki Sota,
`Yoshikazu Takeda,
`Kazuya Fujita, and
`Morihiro
`Kada, Triple-Chip
`Stacked CSP,
`published at 2000
`Electronic
`Components and
`Technology
`Conference
`Shinji Takeda and
`Takashi Masuko,
`Novel Die Attach
`Films Having High
`Reliability
`Performance for
`Lead-free Solder
`and CSP
`Shinji Takeda and
`Takashi Masuko,
`Chapter 12 Die
`Attach Adhesive
`
`Filed
`2/17/2023
`
`Filed
`8/14/2023
`
`2/17/2023 Elenius ISO Patent
`Owner’s Preliminary
`Response
`
`2001
`
`Filed
`8/14/2023
`
`2002
`
`Filed
`8/14/2023
`
`Expunge
`and refile as
`2014 (Issue
`1)
`Expunge as
`duplicate of
`2002 filed
`8/14/2023
`(Issue 1)
`
`None
`
`2003
`
`Filed
`8/14/2023
`
`Expunge and
`refile as
`2014 (Issue
`1)
`None
`
`None
`
`Declaration of Peter
`Elenius in support of
`Patent Owner’s
`Response
`Yasuki Fukui, Yuji
`Yano, Hiroyuki Juso,
`Yuji Matsume, Koji
`Miyata, Atsuya
`Narai, Yoshiki Sota,
`Yoshikazu Takeda,
`Kazuya Fujita, and
`Morihiro
`Kada, Triple-Chip
`Stacked CSP,
`published at 2000
`Electronic
`Components and
`Technology
`Conference
`Shinji Takeda and
`Takashi Masuko,
`Chapter 12 Die
`Attach Adhesive
`and Films in
`MATERIALS FOR
`ADVANCED
`PACKAGING (Daniel
`Lu, C.P. Wong
`editors, 1st ed.
`2009)
`
`Expunge
`and refile as
`2015 (Issue
`1)
`
`2004
`
`Filed
`2/17/2023
`
`C.V. of Peter Elenius Expunge as
`duplicate of
`2013 (Issue
`1)
`
`None
`
`2004
`
`Filed
`8/14/2023
`
`U.S. Patent No.
`5,140,404
`
`None
`
`2001
`
`2002
`
`2002
`
`2003
`
`2003
`
`

`

`and Films in
`MATERIALS FOR
`ADVANCED
`PACKAGING (Daniel
`Lu, C.P. Wong
`editors, 1st ed.
`2009)
`C.V. of Peter
`Elenius
`
`2004
`
`Filed
`2/17/2023
`
`2005
`
`Filed
`2/17/2023
`
`Expunge as
`duplicate of
`2013 filed
`8/14/2023
`(Issue 1)
`
`2004
`
`2005
`
`Filed
`8/14/2023
`Filed
`3/29/2023
`
`2005
`
`2006
`
`Filed
`8/14/2023
`Filed
`8/14/2023
`
`2007
`
`Filed
`8/14/2023
`
`U.S. Patent No.
`5,140,404
`Katana Silicon
`Technologies LLC v.
`Western Digital
`Technologies (E.D.
`Tex. 2021) –
`Western Digital’s
`Opening Claim
`Construction Brief
`WO96/06459A1
`
`U.S. Patent No.
`5,177,032
`
`2005
`
`2006
`
`Filed
`8/14/2023
`Filed
`2/17/2023
`
`None
`
`Expunge
`and refile as
`2016 (Issue
`1)
`
`None
`
`None
`
`2006
`
`2007
`
`Filed
`8/14/2023
`Filed
`3/29/2023
`
`2007
`
`Filed
`8/14/2023
`
`Eric Bogatin, Ch.
`12, Multichip
`Module, in
`ROADMAPS OF
`PACKAGING
`TECHNOLOGY (Dick
`Potter and Laura
`Peters editors, 1st
`
`Expunge
`and refile as
`2007
`Replace to
`include TOC,
`etc (Issue 2)
`
`Yasuki Fukui, Yuji
`Yano, Hiroyuki Juso,
`Yuji Matsume, Koji
`Miyata, Atsuya
`Narai, Yoshiki Sota,
`Yoshikazu Takeda,
`Kazuya Fujita, and
`Morihiro
`Kada, Triple-Chip
`Stacked CSP,
`published at 2000
`Electronic
`Components and
`Technology
`Conference
`WO96/06459A1
`
`Shinji Takeda and
`Takashi Masuko,
`Novel Die Attach
`Films Having High
`Reliability
`Performance for
`Lead-free Solder
`and CSP
`U.S. Patent No.
`5,177,032
`Katana Silicon
`Technologies LLC v.
`Western Digital
`Technologies (E.D.
`Tex. 2021) –
`Western Digital’s
`Opening Claim
`Construction Brief
`Eric Bogatin, Ch. 12,
`Multichip Module,
`in ROADMAPS OF
`PACKAGING
`TECHNOLOGY (Dick
`Potter and Laura
`Peters editors, 1st
`ed. 1997)
`
`Expunge as
`duplicate of
`2002 (Issue
`1)
`
`None
`
`Expunge and
`refile as
`2015 (Issue
`1)
`
`None
`
`Expunge and
`refile as
`2016 (Issue
`1)
`
`Expunge and
`refile as
`2007
`Replace to
`include TOC,
`etc (Issue 2)
`
`

`

`2008
`
`Filed
`8/14/2023
`
`Expunge
`and refile as
`2008
`Replace to
`include TOC,
`etc (Issue 2)
`
`Expunge and
`refile as
`2008
`Replace to
`include TOC,
`etc (Issue 2)
`
`Eric Bogatin, Ch. 13,
`Next Generation
`Technologies, in
`ROADMAPS OF
`PACKAGING
`TECHNOLOGY (Dick
`Potter and Laura
`Peters editors, 1st
`ed. 1997)
`
`2008
`
`Filed
`8/14/2023
`
`2009
`
`2010
`
`2011
`
`Filed
`8/14/2023
`Filed
`8/14/2023
`Filed
`8/14/2023
`
`2012
`
`Filed
`8/14/2023
`
`2013
`
`2014
`
`Filed
`8/14/2023
`
`
`2015
`
`
`
`2016
`
`
`
`
`
`2019
`
`
`
`Filed
`
`ed. 1997)
`Eric Bogatin, Ch.
`13, Next
`Generation
`Technologies, in
`ROADMAPS OF
`PACKAGING
`TECHNOLOGY (Dick
`Potter and Laura
`Peters editors, 1st
`ed. 1997)
`U.S. Patent No.
`6,448,643
`U.S. Patent No.
`5,309,017
`U.S. Patent
`Application
`Publication No.
`2004/0227547A1
`Transcript of
`Deposition of Dr.
`Jeffrey Suhling
`(“Suhling Tr.”)
`C.V. of Peter
`Elenius
`Declaration of
`Peter Elenius in
`support of Patent
`Owner’s Response
`
`Shinji Takeda and
`Takashi Masuko,
`Novel Die Attach
`Films Having High
`Reliability
`Performance for
`Lead-free Solder
`and CSP
`Katana Silicon
`Technologies LLC v.
`Western Digital
`Technologies (E.D.
`Tex. 2021) –
`Western Digital’s
`Opening Claim
`Construction Brief
`
`
`IEEE Xplore Triple-
`
`None
`
`None
`
`None
`
`2009
`
`2010
`
`2011
`
`None
`
`2012
`
`Filed
`8/14/2023
`Filed
`8/14/2023
`Filed
`8/14/2023
`
`Filed
`8/14/2023
`
`2013
`
`2014
`
`Filed
`8/14/2023
`
`
`2015
`
`
`
`2016
`
`
`
`None
`
`New exhibit
`(Ex 2001
`filed
`8/14/2023
`with unique
`number)
`New exhibit
`(Ex 2003
`filed
`2/17/2023
`with unique
`number)
`
`New exhibit
`(Ex 2005
`filed
`3/29/2023
`with unique
`number)
`
`
`
`Expunge per
`
`
`
`2019
`
`
`
`Filed
`
`None
`
`None
`
`U.S. Patent No.
`6,448,643
`U.S. Patent No.
`5,309,017
`U.S. Patent
`Application
`Publication No.
`2004/0227547A1
`Transcript of
`Deposition of Dr.
`Jeffrey Suhling
`(“Suhling Tr.”)
`C.V. of Peter Elenius None
`
`None
`
`None
`
`Declaration of Peter
`Elenius in support of
`Patent Owner’s
`Response
`
`Shinji Takeda and
`Takashi Masuko,
`Novel Die Attach
`Films Having High
`Reliability
`Performance for
`Lead-free Solder
`and CSP
`Katana Silicon
`Technologies LLC v.
`Western Digital
`Technologies (E.D.
`Tex. 2021) –
`Western Digital’s
`Opening Claim
`Construction Brief
`
`
`IEEE Xplore Triple-
`
`New exhibit
`(Ex 2001
`filed
`8/14/2023
`with unique
`number)
`New exhibit
`(Ex 2006
`filed
`2/17/2023
`with unique
`number)
`
`New exhibit
`(Ex 2005
`filed
`3/29/2023
`with unique
`number)
`
`
`
`Expunge per
`
`

`

`2020
`
`2021
`
`2022
`
`2023
`
`2024
`
`2025
`
`2026
`
`2027
`
`2028
`
`
`
`
`
`
`Filed
`9/04/2023
`Filed
`9/04/2023
`
`Filed
`9/04/2023
`
`Filed
`9/04/2023
`
`Filed
`9/04/2023
`
`9/04/2023 Chip Stacked CSP
`Conference
`Publication
`About Content in
`IEEE Xplore
`SpringerLink
`Webpage for
`Materials for
`Advanced
`Packaging
`Worldcat Webpage
`for Materials for
`Advanced
`Packaging
`2018 ECTC
`Brochure and
`Course Description
`Roadmaps of
`Packaging
`Technology Cover
`Page, Copyright
`Page, Table of
`Contents, and List
`of Illustrations
`Pages
`U.S. Copyright
`Office Public
`Catalog Listing for
`Roadmaps of
`Packaging
`Technology
`The Smithsonian
`Chip Collection
`The Smithsonian
`Media Fact Sheet
`Declaration of
`Peter Elenius in
`Support of Katana’s
`Responses to
`Micron’s
`Evidentiary
`Objections
`
`Issue 3
`
`Expunge per
`Issue 3
`Expunge per
`Issue 3
`
`2020
`
`2021
`
`9/04/2023 Chip Stacked CSP
`Conference
`Publication
`About Content in
`IEEE Xplore
`SpringerLink
`Webpage for
`Materials for
`Advanced Packaging
`
`Filed
`9/04/2023
`Filed
`9/04/2023
`
`Issue 3
`
`Expunge per
`Issue 3
`Expunge per
`Issue 3
`
`Expunge per
`Issue 3
`
`2022
`
`Filed
`9/04/2023
`
`Worldcat Webpage
`for Materials for
`Advanced Packaging
`
`Expunge per
`Issue 3
`
`Expunge per
`Issue 3
`
`Expunge per
`Issue 3
`
`2023
`
`2024
`
`Filed
`9/04/2023
`
`Filed
`9/04/2023
`
`Expunge per
`Issue 3
`
`2025
`
`Filed
`9/04/2023
`
`Expunge per
`Issue 3
`Expunge per
`Issue 3
`Expunge per
`Issue 3
`
`2026
`
`2027
`
`2028
`
`Filed
`9/04/2023
`Filed
`9/04/2023
`Filed
`9/04/2023
`
`Expunge per
`Issue 3
`
`Expunge per
`Issue 3
`
`Expunge per
`Issue 3
`
`Expunge per
`Issue 3
`Expunge per
`Issue 3
`Expunge per
`Issue 3
`
`2018 ECTC Brochure
`and Course
`Description
`Roadmaps of
`Packaging
`Technology Cover
`Page, Copyright
`Page, Table of
`Contents, and List
`of Illustrations
`Pages
`U.S. Copyright
`Office Public
`Catalog Listing for
`Roadmaps of
`Packaging
`Technology
`The Smithsonian
`Chip Collection
`The Smithsonian
`Media Fact Sheet
`Declaration of Peter
`Elenius in Support
`of Katana’s
`Responses to
`Micron’s Evidentiary
`Objections
`
`Howard L. Lim | Counsel
`hlim@carterarnett.com
`D: (214) 295-3966
`
`Filed
`9/04/2023
`
`Filed
`9/04/2023
`Filed
`9/04/2023
`Filed
`9/04/2023
`
`

`

`F: 214.550.8185
`www.carterarnett.com
`
`8150 N. Central Expressway, Suite 500, Dallas, Texas 75206
`
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